eurocomp elektronik gmbh - menlo micro · 2017. 11. 23. · 400v/2a rf relay. smart rf and power...

Menlo MicroIntroduction

October 2017

Menlo Micro Proprietary & Confidential

Company Background & Management Team

Overview of Menlo Micro’s Technology & Differentiation

Reliability & Test Highlights

Packaging (TGV)

Key Differentiation; The Menlo Micro Advantage!

Applications & Markets

Menlo Micro Product & Solution Highlights

MRI

Industrial & Military Radio

High-Power RF Switching

Power Relays

Q&A and the “Bottom Line”

1

Topics


Menlo Micro is a new startup based in Irvine, CA which is being spun out of General Electric’s Global Research Center

$40M in GE R&D since 2004, closed a $18.6M series A in Dec 2016

Focused on high performance RF and Power switching products, using GE’s proprietary Digital-Micro-Switch (DMS) technology

2

Company Background

+ =

Menlo Microsystems Proprietary

Management Team

Russ GarciaCEO

• 30+ yrs semiconductors, exec management, startup, M&A experience• EVP Microsemi, CEO Wispry, CEO uNav, TI, Silicon Systems, Hughes

Chris GiovannielloCo-Founder, SVP Product Development & Marketing

• 20+ yrs semi & semi equip exp. in Sales, Marketing, & Bus. Dev.• VP GE Ventures, Sales/Service/ Biz. Dev. Applications. Teradyne

Chris KeimelCo-Founder, CTO

• 12+ yrs material science and MEMS process development• Senior Research Scientist - GE Global Research

Jeff BalounSVP Manufacturing Operations

• 25+ yrs semi manufacturing & operations, front-end & back-end• GM Deca Technologies, CEO Imbera, GM Unisem, ASAT, LSI

3

Lew BooreSVP Sales & Business Development

• 30+ yrs semi product development, marketing & sales• VP Silanna, Cavendish Kinetics, WiSpry, HP/ Agilent, M/A-COM


Ohmic contact switch with cantilever beam and electrostatic actuation

What is GE Digital-Micro-Switch Technology?A novel micro-mechanical switch architecture based on an ultra-reliable material set, incorporating new design and processing techniques

400V/2A RF Relay

Smart RF and Power relay systemsHigh-power, High-reliability

Over 10+ years of development, over 40 patent families and know-how covering materials & fabrication processes, as well

as system architecture, design, test

Gold

GE-0

GE-2

Beam lifetime comparison under accelerated test conditions

GE DMS technology can enable new, disruptive products:High-power, High-reliability SMART RELAY SYSTEMS

240V/10A AC/DC Relay

Beam

Substrate

Gate

Contact


5

The GE Approach

• GE approached MEMS reliability issues not as a semiconductor company, but with decades of experience in high-performance alloys

• GE’s breakthrough innovations in materials and processing enable true Product Development Platform:

• High-Reliability: Shipping in production to a 3B cycles spec

• High-power capable: Opens up new markets, larger TAM

• Simple design, <12 mask layers: Can scale with volume to very low cost

• Simple design, wide design space: Shorter design cycles = more products

9mm x 9mm

1mm x 1.5mm


How is Menlo Unique in the Contact Switch Industry?

Omron• Target market: Consumer and Industrial RF• Status: Stopped in mid-2014 - reliability/size/cost

ADI • Target market: Industrial RF• Status: Active – shipping to ATE market

DelfMEMS(Startup)

• Target market: Consumer RF• Status: Stopped operations in Jan 2016 – reliability/size/cost

Over $100M spent by industry in the past 6-7 years going after reliable, cost-effective MEMS ohmic switch technology

NXP-Epcos • Target market: Consumer RF and Power• Status: Stopped program in ~2012 - reliability

Radant(Startup)

• Target market: Aerospace/Defense and Industrial RF• Status: Stopped operations in May 2015 – reliability/manufac.

