hceres evaluation of csnsm imnc laboratoires de la vallée d’ … · 2019. 1. 17. · •...
TRANSCRIPT
HCERES evaluation of Laboratoires de la vallée d’ rsay
Technical departments
Speaker : V. Chambert on behalf of technical staff
CSNSM
IMNC
IPNO
LAL
LPT
14-17 january 2019
Outline
15/01/2019 HCERES evaluation – Technical departments 2
Strongly connected with science, the technical departments are a major asset in our laboratories
• Human resources and organization • Works and expertise • Responsibilities, teaching, technology transfer • Achievements 2013-2018 • Project 2018-2023 and future • SWOT analysis
Human capital
• 179 engineering people including 102 engineers
• Some people from Accelerator electronics and mechanics departments could join the engineering department
15/01/2019 HCERES evaluation – Technical departments 3
Mechanics: 55 people
Electronics: 51 people
IT: 53 people
Other specialties: 12 people
Biology: 2 people
Detectors: 23 people
Software Development
(21)
CAO – Cabling (16) Real Time/
Slow Control (9)
Mechanical design (38/14/5)
Mechanical manufacturing (17/1/7)
Detectors/
Instrumentation (23/1/22)
Operation (23)
Biology(2)
Front-End electronics (13/0/2)
Acquisition electronics(26/12/2)
Electrotechnics (2/2/0)
Cryogeny (2/1/1)
Vacuum(4/4/0)
Materials (2/0/2)
Laser (2/2/0)
Note: (//): example (26/12/2) means 26 of which 12 in the DEPACC and 2 in the "Detector Services"
Micro-electronics (6)
Charts of technical departments into laboratories
15/01/2019 HCERES evaluation – Technical departments 4 CSNSM : 24 engineering people
IMNC : 6 engineering people
Chart of technical departments into laboratories
15/01/2019 HCERES evaluation – Technical departments 5
IPNO : 48 engineering people
LPT : 2 engineering people
Chart of technical departments into laboratories
15/01/2019 HCERES evaluation – Technical departments 6
LAL : 99 engineering people
Comments on organizations
• Not exactly the same, not exactly different…
• Sizes, methods, culture are different but people already worked together and know each others
• WP3 « Technique » ongoing work: challenge of merging these groups within one pole
• coherence, efficiency, comfort….
15/01/2019 HCERES evaluation – Technical departments 7
Human resources evolution: 2014-1018
Decrease in the total number of persons with significant losses in some area
15/01/2019 HCERES evaluation – Technical departments 8
Detectors (all labs)
52
54
56
58
60
62
64
66
68
2014 2015 2016 2017 2018
Electronics (all labs)
0
10
20
30
40
50
60
70
2014 2015 2016 2017 2018
Mechanics (all labs)
64
54 54 53 51
0
10
20
30
40
50
60
70
2014 2015 2016 2017 2018
Computing (all labs)
Design and manufacturing equally affected by manpower decrease
These histograms include all the people with the corresponding expertise, whatever the group they are in
• All the departments work with CNRS budgets directly attributed by the laboratories for the recurring budgets
• Most activities financed by projects • ANR funded projects (about 9) • European fundings : PCI, SNO, AN, ERC, E-INFRA, ENSAR2 • ANDRA • CNES • LABEX P2iO and PALM
Financial support
15/01/2019 HCERES evaluation – Technical departments 9
P R O J E C T S
Network responsibilities (local, national, international)
Computing
• Strong involvement in local networks for system administrators (ARGOS) and developers (LoOPS): 5+ persons participating to the network management
• Several persons (5+) with national responsibilities in “Réseau des Informaticiens de l’IN2P3 et de l’Irfu (RI3)”: webinars, schools of computing, journées informatiques, …
