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HY461x_Application Notes Preliminary V2.2

HY461x Application Notes

V2.2


© 2016 HYCON Technology Corp www.hycontek.com

Confidential APD_HY461x_AppNote_EN Page1

Contents 1. Overview ............................................................................................................................................................ 3 2. Application introduction .................................................................................................................................... 3 3. Development Tools ............................................................................................................................................ 3 4. HYCON TP solution ............................................................................................................................................ 3

4.1 Chip selection ........................................................................................................................................... 3 4.2 Performance and Feature： .................................................................................................................... 3 4.3 Electronic Specifications .......................................................................................................................... 4 4.4 IIC Interface .............................................................................................................................................. 4 4.5 Response time .......................................................................................................................................... 4 4.6 Interrupt trigger mode ............................................................................................................................. 4 4.7 Automatic compensation ......................................................................................................................... 4 4.8 Sensor design rules and process limit ...................................................................................................... 4 4.9 Application of IC schematic ...................................................................................................................... 4

5. Power sequence ................................................................................................................................................. 5 6. IIC communication description .......................................................................................................................... 5

6.1 IIC communication timing ........................................................................................................................ 5 6.2 IIC Slave Address ...................................................................................................................................... 5 6.3 Host IIC write operation ........................................................................................................................... 5 6.4 Host IIC read operation ............................................................................................................................ 5

7. Operating Mode Register Map .......................................................................................................................... 6 7.1 HYCON’s protocol ..................................................................................................................................... 6 7.2 Customization protocol (Default)............................................................................................................. 8

8. Register address description ............................................................................................................................ 11 9. RAWDATA mode introduction ......................................................................................................................... 12

9.1 RAWDATA register description .............................................................................................................. 12 9.2 RAWDATA operating procedure ............................................................................................................ 12

10. FLASH UPDATE ............................................................................................................................................... 13 10.1 FLASH MAP ........................................................................................................................................... 13 10.2 FLASH UPDATE ..................................................................................................................................... 14

10.2.1 APP+HW/SW FLASH UPDATE .................................................................................................... 14 10.2.2 HW/SW UPDATE ....................................................................................................................... 15 10.2.3 IIC Timing Chart ......................................................................................................................... 16

11. HYCON IC PIN Definition ................................................................................................................................ 17 11.1 HY4613-N048 pin definition ................................................................................................................. 17 11.2 HY4614-N68 pin definition ................................................................................................................... 17 11.3 HY4614-N56 pin definition ................................................................................................................... 18 11.4 HY4616-N88 pin definition ................................................................................................................... 18

12. Edition record ................................................................................................................................................. 19

http://www.hycontek.com/




Attention：

1. HYCON Technology Corp. reserves the right to change the content of this datasheet without further notice. For most up-to-date information, please constantly visit our website: http://www.hycontek.com .

2. HYCON Technology Corp. is not responsible for problems caused by figures or application circuits narrated herein whose related industrial properties belong to third parties.

3. Specifications of any HYCON Technology Corp. products detailed or contained herein stipulate the performance, characteristics, and functions of the specified products in the independent state. We does not guarantee of the performance, characteristics, and functions of the specified products as placed in the customer’s products or equipment. Constant and sufficient verification and evaluation is highly advised.

4. Please note the operating conditions of input voltage, output voltage and load current and ensure the IC internal power consumption does not exceed that of package tolerance. HYCON Technology Corp. assumes no responsibility for equipment failures that resulted from using products at values that exceed, even momentarily, rated values listed in products specifications of HYCON products specified herein.

5. Notwithstanding this product has built-in ESD protection circuit, please do not exert excessive static electricity to protection circuit.

6. Products specified or contained herein cannot be employed in applications which require extremely high levels of reliability, such as device or equipment affecting the human body, health/medical equipment, security systems, or any apparatus installed in aircrafts and other vehicles.

7. Despite the fact that HYCON Technology Corp. endeavors to enhance product quality as well as reliability in every possible way, failure or malfunction of semiconductor products may happen. Hence, users are strongly recommended to comply with safety design including redundancy and fire-precaution equipment to prevent any accidents and fires that may follow.

