goldentechcircuits technology co · ★sales presentation ★ technology capability in quick turn...

GoldenTech Circuits Technology Co.LTD鑫科电路技术有限公司

Professional QTA & HMLV PCB Manufacturer

★ Sales Presentation★

• Established Date: Nov, 2009 Capital: USD 1.5 Million

• Brazil Office:Travessa Rolante, 40 - Corcunda - CEP: 94 175 070 - Gravataí RS / Brasil

• Shenzhen Office :16H Rich business towr, zhongxin Road. shajing, Baoan District, Shenzhen City, China

• South of china office: 401 Room, XiWanNian business tower, Baoan Garden Road. Baoan district, Shenzhen City, China

• Factory Location: E-block, DongMen industrial park. DanShui tower, HuiYang District. Huizhou City , China

• Factory Area: 4500 Square Meter

• Products Type: D.S. and Multilayer PCBs with QTA & HMLV

• Production Capacity: 60,000 square feet (6,000 square meters) per month

• Project Model: 2000 Types per month

★ Sales Presentation★General Information

Our Competitive Advantage

• Constituted by skilled & experienced specialist on PCB / Electronics Manufacturing;Engineering;Quality Assurance & Marketing.

• Just-in-time programs provide considerable savings and guarantee the delivery of speedy services;

• Design For Manufacturability (DFM) programs ensure optimum efficiency based on our professional engineer.

• One-Stop-Shopping Volume PCB/PCBA/PCB Layout solution Provider. (In Schedule)


Our Fast Response Service


Layer Quickest Lead Time Normal Lead Time

Double sides 24hrs 96hrs

4 layers 48hrs 120hrs






16-20 layers Depends on the specific requirements

Above 20 layers Depends on the specific requirements

Remark : Above Lead time based on EQ finished.

Products★ Sales Presentation★

◎ Material: FR-4 (Tg130-180)Rogers TeflonAluminum BasedPolyimide

◎ High layer counts (20+ layers)

◎ ROHS&REACH Compliance

◎ 8:1 aspect ratio

◎Minimum conductor width/spacing: 0.08/0.08mm

◎Minimum drill bit 0.15mm

◎Surface Treatment:

Lead free HAL/ HAL/OSP / Immersion Ni,Au / Immersion Silver / Immersion Tin /Gold finger

◎ Controlled depth drill/profile

◎ Sequential lamination

◎ Buried and blind via and HDI

◎ Heavy Copper PCB’s Up to 18oz.

◎ Controlled Impedance

Products★ Sales Presentation★

Technology Capability in Quick Turn★ Sales Presentation★

Item Standard Sample Layer count 18L 26LFinal board thickness 0.35-4.0mmAspect rate 8:1 12:1Impedance Single line +/-10% +/-8%

Different line +/-10% +/-8%Line/space Inner layer 3/3mil 2.5/2.5mil

Outer layer 3/3mil 3/3milMin drill bit 8mil 6mil

Hole position tolerance +/-3mil +/-3mil

PTH hole dimension tolerance +/-3mil +/-2mil

NPTH hole dimension tolerance +/-2mil +/-1mil

Solder mask Line to solder PAD 4mil 3milRegistration tolerance +/-2mil +/-1.5mil

★ Sales Presentation★Technology Capability in Quick Turn

Peel able mask thickness 5mil 5mil

Carbon ink thickness 0.3mil 0.3mil

Lead and lead free HASL thickness SMD:40-2000u”

GND:30-800u”

Immersion Au Au thickness 1-5u”

Ni thickness 80-200u”

OSP thickness 0.2-0.5um 0.1-0.6um

Immersion tin thickness 0.8-1.2um

Immersion silver thickness 0.15-0.45um

Profile tolerance Punching +/-8mil +/-5mil

Routing +/-4mil +/-2mil

Lamination type FR4(Tg130-180)Halogen free laminationRogers/Teflon/Aluminum board