RFMD• Target market: Consumer RF• Status: Stopped program in ~2011 - reliability


Extensive Reliability Experience and Testing at GE

Continuous reliability testing for accelerated life evaluation:

• Multiple parallel automated testers capable of 20 die evaluation

• 3 ovens in operation at 3 different acceleration temperatures

• >10,000 die evaluated

Very stable resistance <0.4Ω for over 12 Billion cycles

(MM3100)


Extensive reliability experience and testing at GE

Weibull data shows zero early life failures and confidence to 3B operations, with hot-switching at 0dBm

ReliaSoft Weibull++ 7 - www.ReliaSoft.com

Probability - Weibull

Cycles

Un

reli

ab

ilit

y,

F(

t)

100.000 1.000E+111000.000 10000.000 100000.000 1000000.000 1.000E+7 1.000E+8 1.000E+9 1.000E+100.100

0.500

1.000

5.000

10.000

50.000

90.000

99.000

0.100

Probability-Weibull

Data 1Weibull-3PMLE SRM MED FMF=15/S=43

Unadj PointsUnadjusted L ine

Marco AimiGE4/11/201310:56:45 AM

3 Billion cycles

20 Billion cycles

(MM7100)


Key Differentiation

Core Metallurgy and Process Know-how and IP

Power Performance: Very High Power Handling

Quality & ReliabilityRF Performance:

Linearity & Insertion Loss

• Mature & already shipping in high-value GE systems

• Billions of switch events• Simple Manufacturing…Cost!

• 50W+ designs• Metal on glass processing

superior RF specs

• DC and AC, 200V+• Superior thermal performance

• Auto Charging, Home control, Industrial Automation

Horizontal Product Applications

• Wireless Infrastructure: RRH, Small Cell, Wireless Backhaul

• Military/First Responder Radio and Radio Networks


10

Digital-Micro-Switch ApplicationsStep function improvements in power handling and reliability

1W 10W 100W 1kW 10kW 100kW 10MW 100MW

Other ohmic MEMS

Mobile Communications

Relays

Residential/Comm/Indus. Breakers

Base Station Comm.

Test Equipment

DC Bus Arch. / DC Protection

Power Supply Protection

PIN Diode & GaAs Apps.• Smaller size, higher power, higher

frequency for RF switching

• Fast-switching, arc-free protection for Power switching

1MW

Benefits of micromechanical contact switch brought to many more applications

3.5kW

Digital-Micro-Switch(single die)


11

Horizontal Market Breadth

Power IoT:Home Auto, EV Charging,

UPS, Solar, Auto…

AC&DC Power Switch

GE, Tesla, Nest, Honeywell….

$10B+ TAM(2019)

Vertical:

Target Customers:

Product:

Medical

Reed Relay

GE internal & Med Equip Suppliers

$525M TAM(2019)

Present

Revenue

• GE Qualified• Expansion to

other MR coil manufacturers

Mil Radio& Wireless

Infrastructure

RF Switch & Filter ProductsNetwork Equip

Mil Radio Suppliers

$1.4B TAM(2019)

Initial Products

Focus

• RRH Filters• Small Cell Filters• Mil Radio Filters

Mobile, IoT

Process

Mobile RFSuppliers

$1B TAM(2019)

License

Model

• Initial partners validated and in discussions

Strong Early Base:

Revenue and Customer Traction

Future

Power RF Switch

RF Switch

ATE,Cable, Telecom, Defense

Initial Products

Focus

• General Purpose RF Switch products

$750M TAM(2019)


Menlo Product Portfolio – 2017/2018

MM7100 MM7110 MM3100

MM5120 Smart Power Relay Prototype

• Target Markets: A/D, Industrial• Target Applications: Tunable UHF/VHF/HF radios,

general purpose EM relay replacement, WPT

• 6mm x 6mm LGA • 6 channels, 25W/channel• DC to 3GHz• Embedded controller

• 9mm x 9mm LCC• WL bonded• 500V/1A <128MHz

• 6mm x 14mm SIP• 1000V/1A <128MHz

• Integrated driver, passives

• Target Markets: MRI, general purpose HV switch

• Target Market: Industrial, Test & Measurement

• 3” x 2” proto board• 200V/10A DC power relay• Integrated current sense• No heat sink

• Target Market: A/D, Test & Measurement, Wireless Infra.• Target Applications: Switched filters, switch matrix, high

power RF switching, EM replacement

• 5mm x 5mm QFN• SPDT, 25W/channel• DC-12GHz• Embedded controller with Vboost• Bare-die option to 18GHz+

HV Switch Products RF Tuning Products

Power Relay ProductsRF Switching Products

Samples: availableProduction: Q3 2017



Proto Samples: Q3 2017First Product: 2019

Samples: Q4 2017Production: Q4 2018

12

High Voltage Switch Products


GE Healthcare MRI


The MRI Problem Statement


DMS Products for MRI – MM7100“Replacing the PIN diode”

