estorm-b1 hardware manual - embien manual... · 2017-04-18 · hardware, components used etc are...

Embien Technologies – eStorm-B1

Hardware Manual R1.0

of 28 Embien Tech. India Pvt. Ltd

Document Reference: ET/IPD/AN/HM/17/04-R1.0

eStorm-B1 Hardware Manual




Revision History

Date Revision Authors Remarks

11/04/2017 1.0 KSD Initial Document




Table of Contents

1. INTRODUCTION ................................................................................................................................................. 5

1.1 SCOPE ..................................................................................................................................................................... 5 1.2 REFERENCES ............................................................................................................................................................. 5

2. ESTORM-B1 FEATURES ...................................................................................................................................... 6

2.1 FEATURES ................................................................................................................................................................ 6 2.2 BLOCK DIAGRAM ....................................................................................................................................................... 7 2.3 ORDERING INFO ........................................................................................................................................................ 8

3. ESTORM-B1 HARDWARE COMPONENTS ............................................................................................................ 9

3.1 BLE SOC – KW31Z .................................................................................................................................................. 9 3.2 CRYSTAL ................................................................................................................................................................ 12 3.3 RF SECTION............................................................................................................................................................ 13 3.4 SHIELD .................................................................................................................................................................. 13

4. ESTORM-B1 PIN OUTS ......................................................................................................................................14

5. ESTORM-B1 PIN LAYOUTS ................................................................................................................................26

6. ELECTRICAL AND ENVIRONMENTAL SPECIFICATION .........................................................................................27

7. LEGAL NOTICE ...................................................................................................................................................28

7.1 CUSTOMER SUPPORT ............................................................................................................................................... 28 7.2 USAGE RESTRICTION ................................................................................................................................................ 28




Table of Figures

FIGURE 1: ESTORM-B1 BLOCK DIAGRAM ...................................................................................................................... 7 FIGURE 2: KW31Z BLOCK DIAGRAM ........................................................................................................................... 11 FIGURE 3: CLOCKING DIAGRAM .................................................................................................................................... 12 FIGURE 4: ESTORM-B1 CONNECTOR ARRANGEMENT ................................................................................................... 15 FIGURE 5: ESTORM-B1 PAD LAYOUT (TOP VIEW) ...................................................................................................... 26 FIGURE 6: ESTORM-B1 PAD LAYOUT (BOTTOM VIEW) ............................................................................................... 27

Table of Tables

TABLE 1: ESTORM-B1 MODULE FEATURES ..................................................................................................................... 6 TABLE 2: ESTORM-B1 ORDERING INFORMATION ........................................................................................................... 8 TABLE 3: J5 CONNECTOR SIGNAL LIST ......................................................................................................................... 19 TABLE 4: J6 CONNECTOR SIGNAL LIST ......................................................................................................................... 22 TABLE 5: J8 CONNECTOR SIGNAL LIST ......................................................................................................................... 25




1. Introduction

eStorm-B1 is a compact Bluetooth Low Energy v4.2 complaint wireless module from Embien.

Being a pre-qualified module, it is best suited for BLE based IoT device development were low

power consumption and very small form factor is of more concern.

Powered by KW31Z BLE SoC from NXP semiconductors, it can be used as an add-on module

for enabling BLE connectivity for portable embedded system or as a stand-alone system. The

module is available in both industrial, automotive grade and designed in such a way that it

does not require any external components.

1.1 Scope

The primary scope of this document is to provide the developer/technical persons the

background about the module and procedures for using the same. All the details of the

hardware, components used etc are provided to aid the developer use the system effectively

as well as expand its functionalities.

This document does not describe about command set information, programming this device

and using them. For this information, kindly refer to the ―Developer Manual‖ provided.

1.2 References

1. eStorm-B1 Developer Manual: ET/IPD/AN/DM/17/04-R1.0 from embien.com

2. MKW31Z512 technical datasheet: MKW41Z/31Z/21Z Data Sheet from NXP.com




2. eStorm-B1 Features

This section describes various features of the eStorm-B1 module in detail.