★ Sales Presentation★Reference Working Standards

◎ Customer’s SPEC

◎ IPC-A-600G

Acceptability of Printed Boards

◎ IPC6011

Generic Performance Specification for Printed Boards

◎ IPC-6012B

Qualification and Performance Specification for Rigid Printed Boards

◎ IPC4101B

Specifications for Base Materials for Rigid and Multilayer Printed Boards

◎ IPC-D-300

Printed Board Dimensions and Tolerances

◎ IPC-SM-840C

Qualification and Performance of Permanent Solder Mask

◎ANSI/UL-796 Safety Standard for Printed Wiring Board

• The USA UL Certification • ISO9001:2008• UL File NO.: E480288


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Maketing Segment★ Sales Presentation★

★ Sales Presentation★Product by layer count

★ Sales Presentation★Sales turnover

USD

M

Major Equipments List ★ Sales Presentation★

JH-900 automatic Scrubbing machine

CCD parallel expose machine Developer Scrubbing Machine Lamination machine

X-ray drilling Tooling holeJH-900 separation machine

Major Equipments List ★ Sales Presentation★

SCHMOLL Drilling machine MANIA Drilling machine Automatic plating

Etching machine HASL machine X-ray CM-800

Major Equipments List★ Sales Presentation★

AOI

Fly probe

E-test

CNC machine

Key reliability testing equipment

Reliability Testing

◎100% E-TEST◎100% Visual Inspection◎Outline measurement◎Micro section◎Solder ability

(245±5ºC; 3-5 sec)◎Thermal shocking

(288±5ºC,10 sec. 3times)◎Solder mask peeling testing◎Peeling intensity testing◎Impedance testing◎Ionic pollution testing◎Temp& Humidity test


Specail Product introduction


PCB Type： Rigid-Flex Layer： 2L Thickness： 0.50mm Outlayer cu： 1 OZ Min.dril： 0.30mm Min.W/D： 0.20/ 0.15mm Surface： ENIG

Stackup Layer

PCB Type： Rigid-flexLayer： 4L Thickenss： 0.80mm Inner cu： 1 OZ Outlayer cu： 1 OZ Min. drill： 0.30mm Min.W/D： 0.15/ 0.15mm Surface ： ENIG

Stackup Layer

Specail Product introduction


PCB Type： Power boards Layer： 2L Thickness： 1.60mm Outlayer cu： 12 OZ (210um)Min.dril： 0.80mm Min.W/D： 0.90/ 0.70mm Surface： ENIG

This is specail heavy copper 210um (12oz)

PCB Type： MDSIN boards Layer： 2L Thickness： 0.15mm Outlayer cu： 2 OZ (70um)Min.dril： 0.50mm Surface： OSP

Speical thickness 0.15mm with 2oz copper

★ Sales Presentation★Specail Product introduction

PCB Type： Blind&burriedLayer： 6L Thickenss： 2.0mm Inner cu： 0.5 OZ Outlayer cu： 1 OZ Min. drill： 0.35mm Min.W/D： 0.15/ 0.15mm Surface ： ENIG

PCB Type： Rigid-flexLayer： 4L Thickenss： 2.0mm Inner cu： 1 OZ Outlayer cu： 1 OZ Min. drill： 0.30mm Min.W/D： 0.15/ 0.12mm Surface ： ENIG

PCB Type： Blind &burriedLayer： 4L Thickenss： 0.8mm Inner cu： 1 OZ Outlayer cu： 1 OZ Min. drill： 0.25mm Min.W/D： 0.12/ 0.143mm Surface ： ENIG

PCB Type： blind and burriedLayer： 8L Thickenss： 3.20mm Inner cu： 0.5 OZ Outlayer cu： 1 OZ Min.BGA size: 0.22mmMin. drill： 0.10mm Min.W/D： 0.127/ 0.093mm Surface ： ENIGVias pluggd with Resin

★ Sales Presentation★Specail Product introduction

The size 869.6x386mm, the network connect by 16271 blind and buried hoes !

Stackup layer

PCB Type： blind and burriedLayer： 4L Thickenss： 3.20mm Inner cu： 1 OZ Outlayer cu： 1 OZ Min. drill： 0.35mm Min.W/D： 0.15/ 0.15mm Surface ： ENIG

Your Flexible QTA & HMLV PCB Supplier!


Thank you !!!Thank you !!!

GoldenTech CircuitsTechnology Co.,LtdFast Response; Superior Quality; Skilled Experience; High Technology

Contact: [email protected]

mailto:[email protected]

goldentechcircuits technology co · ★sales presentation ★ technology capability in quick turn...

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