• Responsible person for 2 computing-related masterprojects at IN2P3: DECALOG and DW4NP
• AGATA: Online SW&C architect, French Technical Coordinator
• Responsible person for Geant 4 WG “Novices and extended examples”
Instrumentation
• Member of the in2p3 networks board in microelectronics
• Responsible person of the semiconductor in2p3 network
15/01/2019 HCERES evaluation – Technical departments 10
Biology • Responsible person of the biology in2p3 network
• One week (full-time) course on Software Development Methodology and Best Practices in Master 2 NPAC: 5 LAL people involved for 35-40 students
• https://ens.lal.in2p3.fr/NPAC/ • Ecole Informatique IN2P3: one week, yearly, 1 to 3 LAL persons involved • « Data processing » in Master Nuclear Energy (U-psud): 2 engineers IPNO • « Embedded Linux » in Master SETI (U-psud): 3 persons (1 AI IPNO + / IE
(CSNSM) / IR (CSNSM)) • « Databases » in Engineering School L3: 1 engineer IPNO • CNAM, Engineer school, 1rst 2nd and 3rd year (L3, M1 & M2): (Nuclear practical
work) measures and data analysis in the domain of ionizing radiation detection, Computer assisted design with the CATIA, detection courses, Computer data acquisition with Labview courses
• MOOC: Des particules aux étoiles, Voyage de l’infiniment grand à l’infiniment petit • Apprentices supervisions, many engineers schools internships
Teaching activities (highlights)
15/01/2019 HCERES evaluation – Technical departments 11
• SERDI, Electronics group and R&D in instrumentation valorises towards the industry with all the necessary precautions (intellectual property, patents, licenses, contracts with well mastered involvement)
5 ongoing projects in collaboration with industry (Chauvin Arnoult, AG Medical, M2J, CAEN, ITRON)
4 micro-electronics NDA with industrial partners 3 patents + 2 software declarations
Valorization
15/01/2019 HCERES evaluation – Technical departments 12
- SYSTEL, THEORIS - Portable & high resolution Gamma camera for dismantling nuclear installations - ASICs VATA 460,3 (IDEAS) - 60 KeV – 1,5 MeV ~ 12 keV FWHM @ Tinside - Electronics developments, 1 IR CDD for 3 years - Detector developments, 1 IR CDD for 3 years
• Compton CAM project (ANDRA funding, 4 years from 2017, IPN+CSNSM 964 k€, Total 1,77 M €)
• PhD co-funded with industry (AREVA) • Ion beam diagnostic system (CNES)
Achievements highlights
(2013 - 2018)
15/01/2019 HCERES evaluation – Technical departments 13
A large field of capabilities • Both analog and digital Micro-electronics
• Front-End electronics from detectors to ADC
• Data processing electronics : FPGA, DSP, transfer protocols, digital filtering
• Systems
• Complex PCB design
• PCB populating workshop with industrial equipment, control and repair tools
• IT operation (1 cloud: 3500 cores, 0.5 PB, 1 grid site: 5500 cores, 2 PB)
• Software R&D : SW performance and parallelization, Distributed computing (Spark), Accelerator simulation (PSPA), Slow control
• Real time
• Mechanical design: finite elements simulations, vibrational, thermal and material resistance simulations
• Mechanical manufacturing : 2 large workshops including conventional and numerical toolings , many small workshops, 3-D printing
• Detectors implementation and developments : photodetectors , Si detectors, Ge detectors, gazeous detectors, bolometers
15/01/2019 HCERES evaluation – Technical departments 14
We build experiments
• Most of the time physics groups apply to a new project with a technical package proposal
• Technical involvement in almost all the nuclear physics projects
