globalfoundries, dac 2011 update
Post on 21-Oct-2014
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DESCRIPTION
Globalfoundries and Magma presented an update at the DAC 2011 show, talking about 28nm production, IP libraries and tool flows.TRANSCRIPT
GLOBALFOUNDRIES Leading Edge Technology
6-9th June 2011
DAC 2011 Update
Delivering Innovation Through True Collaboration
Only Pure-Play Foundry in HKMG Production32nm “Llano” Yields Climb as Production Ramps
Q4 2010 - Q1 2011
Prim
e D
ie Y
ield
- Lot Yield Averages
Do = 0.13
“Llano” is the first HKMG Product in
the Foundry Industry
2
See “Llano” Demos in our Booth #1517
See “Llano”-powered Laptops in Stores this Month!
Delivering Innovation Through True Collaboration
4Q10 1Q11 2Q11 3Q11 4Q11
Leading the Foundry Ramp in HKMG
Ramping HKMG in volume ahead of others*
Other leading foundries
* Data based on customers’ and GLOBALFOUNDRIES projections. Comparison done for pure play foundries only.
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Delivering Innovation Through True Collaboration
Forget the FUD - Here are the FACTS
• Only foundry to ship HKMG in volume• Excellent SRAM yields (0.120um2 bitcell)
Gate First HKMG not manufacturable?
• 3GHz* on Cortex-A9 for 28nm-HPP• 2GHz* on Cortex-A9 for 28nm-SLP
Gate First HKMG not high performance capable?
• Passed all reliability tests• No burn-in requirements
Gate First HKMG is not reliable?
• Multi-Vt and multi-channel length options• Lowest Isb SRAM with 28nm-SLP
Gate First HKMG is not low power capable?
• HKMG key modules understood & mastered• Excellent process and electrical control
Gate First HKMG process control is difficult?
* Based on GLOBALFOUNDRIES simulation results and assumptions (TT condition)
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Delivering Innovation Through True Collaboration
Understanding and Delivering Market Needs
PerformanceMob
ileD
eskt
op
Tablets
MOBILE COMPUTING DIGITAL
CONSUMER
Laptop, Netbooks
Wireless Connectivity
Feature phones
Smartphones
LOW POWER
Up to 1GHz
1-3GHz
HIGH PERFORMANCE
STB
DTVGraphics
Games Networking
> 3GHz
5
Watts
Up to ‘00s mW
Up to ‘0s mW
Delivering Innovation Through True Collaboration
Two Platforms to Cover Your Needs
Performance
Tablets
MOBILE COMPUTING DIGITAL
CONSUMER
Laptop, Netbooks
Wireless Connectivity
Feature phones
Smartphones
LOW POWER
Watts
Up to ‘00s mW
Up to ‘0s mW
Up to 1GHz
1-3GHz
> 3GHz
HIGH PERFORMANCE
STB
DTVGraphics
Games Networking
28nm-HPP
28nm-SLPLow maskcount, no stress engineering for lowest cost
Mob
ileD
eskt
op
6
SLVT, OD option for > 2.3GHz
Stressors added for > 3.1Ghz
UHVt + LLSRAM for power mgmt
Delivering Innovation Through True Collaboration
Example of typical implementation of a Low Power product
With HP/HPM technology 28nm-SLP
“Gate First” 28nm Die Size Advantage
Up to 10% going
to gate last
Up to 5-10 % additional
increase with UHVt and
power management
Up to 20% die size advantage with 28nm-SLP vs other foundries superior GHz product costs/form factor
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Delivering Innovation Through True Collaboration
28nm-SLP: Best Performance at Low Cost
Increasing Cost (arb. units)
CPU
Clo
ck (
GH
z)
28nmHPP
Other foundry
28HPM
1.0 1.1 1.2
1.0
2.0
3.0
28nmSLP
1.3
+10% (mask adders due to stressors)
+10% (area scaling disadvantage of gate last HKMG)
+ 5-10% (area overhead for power management, larger UHVt device)
28nm-SLP has up to 30% cost benefit over HPM
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Delivering Innovation Through True Collaboration
Enablement is Structured to Provide Comprehensive and Differentiated Solutions
TechnologySolutions
Design Interface
Technology Services
Technology IP
Tech filesand PDK
Reference EDA flow
DFM
DesignInfrastructure
Foundation IP
Differentiated IP
Cultivation of Eco-System
IP Eco-System
TapeoutOperation
Data delivery portal
Qualityconformance
Design Enablement Operations
Design Solutions
SoC Enablement
Design services
Test Vehiclesand Shuttles
Collaboration with customers &
ecosystem partners to optimize
customers’ product performance,
leakage and yields
Design enabling ecosystem with Reference Flows, DEM/DFM, PDKs
and IPs flowing from multiple industry leaders
