g3610 maintenance material

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G3610 Maintenance Manual Confidentiality level

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G3610 Maintenance Manual

V 1 . 0 0

For internal use only

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G3610 Maintenance Manual C o n f i d e n t i a l i t y l e v e l


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Revision record

Date Revision

Version

Revision

Reason

R e v i s i o n

R e v i s i o n R e v i s i o n

R e v i s i o n

C h a p t e r

C h a p t e r C h a p t e r

C h a p t e r

Revision Description Author

July.29,2010 V1.01


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Content

Charter 1 General .......................................................................5

1.1 Mobile Profile..................................................................................................... 5

1.2 Hardware Character and Index........................................................................ 5

Charter 2 Product Introduction ....................................................7

2.1 Functional Diagram ..........................................................................................7

2.2 Functional Module Circuit................................................................................ 8

2.2.1 Startup Procedure ................................................................................ 8

2.2.2 Baseband Part ......................................................................................8

2.2.3 Power, reset, clock, charge management Module ......................... 10

2.2.4 Radio Frequency (RF) Module ..........................................................12

2.2.5 Peripheral Circuits .............................................................................13

Chapter 3 Introduction to Functional Chips ...............................18

3.1 Baseband Part .................................................................................................... 18

3.1.1 Digital Processing Chip........................................................................18

3.1.2 Memory Chip.......................................................................................18

3.1.3 FM Chip ...............................................................................................19

3.2 RF Part ..................................................................................19

3.2.1 RF Chip................................................................................................19

3.2.2 Power Amplifier Chip.........................................................................20

3.3 Clock .....................................................................................20

3.3.1 26MHz Clock Oscillator .....................................................................20

3.3.2 32.768KHz Sleeping Clock ................................................................21

Chapter 4 Engineering & Test Mode .........................................22

4.1 Engineering Mode ..............................................................................................22

4.1.1 Enter/Escape Mode ............................................................................22

4.1.2 Commands of Engineering Mode..................................................... 22

4.2 Test Mode ........................................................................................................... 22

4.2.1 Enter/Escape Mode .................................................................................22

4.2.2 Command of Test Mode ..........................................................................22

Chapter 5 Maintenance Introduction .........................................22

5.1 Maintenance introduction for Failure to power on...................................... 23

5.2 Maintenance Procedure for Failure to Charge ............................................ 24


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5.3 Maintenance Procedure for Display Failure................................................. 25

5.4 Maintenance Procedures of Failure of MIC Soundlessness ...................... 26

5.5 Maintenance Procedures of Failure of no Vibration Ring .......................... 26

5.6 Maintenance Procedures of Failure of Receiver mute ............................... 27

5.7 Maintenance Procedures of Failure of Headphone..................................... 275.8 Maintenance Procedures of No Vibration .................................................... 29

5.9 Maintenance Procedures of Failure of Key pressing detection ................30

5.10 Maintenance Procedures of Failure of SIM Card Recognition .................. 31

5.11 Maintenance Procedures of Failure of Camera ........................................... 31

5.12 Maintenance Procedures of FM Failure........................................................32

5.13 Maintenance Procedures of Failure of Incapable of Network Accessing 32

5.14 Maintenance Procedures of Failure of Abnormal RF Transmitting ..........32

5.15 Maintenance Procedures of Failure of Abnormal RF Receiving ...............33

Chapter 6 Appendix ..................................................................34

6.1 List of Wearing Parts ......................................................................................34

6.2 Position Diagram of Components.................................................................35

6.3 Acronyms......................................................................................................... 37


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Charter 1 General

1.1 Mobile Profile

the HUAWEI G3610 is a multi-functional, and bar qwerty type mobile phone that supports

the Global System for Mobile Communications (GSM) ,the General Packet Radio Service

(GPRS) . With an exquisite and attractive appearance, the G3610 provides various functions By

using the G3610, you can enjoy the fun of viewing images and videos anywhere and anytime. The

G3610 brings wonderfulness to your life and is your ideal choice.

G3610 functions:

Basic function: Communication, Message;

Tools: Alarm Clock, Notebook, Universal Time, Agenda, Calculator;

Entertainment: Camera, FM, Game;

Support GPRS, WAP/MMS.