8. Use of the information described herein for other purposes and/or reproduction or copying without the permission of HYCON Technology Corp. is strictly prohibited.






1. Overview This file will describe HYCON's TP solutions how performance characteristic and how to communicate between host and HYCON's IC solution etc.

2. Application introduction When beginning a new development case, several necessary technological files may be obtained

through our sales or FAE:：

Project information table Product specification Application note IC application schematic Sensor design rule FPC and PCB layout guide

3. Development Tools The developing instrument includes HYCON’s control board and application program for PC.

4. HYCON TP solution 4.1 Chip selection

Model

Name

Panel Package Touch Panel Size

Status TX RX Type Pin Size(mm)

HY4613-N048 21 12 QFN6*6 48 6*6*0.75 P0.4 ≤ 5.3" M/P

HY4614-N056 26 16 QFN6*6 56 6*6*0.75 P0.4 5.3"--- 7" M/P

HY4614-N068 28 16 QFN8*8 68 8*8*0.75 P0.4 7"--- 10.1" M/P

HY4616-N088 42 28 QFN10*10 88 10*10*0.75 P0.4 10.1"--- 13.1" M/P

4.2 Performance and Feature： True multi-touch with up to 11 points of absolution X and Y coordinates，supports

on-line upgrade firmware by IIC. Support TX pin and RX pin to arrange in an order arbitrarily. ESD protection prevents crashing. Gloved finger operation and waterproof function. Supports distance reaction for proximity function. Linearity , accuracy: The center ±1mm, Edge ±2.0mm (condition: recommend pitch

size) Unique the power noise repression function, dispose the frequency spectrum analyze

function. According to the requirement of customer, the communication protocol of IIC can be

customized, besides the slave address can be set arbitrarily.. Supports various kinds of TP stack-up and have exclusive sensor pattern of HYCON. Supports the gesture of doubling click is woken up. Supports touch panel with touch key solution. Automatic temperature compensation.





4.3 Electronic Specifications Power supplies range: 2.6V--3.6V，Power noise Vpp≦50mV

Power consumption: Active mode：8mA--10mA

Standby mode：3mA

Sleep mode：under 20μA

4.4 IIC Interface The standard IIC communication interface, supreme SCL clock is 400 KHz, slave address can be set up, supports 1.8V or VDD level power, needs pull high resistance and we recommend the pull high resistance is 2.0k-10k ohm. The IIC communicate necessary pins as below: VDD, SCL, SDA, INT, RESET, GND. Attention: If IOVCC sets up for 1.8v, the power setting nearly 10mS on the chip, so IOVCC =VDD while the chip is initializing.

4.5 Response time Power on response time needs less than 200mS when the power on than IC into the active mode. The response time of system from standby mode to active mode, it needs less than 35 mS. The response time of system from sleep mode to active mode, it needs less than 200 mS.

4.6 Interrupt trigger mode INT trigger method：When touch panel sensing any touch, INT will produce falling trigger

to host then host will begin to read all of IIC information.

4.7 Automatic compensation Automatic compensation function can guarantee TP module still normal operation when the environment and temperature are changed.

Operating Temperature Range：−40℃ to 85℃; the humidity：≦ 95% RH

Storage Temperature Range：−55℃ to 110℃; the humidity：≦ 95% RH

4.8 Sensor design rules and process limit TP cover lens thickness supported: Glass：0.5mm----5.0mm( base on CPT stack-up and sensor pattern)

PET/PMMA: 0.2mm----3.0mm( base on CPT stack-up and sensor pattern) Touch virtual buttons: Please refer to “HYCON SENSOR design specification ".

4.9 Application of IC schematic FPC and PCB circuit design and layout rules please refer to “HYCON TP FPC and PCB design specification ".





5. Power sequence The RESET pin needs to draw low 5mS first then power on. The time of power on should be as short as possible, can guarantee to finish in 1mS. Wait for 5mS after power on ready then the RESET pin draws high. After the RESET draws high 200mS, IIC can start to operate for read or write.

6. IIC communication description It is according with the relevant norm of the standard IIC communication interface that the protocol of IIC is designed.

