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GS-401-02 GSM Platform

GSM® PlatformGSM1 Single Beam (4681A)GSM2 Dual Beam (4688A)GSM® Dispenser Single Beam (4716A)

Universal Part Number: GS 401-02Reference S-Block Configuration:GSM1 - #47576104;GSM2 - #47576504;GSM Dispenser - #47576204Issued 08/2002

GeneralSpecification

Surface Mount Division of Universal InstrumentsAutomation in Electronic Assembly

GS-401-02GSM Platform


GSM® Platform

Places the complete range of SMT components, using vision centering.

Features one or two placement heads mounted on an overhead, gantry positioning system.

Includes a user-friendly, graphical interface complete with on-line component database,CAD translation, and machine performance simulator.

Machine Highlights

Surface MountProduct Line

Surface MountProduct Line


Contents

Introduction ............................................................................................................ 1Functional Description ........................................................................................... 1Standard Features ................................................................................................... 2

Base Frame ................................................................................................. 2Positioning System/Specifications ................................................................ 2Inspection Cameras ..................................................................................... 2Vision On-the-Fly ......................................................................................... 3Standard Pattern Error Correction (PEC) Downward Looking Camera ............. 3Multi-Pattern Find ......................................................................................... 4Board Support .............................................................................................. 4Staged Board Handling (Single Lane) ............................................................ 4Nozzles ....................................................................................................... 4Nozzle Changing .......................................................................................... 4PrecisionProTM Feeder Interface ................................................................... 518-slot Modular Feeder Banks ...................................................................... 5Machine Control System Architecture ........................................................... 6Microsoft® Windows® 2000 Operating System ............................................... 6UPS+ (Universal Platform Software +) .......................................................... 7

Off-line Personal Computer Configuration ................................................ 7Optional Features ................................................................................................... 8

Component Placement Heads ............................................................................. 8FlexJet® Head .............................................................................................. 8High Force Head .......................................................................................... 8Flex Head .................................................................................................... 8

Material Dispensing Heads ................................................................................. 9Archimedes Metering Valve .......................................................................... 9Positive Displacement Head ......................................................................... 9

Feeders ............................................................................................................ 10Feeder Bank Changing ............................................................................... 10Feeder Bank Change Cart ........................................................................... 10Docking Module ......................................................................................... 10Removable Feeder Bank Storage Table ...................................................... 10Feeder Setup Cart ...................................................................................... 11Feeder Storage Cart ................................................................................... 11Scrap Bin ................................................................................................... 11Feeder Input ............................................................................................... 11

Vision/Inspection .............................................................................................. 12Upward Looking Camera ............................................................................. 12Circular Lighting Upward Looking Camera .................................................... 13On-Axis Lighting Upward Looking Camera ................................................... 13Odd Form Upward Looking Camera ............................................................. 13

Miscellaneous Hardware Options ...................................................................... 14Gripper Nozzles ......................................................................................... 14Board Handling Conveyors ......................................................................... 14Dual Lane Board Handling ........................................................................... 14Dual SMEMA ............................................................................................. 14Reject Stations .......................................................................................... 15Advanced Semiconductor Assembly Options .............................................. 15

Electrical/Power Options ................................................................................... 16Transformer ............................................................................................... 16Uninterruptible Power Supply ...................................................................... 16


Contents

Machine Level Software Options ....................................................................... 17Bar Code Product Changeover .................................................................... 17GEM .......................................................................................................... 17Platform Setup Validation ........................................................................... 17Remote Diagnostics ................................................................................... 17

Line Level Software Options ............................................................................. 18Dimensions Manufacturing Monitoring ......................................................... 18Dimensions Programming and Optimization ................................................ 19

Supporting Documents ......................................................................................... 19GSM Platform Details/Specifications ................................................................... 20

GSM Platform Supported Head Configurations .................................................. 20Global and Local Fiducial Shapes and Dimensions ............................................ 21Recommended Fiducial and Bad Mark Sense .................................................... 21Board Specifications......................................................................................... 22Board Clearance ............................................................................................... 22Board Handling ................................................................................................. 22Large Board Kit ................................................................................................ 23

Large Board Kit Configuration and Operation ............................................... 23Limitations for Board Lengths between 20" and 23" ..................................... 24Limitations for Board Lengths between 20" and 25" ..................................... 24

Rear Rail Position Location ............................................................................... 25GSM Platform Footprint .................................................................................... 26Installation Considerations ................................................................................ 27

Machine Dimensions .................................................................................. 27Service Requirements ................................................................................ 28Environmental Requirements ...................................................................... 29

Appendix A: Cameras ...................................................................................... A-30Technical Specifications ............................................................................... A-30

Appendix B: GSM Platform Feeders ................................................................ B-31Platform Tray Feeder (PTF) .......................................................................... B-31

Introduction ............................................................................................ B-31Functional Description ............................................................................ B-32Configurations ........................................................................................ B-34Available PTF Mounting Locations .......................................................... B-35Pallets ................................................................................................... B-36Tray Transport ....................................................................................... B-36Transfer Shuttle ..................................................................................... B-36PTF Options .......................................................................................... B-37

Orientation Tray Clamps ................................................................... B-37Side Discharge Kit ........................................................................... B-37Large Pocket Tray Removal Kit ........................................................ B-37Tray Removal Transfer Kit ............................................................... B-38Heavy Payload Kit ........................................................................... B-38PSV Barcode Kits ............................................................................ B-38

Technical Specifications ......................................................................... B-39Component Pick and Transfer Specifications .................................... B-39Components .................................................................................... B-40Matrix Tray ...................................................................................... B-40


Contents

Platform Tray Feeder (PTF) continued:Pallets ............................................................................................. B-41Magazine ......................................................................................... B-41Installation Considerations ................................................................ B-42PTF Service Requirements .............................................................. B-42PTF Conveyor Service Requirements ............................................... B-42Environmental Requirements ............................................................ B-42

Supporting Documents ........................................................................... B-43

Stackable Matrix Tray Feeder, Model 4556A ................................................. B-44Introduction ............................................................................................ B-44Standard Features .................................................................................. B-44Functional Description ............................................................................ B-44Technical Specifications ......................................................................... B-45Service Requirements ............................................................................ B-46

PrecisionProTM Spliceable Tape Feeders, Model 4697B .................................. B-47Introduction ............................................................................................ B-47Feeder Concept ...................................................................................... B-47Available Feeders................................................................................... B-48Functional Description ............................................................................ B-49Supporting Documents ........................................................................... B-49Technical Specifications for PrecisionPro Spliceable Tape Feeders ......... B-50Pocket Depth and Length Limitations ...................................................... B-52

Multi-Pitch Tape Feeders, Model 4697A ........................................................ B-53Introduction ............................................................................................ B-53Feeder Concept ...................................................................................... B-53Available Feeders................................................................................... B-53Functional Description ............................................................................ B-54Supporting Documents ........................................................................... B-54Technical Specifications for Multi-Pitch Tape Feeders ............................. B-55

Track Feeder, Model 4696A .......................................................................... B-57Introduction ............................................................................................ B-57Machine Concept ................................................................................... B-57Standard Features .................................................................................. B-57

Track Assembly ............................................................................... B-57Feeder Base Assembly .................................................................... B-57

Functional Description ............................................................................ B-58Technical Specifications ......................................................................... B-58

Stationary Matrix Tray Platform, Model 4649A ............................................... B-59Introduction ............................................................................................ B-59Functional Description ............................................................................ B-59Technical Specifications ......................................................................... B-59Matrix Tray Pick Limitations ................................................................... B-60

Multi-Tube Feeders, Model 4698A ................................................................. B-60Introduction ............................................................................................ B-60Standard Features .................................................................................. B-60


Functional Description ...................................................................................B-61Technical Specifications ................................................................................B-61

Bulk Track Feeder, Model 4702A ...................................................................B-62Introduction .............................................................................................B-62Machine Concept ....................................................................................B-62Standard Features ...................................................................................B-62Functional Description .............................................................................B-63Component Specifications .......................................................................B-63Technical Specifications ..........................................................................B-63

Appendix C: UPS+ Software .............................................................................C-64Technical Specifications ................................................................................C-64Basis Features ..............................................................................................C-64New Features ................................................................................................C-65

Multiple Language Support ......................................................................C-65Expanded System Security .....................................................................C-65Internet Driven Hyperlinks Directly to Universal ........................................C-65On-line Documentation ............................................................................C-65Detailed Event Messages ........................................................................C-65Detailed Error and Warning Messages .....................................................C-66Advanced Product Editor .........................................................................C-66UPS+ Component Database ....................................................................C-66Customizable User Interface ....................................................................C-67Operator Interface and Production Setup Tools ........................................C-67Auto-Pick Coordinate Update ...................................................................C-67Skip Component Quick Bypass ...............................................................C-67Management Information System ............................................................C-68True-to-scale Configuration Graphics .......................................................C-68Diagnostics Tools ...................................................................................C-68

Appendix D: Placement Heads ..........................................................................D-69Component Handling Capabilities ...................................................................D-69Placement Throughput Specifications ............................................................D-70Component Placement Heads ........................................................................D-71

FlexJet Head ..........................................................................................D-71Flex Head and High Force Head ..............................................................D-72

Material Dispensing Heads (GSM1 only) ........................................................D-73Archimedes Metering Valve .....................................................................D-73Positive Displacement Pump ...................................................................D-74Dispensing Nozzle Tooling Configurations ................................................D-75

Appendix E: Odd Form Assembly Capabilities .................................................E-76Introduction ................................................................................................... F-76Applications .................................................................................................. F-76

Components ............................................................................................ F-77Component Tolerances ............................................................................ F-79High Force Head ..................................................................................... F-79Speed ..................................................................................................... F-79Vision-On-the-Fly .................................................................................... F-80Odd-Form Feeders .................................................................................. F-80Cameras ................................................................................................. F-80Passive Clinch Option ............................................................................. F-80

Contents


Appendix F: Board Handling ............................................................................. F-81Dual Lane Board Handling .............................................................................. F-81

First In First Out (FIFO) Mode ................................................................. F-81Dynamic Mode ........................................................................................ F-81Technical Specifications .......................................................................... F-82

Maximum Board Width Configuration ................................................. F-82Dual Lane Board Handling ................................................................. F-82

Appendix G: GSM Platform Traceability ........................................................... G-83Bar Code Changeover Option ........................................................................ G-83

Introduction ............................................................................................ G-83Restrictions/Limitations .......................................................................... G-84Bar Code Types ..................................................................................... G-85

Platform Setup Validation (PSV) Option ........................................................ G-86Introduction ............................................................................................ G-86PSV Specifications ................................................................................ G-86PSV on PTF Assumption and Limitations ............................................... G-87

GEM Host Interface Driver ............................................................................ G-87Dimensions Manufacturing Monitoring ........................................................... G-88

Contents


All specifications are subject to periodic review and maybe changed without notice. Illustrations may not bedrawn to scale.

Universal Instruments Corporation, 2002. All rightsreserved.

Universal, the circle "U", the Universal logo, GSM Platform and Applied ConveyorEngineering are registered trademarks for products and services of UniversalInstruments Corporation. GSM1, GSM2, and FlexJet are trademarks forproducts of Universal Instruments Corporation.

Ethernet is a trademark of Xerox Corporation. Intel is a trademark of IntelCorporation. OS/2 is a registered trademark of International Business MachinesCorporation.

Acronym/Term MeaningAC Alternating Current: type of electrical power generationAPE Advanced Product Editor (Universal brand name)ASCII American National Standard Code for Information InterchangeAWG American Wire Gauge: wire size standardCAD Computer-Aided DesignCD-ROM Compact Disc-Read Only MemoryCE Conformité Europeanne: European safety standardCFM Cubic Feet per Minute: measurement of air flowCPH Components per HourCTA Component Transfer AssemblyDC Direct Current: type of electrical power generationEIA Electronic Industries Alliance: Industry Standards OrganizationGEM Generic Equipment ModelGS General Specification (Universal brand name)GUI Graphical User InterfaceHSMS High Speed SECS Message Service: implements SECS2 messaging over a network linkHz Hertz (cycles per second): measurement of electrical frequencyI/O Input/OutputIEC International Electrotechnical Commission: Industry Standards OrganizationIP Index of Protection: resistance of machine to contamination by foreign objectsIPC IPC: Industry Standards OrganizationJEDEC JEDEC Solid State Technology Association: Industry Standards OrganizationLED Light Emitting Diode: electrical componentMIT Machine Interface Translator (VME to I/O bus)MMIT Mini Machine Interface Translator (VME to I/O bus)OS/2® Operating System 2 (IBM Corp. brand name)P.C. Personal ComputerPCB (or PC board) Printed Circuit BoardPPM Parts Per Million: measurement of machine performanceSCFM Standard Cubic Feet per Minute: measurement of air flowSECS Semiconductor Equipment Communications Standard: interface between host computer and assembly

machinesSEMI Semiconductor Equipment & Materials InternationalSMC Surface Mount ComponentsSMEMA Surface Mount Equipment Manufacturers AssociationTCP/IP Transfer Control Protocol/Internet Protocol: network communication protocolUICS Universal Instruments Control Software (Universal brand name)UPS Universal Platform Software (Universal brand name)VA Volt-Amps: measurement of electrical power consumptionVAC Volts Alternating CurrentVDC Volts Direct CurrentVGA Video Graphics Array: type of CRT monitor standardVME® Versa Module Eurocard (Motorola brand name): industry standard for 32-bit computer bus

Glossary of Acronyms and Specialized Terms

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IntroductionUniversal's GSM® Platform is a cartesian/overhead gantry-styleSurface Mount Technology (SMT) placement system specificallyengineered for application flexibility and long-term reliabililty. Itis capable of placing a wide range of SMT devices such as:

• Chips• Fine pitch components• Area-array components (flip chip, BGA, CCGA)• Odd form components (connectors, snap-in parts)

The GSM Platform can also dispense materials used in printedcircuit board assembly such as adhesive and solder paste. It alsomeets the accuracy requirements for some semiconductor as-sembly applications.

The GSM Platform is a member of Universal Instruments' familyof integrated assembly solutions. The GSM Platform includes aCE Cover Package with full CE Compliance that utilizes the fol-lowing:

• Side covers on the inside of the machine near the feederbanks

• 72 Feeder Blanks for installation in slots without feeders• Interlocked feeder banks to prevent feeder bank change

during production when the bank change option in installed.• Interlocked Lower Lexan Cover• Cover shrouds around board handling openings

Functional DescriptionThe single-beam GSM Platform (GSM1) uses a placement headto pick SMT components from various feeder locations, vision-inspects them on-the-fly, and places them on a printed circuitboard (PCB). The GSM1 can be fit with a dispensing head forapplications requiring adhesives, solder paste, and other approvedviscous materials.

The dual-beam GSM Platform (GSM2) uses a placement headmounted on each beam to pick components from various feederlocations. The first head, mounted on the inside of the rear beam,has access to feeders located on the rear feeder bank; the sec-ond head is mounted on the inside of the front beam and has ac-cess to components located on the front feeder bank. The com-ponents are vision inspected on-the-fly, and placed on the board.While one head is placing components, the other head is pickingcomponents.

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Base Frame

Standard FeaturesBase Frame

The GSM Platform's base frame is designed and manufacturedto exact tolerances. All major subassemblies are edge-justifiedand dowel-pin registered to precision-milled, datum surfaces ma-chined into the base frame. This ensures that the positional rela-tionships are held mechanically, not through adjustment.

Positioning System

The overhead, gantry-style system utilizes one (GSM1) or two(GSM2) X-axis beams and linear scale encoders. The drive sys-tem uses brushless, DC servo motors for optimum accelerationand deceleration.

GSM1 Platform Positioning System SpecificationsX Axis Travel 727.46 mm (28.640")

Y Axis Travel 1073.15 mm (42.250")

Resolution (2.5 micron scale) 0.0025 mm (0.0001")

GSM2 Platform Positioning System SpecificationsX Axis Travel (both beams) 727.46 mm (28.640")

Y Axis Travel (front beam) 720.73 mm (28.375")

Y Axis Travel (rear beam) 762.00 mm (30.000")

Resolution (2.5 micron scale) 0.0025 mm (0.0001")

Inspection Cameras

The GSM Platform supports two Upward-Looking Cameras(ULC), one in the front feeder area and one in the rear. Twocameras reduce travel distance to the camera and allow theGSM Platform to efficiently handle a greater range ofcomponents. The FlexJet Placement Head incorporates an on-the-head-camera using CCD arrays.

Refer to Appendix A, Cameras for information on selecting theappropriate cameras.

Circular LightingUpward Looking

Camera

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Vision On-the-Fly

For component images capable of being captured in a single-field-of-view (generally up to 32 mm (1.25") square), the GSMPlatform performs inspection on-the-fly, without stopping over aULC. While the placement head passes over the ULC, compo-nent images are captured, and placement occurs at vision-ad-justed (where necessary) coordinates.

The GSM Platform can inspect larger components (up to 50 mm)by using a ULC capturing multiple fields-of-view. The placementhead remains over the ULC long enough to capture the requirednumber of component images to ensure accurate placement.

Refer to Appendix A, Cameras, for detailed information.

Standard Pattern Error Correction (PEC)Downward Looking Camera

Fiducials register the board in the machine and compensate forlinear board distortions. Local fiducials are used to measure localboard distortion. The PEC camera is used to inspect fiducials,pad sites, and bad sense marks on the PC board prior to place-ment. Fiducial inspection information is then used to correctcomponent placement locations for X, Y, and Theta shifts relatedto board location as well as linear board distortions such asstretch, shrink, and non-orthogonality.

The downward-looking pattern error correction (PEC) fiducial in-spection camera is mounted under the beam. The field of viewfor this 0.8 mil per pixel camera is approximately 10.16 mm x7.62 mm (0.400" x 0.300") and can also utilize a Bad Mark Sensefeature (programmable in the Product Editor). See TechnicalSpecifications section for more information about fiducials andthe Bad Mark Sense feature.

The PEC camera is also used for enhanced board setup, feederteach, and various machine setup procedures. One PEC camerais mounted under each beam of the GSM Platform's overheadgantry positioning system (GSM1 Platform has only one beam).