Key SpecsGE

MEMS

Blocking Impedance

(Real)~100KΩ

Blocking Impedance

(Reactive)~300fF

Standoff Voltage400V DC

Resistance<0.3 Ω

Peak Current >2A

Cycle 3B+

Switching Time <4 uS (on)

<1uS (off)

SPST 400V/2A AC/DC Relay

High Voltage RF Relay

2014-2015 2016-2017MM7100

Hermetic LCC9x9mm ceramic package

WL Glass Capin 9x9mm package


Signa Pioneer 3.0TEngineering Execution

Digital coils, no manual tuning of PIN-diode networksFaster, cheaper NPI

Patient/Customer BenefitsLighter, thinner and silent coilsFrom 40W to 0.4W per coil: heat free

Higher reliability, lower down time

Enabling TechnologyPath to “wireless coils”Completely new system architectures

Cost ReductionOver $10K reduction in COGS per system

Digital MRI Coils – Already in production!

2600 MEMS switches per system

HV/MR Components:MR SPST MM7100 MM7110 (SIP)

2016 2018+ Aux coils2017

RF Tuning Products


DMS Products for Tuning/Filtering – MM3100Replacing PIN diodes & EM Relays for impedance matching

Six individually controlled, reconfigurable “loss-less” contact switches in a low-profile SMT package

2016/2017MM7100

WL Glass Capin 9x9mm package

WL Glass Capin 6x6mm BGA

2017/2018MM3100

© 2017 Menlo Microsystems, Inc. – All Rights Reserved – www.menlomicro.com Page 1 Doc.Rev MM3100.1.1 21-Jun-2017

MM3100 – 6 Channel SPST Digital-Micro-Switch Preliminary Product Overview Features:

DC to > 3 GHz Frequency Range 25 Watt (CW), 200W (Pulsed) Max Power Handling Low On-State Insertion Loss < 0.3 dB @ 3 GHz Low On-State Resistance < 0.75 Ω 25dB Isolation @ 3 GHz Maximum voltage (AC or DC): +200 Volts on RF Input < 10us On/Off Switching Time High Reliability > 3 Billion Switching Operations Integrated SPI Bus Gate Control Hermetic 6mm x 6mm x 1.3mm LGA Package

Applications: Functional Diagram:

High-Power Tunable Resonators and Filters Broadband Power Amplifier Impedance Matching Electronically Steerable Antennas and Phase Shifters Automated Test and Measurement Systems

Markets:

Defense and Aerospace Scientific and Medical Wireless Infrastructure

Description:

The MM3100 device is a high power 6-channel SPST micro-mechanical switch offered by Menlo Micro, which has developed a new Digital-Micro-Switch (DMS) fabrication process, and applied it to DC and wideband RF/microwave switch applications. This innovative DMS technology enables robust and highly reliable switches capable of > 25 watts. Each switch provides ultra low on-state insertion loss and high off-state isolation from DC to > 3 GHz with greater than 3 billion switching cycles at elevated +85ºC temperatures. Each switch is individually controlled by a standard Serial Peripheral Interface (SPI) synchronous bus. An external +5 VDC logic supply and high voltage +77 VDC bias source is required for operation of the internal switch driver. 6-bit, high-voltage tuning

capability in small SMT package


Applications: Mil-Radio & Commercial Infrastructure

Electronic phase shifter

• High cost ($500+ for phase shifters & filters)

• Weight: wind load for smaller towers

• Space: for multi-band support

• Reliability: due to mechanical components

• Lack of flexibility: for future wireless bands

Objective:• Replace bulky, heavy mechanical fixtures with

lightweight, electronic, tunable versions based on high-power MEMS components

Tunable filter

Pain Points:

Macro & Small Cell

RF Tuning/Switching:

MM3100SIP

• TGV shrink, mmWave• SP4T, SPxT, embedded passives• RF Subsystem-on-a-chip

Future Directions:MM5120SIP, die

“Rethink” the architecture w/low cost, reliable, high-power RF microsystemsImprove on key RF specs & miniaturize critical subsystems for Infrastructure

Broadband PA Impedance matching

2017 2018 2018+

20


(48) high reliability cantilever switches in a 3.6mm x 4mm die

Six channels each capable of carrying 25W RF or > 1A/channel DC

Scalable Design Platform

MM3100

w/integrated controller and 6mm x 6mm package

21


RF Tunable Filter – Reduce Size, Weight & Power for RF MM3100 Replacing PIN Diodes in Tunable Radios

Potential to enable high power handling (5W-20W) in a 2W form factor

UHF interstage (2W) UHF interstage (20W)