1.2 Hardware Character and Index

Hardware Character

Items Description

Form bar

Dimension LxWxH1 0 6 m m * 4 6 m m * 1 4 . 2 m m

Standards G S M : 3 G P P R 9 9 & R 9 7


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Operation band G S M 9 0 0 M H z :

U p l i n k : 8 8 0 M H z ~ 9 1 5 M H z

D o w n l i n k : 9 2 5 M H z ~ 9 6 0 M H z

D C S 1 8 0 0 M H z :

U p l i n k : 1 7 1 0 M H z ~ 1 7 8 5 M H z

Downlink: 1805MHz~ 1880MHz

Data Service Support GPRS

Connectors SIM interface

Charger interface

Battery interface

Earphone interface

Memory 1 2 8 + 3 2 M b i t

Battery/ Charger Type: L iL iL i

L i -

--

- I o n

I o nI o n

I o n

Capacity: 800mAh

Stand-by Time: about 300 hours

Talk Time: about 220 minutes

LCD Type: TFT

Dimension: 1.8 inch

Color: 65K

Resolution: 128X160

Color of background light: White

FM Support

Antennas Build - in

G S M 9 0 0 / 1 8 0 0 M H z

Maximum Transmit Power G S M 9 0 0 : 3 3 d B m ( + / - 2 d B m )

D C S 1 8 0 0 : 3 0 d B m ( + / - 2 d B m )

Statistic Sensitivity G S M 9 0 0 M H z : b e t t e r t h a n - 1 0 2 d B m / 2 0 0 K H z

D C S 1 8 0 0 M H z : b e t t e r t h a n - 1 0 0 d B m / 2 0 0 K H z

Charger Input 1 0 0 V t o 2 4 0 V A C , 5 0 H z / 6 0 H z

Output 4 . 7 5 V 5 . 6 0 V

Ambient temperature Operating: - 1 0 t o + 5 5

Transportation: - 2 0 t o + 6 0

Storage: - 2 0 t o + 7 0

Ambient Humidity 5 % t o 9 5 % R h

Camera Maximum resolution C I F


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Charter 2 Product Introduction

2.1 Functional Diagram

G3610 hardware consists of Baseband and RF (Radio Frequency) two parts.

Regarding the baseband parts, the baseband chipset acts as the central control module.

Peripherals include Audio input/output device, memory device, display module, SIM card,keyboard, FM, and camera etc.. The baseband chipset can achieve the program operation,

communicate with other devices and control the other parts. Baseband chip has IQ channel input

and output and it also can control RF part transmitting and receiving.

Audio input/output devices comprise Receiver MIC which can achieve voice conversion .

Receiver and MIC are voice interface for user. MIC realizes transferring uplink voice into

electrical signals and headphone realizes transferring downlink electrical signals into voice.

Display part includes a TFT LCD. It can display various images for user and it has a parallel

data interface controlled by baseband.

FM part fulfills the Frequency Modulation broadcasting receiving. FM chipset will receiveFM signal , then demodulate RF signal to voice signal and output it to baseband.

Camera adopts 100 thousand pixels sensor. It can capture image and Video data and transfer

the image data to baseband chipset. Then baseband will accomplish the compression and storage

of images.

Memory part includes Flash memory and RAM. Flash will store the software and customer

data; RAM will be responsible as data cache for software running.

Baseband

chip

RF chip

PA SW

Keyboard

LCD

SIM

FM

I/O

connectorMemory

SAW

REC+SPK

MIC

CAMERA

Mot


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SIM card interface will be connected to customer SIM card which archieves the customer

identification, stores the customer information.

IO connector is the mobile interface for external devices such as charger, data cable

&.charging, and updating software.

RF part mainly includes RF Transceiver and RF PA Module.BB I/Q differential signals from BB chip are modulated and transmitted to RF PA by

transceiver. And then the transmitting signals, amplified by RF PA, are fed into the RF Rx/Tx

switch before being radiated by antenna.

The RF signals, received by antenna, are fed into RF Transceiver via RF Rx/Tx switch and

SAW filter. Finally the receiving signals are demodulated into I/Q signals for BB chip by

Transceiver.

2.2 Functional Module Circuit

2.2.1 Startup Procedure

Startup procedure is shown as above: press power button, PWRKEY will detect low level,

after 30ms delay, internal PMU will turn on LDOs providing to baseband; after 200ms delay, the

RESET pin of PMIC will output reset signal to baseband chip. Then baseband chip will run the

program for turn-on, the procedure is ended.