2.1 Features

eStorm-B1 board supports the following features.

Features Description Availability

BLE SoC MKW31Z Default

MCU ARM Cortex-M0+ core Default

MCU Speed 48MHz Default

SRAM 128KB Default

Flash 512KB Default

BLE v4.2 Low Energy complaint

2400-2483.5MHz Band Default

Air Data Rate 1Mbps Default

Antenna Wire Antenna Default

External PCB antenna Optional

External interface 33 pin surface mount or through hole pads Default

UART Serial Interface 1 (TTL) Default

SPI 1 Default

I2C 1 Default

CAN 1* Default

GPIO’s Multiple Optional

Debug port 1 (SWD Interface) Default

Input power 1.71V to 3.6V DC Default

Form Factor 12mm X 17mm Default

Table 1: eStorm-B1 Module features

Features marked in Green as default and in Tan color are selectable when ordering the board.

* Available only in automotive grade module.




2.2 Block Diagram

The block diagram of the eStorm-B1 module is depicted in the below figure,

Figure 1: eStorm-B1 Block Diagram




2.3 Ordering Info

eStorm-B1 can be ordered with only the features necessary for the target applications. The

following table gives the detailed description of the ordering codes.

S. No

Order Code Description Operating Grade

Production status

1 eStorm-B1-II I2C to Bluetooth Low Energy gateway Industrial Active

2 eStorm-B1-IU UART to Bluetooth Low Energy gateway Industrial Active

3 eStorm-B1-IS SPI to Bluetooth Low Energy gateway Industrial Active

4 eStorm-B1-IG Generic Connectivity Module Industrial Active

5 eStorm-B1-AI I2C to Bluetooth Low Energy gateway Automotive Under Development

6 eStorm-B1-AU UART to Bluetooth Low Energy gateway Automotive Under Development

7 eStorm-B1-AS SPI to Bluetooth Low Energy gateway Automotive Under Development

8 eStorm-B1-AC CAN to Bluetooth Low Energy gateway Automotive Under Development

Table 2: eStorm-B1 ordering information




3. eStorm-B1 Hardware Components

The eStorm-B1 platform is designed using some of the most powerful and reliable components

available. This section describes some of the major components used in the design.

3.1 BLE SoC – KW31Z

The KW31Z SoC integrates a radio transceiver operating in the 2.36GHz to 2.48GHz range

supporting a range of FSK/GFSK and O-QPSK modulations, an ARM Cortex-M0+ CPU, up to

512 KB Flash and up to 128 KB SRAM, BLE Link Layer hardware, 802.15.4 packet processor

hardware, Generic FSK Link layer controller hardware and peripherals optimized to meet the

requirements of the target applications.

The KW31Z radio frequency transceiver is compliant with Bluetooth version 4.2 for Low Energy

(aka Bluetooth Smart or BLE), Generic FSK and the IEEE 802.15.4 standard using O-QPSK in

the 2.4 GHz ISM band and the MBAN frequency range spanning from 2.36 GHz to 2.40 GHz. In

addition, the KW31Z allows the Bluetooth Low Energy protocol to be used in the MBAN

frequency range for proprietary applications.

KW31Z has 512KB of on-chip Flash and 128KB of on-chip SRAM memory available to be used

by customer applications and chosen communication protocol stack using a choice of either

NXP or 3rd party software development tools.

The RF section of the KW31Z is optimized to require very few external components, achieving

the smallest RF footprint possible on a printed circuit board. Extremely long battery life is

achieved though efficiency of code execution in the Cortex-M0+ CPU core and the multiple low

power operating modes of the KW31Z.