6.1 IIC communication timing Test condition：VDD=3.3V,IOVCC=3.3V ,SCL=400kHz, pull high resistance 2.0kΩ

Parameter Unit Min Max

SCL frequency KHz -- 400

Bus free time between a STOP and START condition us 1.3 --

Hold time (repeated) START condition us 0.6 --

Data setup time ns 100 --

Setup time for a repeated START condition us 0.6 --

Setup Time for STOP condition us 0.6 --

6.2 IIC Slave Address HY461x supports 7 bit of slave address, the value of address can be set arbitrary. Default slave address seeting:0x38. The detailed structure is shown the following figure:

Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0

I2C Slave Address(7bits) R/W

6.3 Host IIC write operation START SLA+W ACK Register address ACK Data1 ACK ....... Data N ACK STOP

6.4 Host IIC read operation The first step, write Register address:

START SLA+W ACK Register address ACK STOP

The second step, read back to n bytes: ( N: If Register operated, there is n bytes, direct read goes back to n bytes) . START SLA+R ACK Data1 ACK ....... Data N ACK STOP





7. Operating Mode Register Map

7.1 HYCON own protocol

Address Register description R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0

0x00 TP RUN MODE R/W 0x00↔work mode 0xc0↔ test mode

0x01 TOUCH_FINGER_NUM R Reserve touch point

0x02 TOUCH_KEY R virtual key，proximity mark，gesture

0x03 TOUCH1_STATUS_ID R Finger event status

0：Down

1：Up

2：Contact；

3：Reserved

Finger Trace ID1

0x04 TOUCH1_XH R X1 coordinate high byte 8 bit

0x05 TOUCH1_XL R X1 coordinate low byte 8 bit

0x06 TOUCH1_YH R Y1 coordinate high byte 8 bit

0x07 TOUCH1_YL R Y1 coordinate low byte 8 bit

0x08 TOUCH1_Z R Z1 coordinate 8 bit

0x09 TOUCH2_STATUS_ID R Finger event status Finger Trace ID2

0x0A TOUCH2_XH R X2 coordinate high byte 8 bit

0x0B TOUCH2_XL R X2 coordinate low byte 8 bit

0x0C TOUCH2_YH R Y2 coordinate high byte 8 bit

0x0D TOUCH2_YL R Y2 coordinate low byte 8 bit

0x0E TOUCH2_Z R Z2 coordinate 8 bit

0x0F TOUCH3_STATUS_ID R Finger event status Finger Trace ID3











0x1A TOUCH4_Z R Z4 coordinate 8 bit

0x1B TOUCH5_STATUS_ID R Finger event status Finger Trace ID5

0x1C TOUCH5_XH R X5 coordinate high byte 8 bit

0x1D TOUCH5_XL R X5 coordinate low byte 8 bit

0x1E TOUCH5_YH R Y5 coordinate high byte 8 bit

0x1F TOUCH5_YL R Y5 coordinate low byte 8 bit















0x2A TOUCH7_YH R Y7 coordinate high byte 8 bit

0x2B TOUCH7_YL R Y7 coordinate low byte 8 bit

0x2C TOUCH7_Z R Z7 coordinate 8 bit

0x2D TOUCH8_STATUS_ID R Finger event status Finger Trace ID8

0x2E TOUCH8_XH R X8 coordinate high byte 8 bit

0x2F TOUCH8_XL R X8 coordinate low byte 8 bit











0x3A TOUCH10_XH R X10 coordinate high byte 8 bit

0x3B TOUCH10_XL R X10 coordinate 8 bit

0x3C TOUCH10_YH R Y10 coordinate high byte 8 bit

0x3D TOUCH10_YL R Y10 coordinate low byte 8 bit

0x3E TOUCH10_Z R Z10 coordinate 8 bit

0x3F TOUCH11_STATUS_ID R Finger event status Finger Trace ID11










7.2 Customization protocol (Default)


0x00 TP RUN MODE W/R 0x00↔work mode 0xc0↔ test mode

0x01 TOUCH_GESTURE R TOUCH_GESTURE ID[0:7]

