HDI PIIRILEVYT

Aspocomp, PCBs for

Demanding Applications

Base Station

Automotive

Electronics

Mobile Devices

Industrial

Electronics

Photos ABB, Aspocomp, Vacon and Wabco

PCBs for Base Stations and Other

Telecom Infra

Photos ABB, Aspocomp, Vacon and Wabco

Typical PCB features

- wide range of PCBs, from 2L to 24L HDI

- Impedance control

- ENIG, Imm Ag, Imm Sn

- High Frequency laminates

PCBs for Automotive Electronics

Photos Wabco, Conti, Aspocomp

Example PCB, HDI 1+2b+1 Alu

metalback

Typical PCB features

- HDI, Multilayer

- High Tg + Mid Tg FR4, ENIG

- Aluminum back

- Automotive quality procedures

PCBs for Mobile Devices

PCB construction is

driven by component

pitch

0,4mm pitch component

with 207 I/Os

3+2b+3 construction

Typical PCB features

- HDI

- ENIG, ENIG+OSP

- Halogenfree FR4, RCCu

- Very high density, 60/60

- 2+ 3+,4+ stacked laser consrtuction

Net Sales by Application & Product Type

(2014)

RF materials represent 16% of the total

production

Overplated vias also known as: - IPC4761 Type VII

- Plug & Plate

- Capped Via

- Filled and Capped Via

- POFV – Printed Over Filled Via

- VIPPO – Via In Pad Plated Over

46%

26%

17%

11%

Telecom systems & applicationsAutomotive electronicsIndustrial electronicsOther electronics

Examples of HDI PCB Construction

1+4b+1 2+4b+2 stacked

3+2b+3 stacked 2+4b+2 staggered

’ stacked’

’ staggered’

Design Rules for Thick HDI PCBs (≥1,4mm),

Capability 2015

Assumed min avg 20u in PTH and buried via (IPC Class2)

B C D

E

A

F G

T

Ø Ø

Typical Advanced

PWB thickness PCB final A 2,4 mm 5,5mm

Inner layer core 18/18 thickness min T 63µm 50µm

Min conductor width Copper thickness < 25 µm (non-plated I/L) B 75 µm 60 µm

Copper thickness 25u - 50u B 90 µm 75 µm

Min space Copper thickness < 25 µm (non-plated I/L) C 75 µm 60 µm

Copper thickness 25u - 50u C 90 µm 75 µm

Min hole diameter With board thickness 2,4mm Ø 250 µm 200 µm

Min pad size Via hole, outer layer (Ø=0,25mm ) D 550 µm 450 µm

(no break) Via hole, inner layer (Ø=0,25mm) E 550 µm 450 µm

Buried holes (Ø=0,25mm) F 550 µm 450 µm

Laser hole, surface pad G 250 µm 250 µm

Laser hole, inner layer pad, dielectric <=70u H 220 µm 220 µm

Laser hole, inner layer pad, dielectric <=100u H 250 µm 250 µm

S

L K J I M

Ø

P, Q

Assumed min avg 20u in PTH and buried via (IPC Class2)

* See details in the next slide

Design Rules for Thick HDI PCBs (≥1,4mm),

Capability 2015

Typical Advanced

Min distance Laser - buried, non-connected (Ø=0,25mm) I 500 µm 450 µm

Laser - buried, connected (Ø=0,25mm) J 400 µm 350 µm

Laser - laser, non-connected (SM between pads) K 400 µm 375 µm

Laser - laser connected L 300 µm 250 µm

PTH - PTH connected P Ø + 500 Ø + 500

PTH - PTH non connected Q Ø + 550 Ø + 550

PTH to Cu clearance * M 225 µm 190 µm

Aspect Ratio (A/Ø) Thickness/nominal diameter of PTH max A/Ø 10 15

Solder mask registration S +/-37 µm +/-25 µm

12th of Jan 2015 10

Design Rules for Thin HDI PCBs (≤1,3mm),

Capability 2015

Typical capability Assumed min avg 20u in PTH and buried via (IPC Class2)