The following are the lists of features of the BLE SoC:

MCU

32-bit Cortex M0+ (enhanced M0) Central Processor Unit (CPU)

Up to 48MHz core frequency across temperature range of –40 °C to 105 °C

Supports up to 32 interrupt request sources

2-stage pipeline micro architecture for reduced power consumption and improved

architectural performance (cycles per instruction)

Bit Manipulation Engine (BME) for improved bit handling of peripheral modules

Binary compatible instruction set architecture with the CM0 core

Thumb instruction set combines high code density with 32-bit performance

Serial Wire Debug (SWD) reduces the number of pins required for debugging

Micro Trace Buffer (MTB) provides lightweight program trace capabilities using system

RAM as the destination memory

Radio

2.4GHz ISM band (2400-2483.5MHz) and MBAN 2360-2400MHz operation

(G)FSK and O-QPSK Modulation

Supported Standards

o Bluetooth v4.2 Low Energy supporting up to 2 simultaneous hardware connections

o Generic(G)FSK modulation capability in Medical Body Area Network (MBAN)

frequency bands spanning from 2360 MHz to 2400 MHz

IEEE Std. 802.15.4 compliant with dual-PAN support

Bluetooth Low Energy Link Layer hardware

• Hardware acceleration for IEEE Std. 802.15.4 packet processing

• 26 MHz (BLE/Generic FSK only) or 32 MHz crystal reference oscillator

• Generic FSK Link Layer hardware

• Single RF port shared by both transmit and receive, used with

• Supports diversity antenna options for 802.15.4

• Supports dual PAN for 802.15.4 with hardware-assisted address matching acceleration

• Low external component count

• Supports external PA and LNA




The following figure shows the simplified block diagram of the KW31Z BLE SoC.

Figure 2: KW31Z Block Diagram




3.2 Crystal

The following are the clock source options available in KW31Z BLE SoC

• Reference Oscillator — crystal reference oscillator, supports 32MHz

• 32 kHz Oscillator — 32.768 kHz crystal reference oscillator

• Multipurpose Clock Generator(MCG)

Frequency-locked loop (FLL) controlled by internal or external reference

o 20 MHz to 48 MHz FLL output

Internal reference clocks — Can be used as a clock source for other on-chip

peripherals

On-chip RC oscillator range of 31.25 kHz to 39.0625 kHz with 2% accuracy

across full temperature range

On-chip 4MHz oscillator with 5% accuracy across full temperature range

The 32MHz crystal reference oscillator is supported for BLE radio modes and MCU can drive its

clock either from the crystal reference oscillator or the FLL (frequency locked loop). The

32/32.768 KHz crystal reference oscillator is used to maintain precise Bluetooth radio time in

low power modes.

The following picture depicts the clocking diagram of KW31Z BLE SoC

Figure 3: Clocking Diagram

eStorm-B1 includes internal 32MHz and 32.768KHz crystal for driving the internal 32MHz and

32.768KHz crystal reference oscillator.




3.3 RF Section

RF section in the eStorm-B1 is carefully designed based on NXP’s RF circuit recommendations.

Radio block inside KW31Z includes constant envelope transmitter and a Quadrature zero-IF

receiver. Since the radio has an inbuilt balun, other than matching components no external

circuitry is required. The antenna output from the SoC is single ended with characteristic

impedance of 50ohms.

The 50ohms single ended impedance antenna trace is connected to wire antenna (through-

hole connector) with few matching components in between.

3.4 Shield

Metal shield arrangement is provided to protect the module from spurious surges.




4. eStorm-B1 Pin Outs

This section describes pin outs of the eStorm-B1 Module.

eStorm-B1 expansion connectors J5, J6 and J8 can be used to interface module specific to

application requirements. Below table gives the details of the expansion connector pin outs.

The Column heading descriptions are as follows:

Pin No: eStorm-B1 expansion connectors (J5, J6, J8) pin numbers

Connection name: Reference name of the expansion connector pin

uC Pin No: The BLE SoC pin to which this pin is connected to.