2.2.2 Baseband Part

Baseband part mainly consists of baseband chipset and storage chipset. Baseband chipset

integrates digital baseband and analog baseband and can make smaller PCB size.

Digital baseband is based on 32bit ARM7 processor, with memory chipsets external

(includes program memory and data memory) accomplishing the software operation. The digitalbaseband will complete audio encoding/decoding, channel encoding/decoding,

modulation-demodulation function and controlling the RF parts (AFC, AGC, APC). It has

abundant functional interface: LCD interface, camera interface, I2C interface, audio interface,

keyboard interface, ADC interface and interruption etc..

Analog baseband can provide the power supply, startup logic, charge management, SIM

interface, back light driving, motor driving etc..


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Baseband chipset U301 function as followed:

LCD interface

LCD interface includes 4 wires serial data bus, reset signal, SCLK, SDA, chip select, and

command/data select signal.

Camera interface

Camera interface includes SPI serial bus Sclk,SDA,CSB ,I2C bus (SCL,SDA,SSN) ,and

include Main clock, reset signal,overflow and ready singals.

Audio Interface


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Audio interface consists of output signals of receiver, two path MIC input signals (main MIC,

earphone MIC), FM audio input signals, ringtone output signals.

Keyboard interface

G3610 Keyboard matrix is 45,supporting 21 keys, including the function keys, number keys.

ADC interface

There are five ADC channels used. ADC0 is used to detect ID of various LCM; ADC2 is

delicated to detection of the press of talk-key on earphone.

Interruption

Only one interruption signals. INT0 is used to detect earphones plug-in.

2.2.3 Power, reset, clock, charge management Module

Baseband chipset U301 Analog Parts function and power managementunit as followed:


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Power circuit

PMU of MT6223D has 7 LDOs built in, providing power for every function modules.

VTCXO for Crystal Oscillator power supply: 2.8V; VCORE for digital baseband power supply:

1.8V; VIO for IOs power supply: 2.8V; VA for analog section in baseband power supply: 2.8V;

VM for Memory power supply: 2.8V; VSIM for SIM power supply: 1.8V or 3.0V based ondifferent card type.

Reset circuit

PWRKEY is connected to power key of PMU .When power key is pressed, low level

voltage will be detected on PWRKEY. Internal logical circuit will output reset signal and feed itto /SYSRST of digital baseband. Supplied with power from various LDOs, the phone will be

turned on.

Clock Circuit

Above is 32Khz clock circuit. It includes 32K crystal and coupling capacitors. 32 KHz clock

will supply the slow clock which is necessary for baseband working.


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2.2.4 Radio Frequency (RF) Module

RF module comprises of RF Transceiver and RF PA. Transceiver includes LO, receiver and

transmitter.

Transmitter

BB I/Q differential signals from the BB chip are fed into the one-pole RC low-pass filter first.Two double balanced mixers (modulators) are responsible for translating the filtered I/Q signals to

the transmitting frequencies. The transmitting signals are amplified by RF PA and radiated by

antenna finally.

ReceiverThe RF signals, received by antenna, are filtered through RF Rx/Tx switch and SAW filter

and fed into transceiver. Then the receiving RF signals are down-converted to I/Q signals by

demodulator. The I/Q signals are then filtered and amplified through a low-pass filter and a PGA

to BB chip.

Local OscillatorThe frequency synthesizer system provides the Local oscillator (LO) signals for both

receiver and transmitter. It includes PLL Calibration, RF Multi-Modulus Divider and Delta-Sigma

Modulator.Power Supply

The operation voltage of Transceiver is 2.8V. It is supplied by built-in power management

module circuit of A D 6 5 4 8 . Showing as followed:

Reference clock


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26 MHz clock signal is provided by 26MHz crystal. After entering Transceiver, the 26MHz

clock signal is amplified and divided into two parts. One as a reference frequency signal for

transceiver LO, and another as a reference clock signal for BB chip via the 22nd

pin of transceiver.

2.2.5 Peripheral Circuits Display Circuit


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Above is the partial circuit for LCD connector. LCD connector is located on main board, The

definition of interface is shown above . LCD interface is serial interface including 4 wire SPI

interface: clock,data, chip selection, data/command select and reset singal. VDD will supply

power to LCD module.LCD_BL+

LCD_BL- are positive and negative end of back light driving.