Advanced: Assumed min 15u in PTH

B C D

E

A

F G

T

Ø Ø

Typical Advanced

PWB thickness PCB final min A 0,4mm 0,25mm

Plated inner layer min T 100 µm 60 µm

Min conductor width Copper thickness ≤ 20 µm B 60 µm 40 µm

Copper thickness 20µm…35µm B 75 µm 60 µm

Min space Copper thickness ≤ 20 µm C 60 µm 50 µm

Copper thickness 20µm…35µm C 75 µm 60 µm

Min pad diameter Via hole, outer layer ( Ø = 200µ) D 450 µm 400 µm

Via hole, inner layer ( Ø = 200µ) E 450 µm 400 µm

Buried holes ( Ø = 200µ) F 450 µm 400 µm

Laser hole pad 40..75µm G 220 µm 180 µm

Laser hole pad, dielectric 80..110µm G 250 µm 220 µm

11

S

L K J I M

Ø

P, Q

12th of Jan 2015

Typical capability Assumed min avg 20u in PTH and buried via (IPC Class2)

Advanced: Assumed min 15u in PTH

Typical Advanced

Min distance Laser - buried, non-connected I 425 µm 375 µm

Laser - buried, connected J 375 µm 325 µm

Laser - laser, non-connected K 350µm 300 µm

Laser - laser connected L 250 µm 250 µm

PTH - PTH connected (also buried - buried) P Ø + 350 Ø + 300

PTH - PTH non connected (also buried - buried) Q Ø + 450 Ø + 400

Hole wall to copper clearance (PTH to Cu) * M 200 µm 160 µm

Solder mask registration S +/-37 µm +/-25 µm

Design Rules for Thin HDI PCBs (≤1,3mm),

Capability 2015

Please note that advanced parameters should be used carefully and case by case on

demand since they have significant yield impacts.

B C D

E

A

F G

H

T

Assume min 15u in PTH (mobile PCB customer specific specs), assume max 1,3mm PCB thickness

* Sequencial buildup PTH to copper add 50u

** Surface laser Cu viafill: add 15u

PWB thickness PCB final min 0,3mm A

Plated inner layer min 75u T

Min conductor width Copper thickness ≤ 25 µm 50 µm B

Copper thickness 25u…40u** 60 µm B

Min space Copper thickness ≤ 25 µm 50 µm C

Copper thickness 25u…40u ** 60 µm C

Min pad diameter Via hole, outer layer (200u hole size) 400 µm D

(no break) Via hole, inner layer (200u hole size) 450 µm E

Buried holes (200u hole size) 400 µm F

Laser hole, surface pad 220 µm G

Laser hole, inner layer pad, dielectric <=70u 220 µm H

Laser hole, inner layer pad, dielectric <=100u 250 µm H

Thin HDI PCBs

Advanced Capability 2014

PTH wall (by

nominal

diameter)

Risk of short circuit if

too low PTH to Cu

PTH to Cu

Clearance Requirement at Inner Layers

Clearance

PTH to Cu

Clearance

PTH to Cu

Area of the annular ring is

required for true drill

position tolerance

(regardless if there is

annular ring or not)

PTH to Cu Drill length L

Required safe PTH to Cu parameter is depending

on the length and the diameter of the associated

drilling :

L max Ø0,2 Ø0,3 ≥Ø0,35

1,6µm 210µm 200µm 190µm

3,2mm N/A 225µm 200µm

For sequential blind please add + 50µm

Solder Masks And Printing

• Solder mask, min. clearance to pad 37um (25u)

• Solder mask, min dam/line shape 100u

• Solder mask, min dam/round 50u

• SM opening at the PTH via min nominal diameter

• Legend printing, min. clearance to pad 150u

• Legend printing, min. track width 150u

• Legend printing, min. font height 0,7 mm

• Peel-able solder mask, min resolution 400u

HDI Layer Material Options (For laser drilling)

MATERIAL TYPE MATERIAL NAME ESTIMATED FINAL

THICKNESS T MANUFACTURER

1037 prepreg R-1551 40µm Panasonic

106 prepreg

(or 2 x 106pp) Several 50µm (100µm) Several

1080 prepreg Several 60µm-70µm* Several

1035, 1078 prepregs R-5670

(Megtron 6) 40µm, 60µm Panasonic

RO4450B prepreg RO4450B 100µm Rogers

RCCu MRG-200 * 50µm, 75µm Mitsui

* Different resin contents give different thickness value

Most of the materials have halogen free options

T

Surface Finish Options

ENIG Atotech Aurotech

CNN (mid P)

ENIG /OSP (SIT)

OSP Entek Plus Cu-

106 A (X) HT

HASL SN100C

HASL SnPb

Immersion tin

Atotech Stannatech

Immersion silver

McDermid Sterling

Silver 2.0

Galvanic NiAu

contact surfaces

Additional options available subcontracted

End of the Slides