• Very important technical contributions/responsibilities in all the scientific projects of our labs, e.g.:
• At CERN : ATLAS, ALICE, LHCb and several important R&D projects (UA9, RD53 …)
• Spatial experiment (PLANCK)
• Due to our teams wide range of expertise, we can tackle all the technical challenges of a project from detector design to DAQ
15/01/2019 HCERES evaluation – Technical departments 15
Micro-Electronics
15/01/2019 HCERES evaluation – Technical departments 16
iPACI V2 layout iPACI V1 testbench
Collaborations
LPC Caen
INFN Milan
University Valencia
experiment:
Granularity,
Resolution,
Identification,
Transparency
Charge, current, time
measurements
AMS-SiGe 0.35µm
• Development using various technologies : TSMC 130 & 65 nm (RD53); AMS 0.35 µm 5V & HV (LSST-ChLab-DAMIC); AMS 180 nm (SAMPIC)
• Low-noise analog signal processing and readout controllers ASICs for CCD (LSST-DAMIC)
• Charge and timing measurement ASIC for PM (ChLab)
• Waveform digitizer & TDC ASIC for high resolution timing measurement (SAMPIC)
• Ring oscillators ASIC dedicated to radiation monitoring (RD53)
LOJIC 130nm : PLL 2.56GHz TSMC CMOS 130nm
C3 : 1x1 mm² TSMC CMOS 65nm SAMPIC : 2x4 mm²
AMS CMOS 0.18µm
ASPIC IV : 2,7x3,8 mm² AMS CMOS 0.35µm 5V
ROMIC : 1x1 mm² TSMC CMOS 65nm
CABAC1 : 9x6 mm² AMS CMOS 0.35µm HV
• Fast signal shaping • Design of complex boards>12 layers, >15000
interconnections, BGA 1152 pins • ASIC test benches • Optical cavities instrumentation (optoelectronics
devices, lasers and Fabry-Perot cavity expertise, aaaaaaaaaaaaoptical phase noise measurement)
Front-end electronics
15/01/2019 HCERES evaluation – Technical departments 17
Collaboration INFNs, LPCC, GANIL, IPNO Full frontend electronics boards responsibility Fifth version, 100 boards produced for next demonstrator FAZIETTO @ GANIL in spring 2019 VHDL codes development for digital signal processing 14 layers, particular attention to CEM Challenge: 25W / board in vacuum chamber, thermal drain on bottom side
Preamps + amps 100 & 250 MHz ADCs Low power supplies & HV
Frontend board V5 ILC CALICE FE module
MAGICS camera
Si PM version: USB readout
FE Board based on OMEGA ASIC EASIROC
FEB_LHCb
Back-end electronics
15/01/2019 HCERES evaluation – Technical departments 18
Fast signal analog/digital conversion DAC (250 MHz) - ADC (500 MHz) VHDL and Verilog firmware developments on ALTERA, XILINX, ACTEL Use of USB 2, PCI express, UDP and specific developments for fast data transfer Low latency feedback systems Digital filtering with Matlab
AGATA: electronics
New embedded electronic design "phase 2" (INFN-Milano, CSNSM-Orsay, IPHC-Strasbourg, STFC-Daresbury, IFIC & ETSE-Valencia): consumption divided by 6, price by 4; 36+2 channels/Ge detector, 14 bits-100 MSps, FPGA Virtex7 (processing, trigger, readout), 10 Gbit transfer.
NEBULA board
MEZZA Board
Design / Production of many versions of SAMPA ASIC Tests boards
Design / Production / integration of 20k Dual SAMPA frontend Boards for all 5 Stations (MWPC)
1 Million channels Design / Production / integration of the Large
PCB Boards for Station 1 Renewal of high voltage boards Commissioning of the upgraded detector
Testbench of SAMPA ASIC SAMPA ASIC bonded on PCB
Large MWPC PCB prototype
3 FTE electronics group Received help from LAL and LPC Clermont Lab. ~ 800 k€ project (core items)
For the Muon Spectrometer in the LHC Run 3 (2021--...), the expected muon trigger rate in Pb-Pb collisions for a 100 kHz interaction rate is beyond 10 kHz for pT > 1 GeV/c. Current Muon Spectrometer readout cannot cope with this data taking rate.