Receiver Circuit

Receiver Circuit as showed as above: REC and REC represents receiver downlink

signals output from baseband chip.

Microphone Circuit

The circuit is shown as above, MIC audio input is differential signal connecting to MIC

channel 0 of baseband chip. MICBIASP and MICBIASN represent positive/negative bias voltage.

Back Light Circuit


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As shown as above, the circuit adopts 6 backlight LEDs. Positive end is connectted to battery

voltage VBAT, and drive signal KP_LEDis supplied by PMU.

Charge Circuit

Above is the charge circuit including power PMOS and diodes.WPM2005-8/TRhas built-in

PMOS and diodes;R306 is for measuring rechargeable current. R302 R304 makes up the voltagedivider circuit.

Video Circuit


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Above figure is the camera connector circuit. Camera interface comprises SPI data bus

SDA SCLK CSB , main clock, I2C signal (SDA SCL SSN) ,reset and overflow sinal.

VDD(2.8V) are power supply for camera module.

SIM Card Circuit

As shown as above, J501 and J502 is the SIM card connectors. Interface signal comprises

data SIMIO, clock SIMCLK, and reset SIMRST, power supply VSIM. 1.8V or 3.0V SIM card

can identified automatically.

FM Circuit


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As shown as above, FM receiving chipset is RDA5802E controlled by I2C interface(GPIO47_FM_SCL GPIO48_FM_SDA). Baseband chipset provides 32Khz working clock

FM_CLK32, FM chip needs 2.8V power supply, which supplied by VDD of PMU; Earphone can

be used as FM antenna. FM_ANT will be connected to audio signal of IO connector. After FM

demodulation, FM audio signal (FM_OUTL, FM_OUTR) will output to baseband .

Audio Amplifying Circuit

As shown as above, the amplifying circuit adopts type AB Audio amplifier. Input of

amplifier is single-end audio signal and output is Differential-end. Input signal MP3_OUTR isaudio output from baseband chip and it may be voice or ringtone or FM. Power supply of Audio

amplifier is VBAT of battery.


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Chapter 3 Introduction to Functional Chips

3.1Baseband Part

3.1.1 Digital Processing Chip

MT6223D is an entry level chipset solution with class 12 GPRS/GSM modem. It integrates

analog baseband and digital baseband into one chip and can greatly reduce the component count

and make smaller PCB size. Besides, MT6223D is capable of SAIC(Single Antenna Interference

Cancellation) and AMR speech. Based on 32 bit ARM7EJ-STM RISC processor, MT6223D

provides an unprecedented platform for high quality modem performance.

MT6223Dhave powerful multimedia feature: MP3 decoding; Wavetable synthesis with up to

64 tones; FM Radio Recording; Analog multiplexer for Stereo Audio.

The MT6223D device is offered in TFBGA 9x9mm

244 BALL..

Block diagram ofMT6223D is as follows:

3.1.2 Memory Chip

The memory chip applies MCP memory TV00570002CDGBof Toshiba, including 128Mbit

NORflash and 32Mbit pSRAM. Operation Voltage: 2.8v package: TFBGA 81pin.

Block diagram of memory chip is as follows:


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3.1.3 FM Chip

FM chip uses 5802E of RDA, which is able to fulfill receiving of FM frequency modulation

broadcast with frequency band of 70 108Mhz ; Supports digital interface of I2C; Supports

stereo output and station searching automatically or manually; Supports external single-end

headphone antenna receiving with high sensitivity; the package is QFN24pin.

Block diagram of FM chip is as follows:

3.2 RF Part

3.2.1 RF Chip

AD6548 is a highly-integrated RF transceiver IC for GSM850, GSM900, DCS1800 and

PCS1900. It includes receiver, transmitter LO and on-chip LDO.AD6548 have 32 pins, apply

LFCSF PACKING.


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3.2.2 Power Amplifier Chip

RF power amplifier chip is RFMD RF7168/9, which is a transmit and receive front-end

module (FEM). The module consists of a GSM900 PA block and a DCS1800 PA block,

impedance-matching circuitry for input and output impedances, Tx harmonics filtering, high

linearity and low insertion loss PHEMT RF switches, diplexer and a Power Amplifier

Control(PAC) block

3.3 Clock

3.3.1 26MHz Clock Oscillator

The 26MHz clock oscillator is TXC of 7M26000018, which has frequency stability of

+/-10ppm and load capacitor of 11pF.