0x02 TOUCH_FINGER_NUM R reserved touch point [3:0]

0x03 TOUCH1_XH R Finger event

[1:0]:

0：Down

1：Up

2：Contact

3：Reserved

reserved X1 Position[11:8]

0x04 TOUCH1_XL R X1 Position[7:0]

0x05 TOUCH1_YH R Touch1 ID[3:0] Y1 Position[11:8]

0x06 TOUCH1_YL R Y1 Position[7:0]

0x07 TOUCH1_Z R reserved



[1:0]:

0：Down

1：Up

2：Contact

3：Reserved


0x0A TOUCH2_XL R X2 Position[7:0]

0x0B TOUCH2_YH R Touch2 ID[3:0] Y2 Position[11:8]

0x0C TOUCH2_YL R Y2 Position[7:0]

0x0D TOUCH2_Z R reserved

0x0E TOUCH2_Z R reserved

0x0F TOUCH3_XH R Finger event

[1:0]:

0：Down

1：Up

2：Contact

3：Reserved








[1:0]:

0：Down

1：Up

2：Contact

3：Reserved










0x1A TOUCH4_Z R reserved

0x1B TOUCH5_XH R Finger event

[1:0]:

0：Down

1：Up

2：Contact

3：Reserved


0x1C TOUCH5_XL R X5 Position[7:0]

0x1D TOUCH5_YH R Touch5 ID[3:0] Y5 Position[11:8]

0x1E TOUCH5_YL R Y5 Position[7:0]

0x1F TOUCH5_Z R reserved



[1:0]:

0：Down

1：Up

2：Contact

3：Reserved








[1:0]:

0：Down

1：Up

2：Contact

3：Reserved




0x2A TOUCH7_YL R Y7 Position[7:0]

0x2B TOUCH7_Z R reserved

0x2C TOUCH7_Z R reserved

0x2D TOUCH8_XH R Finger event

[1:0]:

0：Down

1：Up

2：Contact

3：Reserved


0x2E TOUCH8_XL R X8 Position[7:0]

0x2F TOUCH8_YH R Touch8 ID[3:0] Y8 Position[11:8]





[1:0]:






0：Down

1：Up

2：Contact

3：Reserved







[1:0]:

0：Down

1：Up

2：Contact

3：Reserved


0x3A TOUCH10_XL R X10 Position[7:0]

0x3B TOUCH10_YH R Touch10 ID[3:0] Y10 Position[11:8]

0x3C TOUCH10_YL R Y10 Position[7:0]

0x3D TOUCH10_Z R reserved

0x3E TOUCH10_Z R reserved

0x3F TOUCH11_XH R Finger event

[1:0]:

0：Down

1：Up

2：Contact

3：Reserved











8. Register address description Address Register description R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0

0x00 TP RUN MODE R/W

0x50--0x5F

LPO value R There are 4 groups LPO value, every 4 bytes correspond to a group of LPO values

0x60 TOUCH KEY Y Coordinate R TOUCH KEY Y[15：8]

0x61 TOUCH KEY Y Coordinate R TOUCH KEY Y[7：0]

0x62 TOUCH KEY1 X Coordinate R TOUCH KEY1 X[15：8]








0x80 TOUCH THRESHOLD R/W Touch threshold value setting =（DATA*4)

0x81 P SENSOR Switch R/W Proximity function switch, setting 0：turn off; 1:turn on

0x82 WORK_MODE_TX_FREQUENCY_H R TX frequency high byte

0x83 WORK_MODE_TX_FREQUENCY_L R TX frequency low byte

0x84 GLOVE_EN R/W Glove function switch, setting 0:turn off; 1:turn on

0x88 REPORT SPEED R/W REPORT SPEED setting[7:0], ex: data=0x64, the report speed=100Hz

0x92 GAIN R/W Sensitivity setting, setting range：0--5

0x93 EDGE OFFSET R/W Margin parameter setting, setting range：0--16

0x94 RX NUMBER USED R Read RX quantity used

0x95 TX NUMBER USED R Read TX quantity used

0xA5 POWER MODE W Write 0x03 let TP into sleep mode, when reset pin pull low TP will be waked.