Upgraded FE boards DUAL SAMPA 345
Old MANU & DUAL SAMPA 12
Electronics Systems (1)
15/01/2019 HCERES evaluation – Technical departments 19
Electronics Systems (2)
But also…
• ATLAS Upgrade
• Super_NEMO
• LHCB Upgrade
• SPIRAL2/S3/SIRIUS
15/01/2019 HCERES evaluation – Technical departments 20
SIRIUS: SI Tunnel detector (96 ch.) Frontend electronic Hardware Backend electronic (Hardware, Firmware ADC 14 bits-100 MSps)
Low latency digital feedback system
SPEC2 board for LHCb Super Nemo Common tracker and calorimeter
front-end crate
ATLAS upgrade - LAr L1 trigger digitizer board (LTDB
common work with IRFU)
• Cloud : used by our labs and users from University Paris Sud + a few external users • 3500 cores, 500 TB
• Hosting several advanced services for scientific computing : JupyterHub (collaborative analysis and teaching), Spark (big data analysis), CodaLab (ML challenges)
• Storage : 1 PB multi-usage platform, distributed in 3 Paris Saclay locations for resilience • Will become the storage platform for the cloud but other usages possible
• Grid : 30% of GRIF grid site resources hosted in Orsay/Virtual Data (5000 cores, 2 PB) • Mainly used by LHC experiments and Belle II but also an external partner (Institut des
Systèmes Complexes)
Computing Operations
15/01/2019 HCERES evaluation – Technical departments 21
• Desktop/laptop management and support: 1000 (Windows, Mac, Linux)
• Windows: integrated into IN2P3 Active Directory (4 local domains currently)
• Network: advanced configuration for specific usages (e.g. VLANs)
Virtual Data data center building 206
Software Development
• Experiment support
• PSPA (Simulation Platform for Accelerator Physics) : local initiative to offer an easy to use framework providing a seamless integration of the main accelerator simulation codes
• Possibility to combine the different simulation codes along the accelerator elements to deliver an end-to-end simulation
• Already used for ThomX simulation
• Strong contribution to R&D for next decade computing in our experiments
• Efficient use of modern processor architectures (GPU, FPGA…) (EU project AIDA2020) • New approaches (including algorithms) for tracking (LHC + Belle II experiments): partly connected to
ML-based tracking R&D (See D. Rousseau talk) • New approaches for analysis of large data volumes, using Big Data technologies (Spark): R&D in the
context of LSST (https://astrolabsoftware.github.io) • R&D benefiting a lot from the local expertise in operating advanced services
• Tumour modelisation using in vivo microPET images (ANR t-Gate)
15/01/2019 HCERES evaluation – Technical departments 22
Real-Time Software Developments
• Data Acquisition: DCOD (former Narval) framework development • Used in several experiments, like AGATA, PRAE/ProRad… • Initially in nuclear physics but extending to new ones : CORTO…
• Integration of readout systems in acquisition chain: software development related to electronics contributions
• LHCb, PAON, DAQGEN, R&D for Belle 2 • Involves a mix of FPGA firmware developments and system drivers for DAQ boards
• Slow control, with a strong focus on accelerators • Expertise developed in the last 5 years around Tango (slow control framework from the
synchrotron community) in the context of ThomX, applied to other local accelerator projects • Integration of local electronics contributions to WinCC-OA (ex-PVSS) at CERN
• Radio isotopic imaging: data acquisition + neural network-based reconstruction (also ComptonCAM,
eASTROGAM, GAMINS)
15/01/2019 HCERES evaluation – Technical departments 23 Regular scan of the
detector Breast node
Mechanics
15/01/2019 HCERES evaluation – Technical departments 24
Main projects
• ThomX : Development of a compact intense X-ray source use
in medical or art application
• XFEL : Production of 800 power couplers for XFEL linear accelerator
• PHIL : Photoinjector test station set at LAL
• SuperNemo : The purpose of the project is to find the disintegration double Beta without neutrino
• Speso : Beam Longitudinal measuring using smith-Purcell radiation setup in Soleil linac
• ILC/ILD : Design of a detector and a Linear electron and positron collider for 2020. This Machine will permit to explore some new physics around 1 TeV energy
• VIRGO: large interferometer designed to detect gravitational waves
• ATLAS - phase II : HGTD, ITK, Test Beam
• ELI–NP-GBS : Extreme Light Infrastructure - Nuclear Physics
• I3D metal : 3D printing status, tests.