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3.3.2 32.768KHz Sleeping Clock

32.768K clock crystal is SSP-T7-F of SII, which has frequency stability of +/-20ppm and

load capacitor of 12.5pF.


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Chapter 4 Engineering & Test Mode

4.1 Engineering Mode

4.1.1 Enter/Escape Mode

Enter Mode Input #*888# on the stand-by screen and enter into engineering mode menu

View version no., sequence no., network locked status, error records, hardwarecomponent test and network parameters

Escape Mode In engineering mode, push backspace button or End button for escape. In case

network parameters is activated, close the parameters first before escape

4.1.2 Commands of Engineering Mode

Version No.: view version of software

S/N No.: sequence number of main board

Error record: display type, module and time of the latest error.

Hardware component test: carry out hardware tests for regular components

Network parameters: activate output of network parameters, which should be displayed in

stand-by screen.

Uart setting set IO port to Uart

4.2 Test Mode

4.2.1 Enter/Escape Mode Input *#7910# on the stand-by screen and enter into test mode

Escape mode continuously push End button in test mode for escape

4.2.2 Command of Test Mode

Test in turn the following components of the mobile-phone

Display Screen, Led, receiver, Headphone, Button, Vibration Microphone, Sperk,Radio,

Camera, Charge, Alarm ring


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Chapter 5 Maintenance Introduction

5.1 Maintenance introduction for Failure to power on

Procedure of power on : ensure powering the phone correctly and Battery voltage Vbat

can be ajusted to 4.0v; Press poweron key,the signal KEY_POWER_ON/OFF is pulled low ; As

soon as PMU U 3 0 1 U 3 0 1 U 3 0 1

U 3 0 1 detects the poweron signal, will open all LDO and supply power to baseband

circuit and RF Transceiver; Main clock circuit inside RF Transceiver starts to work and provides

26Mhz clock;Then slow clock of 32.768Khz starts to work; When power and clock being stable,

PMU outputs reset signal SYSRST to CPU after delay; CPU hence reads program from external

memory into internal RAM and program starts to be executed; The procedure of poweron is

fulfilled.

Maintenance Procedures of Failure to power on:

For examination of failure , first take off the battery, use external power supply for the

phone, observe the change of current during poweron process;

In case the phone can be powered on with external power supply, it should be concluded

that power supply of battery has something abnormal. Hence, check the batteryconnector J602 or battery itself for any damage;

Take out the main board of failure phone, connect power on signal (test point TP301) to

GND and observe the current :

1 In case the current is high (normally more than 1A), it shows that short-circuit exists on

main board. Then remove U301 or U101 and continue the test;

2 In case the current is less than 20mA, check whether all power supply are ok. Most

possible problem is on 26M clock circuit or baseband chip U301. Measure 26M clock

signal on 21pin of U101 to make sure.

3 In case the current is between 20 to 25mA, it is common that software has error or no

software has been downloaded. Hence, re-download the software;

4 In case the current is between 30 to 90mA, check 26M clock, 32K clock (X201),

especially check U301(baseband chip) and U501(memory) for weld defect.


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5.2 Maintenance Procedure for Failure to Charge

Failure 1: insertion of charger can't be detected.

Maintenance procedures: insert charger and check if there is charge voltage at U3023pin. In case

the result is no, it shows that IO connector J601 has weld defect; In case of yes, it shows that

charging voltage can not be provided to baseband chip U302, then change or weld U302 again.

Failure 2: Insertion of charger is detected, however, no charging current is detected and prompt

bad connecting of the charger"

Maintenance procedure: check if U302 is well welded; during charging, check U302 4pin, check


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whether voltage on the grid of PMOS is low level; check whether resistances of R302 and R304

are correct;

5.3 Maintenance Procedure for Display Failure

Failure 1: LCD display has white screen, colored dots, tearing effect;Maintenance procedure: check welding of LCD; change or weld baseband chip U301;


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Abnormal LCD

display

Check the weiding

of LCD Welding LCD

change LCDIf LCD damaged

If MCU damagedWelding or change

U301

OK

Y

Y

Y

Failure 2: LCD display is dark, no background light;

Maintenance procedure: check whether output of u301 is proper, which provides power for LCD

backlight; check welding of LCD;

5.4 Maintenance Procedures of Failure of MIC Soundlessness

Failure: The phoning partner can't hear you.