0xA6 FW VERSION R Read project firmware version.

0xA7 LIB VERSION R Read public firmware version.

0xA8 TP information R Read touch panel information. Ex. Panel size…etc

0xA9 TP CHIP ID R Read chip IC model type.

0xAA LDO VOLTAGE R/W VDD5 voltage setting ： 0xF: 2.6V 0x19: 3.6V 0x13: 5.0V 0xD: 2.8V 0x17: 4.2V 0x11: 5.2V 0x1B: 3.4V 0x15: 4.4V

0xAB TX NUMBER USED R Read TX quantity used same to 0x95.

0xAC RX NUMBER USED R Read RX quantity used same to 0x94.

0xAD INT_TEST R/W Interrupt test, write 1 to the register then INT will run test program and output a coordinate (255,255)

0xAE SAVE BASE STATE R 0x00：reading failed

0x01：Fail to meet condition of storing.(impedance) 0x02：Fail to meet condition of storing.(noise)

0x55：Stored base successful

0xB0 BOOTLOADER VERSION R Read boot loader version, ex: boot loader=0x1009, read the register=0x09.

0xB1 WORK_MODE_CMD W Special instruction register 0x3c: store base instruction.

0xB2 WORK_MODE_CMD_DATA0 W Special instruction register data 0




0xBB R/W Customization registers area, total 31bytes. Supports word format, Ex:”zcABC67-2015” ........ R/W





0xDA R/W

0xDB Debug mode R/W Debug and use the register for internal engineering.

0xDC DATA HH R/W Debug and use the register for internal engineering.

0xDD DATA HL R/W Debug and use the register for internal engineering.

0xDE DATALH R/W Debug and use the register for internal engineering.

0xDF DATA LH R/W Debug and use the register for internal engineering.

0xFF reserved

9. RAWDATA mode introduction

9.1 RAWDATA register description


0x00 TP RUN MODE R/W Write 0xC0,into the RAWDATA MODE

0x01 TX INDEX W Getting RAWDAT for the N column of TX

0x02 ADC SCAN R/W Write 0x01, start ADC scan. If read 0x00, ADC scan is done.

0x10 RAWDATA ADDR0 R First address that RAWDATA preserves.

0xAE SAVE BASE R 0x0：Return to raw data mode；

0x1：reserved；

0x2：show base data in flash

0x3：show normal mode base data used

0x4：show normal mode diff data used Debug and use the register for internal engineering.

9.2 RAWDATA operating procedure

STEP1: Switch to RAWDATA mode：

Read”0x00” register; confirm which mode IC is in at present. Write”0XC0” to the register 0x00, makes IC into RAWDATA mode. Read “0x00” register; confirm which mode IC is in at present.

STEP2: Getting TX NUM and RX NUM

Read”0xAB” register; get the effective TX number. Read”0xAC” register; get the effective RX number.

STEP3: Write the register 0x02 value is 0x01, starts ADC scanning.

Read”0x02” register; check ADC scanning whether is done or not. If read the register value is 0x00 that show ADC scanning is done.

STEP4: Write TX INDEX value to register, getting RAWDATA for the N column of TX. TX INDEX= N

column of TX and begin from 0x01. STEP5: Read the value of “0x10” register can get the RAWDATA for N column of TX. Read back until

RX NUM *2 bytes is one column data of TX STEP6: Repeat step4 and step5, until reading all of RAWDATA. STEP7: Repeat step3 to step6, getting RAWDATA continuously.





0x90000

10. FLASH UPDATE

10.1 FLASH MAP

FASH function area description： BOOT FALSH: Boot loader function that realizes APP FLAS, HW FLASH, SW FLASH on-line update. This

area does not allow to be revised. The flash address is from 0x90000 to 0x90FF; total 4K bytes.

APP FLASH：Execution of TP every function, the flash address from 0x91000 to 0x9FCFF, total 59K bytes.

HW FLASH: IC hardware parameter area; the flash address from 0x9FD00 to 0x9FDFF, total 256 bytes.

SW FLASH: IC software parameter area; the flash address from 0x9FE00 to 0x9FEFF, total 256 bytes.