Service of Development and Mechanical
Technology (S.D.T.M)
CLAS12-CND Jefferson Laboratory
MINIBALL Alto • Measurement of the deformation of small alveoli
made of carbon and Tedlar • Finite element calculations
ALERT
Metal 3-d printing
Plastic 3-d printing
RDD @ IPNO
Materials
15/01/2019 HCERES evaluation – Technical departments 25
Samples preparation for alien materials
Sorting micrometeorites Concordia DC15-16 MEB analysis
Mechanical and ionic polishing Photos
1 2 3 4 5 6 7 8 9 10keV
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
cps/eV
Mg
Al
Si
C
O
S
Fe
Fe
Fe
Ca
Ca
1.00 * ST16-16-03 1
BSD
Biology
15/01/2019 HCERES evaluation – Technical departments 26
Activities
• Animal monitoring/behavioral study • Organ removal • Sample preparation • Cellular Biology • Microscopy
Videomicroscopy system with epifluorescence
confined in an incubation chamber
Rat
Mouse
Fluorescent cell Rat brain
Project (2018 – 2023 and
longer term future)
15/01/2019 HCERES evaluation – Technical departments 27
Context
• Evolution of technical projects within long lasting experiments • e.g. LHC upgrades (ATLAS, ALICE, LHCb), CTA, SOFIA, VIRGO,
GRIT…
• Support to accelerator projects • e.g. SPIRAL2 injector, ThomX, UA9, PRAE
• New projects
• Technical generic R&D
15/01/2019 HCERES evaluation – Technical departments 28
DAQ + Slow Control
• Strong expertises in the various aspects of DAQ and slow control: electronics and software • Increasing role of FPGAs and firmware development
• Has been involved for several years in DAQ for nuclear experiments/detectors (NARVAL/DCOD)
• Increasing contribution to accelerator slow control, based on TANGO framework
• Contributions desired by more and more experiments/projects: probably not able to satisfy all requests
• Promising new electronics approaches for DAQ based on FPGAs started a few years ago resulting in contribution requests by several experiments
• Tightly coupled with (Linux) system programming
• Belle II: proposal for next-generation DAQ short listed, reusing partly work done in LHCb
• BAO Radio: next-generation DAQ based on PCI-Express interconnect
• DAQGEN: IN2P3 project led by our lab to build an off-the-shelf DAQ card for small experiments
• DAQ for cancer diagnosis devices: real time processing • Includes advanced machine learning techniques for reconstruction
15/01/2019 HCERES evaluation – Technical departments 29
R&D on pico second time measurement
15/01/2019 HCERES evaluation – Technical departments 30
• LAL and IRFU have designed fast analog memories for 25 years (HAMAC for ATLAS, PIPELINE, MATACQ, SAM, SAMLONG).
• Their use for ps timing measurement started in 2008 (WaveCatcher)
• 2009: new patented concept, the Waveform Time To Digital Converter (WTDC), mix of a classical TDC and an ultra-fast analog memory
• 2013: SAMPIC 16-channel WTDC ASIC (180 nm technology ) • directly works on analog signals, samples (up to 8,5 GS/s), digitizes the waveform and
measures its arrival time with a resolution of a few ps rms.
• Boards, modules and acquisition software based on SAMPIC have been
developed at LAL • 16 to 64-channel systems, soon 256 channels • Used for particle physics fast detectors (PMT, APD, SiPM, MCP-PMT, LGAD,
diamonds, …) and for R&D on TOF-PET scanners.
• Collaborations ongoing with many French and international labs (IN2P3, IRFU, CERN, INFN, Kansas Univ., Geneva Univ., Munster Univ., …)
• SAMPIC selected as the baseline solution for CMS-TOTEM, SHiP timing and muon detectors, T2K upgrade TOF detector, LiquidO R&D, …
• R&D effort will be pursued, including participation in European calls for TOF-PET. • High integration level and implementation of large scale systems will be studied. • A slower version of SAMPIC dedicated to nuclear physics is under study. • Valorisation with industry will start in the next months (including licensing).
SAMPIC on board
192 channels of SAMPIC in TOTEM experiment at LHC
© S. Sharyy, IRFU
Boards and modules based on SAMPIC
SAMPIC was at the heart of a first international workshop in 2018: http://wpsist.lal.in2p3.fr/wasiw2018/. Next one will take place end of 2019.