Maintenance Procedure: Check welding of Mic, change Mic for test; During normal talking, test

whether there is 2.0v bias voltage on R401 (for signal MICBIASP ); check whether there is any

device unmounted in Mic circuit; weld baseband chip U301;

5.5 Maintenance Procedures of Failure of no Vibration Ring

Failure: no ring during incoming phone call, power on/off phone, no ring when playing ringtone.

Maintenance Procedure: Check whether there is any damage with audio PA U401; When playing

ringtone, check whether there is any audio signal onC428 beside U401 , in case no, it's concluded

that baseband chip U301 has something wrong.


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N O SOUND

Check weiding

condition of speaker

Change or weld

speaker

Change or weld

speaker U401

Check if U401is

good or not

Check if input

signal of U603 is

normal

Welding or change

U301

OK

Y

Y

Y

5.6 Maintenance Procedures of Failure of Receiver mute

Failure: no voice can be heard through receiver during phone call

Maintenance procedures: Check welding of receiver ,check welding or damaged of electronic

components besides receiver; in case of both are ok, it's concluded that welding of baseband chip

U301 is not ok.

5.7 Maintenance Procedures of Failure of Headphone

Failure 1: When insert headphone, no prompt and no headphone insertion is detected.

Maintenance procedures: insert the headphone and measure whether EINT0_HEADSET signal is

at low level; in case of no, then test further whether there is false welding with diode D403 bead

B601 or IO connector.


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Failure 2: Display that headphone inserted, unable to detect plug out of headphone

Maintenance procedures: check whether EINT0_HEADSET signal is still low level, in case of yes,

check respectively short circuit with C413 C415 C602 (remove C413 C415 C602 in turn and

check if EINT0_HEADSET signal is set to high after headphone is plugged out).

Failure 3: After inserting headphone, theres prompt, however no sound in the headphone

Maintenance procedure: insert headphone and play ringtone, measure signal MP3_OUTR/L


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output from baseband chip, check in turn the signals of R408 and R409, C413 and C414,

XMP3_R/L, B601 and B602.

Failure 4: the Mic on headphone is failed.

Maintenance procedures: insert headphone, Speak to MIC during phone call and check whether

the voltage of MICBIASP signal is 2V. In case of 2V, check whether theres any signal at XMICP,

in case of yes, it shows that baseband chip U301 has weld defect.

5.8 Maintenance Procedures of No VibrationMaintenance procedures Set phone into vibration mode, measure the motor driving signal

VIB(on R310), check whether the signal is square wave; In case of no, it shows that baseband

chip U301 has weld defect; in case of yes, continue to check whether L801,C807 and D811 is

broken or weld defect. in case of both are ok,it shows that motor is broken.


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5.9 Maintenance Procedures of Failure of Key pressing detectionFailure 1 Failure of key pressing detection on main board

Maintenance procedures: first check it is single button failure or failure of a row or a column of

keys; in case of single button failure, check whether there is any foreign material on the surface of

failure keypad, then check the key Dome ; in case of failure of multiple key, check the key

scanning signal of failure keys(row or column line), the varistors to protect key sanning line may

be damaged; in case of failure of all keys, check whether any key scanning line is shorted to GND,

varistors or baseband chip U301 may have defect.


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5.10 Maintenance Procedures of Failure of SIM Card Recognition

Maintenance procedures: insert SIM card and power on the phone, measure the voltage output of

VSIM (1.8v or 3v), VSIM may be 1.8v or 3.0v according different type of SIM card. If VSIM is

normal, then check signal SIMCLK SIMRST SIMIO to see whether there is output when

phone is powered on; in case of no output, the baseband chip U301or dual sim card controller

U503 should have weld defect.

5.11 Maintenance Procedures of Failure of Camera

Maintenance procedures: first change Camera FPC to see if theres any problem with camera

module; enter into Camera previewing mode, check power supply of camera (VDD), If powersupply of camera is ok and camera cant work, the baseband chip U301 should have weld defect.