Processor signal name: KW31Z SoC pin name corresponding to SoC pin number.

I/O: Signal type for the pins.

I/O : Input and/Or Output

O : Output Only

I : Input Only

P : Power

G : Ground

Pin description: Provides brief explanation of the pin functionality and usage. Please refer to

NXP Semiconductors KW31Z technical datasheet (MKW41Z/31Z/21Z Data Sheet) for detailed

description of Processor pins.

Comment: Comments on the pin usage.




The following picture depicts the arrangement of expansion connectors in the module

Figure 4: eStorm-B1 connector arrangement

Pin No

Connection Name

uC Pin No.

Processor Signal Name

I / O

Pin description Comment

J5.1 GND G Digital Ground


J5.3 PTC3 39

PTC3 I/O

General purpose

digital

input/output pin.

TSI0_CH15 I

Touch Sensing

Input capacitive

pins

LLWU_P11 I Wakeup inputs

RX_SWITCH O

Front End Module

Receive mode

signal

I2C1_SDA I/O I2C serial data

line

LPUART0_TX I/O Transmit Data

TPM0_CH1 I/O TPM channel

DTM_TX O Direct Test Mode

Transmit




Pin No

Connection Name

uC Pin No.


I / O


J5.4 PTC4 40

PTC4 I/O

General purpose

digital

input/output pin.

TSI0_CH0 I

Touch Sensing

Input capacitive

pins


ANT_A O

Antenna selection

A for Front

End Module

support

EXTRG_IN

LPUART0_ CTS_b

I Clear To Send


BSM_DATA I/O

Bit Streaming

Mode Data

signal, 802.15.4

packet data

stream data line

J5.5 I2C_SCL 42

TSI0_CH2 I

Touch Sensing

Input capacitive

pins

Used as I2C serial

clock interface in

I2C enabled

modules

PTC6 I/O

General purpose

digital

input/output pin


XTAL_OUT_EN I

26 MHz/32 MHz

Clock

output enable for

XTAL_OUT

I2C1_SCL I/O I2C serial clock

line

LPUART0_RX I Receive Data


BSM_FRAME O

Bit Streaming

Mode Frame

signal, 802.15.4

packet data

stream frame line




Pin No

Connection Name

uC Pin No.


I / O


J5.6 I2C_SDA 43

TSI0_CH3 I

Touch Sensing

Input capacitive

pins

Used as I2C serial

data interface in

I2C enabled

modules

PTC7 I/O

General purpose

digital

input/output pin


SPI0_PCS2 O Chip Select


line



BSM_DATA I/O

Bit Streaming

Mode Data

signal, 802.15.4

packet data

stream data line

J5.7 UART_RTS 45

TSI0_CH4 I

Touch Sensing

Input capacitive

pins

Used as UART serial

RTS interface in

UART enabled

Modules

PTC16 I/O

General purpose

digital

input/output pin


SPI0_SCK I/O Serial Clock


line

LPUART0_RTS_b O Request To Send





Pin No

Connection Name

uC Pin No.


I / O


J5.8 UART_RX 46

TSI0_CH5 I

Touch Sensing

Input capacitive

pins

Used as UART serial

RX interface in

UART enabled

modules

PTC17 I/O

General purpose

digital

input/output pin


SPI0_SOUT I/O Serial data out


line


BSM_FRAME O

Bit Streaming

Mode Frame

signal, 802.15.4

packet data

stream frame line

DTM_RX I Direct Test Mode

Receive

J5.9 UART_TX 47

TSI0_CH6 I

Touch Sensing

Input capacitive

pins

Used as UART serial

TX interface in

UART enabled

Modules

PTC18 I/O

General purpose

digital

input/output pin


SPI0_SIN I Serial Data In


line


BSM_DATA I/O

Bit Streaming

Mode Data

signal, 802.15.4

packet data

stream data line


Transmit




Pin No

Connection Name

uC Pin No.