Time Difference Distribution between two chips @ 6.4 GS/s: 4.5 ps rms
Example of use: time characterization of a PLANACON XP85012 MCP-PMT. Changes on
colors correspond to 30 ps.
SAMPIC_V3 ASIC layout
Mechanics expertise from the lab requested by several new experiment with mechanical challenges
Mechanics R&D
15/01/2019 HCERES evaluation – Technical departments 31
DUNE: The Deep Underground Neutrino Experiment (DUNE) is a leading-edge, international
experiment for neutrino science and proton decay studies.
R&D LiquidO: Neutrino detector.
The DAMIC dark matter experiment at LSM (Modane) DeLLight (Deflection of light by light) with LASERIX: mechanics + ultrahigh vaccum
Software performance and optimization
• Build a significant group of experts that can help the experiments/projects to optimise their SW for an efficient use of modern architectures (parallelism) and for the processing of very large amount of data
• Merge of the existing expertise in our labs will allow building a group of 5+ people with strong connection with the experiments
• Well established/recognized R&D work around parallelisation challenge and techniques for the long-living (and legacy) SW of our experiments
• In progress contribution to ATLAS and Belle II tracking, based on ACTS framework (1 core developer in the laboratory)
• Experiment frameworks: involved in adding an efficient support for heterogeneous resources, in particular GPUs
• New approaches for the processing large amount of data: use of big data techniques, machine-learning (connected to data science activities, see D. Rousseau’s talk)
• Big data R&D motivated by the LSST use case but may benefit others
15/01/2019 HCERES evaluation – Technical departments 32
Computing Operations
• A lot of common challenges in our various communities but often different technologies/approaches, partly because of insufficient links between them
• New lab can be place to foster these links around more common solutions around larger infrastructures for the benefit of everybody
• A strong collaboration already in place around computing: Virtual Data • Use the trust relationships built in the last 10 years for building a more integrated team
• Build upon the existing shared cloud and data infrastructure for future scientific computing services
• Data acquisition from local platforms (e.g. ALTO)
• New analysis tools (notebooks, big data services, machine learning…)
• Provisioning of experiment/project-specific resources, including grid for LHC experiments
• Foster the collaboration with the external users interested in our advanced scientific services
15/01/2019 HCERES evaluation – Technical departments 33
• Challenge of the number of planned retirements
• Unknown impact of the merging: some people may choose to leave
RH evolution in the next five years
15/01/2019 HCERES evaluation – Technical departments 34
0
1
2
3
4
5
6
7
T AI IE IR IRHC
Planned departures by category (2019-2024)
Informatique Mécanique Electronique
Note: includes the planned departures (fixed-term contract, retirements) of people with these competencies whatever their position in the current or future structures
0
1
2
3
4
5
6
7
8
9
10
2019 2020 2021 2022 2023 2024
Planned departures in the next 5 years
Informatique Mécanique Electronique
SWOT analysis
15/01/2019 HCERES evaluation – Technical departments 35
• Size of the new lab technical department may lead to problems and some people choosing to leave
• Single-person expertises • Lack of people with HDR in the technical groups leading
to difficulty to get PhD students • Insufficient publication of technical work by engineers in
peer-reviewed journal of their fields • Retirement of senior people during the next 5 years in
some areas
• Large technical services with recognized experts in the various technical fields allowing to play a major role in big projects
• A balanced mix of both short and long term projects, based on local, national or international collaborations
• High level experience in concurrent project management • Strong R&D activities to prepare the future experiment
contributions • Some developments for lab projects are also assets for
valorization • Privileged access to local platforms for test beams
• Funding fragmentation with more and more small projects in parallel
• Increased time spent by senior people to apply for projects funding and to do projects reporting