Benefits:

Max input: <2W 20W+ •10x increase in power handling

Size: 200+ components (2-sided board) 50% area for complex pin-diode switch biasing

~25 componentsNo pin-diodes, single-sided board, simple bias scheme

•80%+ reduction in components•75% reduction in board size•Reduced need for thermal management, smaller box

Insertion Loss: > 3dB @ 500MHz < 2dB @ 500MHz •33% reduction in RF losses, less heat, longer battery life

Power Consumption:

1.2W <100mW •90% reduction in DC losses, less heat, longer battery life

Linearity: IP3: ~40dBm IP3: ~85dBm •Reduced distortion, higher data rates

Ex. Mil Radio

Key metrics:• Fast frequency tuning• Lightweight• Long battery life• Reliability

With PIN Diode With DMS Technology


23

MM3100 – High Power Handling

Robust materials, simple design and fab, scalable architecture enable a high power RF MEMS switch

• A MEMS switch capable of handling 25W RF (CW) @ 3GHz

• Stable insertion loss across entire power range

• Peak (10% duty cycle) RF power capable to 200W/channel

• Power handling increases as frequency decreases, > 70W CW

0

20

40

60

80

100

120

140

0 20 40 60 80 100

QFN

Pa

ckag

eT

em

pera

ture

(⁰C

)

AverageInputPower(Watts)

CWInputPowervsQFNTemperature

2.45GHz

1.90GHz

900MHz

300MHz

100MHz

20MHz


Stable Insertion Loss with Hot-Switching

• MM3100 device hot-switched at +15dBm

for >1B cycles and still functional

• Insertion loss change of +/-0.010dB

measured over ALL hot switch cycles before test stopped

• Hot switch stability and operations are a result of Ruthenium contact material and hermetic package

• Insertion loss at 1 GHz <0.3dB

Cold Switched

(<0dBm)

Hot Switched

(+15dBm)

Typical

Mechanical relay

1-10M operations <<1-10M operations

Typical

Menlo DMS relay

3-10B operations1000x to 3000x

improvement

>1B operations5000x to 10,000x

improvement!

Change in insertion loss over 1B hot-switch cycles

dB

RF Switching Products


Ron*Coff comparison of DMS Technology

Peregrine

• Menlo DMS requires only stack of 1 for 200V voltage handling• MM3100 RonCoff = 40fs, <10fs with TGV for 2018

• Glass is ultimate substrate platform for high RF linearity, >90dBm IP3

~10fs

Most of SOI switch industry

• For SOI, RonCoff is measured for single transistor

• Actual switch product uses transistor stacks (up to 20!) for up to 80V


Next Generation High-Power RF SwitchingMM5120 SPDT in QFN package w/integrated driver (3D simulations)

-35

-30

-25

-20

-15

-10

-5

0

0 2 4 6 8 10 12 14

retu

rnlo

ss(

dB

)

Frequency(GHz)

RETURNLOSS

-1

-0.9

-0.8

-0.7

-0.6

-0.5

-0.4

-0.3

-0.2

-0.1

0

0 2 4 6 8 10 12 14

inse

rtio

nl

oss

(dB

)

Frequency(GHz)

INSERTIONLOSS

-45

-40

-35

-30

-25

-20

-15

-10

-5

0

0 2 4 6 8 10 12 14

isol

atio

n(

dB)

Frequency(GHz)

ISOLATION

MM5120 to be offered in:• 5x5 QFN (w/integrated 70V Vboost)• Hermetic, WL capped bare-die

Functional Block Diagram

CTRL

RFC

RF2RF1

5mm

5m

m

(QFN) (QFN)

(QFN)


Menlo DMS Technology vs. RF Electromechanical

MM5120SPDT

EM (SMT) SPDT

EM (coax)SPDT DMS Benefits

Power Handling 25W (CW)>150W (pulsed) 50W 50W-100W

Hot Switch <0dBm No No Hot-switch capable

Isolation >25dB @ 6GHz 25dB 70dB

Linearity (IP3) >85dBm 62dBm

DC Capable Yes Yes Yes

Max Frequency 12GHz 6GHz 18GHz

Insertion Loss 0.35dB @ 6GHz 0.8dB @ 6GHz 0.2dB @ 6GHz

Power Consumption <25pA 140mW 420mA @ 12V > 1,000,000x lower power

Reliability >3B operations 10M 1-5M 1000x to 3000x more reliable

Switching speed <10us 3-5ms 10-20ms 1000x faster

Size/Ch. Density 25mm3

5 x 5 x 1 mm QFN1280mm3

16 x 8 x 10 mm SMT30,000mm3

50 x 50 x 12 mm COAX >95% reduction in VOLUME

Offering the power handling and RF/electrical performance of an RF EM relay with the size, weight, reliability, and speed of solid-state