Standard PECDownward Looking

Camera

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Multi-Pattern Find

This vision tool expands the GSM Platform's ability to find andorient components for placement. It uses pattern recognition tocenter components. The patterns, in decreasing order of accu-racy, are circle, square, Swiss cross, diamond, and corner. Threepatterns toward the extremities of the component are recom-mended.

Board Support

This equipment minimizes the effects of board warp, sag, and/orflex by supporting the board during component placement. Theboard support uses a grid pattern containing removable pins.

Staged Board Handling (Single Lane)

While one board is being populated, the next board is bufferedwithin the GSM Platform's board handling system, which featuresautomatic width control based on programmed board parameters.Board transfer capabilities include left-to-right, pass through, andright-to-left. Mechanical board stops are standard and accommo-date unique board shapes.

Nozzles

The GSM Platform comes equipped with a standard configura-tion of nozzles, depending on the placement head selected at thetime of machine order. Universal offers nozzles for most SMTcomponents, and regularly develops new nozzles to meet specificcustomer requirements. Contact your Universal Sales Engineerfor details.

Nozzle Changing

Programmed nozzle changers accommodate components of vari-ous sizes and with different vacuum requirements.

Component Shape

Patterns

Staged Board Handling

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PrecisionProFeeder Interface

PrecisionPro™ Feeder Interface

The GSM Platform includes the PrecisionPro™ Feeder Interfacefor PrecisionPro Tape Feeders, and Feeder Bank Change sup-port. The PrecisionPro Feeder Interface incorporates the follow-ing features:

• 3-point location on 8 mm and 12 mm feeders for improvedpick performance when using PrecisionPro Tape Feeders

• 42V DC drive voltage for faster index rate of PrecisionProTape Feeders and improved throughput

• Self-ID control with feeder serial number tracking• Support for future Dual Lane 8 mm Tape Feeders• Support for PrecisionPro Tape Feeders, and all previous

generation Multi-Pitch and Pneumatic Tape Feeders.Note: 24V Transformer Kit required for Multi-Pitch TapeFeeder (Model 4697A) Support.

• Support for new 18-Slot Feeder Banks.

See page Appendix-B, GSM Platform Feeders, page B-47for details.

18-Slot Modular Feeder Banks

Up to four 18-slot feeder banks may be installed on the base ofthe machine in either the inside or outside position. The inside po-sition allows two 18-slot feeder banks to be positioned side byside, allowing 36 usable feeder slots on each side of the machineproviding up to 72 usable feeder slots.

The outside position allows two 18-slot feeder banks to be posi-tioned 80 mm apart to provide four open slots between them forthe installation of an Upward Looking Camera. In the outsideposition, the two feeder slots located in the outer positions in bothbanks are not accessible for feeder installations. Feeder slotnumbering labels are located above the feeder bank area on theGSM Platform cover that is directly above the feeders (no num-bering labels reside on the feeder banks).

18-Slot modular feeder banks can be used with or without Up-ward Looking Cameras. ULC requires 2 or 3 feeder slots fromeach bank, reducing the total available slots per side (front orrear) as follows:

With Standard ULC: 32 Available SlotsWith Circular Lighting ULC: 30 Available SlotsWithout ULC: 36 Available Slots(Spacing between feeder slots = 20 mm.)

Outside Feeder BankConfiguration with ULC

Inside Feeder BankConfiguration with no ULC

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Machine Control System Architecture

• VME (Versa Module European) Bus• Intel® Pentium III 400Mhz embedded CPU, with on

board Ethernet controller, and 256 MB RAM

• IDE hard disk drive

• Motorola Power PC 266 Mhz machine controller

• Motorola 68000 series-based motion controllers

• CD-RW (Read/Write) Drive

Microsoft® Windows® 2000 OperatingSystem

The GSM Platform uses Microsoft's Windows 2000 operatingsystem. Windows 2000 provides:

• Simple and widely supported network connectivity• Expanded system security controls• Easy data transfer and manipulation• Multiple language support• Better software development and test tools

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UPS+ (Universal Platform Software +)

Universal's UPS+ Software represents the first GSM Platformsoftware offering to run on the Microsoft® Windows® 2000 oper-ating system. It provides state-of-the-art programming, opera-tion, and diagnostic tools for use with the GSM Platform.

Basic features of UPS+ include:

• Microsoft Windows 2000 operating system.• Graphic user interface with icons and machine status

messages• Graphical pattern programming tools with spreadsheet-style

data entry• Networkable component and nozzle databases• User configurable optimization aid• Comprehensive data import/export• Powerful query tools• Programmable feeder templates• On-the-fly vision inspection, using cutting-edge ESI™ vi-

sion engine technology• Enhanced Product Setup, simplifying component and board

programming by teaching images• Powerful diagnostic and manual axis control tools• On-line documentation

UPS+ can be run on an off-line personal computer (PC) for con-venient programming.

Recommended off-line PC configuration:

• Microsoft Windows 2000 operating system• 10 GB available hard diskspace• Pentium 4 1.4 Ghz processor• 256 MB RAM

Minimum off-line PC configuration:

• Microsoft Windows 2000 operating system• 4 GB available hard disk space• Pentium III 400 Mhz processor• 128 MB RAM

Refer to Appendix C, UPS+ Software for detailed information.

UPS+ GraphicalUser Interface

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Component Placement Heads

FlexJetHead

FlexJet® Head

The FlexJet Head offers the best mix of flexibility and speed formost surface mount applications. The head accommodates highspeed chip and fine pitch component placement from 0402 chipsto 50 mm square components. It uses seven on-the-head cameraCCDs to inspect components up to 24 mm square during travelto the PCB, thus eliminating the need for a separate UpwardLooking Camera inspection step. Larger components up to 50mm square are inspected using an Upward Looking CameraStation to perform “vision-on-the-fly.” Seven spindles arearranged in 20 mm spacing for full gang picking from 8 mm and12 mm feeders.

High Force Head

The High Force version of the GSM 4-Spindle Flexible Pick andPlace Head accommodates the broadest range of components onthe GSM Platform. The higher placement force range of 175 gto 2500 g accommodates placement of flip-chip (C4), and Odd-Form components (axial, radial, headers, connectors, snap-in-devices, etc.) as well as the full range of standard surface mountdevices. Low placement force special applications down to 50grams are also available with the High Force Head. 4 spindlesare arranged in 40 mm spacing for full gang picking from 8, 12,16, 24, and 32 mm feeders. Each spindle accepts a wide varietyof placement nozzles including grippers to accommodate thebroadest range of components and applications. Visioninspection requires an Upward Looking Camera station.

Flex Head

High Force Head

Flex Head

The GSM 4-Spindle Flexible Pick and Place Headaccommodates the full range of surface mount components from0402 Chips to 304-pin fine pitch Quad Flat Pack components tolarge CCGA and BGA area array devices. 4 spindles arearranged in 40 mm spacing for full gang picking from 8, 12, 16,24, and 32 mm feeders. Each spindle accepts a wide variety ofplacement nozzles, including grippers, to accommodate thebroadest range of components and applications. Visioninspection requires an Upward Looking Camera station.

Optional Features

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Archimedes Metering Valve

The Archimedes Metering Valve (AMV) dispense head featuresdirect drive technology, which effectively eliminates unevenclutch application times resulting in dot diameter variations. TheAMV is based on rotary screw technology, offering precise con-trol that enables multiple dot sizes with each spindle. It is theideal choice for solder paste and silver filled epoxies and otherparticle suspensions.

The AMV offers excellent flexibility in dot size and materialrange, and is the perfect choice for high mix, high changeoverproduction lines where constant dot adjustments are occurring.

Positive Displacement Pump

The Positive Displacement Pump (PDP) dispense head uses fourindependently controlled pumps, each fed by its own syringe toaccurately dispense material onto the board. Positive displace-ment pumps ensure high quality, repeatable dots in a variety ofambient conditions and material types.

At specified throughput of 43,000 dots per hour, the GSM Plat-form can keep up with your chipshooter with no performancedegradation as syringe levels, viscosity, or the adhesive typechanges.

Pumps and syringe holder assemblies are quickly removed foreasy maintenance at a programmable location.

See Appendix D, Placement Heads for complete details re-garding heads for the GSM Platform.

1 Material dispensing is only available on the single-beam GSM Platform (GSM1)

ArchimedesMetering Valve

(GSM1 only)

PositiveDisplacementPump Head

Material Dispensing Heads1

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Feeder Bank Change Cartwith removable feeder

bank

Docking Module

Feeder Storage Table

Feeders

Feeder options include bulk feeders, tape feeders, track feeders,multi-tube feeders, and matrix tray feeders.

Refer to Appendix B, GSM Platform Feeders for detailed in-formation.

Feeder Bank Changing

Feeder Bank Change option reduces changeover time by swap-ping up to 18 feeders at one time by one operator. Feeder BankChange requires at least one Feeder Bank Change Cart, and onedocking module per feeder bank. One additional feeder bank perdocking module, and at least one Feeder Setup Table are recom-mended for effective Feeder Bank Change operation. FeederBank Change also requires the rear feeder plate to be in the Out-bound position. See page 25 for details.

Feeder Bank Change Cart

The rolling Feeder Bank Change Cart is used for feeder bank in-stallation, removal, or transport only. Only one feeder bank oneach side of the machine (front or rear) may be serviced at onetime. Insertion or removal of a feeder bank requires the machineto be in a stop condition.

A 1524 mm (5.0') aisle space is required to properly maneuverthe feeder bank change cart and service feeders. This equatesto 4389 mm (14.4 ') minimum machine spacing from front boardhandling fixed rail to rail. See page 27 for dimensional drawing.

Docking Module

A Docking Module is required to enable feeder bank change oneach feeder bank. Any combination of the 4 feeder quadrantsmay be fitted with docking modules.

Removable Feeder Bank Storage Table

The feeder bank storage table provides off-line storage for twofeeder banks with or without feeders. The feeder storage tablecan be used for off-line feeder bank setup to minimize job changetime.

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Feeder InputNumber of Feeder Slots Used

(Total Available = 721)

Tape Feeders 8 mm & 12 mm 1 slot16 mm, 24 mm, 32 mm 2 slots44 mm 3 slots56 mm 4 slots72 mm 5 slots88 mm 6 slots104 mm 6 slots120 mm 7 slots

Track Feeder 3 slots

Multi-Tube Feeder (MTF) 40 mm 2 slots50 mm 3 slots

Platform Tray Feeder (PTF) zero or 8 slots2

Stackable Matrix Tray 9, 12, or 16 slots

Stationary Matrix Tray Feeder 8 or 9 slots

Odd Form Feeders 2-8 slots

Component Reject Station 3 slots

Standard Lighting Upward Looking Camera 4 slots

Circular Lighting Upward Looking Camera 6 slots

1 Maximum available feeder slots without upward looking cameras. RequiresFlexJet Head.2 PTF shuttle belt can be mounted in the "between rails" position, whichconsumes zero feeder slots. Maximum board width is reduced. See Page B-35 for details.

Feeder Setup Cart

This CE-compliant cart reduces production delays associated withfeeder replenishment since feeders are easily prepared for use off-line. This cart also increases GSM Platform utilization by allowingfor off-line feeder setup. A lower-cost table top version is alsoavailable.

Feeder Storage Cart

This cart reduces product changeover delays and improves work-place appearance by storing idle 8 mm tape feeders in one con-venient location. Each cart holds up to 132 feeders.

Scrap Bin

The rolling tape scrap bin provides a means of collecting tapescrap during production. Up to four scrap bins may be positionedat the GSM Platform, one for each feeder bank.

Feeder Storage Cart

Feeder Setup Cart

Scrap Bin

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Vision/Inspection

FlexJet On-the-Head-Camera

The FlexJet On-The-Head-Camera incorporates a 2.6 mil perpixel component inspection camera that includes Front (45o), Side(5o), and On-Axis lighting programmable on a spindle specific ba-sis.

During component inspection, the mirror cycles into position andillumination is applied. Seven individual spindle CCDs capturecomponent inspection images through a series of mirrors andsend them to the ESI® vision engine for processing while theFlexJet head travels to the placement site on the PC board.

The following limitations apply to FlexJet On-The-Head-Camerainspection:• Maximum component Length and Width = 25 mm

Maximum component height = 11.68 mmLarger components require an optional Upward LookingCamera

• FlexJet can be configured to use the On-The-Head-Cameraor an Upward Looking Camera station. Some componentsmay require an Upward Looking Camera

• FlexJet On-The-Head-Camera does not support BackLighting

Upward Looking Camera

Provides ideal inspection capabilities of 2-dimensional or flatcomponent features associated with most standard surface mountdevices. Front lighting is achieved by strobing inner LED banksas the vision system captures the front image of the componentusing Vision-On-The-Fly technology for components that fit intoa single field of view. Larger components are inspected usingmultiple images. Back lighting is achieved by actuating andstrobing two back lighting LED bank towers, which illuminateBack Lighting nozzles to form a silhouette image. Standard Up-ward Looking Cameras consume four feeder slots.

Standard UpwardLooking Camera

Front Lighting

Back Lighting

On-AxisSide (5o)Front (45o)

CCDCamera

HeadOutlin Spindle

Component

StationaryMirror

CameraLens

ShuttlingMirror Path

PatentPending

FlexJet On-The-HeadCamera

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Circular Lighting Upward LookingCamera

Provides inspection capabilities of BGA and components with 3-dimensional, spherical, or dome-shaped leads or features that re-quire illumination from all sides to produce a circular image. The360o side lighting illumination also reduces the possibility of illumi-nating the body of the component. This gives the necessary con-trast between the lead feature (solder ball) and background(component body) required for reliable BGA missing ball detec-tion and pitch inspection performance. The following limitationsapply to Circular Lighting Cameras:

• The 360o lighting scheme prevents the use ofbacklighting

• The camera body consumes six feeder slots

On-Axis Lighting Upward LookingCamera

On-Axis Lighting upward-looking camera provides ideal inspec-tion capabilities of large BGA, CCGA, and components withhighly specular lead finishes such as palladium leaded devices.1

The camera strobes LED banks that are positioned nearly paral-lel with the horizontal axis to illuminate directly at component fea-tures. On-Axis Lighting Cameras are available in Standard andCircular Lighting camera bodies.1Limitations apply to backlighting. Consult a Universal Sales Engineer.

Odd Form Upward Looking Camera

This camera provides vision assisted placement for odd form andlight electromechanical assembly components. Available in astandard magnification of 4 mil/pixel, it employs a special “cone”cover to concentrate LED illumination at the ends of odd formcomponent leads. The cone opening is 1.125" in diameter.

See Appendix E, Odd Form Assembly Capabilities for de-tailed information related to the GSM Platform's Odd Form As-sembly capabilities.

Circular LightingCamera

On Axis Lighting Camera

LensCover

Camera Cover

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Dual SMEMA

Dual SMEMA is designed to enhance dual lane board handlingflexibility and control. With Dual SMEMA, you can choose theboard handling features that best meet your production needs.

Gripper Nozzles

Gripper tooling is used for components with no flat surface forvacuum picking. Ribbon cable connectors, inter-board headers,and potting forms are examples of the components handled bythis tooling. The gripping action is accomplished using the samevacuum and air kiss as the standard nozzle tips. An adjustablegripper nozzle is also available to handle various componentwidths. The quick change gripper tooling is compatible with op-tional nozzle changers. Each application requires specific tooling.

Contact a Universal Sales Engineer for evaluation of your appli-cation.

Board Handling Conveyors

Universal can provide a variety of board handling and conveyorsolutions for board transport between individual machines withina system. Contact your Universal Sales Engineer for details.

Dual Lane Board Handling

While one board is being populated, another board is bufferedwithin an alternate lane. After a board is populated, processingimmediately begins on the alternate lane’s board. This actionminimizes board transfer time.

See Appendix F, Board Handling for detailed information onDual Lane Board Handling.

Dual Lane BoardHandling

Fixed GripperNozzle

Quick ChangeGripper Nozzle

Miscellaneous Hardware Options

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Reject Stations

Component Reject Stationfor components up to 50.8 mm square:(GSM2 requires 2 stations—front and rear)

Reject Conveyor: Two modes of operation move rejectedcomponents away from the GSM Platform placement head:

• Programmable indexing cycles components until the sensor is interrupted, stopping the machine

• The belt moves continuously, moving components off the end

Vibratory Reject: Components are moved away from the GSMPlatform placement head for manual removal.

Matrix Tray: The stationary matrix tray feeder can beused as a reject matrix for valuable components.

Advanced Semiconductor AssemblyOptions

Universal’s GSM Platform meets the accuracy requirementsnecessary for the placement of area array components and somesemiconductor assembly applications.

Because these processes often require an advanced level ofcomponent and application process engineering, the hardware/software package of each GSM Platform intended for use inarea array and semiconductor applications must be evaluated byUniversal Instruments.

For more information on GSM Platform area array and semicon-ductor assembly capabilities, please consult your Universal SalesEngineer.

Refer to GS-404-xx, Advanced Semiconductor AssemblySystems, for details about Universal's Advanced SemiconductorAssembly capabilities.

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Electrical/Power Options

UninterruptablePower Supply

Transformer

This item allows for the conversion of input power sources to themachine requirements. Consult a Universal Sales Engineer todetermine the correct transformer for your requirements.

Uninterruptible Power Supply

The optional Uninterruptible Power Supply provides filtered,stable, and continuous power of the 230 VAC to the machine.When this unit detects a power interruption, its fully-charged bat-tery can run the machine for up to 10 minutes. This allows timefor a controlled manual shutdown of the machine.

The Uninterruptible Power Supply is offered in two sizes:• 12 KVA can support one GSM Platform and one Plat-

form Tray Feeder (PTF)• 18 KVA can support up to two GSM Platforms and two

PTFs

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Bar Code Product Changeover

The Bar Code Product Changeover option allows for seamlessproduct changeover without requiring the user to manually loadthe product data or press the start button.

See Appendix G, GSM Platform Traceability, for more infor-mation about Bar Code Product Changeover.

GEM

The Generic Equipment Model (GEM) software driver coupledwith a host software application such as Dimensions™ Manufac-turing Monitoring (see page 18), provides a set of communica-tion, data collection, command, and control tools for the GSMPlatform. This software driver, based on the SemiconductorEquipment and Materials International standard, SEMI E30-93,opens the system architecture for integration into factory datacollection and automation systems.

Platform Setup Validation (PSV)

This feature ensures correct component-to-feeder slot relation-ship for tape feeders with an integrated bar code validation pro-cess, which provides component level tracking through a historyfile.