• Potential difficult relationship with other IN2P3 labs due to the perceived risk of domination of FLUO
• Low salaries compared to private sector making difficult to recruit new people, given the living costs in Paris region
• New merged lab creating a unique global technical force
and gathering together single-person expertise • Several upcoming big projects motivating the existence
and increase of this large technical force • Existence of smaller scale projects that motivate the R&D
work between projects with a long cycle • New attractive projects facilitating recruitments
Strengths
Weaknesses
Threats
Opportunities
Backup
15/01/2019 HCERES evaluation – Technical departments 36
High light Biology
Videomicroscopy system with epifluorescence
confined in an incubation chamber
Growth monitoring on long periods (1 picture/5 min during 48h)
Conservation of many available
cell lines
Cellular Biology
F98 cell
Microscopy
Animal monitoring/behavioral study
Rats and mice
Organ removal
Tissue storage and preparation
High light Instrumentation Gamma-caméra for breast cancer, radio-isotopic detection, FOV = 5x5 cm²
TRECAM
New generation
Physical evaluation
Safety tests (Laboratoire National d’Essais)
follow-up of the clinical evaluation
Mechanical design
Integration
PMT version
Electronic design (Asic, FPGA)
MAGICS
Si PM version
Asic EASIROC OMEGA
High light Data processing
Software development for acquisition
Magics
q1
q2
q256
x
y
Propagation
TRECAM-MAGICS : radio isotopic imaging
Reconstruction using neural network
A : Hématoxyline-Eosine marked tissues ; B : autoradiography sections ; C : in vivo microTEP acquisition ; D-E : simulated tumors using A et B respectively
ANR t-GATE :
Tumor modelisation using in vivo microTEP images
TReCam
Regular scan of the detector
Breast node
Future project Biology
- develop tissue clearing
The service is involved in
- the development of optical endomicroscopes and set-ups for in vivo applications and analysis of optical data from normal and pathological tissues
- studies of biological mechanisms involved in proton minibeam radiotherapy and new
approches in radiotherapy on cells and animals
Future projects Instrumentation
Optical scanner
Tungsten collimator 3D-printing
Multimodal optical endoscope for brain cancer
Optical fiber (250 µm) inserted in piezo electric tube (1,2mm), IPNO collaboration
Vibration result on fiber
The laser light is distributed by MEMs, Florida university collaboration
Gamma-caméra for internal radiotherapy, radio-isotopic detection, FOV = 10x10 cm²
SiPM, 1024 pixels
High count rate Front end Data acquisition
Evaluation with 5x5 cm² FOV on a thyroid phantom, 43.4 MBq 131I
Future projects Data processing
Optical Multi-modality endoscope for brain cancer
Real time acquisition
On line processing
Portable gamma camera for breast cancer
Mevo : standardize interface for optical images
Software development for acquisition and processing
Algorithm development
Reconstruction
Classification
SDTM
Means
Studies & conceptions: CATIA V5 (Computer Aided Three-dimensional Interactive Application) is a multi-platform software for computer-aided design (CAD) developed by the French company Dassault Systèmes. 18 users. Finite elements modeling: SAMCEF FIELD, ABAQUS CAE, Thermo fluidique, CATIA Analysis, ANSYS Measures : Traction machine (1 a 150KN), various force sensors, extensometer, vibrations, accelerometer,…. Dimensional control : Three dimensionnal machine, Laser tracker (dimensionnal and alignement), measurement arm, roughness, magnetism, profil measurement, …. Fabrications :
• Numerical tooling machines : turning, milling (4 axis tooling center, 3 axis milling ), Wire cutting, • Conventional tooling (turning, milling,…), • Sheetmetal shop : Welding T.IG., M.IG., vacuum brazing, bending, cutter, hydraulic press, roll machine,
punch machine,… Assembly and Test:
• hall equipped with cranes up to 15 t. ≈ 7000 m2 • 4 clean rooms
3
SDTM
Latest investments
2017 - Laser Tracker LEICA (130k€):
Alignemnt, dimensional control (planeity,…) until 80 meters
6 peoples trained to use it.
2018 - Portable measuring arm (50k€) : Dimensional control
2017 – Numerical milling machine (150k€)
2019 - Dimensional measurement equipment (110k€) In the course of purchase.
To replace old one (1998)
2019 - Numerical turning machine (150k€) In the course of purchase.
To replace old one (1989)
Requirement : Replace the both bender and guillotine (1966/1972)