MM5120 Applications

Test & Measurement

• General purpose RF muxing• Digital step attenuator• Replacing mechanical relays which

are big, slow, and short lifetime

Mil Radio

• General purpose RF muxing• Switched filter banks• Replacing mechanical relays which

are big, slow, and short lifetime

Set-Top-Box

• Docsis3.1• High-performance RF switch• Ultra-high linearity• Replacing SOI devices

Satellite/Cable Matrix

• Huge (2048x2048) switch matrix• Replacing low density mechanical

relays which take up racks of board space

29


MM5120 Applications


From DC to mmWave

Initial simulations of DMS unit cell show mmWave performance is achievable

3D simulation of Menlo DMS unit cell switch

WL Glass Cap w/TGV CSP

MM3100 WL Glass Cap

in 6x6mm QFN

Advances in packaging will enable DMS products to achieve much higher BW

Everything gets better from RF view:• Lower parasitics• Lower bulk resistance/IL• Improved thermals, better power

handling


Advanced Materials Low-Cost Packaging Supply Chain

1Business Name.

Corning Restricted ..

Precision Glass Solutions 1.


Through Glass Via Solutions

1

Precision glass with precision holes for semiconductor packaging

Product Applications

End Market Applications

Corning Value Proposition

Why Glass

• RFFE (Radio Frequency Front End)

• Ohmic MEMS Switch

• Interposer

• Consumer Electronics

• Ability to deliver glass at desired thickness level – from 100μm to 700μm - enables shorter line length

and smaller packaging

• Low insertion loss material- savings in battery power / cost

• Pristine surface quality- enables fine line spacing

• Glass Strength - reliability maintained after

downstream processing

• Capability- available in wafer or panel

format

- design according to customer pattern

• Industry partnerships

.

© 2017 Corning Incorporated ..

2Business Name.


Precision Glass Solutions 2.


TGV formation and metallization

Corning and the industry have made significant progress

Glass size:Wafers: 100mm=>300mmPanels: à508mm*508mm

Thickness: 100-700µmPositional Accuracy: <+/-5µmPitch: Minimum 2x hole dia.Hole Diameter: 100µmà10µm

Throughput:Improved 10x in 2 yearsHigh-volume (10X) by 2018

Supply chain:Several global companies investing in glass cutting, handling and metallization equipment

SUPERIORHOLEQUALITYPrecision Holes

.

© 2017 Corning Incorporated ..

WL Glass Cap w/TGV

1x1mm CSP

MM7100

MEMS in hermetic9x9mm package

WL Glass Capin 6x6mm QFN

MM3100

2018/2019

WL Glass Cap w/TGVer)

4x4mm SIP

2016 2017

Corning + Menlo partnership on TGV packaging enables the scale-up of a low cost supply chain

Power IoT Products


Digital-Micro-Switch Advantages for Switching & Protection

Fast, Reliable, Small & Arc-free switching

•Technology scalable from relays to protection•Voltage and current scalable, 1000V+ and 50A+•>100M operations (without zero crossing)•Arc free switching on demand, < 10us switching•Relays <1cm3 / Breakers <10cm3

•AC & DC equivalent architecture•Passively cooled, no heat sink required• Integrated current sensing & over-current protection•1st Type 3 protection technology (resettable)

Disruptive protection and relay technology in chip scale format

35


10X more industrial internet machines than people in the world, waiting to be connected

3

Smart Power Relays with DMS technology can enable the Industrial IoT vision

Industrial

IoT

Brilliant Power

Brilliant Factory

Logistics Optimization

Factory Optimization

Smart Grid

ConnectedMachines

Hospital Optimization

Real-timeNetworkPlanning

Brilliant Hospital

Brilliant RailYard

Shipment Visibility

© GeneralElectricCompany,2014. AllRightsReserved.