See Appendix G, GSM Platform Traceability for more infor-mation on PSV.

Remote Diagnostics

Remote diagnostics allows Universal support personnel to viewUPS+ screens, transfer files, and interpret diagnostic messagesfrom Universal's headquarters in Binghamton, New York, USA.This feature provides an enhanced level of technical support anddecreases service and troubleshooting cycle times for GSM Plat-forms.

Machine Level Software Options

Bar Code Product Changeover

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Dimensions Manufacturing Monitoring

Universal Instruments’ Dimensions Manufacturing MonitoringSoftware (DMM) is a host software application designed to col-lect and store machine management data from production floorequipment. DMM collects, archives, displays and derives datarelative to the needs of the end user. The DMM application isbrowser based to eliminate IT concerns of supporting client sideapplications. All access to data tables and viewable displays areadministered by the end user.

DMM accommodates multiple and/or unique combinations ofequipment without additional programming by utilizing built in con-figuration wizards. This feature reduces the time typically associ-ated with adding, reconfiguring or removing data collection nodes(machines) from the host architecture. DMM supports multi-ven-dor equipment by using the SECS/GEM communications standardadopted by the electronics manufacturing industry.

The DMM architecture is based upon a multitiered software andhardware configuration solution. Increasing software capabilitiesare introduced as modules of functionality and are determined bythe requirements of the end-user. Capabilities range from basicdata collection and reporting to full-scale traceability, SPC andenterprise level administration. DMM can be utilized as an iso-lated LAN within the production environment or it can be fully in-tegrated into an existing network scheme. Reference DMMGeneral Specification GS-405-xx for details.

Line Level Software OptionsDimensions® Manufacturing AutomationSoftware Suite

Dimensions ManufacturingMonitoring Factory View

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Dimensions Programming andOptimization

Dimensions Programming and Optimization (DPO) software pro-vides one point of data entry, a common interface acrossmachine types, and a consistent process to generate productionand setup data for one or more assembly lines, with any combi-nation of GSM Platforms and HSP Machines or for single ma-chines. It also offers sharing of component and feeder informa-tion across multiple DPO systems.

The DPO software is an independent application and can be inte-grated with other products in the Dimensions Manufacturing Au-tomation Software suite. Dimensions Programming and Optimiza-tion Software provides a single programming and line optimizationprocess for Universal surface mount assembly lines.

Line Level Software Options (continued)

Dimensions Programmingand Optimization Presents

Line Balance Results

Supporting DocumentsAppendix A CamerasAppendix B GSM Platform FeedersAppendix C UPS+ SoftwareAppendix D Placement HeadsAppendix E Odd Form Assembly CapabilitiesAppendix F Board HandlingAppendix G GSM Platform TraceabilityIPC Institute of Printed CircuitsSMEMA Surface Mount Equipment Manufacturers

Association

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GSM Platform Supported HeadConfigurations

1GSM Dispenser Configuration does not support cameras, feeders, andnozzle changers. All other configurations support all available camerasand existing tape, track, and stationary feeders. Contact your UniversalSales Engineer for details about other peripheral equipment support.

GSM 1 GSM 2

Beam #1(front)

Beam #1(rear)

Beam #1 Beam #2

FlexHead

NoneFlexHead

FlexHead

FlexHead

FlexHead

FlexHead

High ForceHead

FlexJetHead

NoneFlexJetHead

FlexJetHead

FlexJetHead

High ForceHead

FlexJetHead

High ForceHead

High ForceHead

NoneHigh Force

HeadFlex

Head

High ForceHead

FlexJetHead

High ForceHead

High ForceHead

High ForceHead

High ForceHead

FlexJetHead

Archimedes

FlexHead

Archimedes

None Archimedes

NonePositive

Displacement

FlexJetHead

PositiveDisplacement

FlexHead



None1

Archimedes None1

GSM Platform Details/Specifications

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Global and Local Fiducial Shapes and DimensionsShape D1 D2Disc Min=0.40 mm (0.016") —

Max=6.10 mm (0.250")

Swiss Min=1.02 mm (0.040") Min=0.508mm(0.020")Cross Max=6.35 mm (0.250") Max=5.84 mm(0.230")

Rectangle Min=0.40 mm (0.016") Min=0.40 mm (0.016")(Square) Max=6.35 mm (0.250") Max=6.35 mm (0.250")

Double Min=1.0 mm (0.040") Min=1.02 mm (0.040" )Box Max=6.35 mm (0.250") Max=6.35 mm (0.250")Left orRight

Diamond Min=1.0 mm (0.040") —Max=6.35 mm (0.250")

Plus Min=0.762 mm (0.030")Min=0.762 mm (0.030")Max=N/A Max=N/A

Recommended Fiducial and Bad Mark SenseUniversal recommends that a minimum of three global fiducials be used forboards assembled on the GSM Platform—two to six fiducials depending on theprocess. Although the GSM Platform handles a range of fiducial types, themost reliable fiducial recommendations follow:

Shape Disc (solid, filled circle)

Size Minimum -- 0.8 mm (0.032")Maximum -- 3.00 mm (0.118")

Tolerance 0.025 mm (0.001")

Clearance The fiducial clearance area must be at least twotimes the diameter of the fiducial

Material Bare copper or copper covered with either clearanti-oxidation coating, nickel plating, tin plating,or hot air leveled solder coating.

Flatness The fiducial surface should be flat within0.015 mm (0.0006" )

Mask Solder resist coatings should not cover a fiducialmark or its clearance area.

D2

D1

D1

D2

D1

D2

D1

D1

D2

D1

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Board SpecificationsMinimum Maximum

Length 50.8 mm (2.00") 635.0 mm (25.00")1

Width 50.8 mm (2.00")2 508.0 mm (20.00")3

Thickness 0.508 mm (0.020")4 5.08 mm (0.200")

Weight — 2.72 kg (6.0 pounds)5

Allowable Warp For board transfer: 5.537 mm (0.218") minusboard thickness

For placement: 0.75% of board length(as per IPC-2221), notto exceed 3.175 mm(0.125") total

1 Standard tooling accommodates board length up to 508.0 mm (20"). Anoptional Large Board Kit increases maximum board length to 635.0 mm(25"). Limitations apply. Special applications are available for boards up to812.8 mm (32") x 508.0 mm (20"). Consult a Universal Sales Engineer fordetails.2 The component reject bin must be relocated and one mechanical boardstop must be removed to accommodate board width between 50.8 mm(2") and 88.9 mm (3.5"). Software reconfiguration is required.3 A maximum board width of 457.2 mm (18.00") includes nozzle changersmounted between the rear feeder plate and the staged board handlingsystem. An optional Large Board Kit increases maximum width to 508.0mm (20"). Limitations apply. See large board kit specs for details.4 Minimum board thickness specification applies only to boards up to 508mm (20.00") in length.5 Represents the sum of all board weights within the GSM Platform boardhandling system and components placed.

Board ClearanceTop Side Clearance 12.7 mm (0.500")

Bottom Side See illustrationClearance

Board HandlingMinimum Maximum

Transfer Height 899 mm (35.4") 965.2 mm (38.00")

Transfer Time 0.0 sec1 2.5 sec2

1 With Dual Lane Board Handling and board length up to 20".2 With Staged Board Handling and board length up to 20".

25.4mm (1.0")

12.7mm (0.5")clearance underboard

Fixed front railRear rail P.C. boardsection

P.C. boardrails

component

com

pone

nt

25.4mm (1.0")clearance underboard

Edge Clearance Standard: 3 mm (0.117"), ±0.4 mm (0.02")tolerance

Optional: 5 mm (0.195"), ±0.4 mm (0.02")tolerance

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Large Board Kit Configuration andOperation:

• A configurable alternate board zero location is used forboards longer than 508.00 mm (20.00") in length. Thislocation is defined by a second set of board stops (long boardstops) and modified software configuration parameters.

• Long board stops may be configured for the largest expectedboard. Possible configurations are as follows:

Large Board Kit

The Large Board Kit increases the maximum GSM board lengthto 635.0 mm (25") and board width according to the followingtable.1

1The Special Applications are available to accommodate maximum board length up to 32". Limita-tions apply. Consult a Universal Sales Engineer for details.2 To achieve board width above 18.0" on a GSM1, the nozzle changers must be removed from theBetween the Rails position. Flex and High Force Head Nozzle Changers are supported in frontfeeder banks, but the outer two holes are not accessible if a FlexJet head is installed on the otherside of the beam. FlexJet nozzle changers in Feeder Banks are not supported.

Machine Type Nozzle Changerbetween BoardHandling Rails

Rear RailPosition

Max. Width3mm EdgeClearance

Max. Width5mm EdgeClearance

GSM1 Yes Out-bound 457.2 mm(18.0")

457.2 mm(18.0")

GSM1 No2 Out-bound 502.9 mm(19.8")

508.0 mm(20.0")

GSM2 Yes Out-bound 508.0 mm(20.0")

508.0 mm(20.0")

GSM-Dispenser Not Applicable Not Applicable 502.9 mm(19.8")

508.0 mm(20.0")

None Long board stops not installed.Max board length = 20.0” (508.0 mm)

23 Long board stop s configured in 23" position.Maximum board length = 23.0" (584.2 mm).

25 Long board stops configured in 25" position.Maximum board length = 25.0" (635.0 mm).

32 Long board stops configured in 32" position.Maximum board length = 32" (812.8 mm) . Boardevaluation and Request for Quote (RFQ) required.

• Boards up to 20.0" in length automatically use the standardboard stops.

• Boards longer than 20.0" automatically use the long boardstops.

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Limitations for board lengths between508.0 mm (20") and 584.2 mm (23") whenlong board stops are configured in 23"position:

• The Board Support length is the same as the width in thestandard configuration, resulting in no board support in theleft-most 44.5 mm (1.75") and the right-most 76.2 mm (3").

• The GSM2 Front Head PEC camera cannot locatefiducials in the left 44.5 mm (1.75") of a 584.2 mm (23")board.

• Enhanced Board Setup will not work for the outer 44.5 mm(1.75") of a 584.2 mm (23") board.

• Board Clamp length is limited. The Single Lane StagedBoard Handling system does not facilitate top/bottomclamp on the right-most 38.1 mm (1.5") on a 584.2 mm(23") board.

• The staged board handling system can accomodate only 1board in the system; no staged board handling can occur.

Limitations for board lengths between508.0 mm (20") and 635.0 mm (25") whenlong board stops are configured in the25" position:1

• The Board Support length is the same as the width in thestandard configuration, resulting in no board support in theleft-most 69.9 mm (2.75") and the right-most 101.6 mm(4").

• The GSM2 Front Head PEC camera cannot locatefiducials in the left 69.9 mm (2.75") of a 127.0 mm (25")board.

• Enhanced Board Setup will not work for the outer 69.9 mm(2.75") of a 127.0 mm (25") board.

• Board Clamp length is limited. The Single Lane StagedBoard Handling system does not facilitate top/bottomclamp on the right-most 63.5 mm (2.5") on a 127.0 mm(25") board.

• Some placement and dispense head spindles cannot reachouter placement locations.

• The staged board handling system can accomodate only 1board in the system; no staged board handling can occur.

1Boards longer than 635.0 mm (25") require the submission of a Request forQuotation (RFQ) and board evaluation. Applications are available for boardsup to 812.8 mm (32"). Limitations apply.

20.0"

23.0"

20.0"

25.0"

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Rear Rail Position LocationThere are currently two mounting positions for the rear feeder baseplate on a GSM1 and three on the GSM2 to optimize throughput.

• The Outbound position maximizes board width at 457 mm (18")(GSM1 and GSM2).

• The Inbound 127.0 mm (5") position mounts the rear feeder baseplate closer to the center of the GSM1. This position reduces theboard width allowed, and also the head travel between the feederpick points and the circuit board being populated. Reduced traveloptimizes distance and time, increasing throughput (GSM1 andGSM2).

• The Double Inbound 215.9 mm (8.5") position mounts the rearfeeder base plate closer to the center and allows matrix tray feederinstallation in rear feeder banks. Limitations apply (GSM2 only).

Matrix Tray Pick Limitations based on Rear Rail PositionDistances denoted below indicate the allowable head spindle reach from the Feeder Plate Interface (Dowel Pin) to the extreme soft

limit within the feeder bank. In some cases, the head cannot reach to all pockets in a matrix tray. Refer to the PTF section formaximum board width.

Configuration Head/Beam FeederBank

StandardOutbound

Inbound 5" Double Inbound8.5" (GSM2 Only)

GSM1 Head1 Front 365.8 mm (14.40") N/A N/A

GSM1 Head1 Rear 105.4 mm (4.15") 232.4 mm (9.15") N/A

GSM1 Head2 Front 105.4 mm (4.15") N/A N/A

GSM1 Head2 Rear 365.8 mm (14.40") 492.8 mm (19.40") N/A

GSM2 Head1 / Beam1 Front N/A N/A N/A

GSM2 Head1 / Beam1 Rear 133.1 mm (5.24") 260.1 mm (10.24") 349.0 mm (13.74")

GSM2 Head2 / Beam2 Front 133.1 mm (5.24") N/A N/A

GSM2 Head2 / Beam2 Rear N/A N/A N/A

Maximum Board Width based on Machine Configuration

GSM Rear Rail Position PTF Transfer Shuttle InstalledBetween Board Handling Rails

GSM1 MaximumBoard Width

GSM2 MaximumBoard Width

Outbound No 457.2 mm (18.0")1 457.2 mm (18.0")1

Outbound Yes 355.6 mm (14.0")2 419.1 mm (16.5")

Inbound 127.0 mm (5)" Yes 241.3 mm (9.5") 304.8 mm (12.0")

Inbound 127.0 mm (5") No 330.2 mm (13.0") 368.3 mm (14.5")

Dbl Inbound 215.9 mm (8.5")GSM2 Only

Yes (consuming Feeder Slots) N/A 304.8 mm (12.0")

Dbl Inbound 215.9 mm (8.5")GSM2 Only

No N/A 304.8 mm (12.0")

1508.0 mm (20") Board Width can be achieved with Large Board Kit. Limitations apply. See Large Board KitSpecifications for details.2 Maximum Board Width up to 368.3 mm (14.5") is available with additional hardware. Consult a UniversalSales Engineer for details.

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GSM Platform Footprint

Top-Down View

Front View

Please note: Footprints forSingle-beam and Dual-beamGSM Platform machinesare identical.

D

Board flow559 mm

(22")

Conveyor

1676 mm(66.0")

P

E

857.3 mm(33.75")

254 mm(10.0")

Pneumatic Connection

Electrical Connection

"D" varies with feeder type: Up to 406 mm (16") for tape feeders

PE

686 mm(27")

152 mm(6")

2540 mm(100")

P

E

914 mm (36") PTFConveyor

PlatformTray Feeder(PTF)

76 mm(3.0")

2184 mm(86")

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Installation Considerations

Machine Dimensions: GSM1Length1 Depth Height 2 Weight

GSM1 Base 1676 mm 2184 mm 2540 mm 2614kgMachine (66") (86") (100") (5762 lbs)

Domestic 1905 mm 2591 mm 1854 mm 2772kgShipping (75") (102") (73") (6112 lbs)

Air Freight 1930 mm 2616 mm 1854 mm 2986kg(76") (103") (73") (6582 lbs)

Sea Freight 1930 mm 2616 mm 1854 mm 3056kg(76") (103") (73") (6738 lbs)

Component 2305 mm 1041 mm 1473 mm 953 kgShuttle (90") (41") (58") (2100 lbs)

Air Freight 2767 mm 1245 mm 1803 mm 1112 kg(109") (49") (71") (2450 lbs)

Sea Freight 2767 mm 1245 mm 1803 mm 1112 kg(109") (49") (71") (2450 lbs)

Floor Space A minimum clear area of 1000 mm (3 feet)around the machine perimeter is recommended formachine operation and servicing.A minimum aisle width between lines of 1524 mm(5 feet) is recommended for feeder servicing.

1 Length is in the direction of board flow.2 Machine light tower and monitor shipped separately.

Machine Dimensions: GSM2Length1 Depth Height 2 Weight

GSM2 Base 1676 mm 2184 mm 2540 mm 2795kgMachine (66") (86") (100") (6162 lbs)

Domestic 1905 mm 2591 mm 1854 mm 2954kgShipping (75") (102") (73") (6512 lbs)

Air Freight 1930 mm 2616 mm 1854 mm 3167kg(76") (103") (73") (6982 lbs)

Sea Freight 1930 mm 2616 mm 1854 mm 3238kg(76") (103") (73") (7138 lbs)

Component 2305 mm 1041 mm 1473 mm 953 kgShuttle (90") (41") (58") (2100 lbs)

Air Freight 2767 mm 1245 mm 1803 mm 1112 kg(109") (49") (71") (2450 lbs)

Sea Freight 2767 mm 1245 mm 1803 mm 1112 kg(109") (49") (71") (2450 lbs)

Floor Space A minimum clear area of one meter (three feet)around the machine perimeter is recommended formachine operation and servicing.A minimum aisle width between lines of 1524 mm(five feet) is recommended for feeder servicing.

1 Length is in the direction of board flow.2 Machine light tower and monitor shipped separately.

GSM Platform Pad LocationsOverhead View

8x 4.640"Overall Pad Diameter

45.98 mm(1.81")

38.1 mm(1.5")

608 mm(23.94")

1014.5 mm(39.94")

1500 mm(59.06")

Aisle Considerations forUse of Feeder Cart

GSM2

Feeders

Feeders

GSM2

Feeders

Feeders PTF

36" Conv

GSM2

Feeders

Feeders

GSM2

Feeders

Feeders PTF

36" Conv

5 ft

.00

in

14 ft

4.0

0 in

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Service RequirementsElectrical 230 VAC, nominal

Frequency 50 or 60 Hz (49-51 or 59-61 Hz).Frequency must be stated at time of order.