I / O


J5.10 UART_CTS 48

TSI0_CH7 I

Touch Sensing

Input capacitive

pins

Used as UART serial

CTS interface in

UART enabled

Modules

PTC19 I/O

General purpose

digital

input/output pin




line

LPUART0_CTS_b I Clear To Send

BSM_CLK O

Bit Streaming

Mode (BSM)

Clock signal,

802.15.4

packet data

stream clock line

BLE_RF_ ACTIVE

O

Signal to indicate

future BLE

activity.

J5.11 VIN P Digital supply

Used for DC

positive supply

input

Table 3: J5 connector signal list




Pin No

Connection Name

uC

Pin No.


I

/ O


J6.1 GND G Digital Ground Used for DC supply

ground

J6.2 VIN P Digital supply

Used for DC

positive supply

input

J6.3 ADC_DIFF- 25

ADC0_DM0 I

ADC Channel 0 Differential Input Negative

CMP0_IN1 I Analog voltage inputs

J6.4

ADC_DIFF+

24

ADC0_DP0 I

ADC Channel 0

Differential

Input Positive


J6.5 PTB18 23

DAC0_OUT O DAC output

ADC0_SE4 I

ADC Channel 0

Single-

ended Input 4

CMP0_IN2 I Analog voltage

inputs

PTB18 I/O

General purpose

digital

input/output pin


line

TPM_CLKIN0 I External clock


NMI_b I Non-maskable

interrupt




Pin No

Connection Name

uC

Pin No.


I

/ O


J6.6 GND G Digital Ground Used for DC supply

ground

J6.7 ADC_SE2 19

ADC0_SE2 I

ADC Channel 0

Single-

ended Input 2


inputs

PTB3 I/O

General purpose

digital

input/output pin

CLKOUT O Internal clocks

monitor


RTC_CLKOUT O 1 Hz square-wave

output

J6.8

ADC_SE3

18

ADC0_SE3 I

ADC Channel 0

Single-

ended Input 3


inputs

PTB2 I/O

General purpose

digital

input/output pin

RF_NOT_ALLOWED I

Radio off signal,

intended for

WiFi coexistence

control


Transmit


J6.9 TIMER2 17

ADC0_SE1 I

ADC Channel 0

Single-

ended Input 1


PTB1 I/O

General purpose

digital

input/output pin


Receive


line

LPTMR0_ALT1 I Pulse counter

input pin





Pin No

Connection Name

uC

Pin No.


I

/ O


J6.10 TIMER1 16

PTB0 I/O

General purpose

digital

input/output pin


XTAL_OUT_EN I

26 MHz/32 MHz

Clock

output enable for

XTAL_OUT


line

CMP0_OUT O Comparator

output


CLKOUT O Internal clocks

monitor



Pin No

Connection Name

uC

Pin No.


I

/ O



J8.2 SWD_DIO 1

TSIO_CH8 I

Touch Sensing

Input capacitive

pins

Used for SWD

debug interface by

default

PTA0 I/O

General purpose

digital

input/output pin



SWD_DIO I/O

Serial Wire Debug

Data

Input/Output

J8.3 SWD_CLK 2

TSI0_CH9 I

Touch Sensing

Input capacitive

pins

Used for SWD

debug interface by

default

PTA1 I/O

General purpose

digital

input/output pin



SWD_CLK I Serial Wire Clock




Pin No

Connection Name

uC Pin No.