Intelligent Medical Devices


Key Technologies:Electromechanical, SS

Market Segments:Industrial

Markets - Power Relay

Key Technologies:SSR, Electromagnetic,

Reed

Market Segments:Industrial, Telecom, Automotive,

Home Automation

AC/DC Printed Circuit Board

Relays


Market Segments:UPS, PV, Wind, EV Charging

AC/DC Low Voltage

Contactors


Market Segments:Residential, Industrial

Mini-Circuit-Breaker & RSD

(<100A)

AC/DC Electronic Control Relays


Power Relay – Size, Weight & Power for Industrial IoT“Smart Power Relay” Replacing SSR and EM Relay

Menlo DMS Technology SS DC

RelayEM Relay

Benefits:Size: < 6mm x 40mm x 25mm

6,000 mm3 / channel

(no heat sink)

45mm x 57mm x 22mm

56,430 mm3 / channel(w/o heat sink)

44mm x 35mm x 35mm

53,900 mm3 / channel

•85% reduction in volume

•90% reduction in weight

•No heavy heat sink

•Higher density possible

Turn on time: <20us <100us 30ms •5x faster than SSR

•>1000x faster than EMR

Power Consumption:

10mW <60mW 1.5W •80% reduction from SSR

•150x reduction from EMR

Lifetime: 10B operations, decades of life

>10B operations, decades of life

100k operations •Lifetime similar to SS

technology

Features: Current Sense and over-current protection

•Extra features for

monitoring & protection

Ratings: 200V/10A DC 200V/10A DC 240V/10A AC •Scalable to higher V/I

3” x 5”

40mm x 25mm SMT

Low losses & power handling of EMR with speed, size, cost, and reliability of SS

Home, Auto, Battery, Industrial, UPS, Solar,

38


DMS Power Relay Prototype (Rev0)

MEMS

Driver

Q1MEMS

Switch

IS IQ1

ILOAD

Q1 Gate

Control

P1

P2

Vg1

C1

C2

On-Off

Signal

Power

Circuits

MEMS Relay

I sense

Isolation

Power

On-Off

Parallel Voltage Limiting Circuit

Voltage and current: 200V / 10A

On resistance: < 30mΩ

Over current protection: 15A

Operating frequency: Min 10KHz

Isolation voltage: 2,500Vac (higher if needed)

Control voltage and current: 5V / 1mA

Package: SMT LGA:40mm x 25mm x 3mm

Key Features:• Much lower on resistance (~30mΩ vs. ~200mΩ for SSR)

• Isolation voltage of 2,500Vac (higher if needed)

• Over current protection (for higher reliability)

• 10x lower control current (~1mA versus ~10mA)

• 10x higher operating frequency (>10KHz versus 1KHz)

• Current sensing information available at control side

• Surface mount component, no heat sink needed

• No de-rating up to 85C

Target specs

39

*Over 20 granted patents & applications around system-level, MEMS-based industrial relay & breaker designs


Temperature vs. Current load

5A 7.5A 10A 11A

MEMS#14 37.9 51.8 71.9 79.9

MEMS#15 35.1 45.6 61 67.4

MEMS#16 39.9 56.2 79.5 89.3

0

10

20

30

40

50

60

70

80

90

100

Tem

per

atu

re (

deg

ree)

Temperature of each MEMS

High current handling capable, and scalable, no heat sink needed

40


40mm

25mm

Multi-Chip-Module surface mount SIP• 2-4 DMS switches• 3-4 active ICs• <10 passives

• Ability to shrink form factor significantly with advanced packaging

DMS Power Relay – Integration Strategy

With advanced packaging (TGV) and simple integration, DMS technology can create disruptive industrial relay and controls products

2017 2018-2019

41

DMS Power Relay Proto EVK


Menlo provides proactive support at all stages of design

Data Sheets & Application Notes

Evaluation Kits (EVKs) provide the Customer with first-level product validation and working metrics

Menlo Models provide a direct link between the device design and systems design

ADS/ S-parameters

Corporate device & systems design engineering support

Schematic capture & layout analysis

Design review

42

Menlo Micro Technical Support

Menlo Micro is focused on supporting each stage of Customer design & manufacturing


Menlo Micro’s “roots run deep” as a Legacy of GE Innovation & Reliability

Menlo’s Management Team has the experience & history of success to support & grow our targeted Customers

Menlo’s PROVEN key differentiation enables small size & high performance within our targeted markets & applications

• Medical

• Power RF Switch for Mil Radio, Space & Industrial Applications

• Power IoT

Menlo is SHIPPING in VOLUME !

We are focused on a select-few (Strategic) Customers

How can we support YOU?

43

The “Bottom Line”

THANK YOU!

www.menlomicro.com

eurocomp elektronik gmbh - menlo micro · 2017. 11. 23. · 400v/2a rf relay. smart rf and power...

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