Phases 3

Number of 4 (three phase lines and ground)Wires

Service Service must be grounded DeltaConfiguration

Branch Circuit 30 ampsSize

Distortion <10% total harmonic distortion

Average Power 5000 watts

Electrical 76.2 mm (3") from frontConnection 686 mm (27") from floor

Pneumatics (clean air)

GSM1 (1 head)• Air flow1 10 CFM @ 90 psi (284 liters/minute

@ 6.2bar)• Air Consumption2 10 SCFM (284 Nliters/minute)

GSM1 (2 heads)• Air Flow1 11 CFM @ 90 psi (312 liters/minute

@ 6.2bar)• Air Consumption2 20 SCFM (566 Nliters/minute)

GSM2 (2 heads)• Air Flow1 20 CFM @ 90 psi (568 liters/minute

@ 6.2 bar)• Air Consumption2 20 SCFM (568 Nliters/minute)

Platform Tray Feeder (PTF)• Air Flow1 0.6 CFM @ 90 psi (17 liters/minute

@ 6.21bar)• Air Consumption2 2.3 SCFM (65.1 Nliters/minute)

Component Shuttle• Air Flow1 0.75 CFM @ 90 psi (21.2 liters/minute

@ 6.21 bar)• Air Consumption2 3.73 SCFM (105.6 Nliters/minute)

1 Air consumption is an average value for air used by the base machine

during a normal machine cycle and is measured in standard cubic feet

per minute. It accounts for heads and feeders only and does not

consider peripheral options such as PTF and Shuttle, which must be

added to base machine requirements.2 Air Flow values are used to represent momentary peak demands for the

machine to size input air lines to the machine. As with air consumption,

it accounts for heads and feeders only and does not consider peripheral

options such as PTF and Shuttle, which must be added to base

machine requirements. Requirements of options must be taken into

account in addition to the base machine for line and compressor sizing.

Clean Air is defined as:

1. Dew point Must be 20 degrees F (11 degrees C) below ambient

temperature

2. Oil 0.08 ppm at 82 degrees F (28 degrees C)

3. Input air Filtered to 5 microns particle size

GS-401-02

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Environmental RequirementsMinimum Maximum

Operating 4.4° C (40° F) 35° C (95° F)Temperature

Operating — 6° C/hourTemperature (10.8° F/hour)Change Tolerance

Storage -20° C (-4° F ) 65° C (149° F)Temperature

Operating Humidity 10% non-condensing 90% non-condensing

Operating Altitude — 2500 meters (8202 feet)

Noise level 70.5 dbA in accordance with National MachineToolbuilders Assoc. Noise MeasurementTechnique Standard — June 1986.

Pneumatic 254 mm (10") from front,152.4 mm (6") fromConnection floor.

Internal thread connection is 9.65 mm (3/8")NPT and provided with the machine.Equipment is adequately protected againstingress of solid and liquid contaminants.

A - 30 GS-401-02 Appendix A: CamerasC

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RequiredPixels

Circular and Standard Lighting Upward-Looking Cameras On-AxisLightingCamera

Odd FormLightingCamera

FlexJetOptics1

4.0 mpp 3.0 mpp 2.6 mpp 1.0 mpp 4.0 mpp 4.0 mpp 2.6 mpp

mm inch mm inch mm inch mm inch mm inch mm inch

Maximum Component2

(Single Field of View)n\a 33.358 1.313 24.067 0.948 20.348 0.801 8.270 0.326 33.358 1.313 20.193 0.795

Leadless Components

Length 10.0 1.016 0.040 0.762 0.030 0.660 0.026 0.330 0.013 1.016 0.040 1.016 0.040

Width 5.0 0.508 0.020 0.381 0.015 0.330 0.013 0.165 0.007 0.508 0.020 0.508 0.020

Leaded Components

Pitch3 4.0 0.406 0.016 0.305 0.012 0.264 0.010 0.132 0.005 .0406 0.016 0.406 0.016

Width-WithoutInspection

2.0 0.203 0.008 0.152 0.006 0.132 0.005 0.066 0.003 0.203 0.008 0.203 0.008

Width-With Inspection 2.5 0.254 0.010 0.191 0.008 0.1651 0.0065 0.083 0.003 0.254 0.010 0.254 0.010

Multi-PatternComponents

Length 25 2.540 0.100 1.905 0.075 1.651 0.065 0.826 0.033 2.540 0.100 2.540 0.100

Width 25 2.540 0.100 1.905 0.075 1.651 0.065 0.826 0.033 2.540 0.100 2.540 0.100

BGA & C44

Components

Pitch 8.0 0.813 0.032 0.610 0.024 0.528 0.021 0.264 0.010 0.813 0.032 0.813 0.032

Bump Diameter 4.0 0.406 0.016 0.305 0.012 0.264 0.010 0.132 0.005 0.406 0.016 0.406 0.016

1 Actual component dimensions will vary depending on pick tolerance applied.

2 Assumes a default ±1.905mm (0.075") pick tolerance.

3 Assumes a 2.0 pixel minimum separation distance between leads.

4 Maximum number of bumps is 3,000 with the ESI 630 vision system, and 4,000 with the ESI 640 vision system.

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Appendix A: Cameras

Technical Specifications

Circular Lighting Camera

Odd Form CameraStandard Camera On-Axis Lighting Camera

On-Axis Circular Lighting Camera

LensCover

Camera Cover

B - 31Appendix B: GSM Platform Feeders - GS-401-02

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Appendix B: GSM Platform Feeders

Platform Tray Feeder (PTF), Model 4559A

Introduction

Universal’s optional Platform Tray Feeder (PTF), Model 4559A,is a 58-input stackable matrix tray feeder for the GSM Platform,which increases flexibility, improves line performance, and maxi-mizes throughput.

The PTF is flexible. It features 29 pallet slot locations, eachconfigurable with up to two unique component types. Up to 58different leaded and area-array components can be fed to theGSM Platform. If desired, one of the pallets can be defined forcomponent purge or reject, reducing usable pallets to 28 palletslot locations providing up to 56 component inputs. While a singlePTF provides all these benefits, a second PTF expands flexibilityeven further. Beyond the additional 58 inputs gained from a sec-ond PTF, dual PTFs provide several modes of operation to matchproduction requirements.

The PTF is efficient. Rather than just one matrix tray at a time,the PTF can support stacks of matrix trays. This capability sig-nificantly reduces tray replenishment requirements and increasesthroughput. And, the unique side-mounting scheme of the PTFmaximizes floor space utilization without interfering with adjacentproduction lines. The PTF may be optionally configured topresent components at rotations of 0°, 90°, 180°, or 270° for pickby the GSM Platform to increase machine throughput.

The PTF is fast. While many other matrix tray feeders wastetime by presenting the entire tray or just a couple of componentsto the pick and place head, the PTF can present up to 7 compo-nents to the GSM head. The independent PTF pick and placeaxes buffer components for the next cycle in the GSM Platform.In parallel, the GSM Platform gang picks components (simulta-neously picks multiple components) previously queued on thePTF transfer belt. The PTF features user programmable servo-controlled pallet and transfer belt motions to provide optimal com-ponent handling speed.

In consideration of essential health and safety requirements, thePTF is CE-marked.

Transfer Shuttleto GSM

Door to accesselevator and refillpallets with matrixtrays

Platform Tray Feeder (PTF)

PTF

PTF transfer shuttle

GSM

B - 32 GS-401-02 - Appendix B: GSM Platform FeedersF

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Functional Description

The primary function of the PTF is to provide components frommatrix trays for gang picking by the GSM Platform. To accom-plish this, the component and matrix trays are defined using thefeeder and component databases in the Product Editor duringsetup.

There are 3 modes of operation applicable to dual PTFs:

Independent Mode allows the two PTFs configured on aGSM Platform to act as two unique matrix tray feeders.This configuration provides 116 matrix tray inputs. For ex-ample Components 1-58 are fed by one PTF and Compo-nents 59-116 are fed by the second PTF. In this mode,neither PTF can act as an alternate to the other; however,a GSM Platform-mounted feeder can be an alternatefeeder to either PTF.

Backup Mode allows the two PTFs configured on a GSMplatform to serve as backup feeders to each other. Thebackup PTF will not deliver components unless the primaryPTF is out of a specific component or the primary PTF isin the load feeder state. Once the primary PTF is reloaded,the component will be accessed by the primary PTF. Forexample, Component A is depleted from the primary PTF,so the backup PTF supplies Component A until the primaryPTF is reloaded. Both primary and backup PTFs must beaccessible by the same beam. As with the IndependentMode, a GSM Platform-mounted feeder can act as an al-ternate PTF feeder. The goal is to produce boards asquickly as possible, based on component availability. Thebackup PTF will maximize throughput.

Exchange Mode allows the two PTFs configured on aGSM Platform to act as alternate feeders. In this mode,the primary and secondary PTFs switch when a singlecomponent is no longer available in the primary PTF. Forexample, once Component A is depleted in the PrimaryPTF, all components will be picked from the alternate PTF.Component A will continue to be picked from the alternatePTF until Component A is no longer available, then allcomponents will once again be picked from the primaryPTF. Both PTFs must be accessible by the same beam.This mode is suggested when the primary and secondaryPTF magazines are balanced. (Requires factory quote.)

Platform Tray Feeder (PTF)(reverse view)


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After setup configuration, the operator loads matrix trays in thedefined pallets of the elevator using the feeder load procedure.During loading, matrix trays can be stacked to the top of the pal-let, and then the pallet is easily pushed into place in the magazineslot. When all pallets are loaded, the feeder door is closed andthe start button is pushed to begin operation.

During operation, the feeder uses multiple servo-controlled axesto accurately move matrix trays and components to the PTF andGSM Platform pick points at user-defined transfer speeds. Thesoftware signals the servo-controlled tray transport to extend theselected pallet out of the magazine. While the pallet is extended,the servo-controlled feeder head assembly picks the componentfrom the matrix tray. A rotation of 0°, 90°, 180°, or 270° occursbefore the component is placed on the PTF Transfer Shuttle.Once a component is sensed, it is placed on the transfer shuttle.Up to 7 components are placed on the transfer belt and moved tothe GSM Platform for gang pick.

As a matrix tray is emptied, the PTF head assembly automati-cally removes the matrix tray from the pallet to a customer-sup-plied tray bin. When an empty stack or pallet is determined byUPS, the corresponding LED illuminates, thus indicating whichpallet to address. The operator loads the pallet(s) as required,and returns the PTF to the run sequence without stopping theGSM Platform.

PTF Pre-Orient Head


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Configurations

PTF

RearRight

PTF

FrontLeft

PTF

FrontRight

PTF

FrontLeft

PTF

RearLeft

PTF

FrontRight

PTF

RearRight

PTF

RearLeft

FrontFront

FrontGSM1 only

FrontGSM1 only

Rear Rear

Rear Rear

Single PTF can bemounted as such:

Dual PTFs can bemounted as such:

Front Right (GSM1 only) Front Right and Front Left(GSM1 only)

Front Left Front Right and Rear Left(GSM1 only)

Rear Left Rear Right and Rear Left

Rear Right Front Left and Rear Right


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PTF shown installed on GSM Platform (GSM1 & 2)(platforms with side entrance holes)

Rear

Front

Available PTF Mounting Locations

1Maximum Board width up to 368.3 mm (14.5") is available with additionalhardware. Consult a Universal Sales Engineer for details.

Note: All four PTFframe mountinglocations are shownfor dimensionalreference only. Upto 2 PTF machinescan be mounted on aGSM Platform.Some limitationsapply.

ApplicableGSM

Platform

PTFMountingLocation

GSMRear RailPosition

PTFTransferShuttle

Location

PTFTransferShuttle

Entrance

GSM1Max.

BoardWidth

GSM2Max.

BoardWidth

GSMFeederSlots

Consumed

GSM 1 Only Front Right Outbound Feeder Bank GSM Frame 457.2 mm(18.0")

N/A 8

GSM 1/GSM 2 Rear Left Outbound Feeder Bank GSM Frame 457.2 mm(18.0")

457.2 mm(18.0")

8

GSM 1/GSM 2 Rear Left Outbound Between Rails Brd Handling 355.6 mm(14.0")2

419.1 mm(16.5")

0

GSM 1/GSM 2 Rear Left Inbound Between Rails Brd Handling 241.3 mm(9.5")

304.8 mm(12.0")

0

GSM 1/GSM 2 Rear Left Inbound Feeder Bank GSM Frame 330.2 mm(13.0")

368.3 mm(14.5")

8

GSM 1 Only Front Right Inbound Feeder Bank GSM Frame 330.2 mm(13.0")

N/A 8

GSM 2 Only Rear Left Dbl Inbound Feeder Bank Brd Handling N/A 304.8 mm(12.0")

8

GSM 1/GSM 2 Front Left Outbound Feeder Bank GSM Frame 457.2 mm(18.0")

457.2 mm(18.0")

8

GSM 1/GSM 2 Rear Right Outbound Feeder Bank GSM Frame 457.2 mm(18.0")

457.2 mm(18.0")

8

GSM 1/GSM 2 Rear Right Outbound Between Rails Brd Handling 355.6 mm(14.0")2

419.1 mm(16.5")

0

GSM 1/GSM 2 Rear Right Inbound Between Rails Brd Handling 241.3 mm(9.5")

304.8 mm(12.0")

0

GSM 1 Only Front Left Inbound Feeder Bank GSM Frame 330.2 mm(13.0")

N/A 8

GSM 2 Only Front Left Dbl Inbound Feeder Bank GSM Frame N/A 304.8 mm(12.0")

8

GSM 2 Only Rear Right Dbl Inbound Feeder Bank Brd Handling N/A 304.8 mm(12.0"

8

GSM1

914mm (36")

PTF Conveyor

914mm (36")

PTF ConveyorBoard flow

P

E

Pneumatic Connection

Electrical Connection

PE





1676 mm (66.0")

813 mm (32")

356 mm (14") GSM1419 mm (16.5") GSM2

E

356 mm (14") 356 mm (14")

2540 mm (100")

279 mm (11")

610 mm (24")

229 mm (9")

876 mm (34.5")

2553 mm (100.5")

Installation in this location for the GSM1 only

GSM2


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The tray transport automates the pallet selection and matrix traydisposal through user-programmable transport speed. Softwaresignals the servo-controlled tray transport to move the selectedpallet out of the magazine. While the pallet is extended, thefeeder head assembly, also servo-controlled, picks the componentfrom the matrix tray and places it on the transfer shuttle moving itinto the GSM Platform. When the matrix tray is empty, thefeeder head assembly automatically removes the matrix trayfrom the pallet to a customer-supplied empty tray bin. If the userdoes not want automatic disposal of empty matrix trays, UPS canbe configured to force manual removal.

Pallets

Small-, medium-, or large-depth pallets accommodate most of theleaded and area array components packaged in matrix trays. Pal-lets are selected separately or in a standard configuration, andhold one or two unique component IDs for up to a total of 58 ma-trix tray component IDs. The various depths of the pallets allowsmall to large stacks of matrix trays, optimizing production needs.The standard configuration includes five small pallets, three me-dium pallets, five large pallets, and one small purge pallet. An op-erator can load a stack of matrix trays within 20 seconds, andpallets easily slide into any one of the 29 magazine slots.

Tray Transport

Transfer Shuttle

The servo-controlled transfer shuttle moves components from thefeeder to the pick point of the GSM for placement through user-programmable transfer speed. Transfer time from one tray to thepick point is only six seconds. Transfer shuttle movement is par-allel to board transfer in the GSM Platform.

Standard Features

Tray Transport

Transfer Shuttle Assembly

Medium Pallet with fullMatrix Trays

GSM

PTF

Components


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PTF Options

The following options are available on the Platform Tray Feeder(PTF).

Orientation Tray Clamps

PTF Pallets are available with Orientation Tray Clamps1, whichrequire JEDEC or IEC Compliant trays to be inserted at the cor-rect orientation. These clamps also incorporate a "quick-release"t-handle. Pallets with Orientation Clamps are available as fol-lows:

Medium (Type-2) Pallet withoptional Orientation Clamps

R=4.25”

3.75”

Side Discharge Kit

With the use of the Side Discharge Kit2, the empty tray rejectchute can be configured to discharge trays from the side cover(as opposed to the standard rear eject configuration) to providebetter access to the empty tray reject bin in some installations.This kit is recommended when combining a PTF with a Compo-nent Shuttle on the same side of the GSM Platform. The SideDischarge Kit improves access in some cases.

Large Pocket Tray Removal Kit

A larger PTF tray removal pad is available to accommodatemore non-standard and larger pocket matrix trays. The optionalLarge Pocket Tray Removal Kit accommodates trays withpocket areas up to 50 mm x 88 mm (2" x 3.50") of walled-offarea. Standard PTF Tray Removal Pad accommodates trayswith pocket areas up to 45 mm x 70 mm (1.75" x 2.75") ofwalled-off area.

Large Pocket TrayRemoval Pad

1 Orientation Clamps require matrix trays complying with IEC 60286specifications. Orientation Clamp setup fixture is available for installingOrientation Clamps into standard pallets.2 Side Discharge Kit is compatible with Left Front or Right Rear PTF mountinglocation configurations only. Side Discharge Kit accommodates trays with amaximum length of 323.9 mm (12.75").

Pallet SizeMagazine Slots

RequiredWeight without Trays

Small (Type-1)Pallet with Orientation Clamp

1 5.3lbs.

Medium (Type-2)Pallet with Orientation Clamp

2 6.3lbs.

Large (Type-4)Pallet with Orientation Clamp

4 8.1lbs.


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Tray Removal Enhancement Kit

The optional Tray Removal Enhancement Kit simplifies emptytray reject collection in some installation configurations and pro-duction environments. The kit includes the low-profile scrap binand a cable cover to prevent interference with dropping trays.Overall dimensions 711.2 mm (28.0") L x 508.0 mm (20.0") W x215.9 mm (8.50") D.

Heavy Payload Kit

Low Profile Scrap Bin

The PTF magazine capacity can be increased from 135 lb to 200lb.1 with the use of the 200 lb. Payload Kit. With the standardPTF Tray Configuration2, the 200 lb. payload kit extends themaximum weight of trays and components to 119 lbs. Refer topage B-41 to calculate weight of non-standard pallet configura-tions.

PSV Barcode Kits

To implement the PSV option on a PTF, the following PSVBarcode Kits are available to accommodate component lotbarcode labels.