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5.12 Maintenance Procedures of FM Failure

Failure 1: FM doesn't work;

Maintenance procedures: with FM function being activated, measure wether power supply of

VDD is normal, in case of no, it shows U301 has weld defect or damage; in case of being normal,

continue to check signal FM_CLK32, if FM_CLK32 has no output from baseband chip, it also

indicates that U301 has problem; finally check FM chip U901 to find weld defect.

Failure 2: no sound can be heard from speaker or earphone when FM works;

Maintenance procedures: with FM function being activated, check audio output signal

FM_OUTL/R from FM chip U901, if the output is normal ,it indicates baseband chip U301 may

has weld defect;if signal FM_OUTL/R is abnormal , FM chip U901 may have problem, change

or weld U901.

5.13 Maintenance Procedures of Failure of Incapable of Network Accessing

Maintenance procedures: 1. Change current position of the mobile phone to an area with stronger

signals, open the machine again to see if the network is detected to eliminate problem of weak

network signal; 2. disassemble the mobile phone, check if spring plate of the antenna has goodconnection; 3. Connect the mobile phone to integrated measuring instrument to check if the RF

indicators are normal under conduction; 4. In case the RF indicators under conduction are

abnormal, calibration to the mobile phone should be done until it is ok.

5.14 Maintenance Procedures of Failure of Abnormal RF Transmitting

Failure: it is determined that RF transmitting is abnormal during calibration of the mobile phone.

Maintenance procedures: 1. Check if theres any miss paste, movement or false welding with the

components; 2. Check if working voltages of Transceiver and RF PA are normal, the working


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without permission

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voltage of Transceiver should be 2.8v (measure VDD) and that of RF PA is the battery voltage

(measure VBAT); 3. Measure if voltage of VAPC of RF PA is normal, which is about 1.4v at

maximum transmitting power; 4. Measure TX_Enable of RF PA, which should be high level

(typical voltage should be 2.8v); 5. In case all the above four procedures are normal, the problem

must be with the chip, then change in turn the RF PA, Transceiver.

5.15 Maintenance Procedures of Failure of Abnormal RF Receiving

Failure: it is determined that RF receiving is abnormal during calibration of the mobile phone

Maintenance procedures: 1. Check if theres any miss paste, movement or false welding with the

components; 2. Check if working voltage of Transceiver is normal, which should be 2.8v

(measure VDD); 3. Measure TX_Enable of RF PA, TX_Enable be low level at the moment; 4. In

case the above three procedures are normal, the chip should have problems. Then change in turn

the receiving filter, RF PA, Transceiver


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Chapter 6 Appendix

6.1 List of Wearing Parts

No. Material no. Type Material Description Order

no.

Position

no.Manufacturer

1 H Q 1 1 1 0 0 1 1 0 0 2 3 M T 6 2 2 3 D - L baseband chip 1 U 3 0 1 M e d i a T e k

2 H Q 1 1 2 3 0 1 8 0 2 9 8 W P M 2 0 0 5 - 8 / T R Mosfet(Combo Diode) 1 U 3 0 4 w i l l

3 H Q 1 1 1 6 0 1 6 0 1 1 9 S N 4 9 9 0 Audio amplifier 1 U 4 0 1 SI-EN

4 H Q 1 1 1 0 0 3 5 0 0 2 3 A D 6 5 4 8 B C P Z - R L S i n g l e c h i p G S M r a d i o 1 U 1 0 1 M e d i a T e k

5 H Q 1 1 1 2 0 3 7 0 0 3 4 T V 0 0 5 7 0 0 0 2 C D G B

M C P 2 i n 1 1 2 8 M b N O R F l a s h + 3 2 M b

P S R A M ) ( 7 0 n m )

1 U 5 0 1 T o s h i b a

6 H Q 1 1 1 4 0 0 5 0 0 2 3 M T 6 3 0 2 D u a l S I M C a r d C o n t r o l l e r 1 U 5 0 3 M e d i a T e k


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6.2 Position Diagram of Components


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6.3 Acronyms

GSM Global System For Mobile Communication

GPRS General Packet Radio Service

TFT ThinFilmTransistor

SIM Subscriber Identity Module

AFC Automatic Frequency Control

AGC Automatic Gain Control

APC Automatic Power Control

ADC Analog-to-Digital Converter

LDO Low Dropout Regulator

MCU Micro Controller Unit

g3610 maintenance material

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