group/presentation title month ##, 200x page 1 working with digital and rf can be as easy as abc...
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Group/Presentation Title
Month ##, 200XPage 1
Working with Digital and RF can be as easy as ABC
Convergence of RF & Digital
Technologies
Presented by:
Mohit KhannaR&D Operating Manager
Agilent Technologies
Convergence of RF & Digital Technologies
Abstract:
With the rapid development of mixed signal technology to fulfill ever growing need to make
newer electronics gadgets smarter, smaller & cheaper throws out a unique challenges for
designers as these technologies pose interesting and often contradictory challenges.
As a recognized market & innovation leader in RF & Mixed Signal Simulation space alongwith
state-of-the-art T&M, Agilent Technologies provides competitive & technological edge to
designers/developers working in ever challenging environment to be successful. During the
course of presentation we shall provide insights on latest design & development challenges with
tools & techniques to be successful.
Presenter’s Profile
Mohit is B.Tech in Electronics and Telecommunication from Allahabad University and M.Tech from IT- BHU in RF. Previous to working in Agilent, Mohit worked with ISRO as Scientist for six years. For last 6 years, Mohit is working with Agilent Technologies. Currently Mohit is working as Operating Manager looking into Software Testing & Quality Assurance of Agilent EEsof software products.
He can be reached at [email protected]
What’s the Story?The Digital and the RF World are MERGING
It’s a REALITY: A standalone working Baseband and a standalone working RF front-end does not GAURANTEE a working system!
4
Digital RF
Baseband Designer RF Designer
Challenges for System Designer“Cross the A/D Converter Divide”
(1) Requires both Digital and RF Knowledge to understand the complete “picture”
5
(2) Needs a tool to perform Baseband/RF co-simulation. Design paths has to remain in contact throughout the design process. Continuous cross-verification allows aggressive RF/Baseband partitioning, and reduced design margins with lower project risk.
Digital
RF
Fear Factor“Crossing the A/D Convertor Divide” System engineer
who are RF trained need to learn the digital way
System engineer who are Digital trained need to understand the RF world
6
RF Digital
How do we ensure integration goes smoothly?Baseband and RF Cross verification is a MUST!
Digital
RF
Communication Link where Agilent tools have role to play
PHY ArchitectureResearch Analysis
PartitioningVerification
Instrument Links
MIMO/ChannelFading
JammingNoise
InterferenceArrays/Steering
Baseband DSP Modeling Algorithms
Code-GenerationFixed Point/HDL
Verification
RF SystemArchitecture
Behavioral/NoiseX-parameters
Links from ADS/GG
PHY Reference IPWireless Standards
InteroperabilityVirtual H/W
Coded Test VectorsEDA/Test integration
Overcoming System Design Challenges
Using a Mixed Signal System Design tool which allows Digital/DSP as well as RF system modeling allows designers to partition their designs more accurately
This analysis also allows to mitigate the initial RF + Digital/DSP integration challenges and performance optimization
Mixed Signal PCB Challenges:Higher integration, higher complexity, smaller size
Dig
ital
Syn
the
size
rRF
F
ilte
rs
RF Osc
Digital Controller
RF
Co
nve
rte
r
RF
DigitalDigital
AnalogAnalog
RFRF
Agilent Spectrum Analyzer Mixed Technology RF PCB
More complex multilayer, multifunctional RF-high speed mixed signal boards
More mixed technology (RF, analog, digital) boards
Globally dispersed, isolated design team specialists
Continued pressure to meet an electronic company’s business needs:• Shorter design cycle times• Reduced development and end product costs• More competitive
products• Lower price points
Group/Presentation Title
Month ##, 200XPage 11
GPS
RF
S
wit
ch
Advanced Mobile Wireless IC Trends
Radio 2010 Next
Bands 7 >10
Mode Single Dual
Process 65/40nm 28nm
uP 2010 Next
CPU Single Multiple
GPU Tens Hundreds
Clock > 1GHz > 2 GHz
RAM PoP PoP/TSV
Process 45/40nm 28nm LHP
Cellular Radio/FEM
Apps Processor
WiFi+BT
BB 2010 Next
Core ARM9 ARM11, QMSM
Clock 300MHz 600MHz
RAM PoP TSV
Process 65/45/40nm 28nm LHP
Cellular Base Band
PA 2010 Next
Integration Module Si Carrier/3DIC
Process GaAs GaAs + CMOS
Passives 2010 Next
Type Discrete Integrated
Process SMT IPD/Interposer
Wireless Connectivity
2010 Next
Integration WiFi+BT+FM +GPS+NFC
Process 65/40nm 28nm
802.11ad/15.3c Radio-90/65nm Radio + BB65/40/32nm
Higher Levels of Integration, More “Radios”, Advanced Technology
Growth for RFIC Segment
12
Wireless Design ComplexityRadio design challenges associated with increased complexity:• Trend is complex signaling which requires a more complete verification flow:
• Analysis of full RX/TX functional path with “real” signals• System Design and Circuit Realization May Be Misaligned
• Cost is a Verification Bottleneck• Trend is for More Bands and Higher Frequencies:
• Broadband Millimeter Wave ICs are Being Designed in CMOS!• Trend is toward most advanced process technologies for RF
• RF Design Enablement is essential for success• New yield effects require additional verification before tapeout
• Advanced technologies are driving new packaging alternatives
LTE TX Signal
UpconvertedInterferer
LTE RX Band
How Agilent can help?Agilent EEsof Software Solutions….
SystemVue
GoldenGate
ADS
EMPro
Genesys
IC-CAP
DeviceModeling
RFIC MMICRF SiP / Hybrid
RFBoard
SignalIntegrity
CommsESL
Perform Early Verification using Combination of H/W and S/W LTE FDD UL Throughput Test (TS 36.141), or BER/BLER
Filter X
~
Filter A/D 1 2 3 4
DUGainDPDFilterX
~
A/D
RU DU
CPRI
Signal Generator
Signal Analyzer
SystemVue – Generates signal, then closes the loop
VSA 89600 waveform recordingSystemVue – LTE decode
Customer Hardware eNodeB receiver
STEP 1
STEP 2
SystemVue closed a loop to help measure LTE throughput
APP NOTE 5990-6202EN
Page 14
Resources:
1. Agilent Website: www.agilent.com2. Agilent EEsof: www.eesof.com3. Agilent EEsof Channel on You Tube: www.youtube.com/user/AgilentEEsof
Thank YouQ&A Session