• PSV Barcode Plaque Kit for Standard Clamps includesbarcode plaques that attach to each tray stack clamp of a pallet.The plaques incorporate a pocket with a clear lexan top cover tofacilitate insertion of barcode labels when using Standard TrayClamps.3

• PSV Barcode Plaque Kit for Orientation Clamps includes apallet extension plate to be installed on the leading edge of eachpallet for use with Orientation Clamps. The plaque includes aclear lexan cover fastened over a stainless steel plate to form asleeve in which users can insert barcode labels cut from the traypackaging.3

1200 lb. Magazine Payload Capacity includes pallets, trays, clamps, andcomponents. Software parameters must be configured for the 200 lb. PayloadKit.2Standard PTF Pallet Configuration includes 5 Small (Type-1), 3 Medium (Type-2), and 5 Large (Type-4), and 1 Purge Pallet. Standard PTF PalletConfiguration does not include Orientation Tray Clamps.3PTF Barcode Plaques accommodate component barcode labels up to 101.6mm (4")in length x 62.5 mm (2.5") in height. Alternatively, users can use anoutside barcode reference sheet for component barcode label scanning.

Barcode Plaques for StandardTray Stack Clamps

Barcode Plaques forOrientation Clamps


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ConfigurationGSM Software The PTF is controlled by Universal Platform

Software (UPS). The UPS processes diagnosticmessages, and optimization of one product.Included is a graphic interface for definingcomponents, matrix trays, magazine slots andfeeder configuration from the feeder andcomponent database.

Configuration The base platform has side entrance holes forinstalling the PTF transfer shuttle in the rightrear, left rear, and left front. The right frontinstallation is supported on the GSM1 only. ThePTF transfer shuttle can be mounted in otherlocations. Consult a Universal SalesEngineer.

A manual slide-width 914 mm (36") PTFConveyor is supplied with the PTF.

Required 8 slots when installed in side entranceSlots holes.

Empty Tray Bin Use to collect empty matrix trays, customersupplied.

Component Pick and Transfer SpecificationsTact Time1 1.5 seconds per component

Transfer Time1 4 components from one tray: 6.25 seconds4 components from 4 adjacent pallets: 9 seconds

Shuttle Transfer 899 mm to 965.2 mm (35.4" to 38.00")Height1 Based on average moves across an entire matrix tray over variouspallet types.

Suggested configurationsfor a PTF installation on the

feeder bank of the GSM

Platform front

36" PTFConveyor

Board flow

PTF TransferShuttle

GSM

Feeders

Platform front

Boardflow

PTF GSM

36" PTFConveyor

TransferShuttle

Feeders

Platform front

22"Conveyor

Board flow

PTF

GSM

36" PTFConveyor

TransferShuttle

Feeders


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ComponentsType Leaded and area array

Dimensions 6.4 mm to 51 mm (0.25" to 2.0") square, manualnozzle change may be required for a full rangeof component picking.

Thickness 1.0 mm to 12.7 mm (0.04" to 0.50"), flat andsmooth surface for vacuum retention.

Weight Up to 35 grams each.1

1 Heavier components up to 50 grams can be handled when pre-orient isdisabled.

Matrix TrayDimensions • 102 mm x 102 mm x 3 mm (4" x 4" x 0.1"),

minimum• 330 mm x 292 mm x 12.7 mm (13.0" x 11.5" x

0.5"), one component ID, or• 330 mm x 140 mm x 12.7 mm (13.0" x 5.5" x

0.5") for one or two component IDs (twomatrix trays) in one pallet.

Height Height of trays and components cannot exceedthe top of the pallet.

Weight (Maximum) 300 grams maximum empty weight. Trays thatdo not meet IEC 60286 standards can be manuallyremoved.

Pick Area, Empty Tray vacuum pick-up method requires aminimum-walled pick up area that allowsvacuum retention and therefore removal of anempty matrix tray. Reference IEC specificationsfor requirements. [Based on IEC specification,minimum 28 mm x 28 mm (1.1" x 1.1") walled-offarea. IEC specification does not specify amaximum walled-off. Platform Tray FeederREQUIRES a maximum 45 mm x 70 mm (1.75" x2.75") walled-off area.]*

*An optional tray removal kit, for larger pocket areas up to 50 mm x88 mm (2.00" x 3.50") walled-off area, is available. Refer to thePTF Options section on page B-37.


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PalletsSmall Medium Large

(Type 1) (Type 2) (Type 4)

Pallet Depth 12.7mm (0.50") 26.7mm (1.05") 64.8mm (2.55")

Pallet Capacity

Number of stacks 1 or 2 1 or 2 1 or 2

Number of trays 2 4 10per stack1

Magazine slots 1 2 4required per pallet

Load Time 20 to 30 seconds to load a stack of trays andclamp each stack flush with the palletleading edge.

Pallet Weight (Full) 7.26 kg (16 lbs.), maximum combinedweight of pallet and full matrix trays.

Pallet Weight (Empty) Large 3.18 kg (7 lbs.)Medium 2.61 kg (5.75 lbs.)Small 2.18 kg (4.8 lbs.)Purge 2.18 kg. (4.8 lbs.)

1 Based on IEC thin tray specification of 6.35 mm (0.25"). If thicker traysare used, the maximum trays per stack will be less. Stack heightcannot exceed the top of the pallet (including components). See“Pallet Depth,” above.

MagazineMagazine Capacity 29 pallet slots

Standard magazine package includes 5small, 3 medium, and 5 large pallets, plusone purge pallet. A large pallet is placed inthe bottom magazine slot to accommodatethis pallet mix.

Capacity 61.3 kg (135 pounds), including pallets,matrix trays, and components. See examplebelow:

Loaded Elevator Example — Standard Pallet Configuration

5 large (type 4) pallets x 3.18 kg (7 lbs.) = 15.88 kg (35 lbs.)3 medium (type 2) pallets x 2.61 kg (5.75 lbs.) = 7.82 kg (17.25 lbs.)

5 small (type 1) pallets x 2.18 kg (4.8 lbs.) = 10.89 kg (24 lbs.)1 purge pallet x 2.18 kg (4.8 lbs.) = 2.18 kg (4.8 lbs.)

Total = 36.74 kg (81 lbs.)

Total Weight (incl. pallets, parts, and trays) = 61.23 kg (135 lbs.)– Standard Pallet Configuration = 36.74 kg (81 lbs.)

Component/Tray Weight = 24.49 kg (54 lbs.)

Optional Heavy Payload KitTotal Weight (incl. pallets, parts, and trays) = 90.70 kg (200 lbs.)

– Standard Pallet Configuration = 36.74 kg (81 lbs.) Component/Tray Weight = 53.96 kg (119 lbs.)

2 magazine slots

Full matrix traysPartially full matrix trays

Medium size pallet

Component ID #1 Component ID #2

1 magazine slot

Small size pallet

Partially full matrix trays


4 magazine slots

Full matrix traysPartially full matrix trays

Large size pallet

Full matrix traysFull matrix trays



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Installation ConsiderationsLength 1 Depth Height Weight

Overall 813 mm 1524 mm 1575 mm 524 kg(32") (60") (62") (1155 lbs.)

Domestic 1067 mm 1753 mm 1702 mm 568 kgShipping (42") (69") (67") (1250 lbs.)

Air Freight 1092 mm 1753 mm 1753 mm 615 kg(43") (69") (69") (1355 lbs.)

Sea Freight 1092 mm 1753 mm 1753 mm 624 kg(43") (69") (69") (1375 lbs.)

Floor Space A minimum clear area of one meter (three feet)around the machine perimeter is recommended formachine operation and servicing.

1 Length is in the direction of board flow.

PTF Service RequirementsElectrical 230 VAC, provided by the GSM Platform

400 Watts RMS800 Watts PeakElectrical interface is needed for existing GSMPlatform installations. Consult a UniversalSales Engineer.

Pneumatic Provided by the GSM Platform

Air Flow 17 liters/[email protected] bar (0.6 cfm@90 psi)

Vacuum Generated internally by PTF feeder

PTF Conveyor Service Requirements100 to 130 VAC, 50/60 Hz, 5 amperes200 to 260 VAC, 50/60 Hz, 5 amperes.Separate drop required.

Environmental RequirementsMinimum Maximum

Operating 4.4° C (40° F) 35° C (95° F)Temperature

Operating — 6° C/hourTemperature (10.8° F/hour)Change Tolerance

Storage -20° C (-4° F) 65° C (149° F)Temperature

Operating Humidity 10% non-condensing 90% non-condensing

Operating Altitude — 2500 meters (8202 feet)

Noise 70 dbA in accordance with National MachineTool Builders Association Noise MeasurementTechnique Standard 1986.


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Supporting Documents

International Electrotechnical Commission (IEC) Standards,60286-5, revision 1995-02 for Packaging of Components forAutomatic Handling

SMEMA Software/Communications Interface Standard 2.0

National Machine Tool Builders Association Noise MeasurementTechnique Standard, 1986.


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Stackable Matrix Tray Feeder

Stackable Matrix Tray Feeder, Model 4556A

IntroductionThe Stackable Matrix Tray Feeder, Model 4556A, moves a stackof matrix trays all loaded with components of one part number tothe pick position of the GSM Platform. Empty trays are dis-carded. Vacuum pickup requires trays with a smooth surfaceand solid-backed pockets near the center of the tray.

Standard FeaturesThe simple, compact feeder will move up to a 95.25 mm (3.75"),6.80kg (15.0 lbs.) stack of matrix trays to the pick position.Three size feeders are available. For other than stated matrixtray sizes, consult a Universal Sales Engineer.

• 6.1 Feeder: 135.9 mm to 154.9 mm (5.35" to 6.10") wide by266.7 mm to 330.2 mm (10.5" to 13") long matrix trays.GSM1 or GSM21

• 8.3 Feeder: 135.9 mm to 212.9 mm (5.35" to 8.38") wide by266.7 mm to 330.2 mm (10.5" to 13") matrix trays. GSM orGSM21

• 13.0 Feeder: 135.9 mm to 212.9 mm (5.35" to 8.38")2 wideby 266.7 mm to 330.2 mm (10.5" to 13") matrix trays. Pre-sents matrix trays at 90° rotation. GSM2 only.

Functional DescriptionA stack of matrix trays is presented to the GSM Platform forcomponent pickup. The GSM Platform picks from the top tray.When the top tray is empty, the stack moves to the discard posi-tion. The empty tray is picked, uncovering the next full matrixtray. The remaining loaded stack returns to the pick area, whilethe empty tray is discarded, manually or automatically. A fullstack of matrix trays is manually loaded as needed. Automatictray removal is limited to trays conforming to IEC 60286 andJEDEC tray specifications.

1 Requires the “double inbound” 127.0 mm (5") real rail location for GSM2installation. See Page 20. Limitations apply. Contact a Universal SalesEngineer.2 Requires the “inbound” 127.0 mm (5") or "double inbound" 215.9 mm (8.5")rear rail position.


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Technical SpecificationsLength Width Height Weight

Overall 6.1 930 mm 177.8 mm 800.2 mm 24.49 kg(36.62") (7") (31.50") (54 lbs.)

8.3 930 mm 238.0 mm 800.2 mm 25.40 kg(36.62") (9.37") (31.50") (56 lbs.)

13.0 930 mm 340.0 mm 800.2 mm 35.83 kg(36.62") (13.38") (31.50") (79 lbs.)

Electrical N/A N/A 387.4 mm 6.8kgEnclosure (15.25") (15 lbs.)Assembly

Floor Clearance 356.6 mm (14"), approximately

Altitude Up to 1000 m above mean sea level

Ambient Air +5°C to +40°CTemperature Range

Average Ambient Not to exceed +35°C in 24 hours.Air TemperatureRange

Free Air Operating +5°C to +55°CTemperature

Average Free Air Not to exceed +50°C in 24 hours.OperatingTemperature

Humidity Range 30% to 95%, non-condensing.

Noise 65 dbA

Transportation -25°C to +55°C., up to +70°C. in 24 hoursand Storage Store in shipping carton, Universal # M00067900

or mounted on a Feeder Setup Cart, see page 7.

Required Feeder 6.1 Feeder: 9 feeder slotsPositions 8.3 Feeder: 12 feeder slots

13.0 Feeder: 16 feeder slots

Maximum Tray 95.25 mm (3.75")Stack Height

Maximum Tray 6.80 kgs (15 lbs.)Stack Weight

Tray Pick Area, Tray vacuum pick-up method requires aEmpty minimum-walled pick up area that allows

vacuum retention and therefore removal of anempty matrix tray. Reference IEC specificationsfor requirements. [Based on IEC specification,minimum 28 mm x 28 mm (1.1" x 1.1") walled-offarea. IEC specification does not specify amaximum walled-off area. The stackable matrixtray feeder REQUIRES a maximum 45 mm x 70mm (1.75" x 2.75") walled-off area for automatictray removal.] Trays not conforming to thisspecification can be manually removed.1

1 Some vacuum formed trays can be automatically removed with specialhardware. Consult a Universal Sales Engineer for details.


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Service RequirementsElectrical Power is provided by the Universal Platform.

IEC-type connector, 120VAC, 50-60 Hz.,1.6 ampere. Voltage fluctuation, 10%.

Pneumatic Air is provided by the Universal Platform at84.95 liters/minute at 5.52 bar (3 cfm at 90 psi)with a 6.35 mm (0.25") hose.

Vacuum Generated internal to the feeder.

Safety Bottom panel provided.

Moving 27.22 kgs (60 lbs.) pallet jack, and 15 minutes touncrate. To lift uncrated Feeder, disassembleand use lift points shown in illustration.


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PrecisionProTM Spliceable Tape Feeders, Model 4697B

Introduction

The PrecisionPro™ Tape Feeder, Model 4797B, processes awide range of paper and embossed component types with optimalperformance. PrecisionPro Tape Feeders incorporate the follow-ing features:

• 3-Point location on 8 mm and 12 mm feeders for improvedpick performance

• Faster index rate for improved throughput• Pivoting-spindle style reel holder and improved Shutter-

Peeler latch mechanism for faster reel replenishment• Splicing capability on all PrecisionPro Tape Feeders• Self-ID control with feeder reference number and cycle

count tracking• Reel detection sensor for PSV and traceability tracking

PrecisionPro Tape Feeders require the PrecisionPro Feeder In-terface. See Page 5 for PrecisionPro Feeder Interface details.

Feeder Concept

Each feeder is dedicated to a tape width with adjustable pitch se-lections, depending on desired pitch. Tape advancement is step-per-motor driven with 42V DC power, capable of forward andreverse tape advancement. Electrical connections are engagedvia the Precision Pro feeder interface when the feeder ismounted to the GSM Platform.

PrecisionPro Spliceable Tape Feeders offer Platform Setup Vali-dation (PSV) compatibility wiht splicing.

PrecisionPro SpliceableTape Feeder


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Available Feeders

Feeder units are adjustable for pitch settings from 2 mm - 44 mm.All units support tape splicing, which requires Universal-suppliedtools and materials.• 8 mm (2 mm - 8 mm pitch)

• 12 mm (4 mm - 12 mm pitch)

• 16 mm (4 mm - 16 mm pitch)

• 24 mm (4 mm - 24 mm pitch)

• 32 mm (4 mm - 32 mm pitch)

• 44 mm (4 mm - 44 mm pitch)

• 56 mm (4 mm - 44 mm pitch)

• 72 mm (4 mm - 44 mm pitch)

• 88 mm (4 mm - 44 mm pitch)

• 104 mm (4 mm - 44 mm pitch)

• 120 mm (4 mm - 44 mm pitch)

Feeder design is based on EIA-481-B standards. Embossedcarrier tapes, reels and components meeting the above standardsare processed by these feeders. Reference Technical Specifica-tions section where limitations apply.


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The following sequence of events describe thePrecisionPro TapeFeeder functions. The numbers in parentheses relate to thecallouts in the illustration above.

(1) A tape reel is mounted on the Component ReelHolder. The reel holder pivots upward to facilitate reelsplicing and replenishment. A sensor detects when thereel is removed.

(2) The Tape Window is released and rotated upwards.

(3) The component tape is routed through the rear channel ofthe feeder, over the top of the inside and outside guides,and directed into the Front Tape Chute.

(4) Cover tape is peeled back from the component tape andpulled through the Tape Window. Expended tape is col-lected via the Take Up Reel.

(5) The component is presented in the Component PickupPosition.

(6) The component tape is secured under the Tape Windowwith the Tape Window Latch.

(7) The pitch setting is selected from the Pitch Selectorswitch on the Control Panel.

(8) The Latch locks and releases the feeder from the GSMPlatform.


EIA-481-B Punched and embossed carrier taping of surfacemount components for automatic handling.

(1)

(2) (3)(6)

(5)

(7)

(8) (4)


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Technical Specifications for Precision Pro Spliceable Tape Feeders

1 Maximum component size, in the feed direction is 40 mm. Maximum index 44 mm.

Max Max Feeder Tape Tape Take Up IndexingReel Size Reel Weight Positions Type Leader Capacity Increment

Required 8 mm 381 mm 1.13 kg 1 Embossed 203 mm 60,000 picks 2 mm, 4 mm,

(15.00") (2.5 lbs.) or Paper (8.00") at 2 mm 8 mmCarrier increments

12 mm 381 mm 1.13 kg 1 Embossed 203 mm 60,000 picks 4 mm to 12 mm(15.00") (2.5 lbs.) or Paper (8.00") at 2 mm in 4 mm

Carrier increments increments

16 mm 381 mm 2.27 kg 2 Embossed 203 mm 3810.00 cm 4 mm to 16 mm(15.00") (5.0 lbs.) Carrier (8.00") (1500.0") in 4 mm

of 0.10 mm increments(0.004")






of 0.10 mm increments1

(0.004")



(0.004")



(0.004")



(0.004")



(0.004")



(0.004")


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Precision Pro Spliceable Tape Feeder: 16 mm -120 mmPitch Swing Setting Tape Advance Distance (mm) Index Rate in Seconds

1 4 0.080

2 8 0.130

3 12 0.180

4 16 0.230

5 20 0.280

6 24 0.320

7 28 0.380

8 32 0.430

9 36 0.480

10 40 0.530

11 44 0.580

12 48 0.630

13 52 0.680

14 56 0.730

Precision Pro Spliceable Tape Feeder: 8 mm -12 mmManual Setting Tape Advance Distance (mm) Index Rate in Seconds

2 2 0.050

4 4 0.071

8 8 0.140

12 12 0.198


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4697A & 4697B Tape Feeder Pocket Depth and Length Limitations1

Tape Feeder Width Tape Max Pocket Max Part ComponentPitch Depth Length2 Pick Height

8 mm 2-8 6.5 N/A 139.7 Embossed

12 mm 4-12 6.5 N/A 139.7 Embossed

16 mm 4-16 14 16 139.7

24 mm 4-20 14 24 139.7

24 mm 24 13.8 24 139.7

32 mm 4-20 14 31.5 139.7

32 mm 24 13.8 31.5 139.7

32 mm 28 13.4 31.5 139.7

32 mm 32 12.9 31.5 139.7

44, 56 mm 4-20 14 40 139.7

44, 56 mm 24 13.8 40 139.7

44, 56 mm 28 13.4 40 139.7

44, 56 mm 32 12.9 40 139.7

44, 56 mm 36 12.4 40 139.7

44, 56 mm 40 11.7 40 139.7

44, 56 mm 44 11 40 139.7

72, 88, 104, 120 mm 4-40 20 44 139.7

72, 88, 104, 120 mm 44 19.5 44 139.71 All dimensions are in millimeters.2 Maximum part length due to a peeler opening limitation.