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Delivering Innovation Through True Collaboration
28nm – Extensive enablement in place
IP Category Wireless Comms
Mobile computing
Digital Consumer
ComputingNetworking
Foundation Std cells SLP SLP, HPP SLP, HPP SLP, HPP
Foundation Memory Compiler SLP SLP, HPP SLP, HPP SLP, HPP
Foundation GPIO SLP SLP, HPP SLP, HPP SLP, HPP
Basic Specialty IO SLP SLP, HPP SLP, HPP SLP, HPP
Basic PLL Library SLP SLP, HPP SLP, HPP SLP, HPP
Basic USB2.0 HS SLP SLP, HPP SLP, HPP NA
Basic USB3.0 SLP SLP, HPP SLP, HPP NA
Complex PCIe1.1 NA NA SLP, HPP SLP, HPP
Complex PCIe2 NA NA SLP, HPP SLP, HPP
Complex SATA I / II NA SLP, HPP SLP, HPP SLP, HPP
Complex SATA 6G NA NA SLP, HPP SLP, HPP
Complex XAUI NA NA NA SLP, HPP
Complex LPDDR2+ SLP SLP, HPP NA NA
Complex DDR2/3 NA NA SLP, HPP SLP, HPP
Complex HDMI1.4 Tx SLP SLP, HPP SLP, HPP NA
Complex HDMI1.4 Rx NA HPP HPP NA
Complex MIPI D-PHY SLP (HPP) NA NA
Complex HSIC SLP NA NA NA
28nm-SLP Full Design Kits Available NOW Well suited to cover wireless comms, mobile computing and digital consumer needs
28nm-HPP Front End Views Available, Full Design Kits Q4 Targeted for mobile computing, digital consumer and certain segments of computing/networking
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Delivering Innovation Through True Collaboration
GLOBALFOUNDRIES 28nm Fabs
East Fishkill, NY
Austin, TX
HeadquartersSi Valley, CA
London, UK
Yokohama,Japan
Shanghai,China
Hsinchu,Taiwan
Munich, Germany
Sales and Support Offices
Saratoga, NY
28nm manufacturing will be available in both Fab1 Germany and Fab8 New York
Dresden, Germany
Singapore
Manufacturing sites
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Plus, Added Flexibility with Common Platform FabSync – IBM, SEC
Delivering Innovation Through True Collaboration
Fab 1: Dresden, Germany
Fab 1 – Output Expanding to ~1M wafers/year Construction of 110,000 sq ft of new clean room space Brings total output to 80,000 wafers per month Completely 45/40nm and below technology
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Delivering Innovation Through True Collaboration
Fab 8: Saratoga County, NY
Most advanced 300mm wafer fab in the world Designed for 28/20nm technologies 60,000 wafer starts per month once fully ramped Construction started in July 2009 with production
expected to come online in 2012 Campus accommodates up to 2 more fabs
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Delivering Innovation Through True Collaboration
Enabling 28nm IP Silicon validation with MPW Program
4 shuttles in 2011 MPW0309 and MPW0310 fully
subscribed 28nm-HPP supported from MPW0311
onwards
4 shuttles planned for 2012
MPW0305MPW0306
MPW0307
Tech. Node
2011
Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
28nm 0309(07 Feb)
0310(03 May)
0311(15 Aug)
0312(01 Nov)
MPW0308
Tech. Node
2012Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
28nm 0313 0314 0315 0316
MPW0309
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Delivering Innovation Through True Collaboration
Most competitive solution at 20nm
HIGH PERFORMANCE
LOW POWER Extreme low power & cost sensitive
MOBILE , HIGH PERFORMANCE
Low power GHz applications, cost optimized
Mobile, high end applications > 3GHz
Wired, desktop applications
High performance to extreme high performance (>4GHz)
Cos
tLo
w P
ower
Hig
h Pe
rfor
man
ce
20LPM
20SHP(additional perf option)
• 50% area scaling from 28nm
• Single technology platform with multi Vt and multi Lg support
• >30% performance over 28nm
• Silicon-based PDK available
• Innovative MOL, BEOL for cost/density optimization
• First MPW in 4Q2011
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Delivering Innovation Through True Collaboration
Summary
Gate First HKMG in high volume production at GLOBALFOUNDRIES
We are the only pure-play foundry in HKMG production
28nm is ready and prototyping
28nm-SLP ideal for cost sensitive, GHz mobile consumer applications
28nm-HPP enables high performance computing markets (>2.5GHz)
Accelerate your designs with comprehensive design enablement
$5.4B investment in global capacity expansion in 2011
20nm is well underway
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