I / O


J8.4 RESET 3

PTA2 I/O

General purpose

digital

input/output pin Used for SWD

debug interface by

default TPM0_CH3 I/O TPM channel

RESET_b I/O

Reset

bidirectional

signal

J8.5 SPI_SOUT 4

TSI0_CH10 I

Touch Sensing

Input capacitive

pins

Used as SPI MISO

interface in SPI

enabled modules

PTA16 I/O

General purpose

digital

input/output pin


SPI1_SOUT I/O Serial data out


J8.6 SPI_SIN 5

TSI0_CH11 I

Touch Sensing

Input capacitive

pins

Used as SPI MOSI

interface in SPI

enabled modules

PTA17 I/O

General purpose

digital

input/output pin


RF_RESET I Radio reset signal

SPI1_SIN I Serial Data In

TPM_CLKIN1 I External clock

J8.7 SPI_SCK 6

TSI0_CH12 I

Touch Sensing

Input capacitive

pins

Used as SPI clock

interface in SPI

enabled modules

PTA18 I/O

General purpose

digital

input/output pin


SPI1_SCK I/O Serial Clock





Pin No

Connection Name

uC Pin No.


I / O


J8.8 SPI_PCS0 7

TSI0_CH13 I

Touch Sensing

Input capacitive

pins

Used as SPI chip

select interface in

SPI enabled

modules

ADC0_SE5 I

ADC Channel 0

Single-

ended Input 5

PTA19 I/O

General purpose

digital

input/output pin




J8.9 PTC5 41

TSI0_CH1 I

Touch Sensing

Input capacitive

pins

PTC5 I/O

General purpose

digital

input/output pin


RF_NOT_ ALLOWED

I

Radio off signal,

intended for

WiFi coexistence

control

LPTMR0_ALT2 I Pulse counter

input pin



BSM_CLK O

Bit Streaming

Mode (BSM)

Clock signal,

802.15.4

packet data

stream clock line




Pin No

Connection Name

uC Pin No.


I / O


J8.10 PTC2 38

TSI0_CH14 I

Touch Sensing

Input capacitive

pins

PTC2 I/O

General purpose

digital

input/output pin


TX_SWITCH O

Front End Module

Transmit

mode signal


line



Receive

J8.11 PTC1 37

PTC1 I/O

General purpose

digital

input/output pin

ANT_B O

Antenna selection

B for Front

End Module

support


line



BLE_RF_ ACTIVE

O

Signal to indicate

future BLE

activity.





5. eStorm-B1 Pin Layouts

All the connections between eStorm-B1 module and external host processor or PC will be via

33 pin surface mount or through-hole connector. The 33 pin external interface is split into

three 11 pin connectors at the left, right and bottom sides.

1mm X 0.6mm rectangular pads at bottom supports surface mounting and 0.4mm half plated

holes at the board edges supports through-hole mounting via 1mm pitch headers.

The following picture illustrates the layout of the pad layout in eStorm-B1 module in top view

and bottom view,

Figure 5: eStorm-B1 pad layout (Top View)




Figure 6: eStorm-B1 pad layout (Bottom View)

6. Electrical and Environmental Specification

Parameter Min Typical Max

Input power supply 1.71V DC - 3.6V DC

Operating temperature -40 degree Celsius +25 degree Celsius +105 degree Celsius




7. Legal Notice

7.1 Customer Support

Embien Technologies are excited to offer our customers an easy ―out of box‖ experience by

providing board support package, software demos, user manuals and other electro mechanical

documentation to get our evaluation modules up and running.

Customer product development support is a part of standard support offer from Embien

Technologies. If customers are interested, Embien Technologies can offer product development

services around Embien’s eStorm-B1 platform. This includes application board (daughter

board) development, Board Support package (BSP) development and application software

development.

7.2 Usage Restriction

Embien Technologies products are excellent starting point for customer’s applications

development. But, selection and usage of Embien Technologies products for a particular

application is responsibility of customers. In order to minimize risks associated with customer

applications, the customer must use adequate design and operating safeguards to minimize

inherent or procedural hazards.

Embien Technologies products are not intended for use in life support systems and appliances,

nuclear systems or systems where malfunction can reasonably be expected to result in

personal injury, death or severe property or environmental damage. Any use of products by

the customer for such purposes are at the customer’s own risk.

estorm-b1 hardware manual - embien manual... · 2017-04-18 · hardware, components used etc are...

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