4697A & 4697B Tape Feeder Channel Cross-Section DimensionsDimensions are not drawn to scale, and are provided for reference only

These dimensions do not account for tape routing radius clearance and tolerances. For maximum specified tape pocket depthbased on pitch and pocket length, refer to Tape Feeder Pocket Depth and Length Limitations table above.

0.9mm8 - 12mm

3mm

6.5mm12.8mm

15.5mm

0.9mm 3.8mm

16 - 24mm

12.3mm

15.5mm

3.8mm 3.8mm

32 - 56mm

2.8mm

4.3mm22.6mm

72 - 88mm

3.1mm

13.4mm

8.8mm1.8mm

13.2mm

8.9mm

19.9mm

4.1mm 3.9mm

32 - 44mm

3.9mm

5.8mm 23.5mm

104-120mm3.9mm

12.8mm

8.9mm2.0mm

8 - 12 mm Pocket

32 - 44 mm Deep Pocket

16 - 24 mm Pocket

32 - 56 mm Pocket

72 - 88 mm Pocket 104 - 120 mm Pocket


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• 16 mm (4 mm - 16 mm pitch)

• 24 mm (4 mm - 24 mm pitch)

• 32 mm (4 mm - 32 mm pitch)

• 44 mm (4 mm - 44 mm pitch)

• 56 mm (4 mm - 44 mm pitch)2

• 72 mm (4 mm - 44 mm pitch)2

• 88 mm (4 mm - 44 mm pitch)2

• 104 mm (4 mm - 44 mm pitch)2

• 120 mm (4 mm - 44 mm pitch)2

1 Model 4697A Multi-Pitch Tape Feeders require the 24V transformer kit.2 Larger pitch can be handled. Limitations apply to pitch selectionsabove 44 mm. Consult a Universal Sales Engineer.

Feeder design is based on EIA-481-B standards. Punched andembossed carrier tapes, reels and components meeting the abovestandards are processed by these feeders. Reference TechnicalSpecifications section where limitations apply.

Multi-Pitch Tape Feeders, Model 4697A1

Introduction

The classic Multi-Pitch Tape Feeder, Model 4697A, is availableto process a wide range of embossed component tapes. Reelloader feeders can be kept ready for installation on the GSMPlatform.

These previous generation tape feeders continue to be availablefor environments where mixing of feeder types is not feasible.New Precision ProTM Tape Feeders provide superior perfor-mance (see page B-51).

Feeder Concept

Each feeder is dedicated to a tape width with adjustable pitch se-lections, depending on desired tape pitch. The tape advancementis stepper motor driven, capable of forward and reverse tape ad-vancement control. Electrical connections are engaged when thefeeder is mounted to the GSM Platform.

Available Feeders

Feeder units are adjustable for pitch settings from 4mm - 44mm.Select a dedicated multi-pitch tape feeder based on tape width.

32 mmEmbossed Carrier

16 mmCarrier Tape

32 mm Feeder

Multi-Pitch Tape Feeder


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Handle

ComponentReel Holder

1

Latch 7Control Panel6

Mylar Cover TapeTake-Up Reel

4

Front Tape Chute32Tape Window

Component Pick UpPosition

4Tape Window Latch5


The following sequence of events describe the Multi-Pitch TapeFeeder functions. The numbers in parentheses relate to thecallouts in the illustration above.

(1) A tape reel is mounted on the Component Reel Holder.

(2) The Tape Window is released and rotated upwards.

(3) The component tape is routed through the rear channel of thefeeder, over the top of the inside and outside guides, and di-rected into the Front Tape Chute.

(4) Eight inches of the cover tape is peeled back from the com-ponent tape and pulled through the Tape Window. Be surethe end of the carrier tape is secured to the Take Up Reel.

(5) The component tape is secured under the Tape Window withthe Tape Window Latch.

(6) The pitch setting is selected from the Pitch Selector switchon the Control Panel.

(7) The Latch locks and releases the feeder from the GSM Plat- form.


EIA-481-B Punched and embossed carrier taping of surfacemount components for automatic handling.


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Max Max Feeder Tape Tape Take Up IndexingReel Size Reel Weight Positions Type Leader Capacity Increment

Required 16 mm 381 mm 2027 kg 2 Embossed 203 mm 3810.00 cm 4 mm to 16 mm

(15.00") (5.0 lbs.) Carrier (8.00") (1500.0") in 4 mmof 0.10 mm increments

(0.004")



32 mm 381 mm 2.27 kg 2 Embossed 203 mm One reel 4 mm to 32 mm(15.00") (5.0 lbs.) Carrier (8.00") of cover in 4 mm

tape increments

32 mm 381 mm 2.27 kg 3 Embossed 203 mm One reel 4 mm to 32 mm Deep (15.00")2 (5.0 lbs.) Carrier (8.00") of cover in 4 mm Pocket tape increments

44 mm 381 mm 2.27 kg 3 Embossed 203 mm 3810.00 cm 4 mm to 44 mm Standard (15.00")2 (5.0 lbs.) Carrier (8.00") (1500.0") in 4 mm and Deep of 0.10 mm increments4

Pocket (0.004")

56 mm 381 mm 2.27 kg 4 Embossed 203 mm 3810.00 cm 4 mm to 44 mm5

(15.00")3 (5.0 lbs.) Carrier (8.00") (1500.0") in 4 mmof 0.10 mm increments4

(0.004")

72 mm1 381 mm 5.44 kg 5 Embossed 203 mm One reel 4 mm to 44 mm5

(15.00")3 (12.0 lbs.) Carrier (8.00") of cover in 4 mmtape increments4

88 mm1 381 mm 5.44 kg 6 Embossed 203 mm One reel 4 mm to 44 mm5

(15.00")3 (12.0 lbs.) Carrier (8.00") of cover in 4 mmtape increments4

104 mm1 381 mm 5.44 kg 6 Embossed 203 mm 3810.00 cm 4 mm to 44 mm5

(15.00") (12.0 lbs.) Carrier (8.00") (1500.0") in 4 mmof 0.10 mm increments4

(0.004")

120 mm1 381 mm 5.44 kg 7 Embossed 203 mm 3810.00 cm 4 mm to 44 mm5

(15.00") (12.0 lbs.) Carrier (8.00") (1500.0") in 4 mmof 0.10 mm increments4

(0.004")

Technical Specifications for Multi-Pitch Tape Feeders

1 Pick point has been adjusted from 72.7 mm to 87.9 mm (2.865" to 3.462") to accommodate larger pocketdepth; hence, these feeders are not compatible with a Component Shuttle.2 Deep Pocket version available with 22" reel holder.3 Deeper Pocket and larger reel holder applications available via RFQ. Consult a Universal Sales Engineer.4 Maximum component size, in the feed direction is 40mm. Maximum index 44 mm.5 Larger pitch applications are available. Limitations apply to pitch selections above 44 mm. Consult a Univer-sal Sales Engineer for details.


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MPTF: 16 mm -120 mmPitch Swing Setting Tape Advance Distance (mm) Index Rate in Seconds

1 4 0.198

2 8 0.303

3 12 0.412

4 16 0.525

5 20 0.624

6 24 0.736

7 28 0.842

8 32 0.947

9 36 1.052

10 40 1.157

11 44 1.262

12 48 1.367

13 52 1.577


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Track Feeder, Model 4696A

Introduction

The Track Feeder, Model 4696A, supports and positions compo-nent tubes for component transport to the pick position for pre-sentation. Tracks and feeder bases are sold separately. TheTrack Application Listing contains the component types and di-mensions that can be used on the track feeder.

Visit the Universal web site, www.uic.com, for a complete nozzleand track catalog, or consult a Universal sales engineer for spe-cial requests.

Machine Concept

The track assembly and the feeder base assembly make up thetrack feeder.

The component-specific track accommodates a maximum of fourtubes. Track assemblies, with or without isolator assemblies, canbe installed on the base assembly.

Modular design of the track feeder permits quick feeder change-over on the GSM Platform.

Standard Features

Track Assembly

The component track assembly, with or without an isolator as-sembly, is application specific. Tracks are available for SOIC,LCC, PLCC, SOJ, and MOD DIP components. Select the re-quired track from the Track Application Listing. Tracks with iso-lators are used for the most common component packages. Atrack load assembly or wireform supports the component tubes.

Feeder Base Assembly

The feeder base assembly, with GSM Platform mounting, in-cludes the interface and shutter assembly.

Track Feeder


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Technical SpecificationsRequired Feeder 3 feeder slotsPositions

Service Requirements

Electrical Power is provided by the GSM Platform.

Pneumatic Air is provided by the GSM Platform.

Feeder Base

2 Track Assembly withIsolator Assembly

1 ComponentTube

3 Interface Assembly (Usedwith Isolator-equipped trackassembly. Removed wheninstalling all others.)

3a Shutter


The following sequence of events describes the Track Feederfunctions. The numbers in parentheses relate to the callouts inthe illustration above.

(1) Components are loaded:

• Automatically from Component Tube.

• Manually from a Component Tube. Nonstandard tubes mayrequire a manual method.

(2) The components move through the Track Assembly to thepickup position. An Isolator relieves component back-pres-sure for ease of component pickup.

(3) The Interface, between the Track and the Feeder Base, in-cludes a Shutter. Components remain in the Track, capturedby the Shutter until the component is picked.

For Odd Form Feeders, refer to Appendix-E, Odd Form AssemblyCapabilities, page E-76.


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Stationary Matrix Tray Platform, Model 4649A

Introduction

The Stationary Matrix Tray Platform, Model 4649A, is a base forup to 177.8 mm x 330.2 mm (7" x 13") matrix trays. The matrixtray platform requires no power and has no options.


The matrix tray support clamp assembly secures matrix trays forcomponent pickup by the GSM Platform.

Technical SpecificationsMaximum 25.4 mm (1.0")Component andTray Height

Weight 11.8 kg (26 lbs.)

Required Feeder 8 feeder slotsPositions

Service None required.Requirements

Matrix Tray Pick Limitations (Available axis travel to reach Matrix Tray pockets)GSM Platform Configuration Head/Beam Feeder Bank Outbound 5" Inbound 8.5" Inbound

Standard

GSM 1 Head 1 Front 14.40" N/A N/AGSM 1 Head 1 Rear 4.15" 9.15" N/AGSM 1 Head 2 Front 4.15" N/A N/AGSM 1 Head 2 Rear 14.40" 19.40" N/AGSM 2 Head 1/Beam 1 Front N/A N/A N/AGSM 2 Head 1/Beam 1 Rear 5.24" 10.24" 13.74"GSM 2 Head 2/Beam 2 Front 5.24" N/A N/AGSM 2 Head 2/Beam 2 Rear N/A N/A N/AThis table notes the distances of Y-axis travel from the feeder interface dowel pins to the limit. When configuring therear feeder plate position, users should consider the trade-off between maximum board width, Matrix Tray picklimitations (available travel to reach Matrix Tray pockets), and machine throughput. These limitations do not apply tothe Platform Tray Feeder.


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Multi-Tube Feeders, Model 4698A

Introduction

The Multi-Tube Feeder, Model 4698A, delivers a variety of com-ponents from tubes to the pick position on the GSM. The feederis loaded with multiple tubes of the same component type andpart number. It automatically ejects empty tubes and continuesfeeding components. The feeder can be manually loaded withfull tubes while the GSM is operating.

The General Application Placement Head can gang-pick fromthe Multi-Tube Feeders that require two feeder slots. Multi-TubeFeeders require application analysis and quotation. Consult a Uni-versal Sales Engineer for details.

Standard Features

Each feeder is dedicated to a component style. Universal Instru-ments offers several Multi-Tube Feeders for integration to theGSM Platform, including custom designs.


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The following sequence of events describe the Multi-TubeFeeder functions. The numbers in parentheses relate to thecallouts in the illustration at left.

(1) Tubes are stacked, one on top another and at an angle, forgravity feed of components to the singulator/track assem-bly.

(2) The Singulator retains the second component in line, whileallowing the first component in line to advance to the con-veyor. When the Singulator returns, the line of compo-nents advance by one component length.

(3) The Conveyor indexes the component to the end stop forpick up by the GSM Platform head.

(4) An empty tube ejects from the bottom of the feeder andthe next one in the stack drops into position for feeding tothe Singulator.

2

4

1

Technical SpecificationsElectrical Power is provided by the GSM Platform.

Pneumatic Air is provided by the GSM Platform.

Required Feeder 2 feeder slots for a 40 mm feeder track.Positions 3 feeder slots for a 50 mm feeder track.

Tube Length 501.6 mm to 558.8 mm (19.75" to 22.00")

Tube Stack Height 101.6 mm (4.00"), maximum

Index Rate Programmable. Recommended minimumsetting is 1.300 seconds.

For Odd Form Feeders, refer to Appendix-E, Odd Form AssemblyCapabilities, page E-76.

3


Tube Stacker

TubeEjector

Singulator

Conveyor


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Bulk Track Feeder, Model 4702A

Introduction

The Bulk Track Feeder, Model 4702A, is designed to process avariety of bulk packaged chips. Bulk feeding components pro-vides several benefits:

Maximize Production Time: Since bulk cassettes hold sub-stantially more components than taped reels, production delaysare reduced and productivity is increased.Decrease Replenishment Requirements: Reloading a typi-cal tape feeder can take approximately 5 minutes; however, thebulk cases simply slide into place in less than 15 seconds.Eliminate Feeder Waste: Bulk cases are refillable, or at leastrecyclable. Tape feeding creates excessive non-recyclablewaste including reels, carrier tape, and cover tape.

Machine Concept

A Bulk Track Feeder is dedicated to a specific chip size. Theelectrical and pneumatic connections are engaged when thefeeder is mounted to the GSM Platform through the standardfeeder interface.

Standard Features

Select a Bulk Track Feeder for the following chip sizes:

• 0603 Capacitor and Resistor• 0805 Capacitor and Resistor

Feeder design is based on the EIAJ-ET-7201 and IEC-60286-6standards, respectively. Bulk packaged chips conforming to theabove standard are processed by the Bulk Track Feeder family.

Refer to the Technical Specifications section where limitationsapply.

Note: The FlexJet Head does not support Bulk Track Feeders.


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Technical SpecificationsElectrical Power is provided by the GSM

platform

Pneumatic Air is provided by the GSMplatform

Required Feeder Slots One

Index Rate 250 milliseconds

Compatibility Flex Head, High Force Head


The following sequence of events describes the BulkTrack Feeder functions.

(1) Cassette is locked into the bulk cassette mount.(2) Case is mounted to the bulk feeder cassette.(3) Cassette aligns the chips end-to-end.(4) Chips are pneumatically transported to the pick

position via the track.(5) A vacuum nozzle is engaged to separate a com-

ponent from the next component in line.

ConnectorAssembly

VacuumNozzle

Bulk CassetteCaseTrack

Bulk Cassette

Lever

ComponentLabel

Base

LoadButton

Latch

Bulk CassetteMount

Metric Size L +/- L W +/-W T +/-T

1608C 1.6000 0.0708 0.8000 0.0700 0.8000 0.0700

1608R 1.6250 0.0750 0.8500 0.0500 0.4400 0.0400

2012C 2.0000 0.1000 1.2500 0.1000 0.6000 0.1000

2012R 2.0000 0.1000 1.2500 0.1000 0.5500 0.0500

Component SpecificationsThe following table lists the component specifications for all BulkTrack Feeders.

Inch Size L +/- L W +/-W T +/-T

0603C 0.0630 0.0028 0.0315 0.0028 0.0315 0.0028

0603R 0.0640 0.0030 0.0335 0.0020 0.0173 0.0016

0805C 0.0787 0.0039 0.0492 0.0039 0.0236 0.0039

0805R 0.0787 0.0039 0.0492 0.0039 0.0217 0.0020

C - 64 GS-401-02 Appendix C: UPS+ Software

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Graphical Component and BoardPattern Programming Tools

Graphical User Interface

Universal's UPS+ Software runs on the Microsoft®

Windows® 2000 operating system. It providesstate-of-the-art programming, operation, and diag-nostic tools for use with the GSM Platform.

Basic features of UPS+:

• Microsoft Windows 2000 operating system.• Graphic user interface with configurable icons

and machine status messages• Graphical pattern programming tools with

spreadsheet-style data entry• Networkable component and nozzle databases.• User configurable optimization aid• Comprehensive data import/export• Powerful query tools• Programmable feeder templates• On-the-fly vision inspection, using cutting-edge

ESI™ vision engine technology• Enhanced Product Setup, simplifying component

and board programming by teaching images.• Powerful diagnostic and manual axis control

tools• On-line documentation• GSM Platform can measure its own accuracy

and repeatability performance and provide sta-tistical information back through the user inter-face. (CPE with MMI)

• Management information includes detection andreporting of pick and vision inspection feeder,nozzle, and head performance

• Missing ball detection and pitch inspection forBGA (Ball Grid Array) and CCGA (CeramicColumn Grid Array) devices, including all ballcount

• Mixed head support, with common database.(See page 20 for supported head configura-tions)

• Configuration template export facilitates off-lineprogram generation, optimization, and simulationfor multiple GSM Platform configurations

Appendix C: UPS+ Software


Graphical Programming Tools

C - 65Appendix C: UPS+ Software - GS-401-02

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New Features of UPS+:

Multiple Language Support (languages can be switchedduring machine operation):

• English• Spanish• Chinese (Traditional)• Chinese (Simplified)

Expanded System Security

• Administrator-level control to access levels (by individual orgroup)

• Access to individual UPS+ Software files and folders, andoperating system functions can be limited or denied based onuser

• User-level event tracking• User accounts can be imported and exported easily to other

machines

Internet driven hyperlinks directly to Universal viaMicrosoft® Internet Explorer web browser to access:

• Software Updates and Revision Notes• Documentation and procedure updates• Service and support contact information• GSM Knowledge Base technical database• Technical Service Bulletins

On-line documentation via the VOYAGER InformationBrowser for access to the following:

• Operation• Programming• Maintenance support• Feeder Topics• General Information• Related information links• User created annotations and F1 "Quick Help" links

Detailed Event Messages

• Improved message descriptions• Expanded access to further event details and corrective ac-

tion recommendations• Search function within Event Messaging

Multiple Language Support

On-line Support viaUniversal's Web site

Voyager InformationBrowser


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Detailed Error and Warning Messages

• Provides instructions to correct machine-stop conditions• Warning events proactively alert user to potential machine-

stop conditions• Error-recovery screen automatically disappears when all er-

rors and warnings have been addressed

Advanced Product Editor

• Allows overlapping circuits and unrestricted positioning ofleads, components, fiducials, and feeders for a wide range ofapplications

• Programmable placement order within each task block• Supports Component ID up to 32 characters• Real-time simulator• 1-step Platform Tray Feeder (PTF) programming with

JEDEC trays• Custom macro scripting• Saves invalid products for future editing• Optimizer includes quick or optional iterative long optimization• CI2 Comprehensive Import incorporates an intuitive, flexible

layout and supports partial import/export of individual compo-nents, feeders, placements or fiducials

• Product data status windows track 3 levels of error types,displays clear instructions that lead to valid product genera-tion, and a "Go To" button to quickly view root-cause data

• New independent fiducial and nozzle databases

UPS+ Component Database

• Incorporates a new intuitive layout that organizes data bytabs

• Unique programming values for multiple head and cameratypes facilitate factory-wide sharing of single component da-tabase

• Includes over 1,200 industry-standard default componentdefinitions

• New spreadsheet-style data entry with tool-tip informationfor each field streamlines data entry

• Supports offset pick-and-place centroid coordinates for awider range of applications

Product Editor

UPS+ Component Database

C - 67Appendix C: UPS+ Software - GS-401-02

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Customizable User Interface templates for the followinguser levels:

Default templates:• Operator• Technician/Maintenance• Programmer• Line Engineer• Manager/Supervisor

UPS+ allows for custom template and user group criteria, andsimple import and export of user templates and accounts.

Operator Interface and Production Setup Tools

• Automatic nozzle change during component setup teach• Quick Image Capture tool facilitates simple export of actual

vision image as bitmap file• Nozzle setup routine guides operator through nozzle configu-

ration setup during product changeover• Runs in full screen mode (Operators cannot access operating

system)• Includes quick access icon for nozzle and feeder perfor-

mance data

Auto-pick Coordinate Update

• Automatically tunes feeder pick point based on vision resultsfor optimal small-part pick performance

Skip Component Quick Bypass• Selecting "Skip Component" within feeder repair window

quickly bypasses component• Component remains bypassed until next product changeover• Supports multiple component bypasses• Configurable to standard or quick bypass skip component

Operator Interface

Additional user groups:• Operator (advanced)• Backup operator• Guest• Power user• Replicator• User• Administrator

User Setup Template


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Management Information System

• Powerful, flexible charting tools and graphics provide quickaccess to production detractors

• Configurable data query period by time interval, product, oroperator

• Displays metrics as percentage, parts per million (PPM), orquantity

• Report generators• Configurable screens• Data sort function• Custom query capability

True-to-scale Configuration Graphics

• Represents current real-time configuration of machine• Add Hardware Wizard streamlines reconfiguration process• Easy system-wide switch between English and Metric units

of measure

Diagnostics Tools

• Trend analysis graphically displays machine event historywith powerful sorting, filtering, and statistical analysis toolsfor troubleshooting and maintenance.

• Manual Axis Control feature incorporates user friendly inter-face, vision image from PEC camera, and programmable in-tervals up to 10%

• Manual diagnostics feature provides advanced digital I/O di-agnostics

• Pattern diagnostics feature facilitates motion control macrosto cycle axes at programmable intervals and monitor servomotor performance

Diagnostics Tools

Management InformationSystem

D - 69Appendix D: Placement Heads - GS-401-02

Pla

cem

ent

Hea

ds

Component HandlingCapabilities

FlexJet 1 Flex High Force

mm inch mm inch mm inch

Maximum(without thetarotation in thecamera housing)

Length 25.400 1.000

Each of these GSM Platform placementheads require the use of an Upward-Looking Camera for image acquisition.Refer to Appendix A, “Cameras,” forapplicable component considerations.

Width 25.400 1.000

Height 11.68 0.460

Maximum(with theta rotationin the camerahousing)

Length 17.960 0.707

Width 17.960 0.707

Height 11.68 0.460

Minimum

Length 0.500 0.020

Width 1.000 0.040

Height 0.150 0.006

Maximum(Camera SelectionDependent)

Length 50.800 2.000 50.800 2.000 50.800 2.000

Width 50.800 2.000 50.800 2.000 50.800 2.000

Height 12.700 0.5004 12.700 0.500 12.700 0.500

Minimum(Camera SelectionDependent)

Length 0.500 0.020 0.500 0.020 0.500 0.020

Width 1.000 0.040 1.000 0.040 1.000 0.040

Height 0.150 0.006 0.150 0.006 0.150 0.006

Minimum Lead Width 5 0.228 0.009Upward-Looking Camera Selection

DependentRefer to Appendix A, “Cameras,” for

details

Minimum Lead Pitch 5 0.500 0.020

Minimum Bump Diameter 5 0.335 0.013

Minimum Bump Pitch 5 0.671 0.026

Task Block Thickness Range 6 6.35 0.250 N/A N/A

Placement Force Range (10gincrements)

150 to 1,000 125 to 450 175 to 2,500 7

Maximum Component Weight 8 35 35 35

Practical Component Range

Standard SMcomponents from

chips to large leaded &area array

components, includinga limited range of OddForm surface mount

packages 9

Mid to large leadedand array components,including Odd Form IM

or SM packagesrequiring up to 450gplacement pressure

Mid to large leadedand array components,

including advancedpackaging and Odd

Form packagesrequiring up to 2,500gplacement pressure

Appendix D: Placement Heads

Notes:1 Vacuum pick surface MANDATORY for FlexJet heads. Additional considerations for the FlexJet head include the lack of backlighting capability, co-planarity support, and gripper nozzles. The FlexJet nozzle changers cannot be configured in the Feeder Bank. Finally, there is no support for thin filmapplicator or wafer array feeders; however, support is planned for a future software release.2 Actual component dimensions will vary depending on the pick tolerance applied.3 Special situations exist where specified constraints can be alleviated to accommodate non-standard applications. The GSM Platform has placed a146.1 mm (5.75") x 12.95 mm (0.510") SM connector with special considerations.4 Special situations exist where specified constraints can be alleviated to accommodate non-standard applications. The GSM Platform has placed a25.4 mm (1.0") tall electrolytic capacitor with special considerations.5 Some component applications may require an upward looking camera. Refer to Appendix A: “Cameras” for details.6 This thickness range is for imaging parts in the same FlexJet task block and is necessary to ensure all components are centered within the specifiedfocal plane of the camera.7 Requires the optional Pressure Enhancement Kit and Pressure Readout Assembly for calibration and maintenance.8 Special situations exist where specified constraints can be alleviated to accommodate non-standard applications. The GSM Platform has placed a 56gram CCGA using a specific vacuum nozzle.

9 The FlexJet component range is continually expanding. Consult GSM Applications Engineer for a review of specific components.

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D - 70 GS-401-02 - Appendix D: Placement HeadsP

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GSM throughput specifications have been achieved by running benchmarkproducts with the following significant characteristics. All throughputspecifications exclude board transfer, fiducial inspection, and bad board sensetimes. Actual product throughput may vary with each application.

1 Based on Chip-1206 component placements from 8 mm tape feeders on a457.2 mm x 406.4 mm (18" x 16") board with feeder duplication, gang-picking,and On-the-Head Centering (FlexJet Head) or 4.0 mil/pixel Upward LookingCamera Station (Flex or High Force Heads). Can be verified using 1206 SpeedVerification Kit, part number 48884501.

2 Based on (42) PLCC44 component placements from 32 mm Multi-Pitch TapeFeeders on a 254.0 mm x 203.2 mm (10" x 8") board with feeder duplication,gang-picking, and On-the-Head Centering (FlexJet Head) or 4.0 mil/pixelUpward Looking Camera Station (Flex or High Force Heads). Can be verifiedusing PLCC44 Speed Verification Kit, part number 48884601.

3 Based on (36) PLCC84 component placements from 44 mm Multi-Pitch TapeFeeders on a 254.0 mm x 203.2 mm (10" x 8") board with feeder duplicationand 4.0 mil/pixel Upward Looking Camera Station. Can be verified usingPLCC84 Speed Verification Kit, part number 48884701.

4 Application dependency is related to component type and size, feederpackaging, accessory feeders such as PTF or shuttle, component featuresprogrammed, and any requirements for special nozzles.

5Specifications listed are typical for low-volume applications. For high-volume

applications you can obtain extra throughput with this configuration. Consultyour Universal Sales Engineer to obtain throughput estimates for your specificapplications.

GSM Platform: Placement Throughput Specifications

GSM2 Tact Time CPH GSM1 Tact Time CPH

w/2 FlexJet Heads w/ FlexJet Head & High Force Head

1Components < 12mm 0.18 second 20000 cph 1Components < 12mm 0.36-0.80 second 4500-10000 cph

2Components > 12mm – < 25mm 0.36 second 10000 cph 2Components > 12mm – < 25mm 0.51-1.03 seconds 3500-7000 cph

3Components > 25mm – < 32mm 0.80 second 4500 cph 3Components > 25mm – < 32mm 1.00-1.80 seconds 2000-3600 cph

4Components > 32mm Application dependent 4Components > 32mm Application dependent

w/2 Flex Heads w/ FlexJet Head (front)

1Components < 12mm 0.36 second 10000 cph 1Components < 12mm 0.36 second 10000 cph

2Components > 12mm – < 25mm 0.60 second 6000 cph 2Components > 12mm – < 25mm 0.51 second 7000 cph

3Components > 25mm – < 32mm 0.90 second 4000 cph 3Components > 25mm – < 32mm 1.00 second 3600 cph


w/FlexJet Head (front) & High Force Head (rear)5 w/2 Flex Heads

1Components < 12mm 0.36 - 0.80 second 4500 - 10000cph

1Components < 12mm 0.67 second 5400 cph

2Components > 12mm – < 25mm 0.51 - 1.03 second 3500 - 7000 cph 2Components > 12mm – < 25mm 0.90 second 4000 cph

3Components > 25mm – < 32mm 1.00 - 1.80 second 2000 - 3600 cph 3Components > 25mm – < 32mm 1.64 seconds 2200 cph



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X, Y: ±62µm @ 5σ (CP > 1.67)Using upward looking camera+ 75µm @ 5σ (CP > 1.67)Using On-The-Head Camera

θ: ±0.2° @ 5σ (CP > 1.67)X, Y: Repeatability < 12.4µmθ: Repeatability < 0.04°X, Y, θ: Cpk > 1.33

2

2

1 Assumes: Lead Width = Pitch X 0.5, Pad Width = Lead Width X 1.25, Span =38.1 mm. Reference IPC SM-782.2 Verified with all components of variation included: all spindles at allrotations for multiple boards and for each head and camera combination.Specified over standard (18" width X 20" length) placement area. Glassslugs placed on glass plate. Data analyzed by placement site.

Placement Performance Specification for Chips

X, Y: ±100µm @ 5σ (CP > 1.67)X, Y: Repeatability < 20µmX, Y: Cpk > 1.33

Component 150g to 1,000g, in 10g incrementsPlacement ForceRange

Final Placement 50 defects per million (dpm)Performance

Intrinsic Availability 98%

FlexJetHead

The FlexJet Head offers the best mix of flexibility and speed formost surface mount applications. The head accommodates highspeed chip placement and fine pitch component placement of0402 chips to 50 mm square components. It uses seven on-the-head camera CCDs to inspect components up to 24 mm squareduring travel to the PCB, thus eliminating the need for a separateUpward Looking Camera inspection step. Larger components upto 50 mm square are inspected using an Upward Looking Cam-era Station to perform “vision-on-the-fly.” Seven spindles are ar-ranged in 20 mm spacing for full gang picking from 8 mm and 12mm feeders.

Adding a second FlexJet head to a GSM Platform reduces thenumber of nozzle changes when building a product. In addition,full access to matrix tray feeders is gained from all feeder banks.

FlexJet® Head

Placement Performance Specification for Leaded andArray Components

75% lead-to-pad @ 4σ by placement 1

Component Placement Heads


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The Mean is the arithmeticaverage of a set ofmeasurements.

Standard Deviation is ameasure of the variability of aprocess output.

Accuracy is the distancebetween the mean and thetarget value.

Repeatability is one standarddeviation.

Cp is a capability index whichcompares the spread of theprocess to the distancebetween the upper and lowerspecifications.

Cpk is the process capabilityindex, which is a measure ofthe process's ability to produceproduct within specifications.

75% lead-to-pad @ 6σ by placement

X, Y: ±50µm @ ±5σ (CP > 1.67)θ: ±0.2° @ ±5σ(CP > 1.67)X, Y: Repeatability < 10µmθ: Repeatability < 0.04°X, Y, θ: Cpk > 1.5

1 Assumes: Lead Width = Pitch x 0.5, Pad Width = LeadWidth x 1.25, Span = 38.1 mm (1.5"). Reference IPC SM-7822 Verified with all components of variation included: allspindles at all rotations for multiple boards and for eachhead and camera combination. Specified over standard(18" width X 20" length) placement area. Glass slugsplaced on glass plate.

Cp= Upper Spec Limit - Lower Spec Limit

6σwhere σ = the standard deviation

of the sample

Cpk=

min(x - Lower Spec Limit, Upper Spec Limit - x )

3σ

where σ= the standard deviation of the sample and x is the sample mean

Flex Head and High Force Head

The Flex Head is a general purpose 4-spindle head, with 40 mmspacing between each spindle. This head offers added flexibilityby placing odd form as well as most standard surface mountcomponents.

Adding a second Flex Head reduces the number of nozzlechanges when building a product on a GSM1. In addition, full ac-cess to matrix tray feeders is gained in all feeder banks of theGSM Platform.

Universal’s High Force Head is essentially the same as theFlex Head, but it expands the placement force from 175 grams to2,500 grams with a force verification unit. Low force special ap-plications down to 50g are available. It also provides a high vol-ume die placement solution for applications such as flip chip andbare die attach, in addition to flexible fine pitch placement. TheHigh Force Head accommodates the broadest range of compo-nents on the GSM Platform.

Placement Performance Specification

1

Component Flex Head High Force HeadPlacement Force 150g to 450g, 175g to 2500g1

Range in 100g increments Programmable

Final Placement 50 defects per million (dpm)Performance

Intrinsic Availability 98%

1 Requires the optional Pressure Enhancement Kit and Pressure Readout As-sembly for calibration and maintenance. Low force applications are available.Consult a Universal Sales Engineer for details.

LSL USL

Target

Mean

Accuracy

±1σ

±2σ

±3σ

2


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Material Dispensing Heads (GSM1 only)

ArchimedesMetering Valve

Archimedes Metering ValveThe Archimedes Metering Valve (AMV) dispense head featuresdirect drive technology, which effectively eliminates unevenclutch application times resulting in dot diameter variations. TheAMV is based on rotary screw technology, offering precise con-trol that enables multiple dot sizes with each spindle. It is the idealchoice for solder paste and silver filled epoxies and other particlesuspensions.

The AMV offers excellent flexibility in dot size and materialrange, and is the perfect choice for high mix, high changeoverproduction lines where constant dot adjustments are occurring.For ultimate flexibility, combine the AMV Head with a FlexJet orFlex Head on a GSM1

Dispense Specifications 1

Cartridges 10cc and 30cc, customer supplied

Dispense Rate2 GSM GSM1 w/AMV GSM1 w/AMV

AMV only & FlexJet Head & Flex Head

AMV Spindle #1 35,000 dph 33,000 dph 31,000 dph

(Single Dot Small)

AMV Spindle #2 35,000 dph 27,000 dph 25,000 dph

(Dual Dot @ 0°)

AMV Spindle #3 35,000 dph 27,000 dph 25,000 dph(Dual Dot @ 90°)

AMV Spindle #4 35,000 dph 22,000 dph 20,000 dph(Single Dot Large)

Intrinsic 98%Availability

Nominal: 1, 2

X, Y Accuracy 0.020 mm (±0.0008")

X, Y Repeatability (σ) 0.018 mm (<0.0007")

Diameter 0.013 mm (<0.0005")Repeatability (σ)

Verified to: 1, 2

X, Y Accuracy 0.076 mm (±0.003")

X, Y Repeatability (σ) 0.051 mm (<0.002" )


1 Using a Universal Instruments certified adhesive overstandard (18" width x 20" length) placement area. Resultsvary with material, axis moves and Z-stroke requirements.2 Based on 0.508 mm (0.020") dot at 2.54 mm (0.100") X, Y,and Z.


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Positive Displacement Pump

The Positive Displacement Pump (PDP) dispense head uses fourindependently controlled pumps, each fed by its own syringe toaccurately dispense material onto the board. Positive displace-ment pumps ensure high quality, repeatable dots in a variety ofambient conditions and material types.

At specified throughput up to 43,000 dots per hour, the GSM Dis-penser can keep up with your chipshooter with no performancedegradation as syringe levels, viscosity, or the adhesive typechanges.

Pumps and syringe holder assemblies are quickly removed foreasy maintenance at a programmable location.Positive

DisplacementPump Head

Dispense Specifications 1

Cartridges 10cc and 30cc, customer supplied

Dispense Rate2 GSM GSM1 w/PD GSM1 w/PD

PD only & FlexJet Head & Flex Head

PDP Spindle #1 43,000 dph 37,000 dph 35,000 dph

(Single Dot Small)

PDP Spindle #2 39,500 dph 37,000 dph 35,000 dph

(Dual Dot @ 0°)

PDP Spindle #3 39,500dph 37,000 dph 35,000 dph(Dual Dot @ 90°)

PDP Spindle #4 39,500 dph 37,000 dph 35,000 dph(Single Dot Large)

Intrinsic 98%Availability

Nominal: 1, 2

X, Y Accuracy 0.020 mm (±0.0008")

X, Y Repeatability (σ) 0.018 mm (<0.0007")


Verified to: 1, 2

X, Y Accuracy 0.076 mm (±0.003")

X, Y Repeatability (σ) 0.051 mm (<0.002" )


1 Using a Universal Instruments certified adhesive overstandard (18" width x 20" length) placement area. Resultsvary with material, axis moves and Z-stroke requirements.2 Based on 0.508 mm (0.020") dot at 2.54 mm (0.100") X, Y,and Z.


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Dispensing Nozzle ToolingConfigurationsStandard Nozzle Tooling Configurations are included with thepurchase of the Archimedes Metering Valve and PositiveDisplacement Pumps.

Standard Nozzle Tooling encompasses the following:

Spindle 1 Small Minimum Dot Size Requirement is 0.508 mmSingle Dot (0.020")

Spindle 2 Dual Minimum Dot Size Requirement is 0.762 mmDot at 0° (0.030")

Spindle 3 Dual Minimum Dot Size Requirement is 0.762 mmDot at 90° (0.030")

Spindle 4 Large Minimum Dot Size Requirement is 1.016 mmSingle Dot (0.040")

Notes: Standard nozzles are only intended for dispensing adhesive betweencomponent pads that do not have solder paste printed on them.The 4 standard Nozzles that ship with the GSM dispense head cannot beexchanged for other special nozzles. If it is determined that special nozzlesare requires, the customer must purchase them.

Please refer to the following for standard nozzle configurations provided with machine. Additional or replacement nozzles may beprovided at additional cost.

Archimedes Metering Valve Standard Configuration

Spindle Type Inside Diameter Stand-off Height Dual Dot Span

1 SP/8/5 0.008" (0.2032 mm) 0.005" (0.1270 mm) N/A

2 DP/13/8/45 0.013" (0.3302 mm) 0.008" (0.2032 mm) 0.045" (1.143 mm)

3 DP/13/8/45 0.013" (0.3302 mm) 0.008" (0.2032 mm) 0.045" (1.143 mm)

4 SP/16/10 0.016" (0.4064 mm) 0.010" (0.2540 mm) N/A

Positive Displacement Pump Standard Configuration

Spindle Type Style Inside Diameter Stand-off Height Dual Dot Span

1 0.025" Piston B 0.010" (0.2540 mm) 0.005" (0.1270 mm) N/ASingle Port

2 0.040" Piston Q 0.016" (0.4064 mm) 0.010" (0.2540 mm) 0.045" (1.143 mm)Dual Port

3 0.040" Piston Q 0.016" (0.4064 mm) 0.010" (0.2540 mm) 0.045" (1.143 mm)Dual Port

1 0.040" Piston B 0.016" (0.4064 mm) 0.010" (0.2540 mm) N/ASingle Port

E - 76 GS-401-02 - Appendix E: Odd Form AssemblyO

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Appendix E: Odd Form Assembly Capabilities

Introduction

The flexibility of the GSM Platform offers manufacturers a highthroughput alternative to manual assembly for odd form throughhole and surface mount components. By automating odd form as-sembly, manufacturers produce cost-effective products while im-proving product quality.

To help customers automate their odd form and light electrome-chanical assembly, Universal’s Surface Mount Division providesknowledge-based services to resolve viability issues. These ser-vices include evaluating components, packaging formats, andfeeders; and design guidelines for printed circuit board lead-to-hole ratios, component density, and insertion forces.

Applications

This Appendix covers the odd form capabilities of the GSM Plat-form. Included is a list of components that have been inserted bythe GSM Platform. Odd-form applications require component,board, and feeding samples for complete analysis and quotation.Consult a Universal Sales Engineer for details.

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E - 77Appendix E: Odd Form Assembly - GS-401-02

Components

The GSM Platform has been configured to readily handle the fol-lowing odd form components:

D-Sub

DinCrystal

Connector-Rt angleConnector Block

Connector-Aux Connector RAHeader

CapacitorsAutomotive Headers


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Odd form components vary from vendor to vendor. Retentionfeatures and their respective hole sizes need to be analyzed, aswell as tooling clearances between components.

If your component type does not appear on this list, please con-tact a Universal Sales Engineer or visit the Universal web site,www.uic.com, for a complete nozzle and track catalog.

USBRelayPower IC

Pin-Header

Phone JackMulti-Chip Module

Mother-Daughter

KeypadICFilter

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E - 79Appendix E: Odd Form Assembly - GS-401-02

Component Tolerances

Maximum Component RangeLength 127 mm (5.0")Width 63.5 mm (2.5")Overall Height (body + lead) 21 mm (0.825")Height above board - staged 15.7 mm (0.620")Height above board - non-staged 17.8 mm (0.700")

High Force Head

The High Force Placement Head accommodates the broadestrange of components on the GSM Platform. The higher place-ment force range of 175 g to 2500 g accommodates placement offlip-chip (C4), and odd form components (axial, radial, headers,connectors, snap-in devices, etc.) as well as the full range ofstandard surface mount devices. Low placement force applica-tions down to 50 grams are also available with the High ForceHead. 4 spindles are arranged in 40 mm spacing for full gangpicking from 8, 12, 16, 24, and 32 mm feeders. Each spindle ac-cepts a wide variety of placement nozzles including grippers toaccommodate the broadest range of components and applica-tions. Vision inspection requires an Upward Looking Camerastation.

Speed

Actual throughput will typically be between 2 and 4 seconds percomponent, depending on force requirements, opportunities togang pick, and field of view requirements.

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Vision On-the-Fly

The GSM Platform is equipped with Vision On-the-Fly forthrough hole components. It also allows for lead inspection andregistration. Its inherent flexibility eliminates the need for feederregistration of components.

Odd-Form Feeders

The following feeders have been developed for odd form compo-nent applications:

Consult with a Universal Sales Engineer for component-specificfeeder tooling and software version requirements. Factory quoteis required..

Cameras

A specialized camera offers vision-assisted placement of oddform and light electromechanical assembly components. Avail-able in a standard magnification of four mils/pixel, this cameraemploys a special “cone” cover. The cone helps direct the light insuch a way that the ends of the leads on odd form componentscan be seen. The cone opening is only 1-1/8" wide.

OFA Camera

LensCover

Camera Cover

Radial Tape Feeder GPAX Feeder

Multi-Tube Feeder Matrix Tray Platform

Connector Feeder(SIMM/DIMM)

Vibratory Bowl

F - 81Appendix F: Board Handling - GS-401-02

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Appendix F: Board Handling

Dual Lane Board Handling

There are six zones within the dual lane option. Zones A, C, D,and F are used for input / output board stationing. Zones B and Eare used for board populating.

Up to three boards are staged in the GSM Platform at one time.Typically, two boards are in zones B and E and one board is inany of the other four input / output stations.

Dual Lane Board Handling can be configured in First In / FirstOut or Dynamic Modes as follows:

First In First Out (FIFO) ModeCurrently, the GSM Platform always attempts to ensure that thefirst board to enter the machine is the first board to exit the ma-chine, this is referred to as First In First Out or FIFO mode. Thisalternating lane order has proven to be the most optimal processfor the configuration. The machine stops in this mode if a non-al-ternating sequence of boards is presented.

Dynamic ModeIf Dynamic mode is selected and boards are not arriving in an al-ternating order, the machine continues to utilize the available lanewithout stopping. It is important to understand that even in Dy-namic mode, the machine attempts to run in FIFO mode as de-scribed above. It is only when an interruption in the traffic flow isdetected that the machine utilizes the lane that has the “avail-able” signal downline. Due to the dual lane hardware being con-trolled by a 1 drive system, boards cannot be staged in Dynamicmode. This allows the machine to continue running a given lanewhen the opposite lanes downline signal is “not available”.

A

B

C

D

E

F

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Maximum Board Width Configuration1

Nozzle Changer Rear Feeder Maximum BoardLocation Plate Position Width 2

Between rails outbound 216.0 mm (8.5")1 Other configurations available. Consult a Universal

Sales Engineer. 2 Board edge clearance of 5 mm (0.195") is standard; optional

3 mm (0.117") edge clearance reduces maximum boardwidth by 6.35 mm (0.250").

Dual Lane Board Handling:

• This configuration supports a 12.7 mm (0.5") maximumbottomside clearance for the first inch measured from thefront of the board. See illustration below.

• Board widths less than 89.0 mm (3.5") require the removal ofa board stop from each lane.

Fixed front railRear rail

12.7 mm (0.5")clearance under board

P.C. board section

Maximum Underboard Clearance Area

component

com

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nt

25.4 mm (1.0")

25.4 mm (1.0") clearance under board

P.C. board rails

G - 83Appendix G GSM Platform Traceability - GS-401-02

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Appendix G: GSM Platform Traceability

Traceability at the component and board level gives you a closed-loop feedback system that can both confirm quality and zero in onpotential problems — quickly, easily, accurately, and automati-cally.

That capability is now available through the DimensionsTM Manu-facturing Monitoring module of Dimensions Manufacturing Auto-mation Software, in combination with Universal’s bar code track-ing options for product identification and component validation.Traceability is featured on Universal’s GSM Platform.

Bar Code Changeover Option

Introduction

The GSM Platform is capable of handling bar code changeoversif it is equipped with the Bar Code Changeover option. This op-tion allows for seamless product changeovers without requiringthe user to manually load product data or press the start button.The changeover is accomplished based on a bar code string beingpresented to bar code reading hardware mounted to one of theboard handling lane’s upline conveyors. Once the bar code stringis received, a lookup is performed in a cross-reference lookuptable to verify what product should be executed for the given barcode.

This option is completely local to the GSM Platform. No externalhost machine is required. It is a separate purchased option to theUPS+ Software.

G - 84 GS-401-02 - Appendix G: GSM Platform TraceabilityT

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Restrictions/Limitations

The Bar Code Changeover option is only supported on StagedBoard Handling hardware with the SMEMA protocol. Eachboard handling lane requires bar code reading hardware mountedon the upline conveyor. Additionally, each bar code reader re-quires a serial line to the ISIO board. Dual Lane Board Handlingrequires twice the scanning hardware as Staged Board Handling.

Only printed circuit boards for the current product will be allowedin the machine. Any board requiring a product changeover will bemaintained outside the machine until all current boards have ex-ited the machine and the product changeover has been per-formed.

Before the GSM Platform can be placed into either Line Monitoror Changeover mode, it must be powered up and the amplifiersenabled by pressing the “hard” start button. If pallets are utilized,only one bar code in the set is used as the main product identifi-cation.

Universal-supplied bar code readers and conveyors are recom-mended. Should different conveyors or scanners be desired,there will be additional fees for integration, consulting, and re-quired parts/labor.

The scanner selected must scan fast enough to obtain good readsfor the speed rate of the input conveyor. The customer will needto place the bar code labels in a location which will allow thescanner to read the label successfully without adjusting the scan-ner location.


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Bar Code Types

The scanner is a high density 0.127 mm (0.005") line width, ca-pable of reading the following bar code types:

Code 39; UPC; Codabar; Code 128; Interleaved 2 of 5.

Narrow Bar Width Read Range Maximum Scan Width

High Density, Right Angle Down0.127 mm (0.0050") 50.8 mm to 78.7 mm (2" to 3.1") 53.3 mm (2.1")0.191 mm (0.0075") 50.8 mm to 102 mm (2" to 4") 91.4 mm (3.6")

0.191 mm (0.0075") 63.5 mm to 140 mm (2.5" to 5.5") 102 mm (4")0.254 mm (0.0100") 50.8 mm to 165 mm (2" to 6.5") 127 mm (5")0.381 mm (0.0150") 50.8 mm to 190 mm (2" to 7.5") 152 mm (6")0.508 mm (0.0200") 50.8 mm to 254 mm (2" to 10") 178 mm (7")0.762 mm (0.0300") 50.8 mm to 254 mm (2" to 10") 178 mm (7")1.02 mm (0.0400") 50.8 mm to 254 mm (2"to 10") 178 mm (7")

Right Angle Down

0.191 mm (0.0075") 31.8 mm to 102 mm (0.25" to 4") 102 mm (4")0.254 mm (0.0100") 25.4 mm to 127 mm (1" to 5") 127 mm (5")0.381 mm (0.0150") 25.4 mm to 152 mm (1" to 6") 152 mm (6")0.508 mm (0.0200") 25.4 mm to 216 mm (1" to 8.5") 178 mm (7")0.762 mm (0.0300") 25.4 mm to 216 mm (1" to 8.5") 178 mm (7")1.02 mm (0.0400") 25.4 mm to 216 mm (1" to 8.5") 178 mm (7")

Low Density

Direction of label travel

Scan Line

Direction of label travel

Scan Line


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Platform Setup Validation (PSV) Option

Introduction

The GSM Platform also supports Platform Setup Validation(PSV), which prevents operator-related errors during feedersetup or reloading by verifying the correct components are loadedinto the correct feeder slots. PSV minimizes product costs by re-ducing rework, thereby improving product yield while p roviding avalidation log, which tracks each feeder dismount, scan, andmount routines. Minimal operator training is required due to thesimple closed-loop operation and common look of the graphicaluser interface.

Incorporating PSV provides numerous benefits:• Prevents operator related loading errors: The closed-

loop feedback system ensures the correct feeders and com-ponents are loaded into the appropriate feeder slot whenevera tape feeder is mounted on the GSM Platform.

• Eliminates costly rework: Since PSV will never enable amismatched component and feeder slot, the wrong compo-nents are simply not picked, thus preventing any associatedrework.

• Improves product yield: Again, PSV ensures correct com-ponent usage. This means you will never be forced to reworkboards because the wrong part was placed. Hence, your firstpass product yield may increase.

• Minimizes product costs: PSV always ensures the correctcomponent is loading in its corresponding slot. In doing so,you can rest assured the GSM Platform will not place incor-rect parts onto your boards. Since this type of rework isavoided, less labor and materials are needed during boardproduction.

Bottom line, Universal’s closed-loop bar code scanning optionsaves time and money, while ensuring the production of highquality boards.

PSV Specifications• Requires UPS 3.1 or later software.• Supported Bar Code Label Formats:

Codes 11, 39, 93, and 128; UPC-A and E (not expanded);EAN/JAN; Standard 2 of 5; Interleaved 2 of 5; Codabar.

• See PTF options on page B-38 for available PTF barcodelabel kits and label size requirements.


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GEM Host Interface Driver

The Generic Equipment Model (GEM) software driver coupledwith a host software application such as Dimensions™ Manufac-turing Monitoring, provides a set of communication, data collec-tion, command, and control tools for GSM Platforms. Based onthe Semiconductor Equipment and Materials International stan-dard, SEMI E30-93, this software driver opens the system archi-tecture for integration into factory data collection and automationsystems.

PSV on PTF Assumptions andLimitations• Components loaded into the PTF are typically a stack of

matrix trays, encased in ESD packaging with barcodelabels affixed to the bag that identifies the components anddate / lot code information. The connection between thebarcode label and the components is broken when theoperator removes the stack of trays from the bag andplaces it in the PTF pallet. Maintaining this connection isoutside the scope of the PSV system. The quality of thevalidation and traceability function is completely dependenton the quality of the user’s solution for maintaining the con-nection between the components and the barcode labelsthat identify them.

• A pallet can be programmed to contain two differingstacks of components. There is no electrical signal that willallow PSV to detect activity for each individual stack. PSVwill require that data for both stacks be scanned every timethat a PTF pallet is removed from its magazine. Theoperator will indicate which stack is acted upon, by firstscanning a stack identifying barcode label on the top of themagazine. The contents of this label will not be tracked byPSV; PSV will use it only to associate scanned data to theproper stack in the pallet. There is no way to ensure thatcomponents are placed and scanned in the proper stack ofa PTF pallet.

• It is recommended that pallets be run until they are empty.If not, then lot code traceability is compromised, since thereis no way to know when a stack of trays of a specific lothas been consumed, and is no longer being placed onboards. This becomes more of a problem if matrix traysfrom differing lots are mixed together. PSV will report thecomponent ID and additional scanned lot / date code datafor the component most recently scanned into each stackof each pallet in the PTF.

• PSV on PTF requires Barcode Plaque Kits. See PTFOptions section of page B-37.


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Dimensions® Manufacturing Monitoring

Universal Instruments’ Dimensions Manufacturing MonitoringSoftware (DMM) is a host software application designed to col-lect and store machine management data from production floorequipment. DMM collects, archives, displays and derives datarelative to the needs of the end user. The DMM application isbrowser based to eliminate IT concerns of supporting client sideapplications. All access to data tables and viewable displays areadministered by the end user.

DMM accommodates multiple and/or unique combinations ofequipment without additional programming by utilizing built inconfiguration wizards. This feature reduces the time typically as-sociated with adding, reconfiguring or removing data collectionnodes (machines) from the host architecture. DMM supportsmulti-vendor equipment by using the SECS/GEM communicationsstandard adopted by the electronics manufacturing industry.

The DMM architecture is based upon a multi-tiered software andhardware configuration solution. Increasing software capabilitiesare introduced as modules of functionality and are determined bythe requirements of the end-user. Capabilities range from basicdata collection and reporting to full-scale traceability, SPC andenterprise level administration. DMM can be utilized as an iso-lated LAN within the production environment or it can be fully in-tegrated into an existing network schematic.

For assembly equipment where options are in place to performbarcode read functionality, DMM offers the capability of compo-nent and board level traceability. On equipment that offers thisfunctionality, data is generated that uniquely identifies the indi-vidual PCBs and components. This allows for data collected atDMM to be used for tracing board and component usage per lotnumber, vendor number, serial number or date/time stamp. Thisfunctionality allows for user-defined inventory control, work inprogress and product recall tasks to be accomplished quickly andeasily.

Reference General Specification GS-405-00A, DimensionsManufacuring Monitoring, for more details.