RESERVED: Reserved area total 256 bytes.

APP FLASH 59K

HW FLASH 256

SW FLASH 256

BOOT FLASH 4K

0x9FD00

0x9FE00

0x91000

RESERVED 256

0x9FF00





10.2 FLASH UPDATE 10.2.1 APP+HW/SW FLASH UPDATE

A new project will offer a *.bin file to end-customer for firmware upgrade. The *.bin file includes APP flash area and HW/SW flash area. When the whole *.bin file is updated to IC by host, it can finish the upgrading together of APP area and HW/SW parameters, the procedure as follows:

STEP1：Makes RESET PIN to produce the low pulse to reset TP, low pulse keeps time more than 5mS.

STEP2：Into boot and read bootloader version In 50mS after RESET finish, send the command “0xFF, 0x90” and read back 2 bytes that is a bootloader version.(ex.0x1009)

STEP3: Enable writing flash

Send the command “0xFF 0x63 0x03 0x3D 0x00 0x00” then read back 1 byte, if read back value is “0x3D” shows that is enabled writing flash, if not please repeat step3 until reading back to 0x3D.

STEP4: Erase APP flash area Send the command “0xFF, 0x91” can erase APP flash area, need to delay around 1.5s.

STEP5：Sending data packet Sending the data packet for update function, the length of each data packet is fixed: 5 bytes packet head + 128 bytes firmware data

STEP6：Repeat STEP5, until all data packets are sent and finished

STEP7：Read ECC code After send the command “0XFF 0X62 0X10 0X00 0XEF 0X00”, delay 200ms read back 1 byte to obtain a ECC code of the whole renewal process.

Comments: The calculation of ECC code does not include 5 bytes of the packet head. Calculate formulae: The data packet removes 5 bytes of packet head then all number values

accumulate and get the total; For example if the total values are 0x123456, ECC value only read the last 2 bytes at this time, so ECC is 0x56.

STEP8：Makes RESET PIN to produce the low pulse to reset TP, the low pulse keeps time more than

5mS, then delay around 500mS and the upgrade function will be finish. Annotation:

a）The first data packet will be send to flash first address that is 0x0000. (for STEP3)

b）In STEP3,data packet form (133byts/buffer) as follows : Packet

head

Flash address

H Byte

Flash address

L Byte

DATA packet

length H Byte

DATA packet

length L Byte

FW data FW data

Data0 Data1 Data2 Data3 Data4 Data5 ... Data132

0xBF Address=128*i

（i=0,1,2,3,4,5........）

0x00 0x80 data ... data





10.2.2 HW/SW UPDATE

A new project will provide a *.bin file for host update HW and SW parameters. Values of HW and SW are appointed to corresponding address of flash and upgrade; then finish upgrading the parameter

of HW/SW. The upgrade procedure as follows:

STEP1：Makes RESET PIN to produce the low pulse to reset TP, low pulse keeps time more than 5mS.

STEP2：Into boot and read bootloader version In 50mS after RESET finish, send the command “0xFF, 0x90” and read back 2 bytes that is a bootloader version.(ex.0x1009)

STEP3: Enable writing flash

Send the command “0xFF 0x63 0x03 0x3D 0x00 0x00” then read back 1 byte, if read back value is “0x3D” shows that is enabled writing flash, if not please repeat step3 until reading back to 0x3D.

STEP4：Sending data packet Sending the data packet for update function, the length of each data packet is fixed: 5 bytes packet head + 128 bytes firmware data

STEP5：Repeat STEP4, until all data packets are sent and finished

STEP6：Read ECC code

After send the command “0XFF 0X62 0X10 0X00 0XEF 0X00”, delay 200ms read back 1 byte to obtain a ECC code of the whole renewal process.

Comments: The calculation of ECC code does not include 5 bytes of the packet head. Calculate formulae: The data packet removes 5 bytes of packet head then all number values

accumulate and get the total; For example if the total values are 0x123456, ECC value only read the last 2 bytes at this time, so ECC is 0x56.

STEP7：Makes RESET PIN to produce the low pulse to reset TP, the low pulse keeps time more than

5mS, then delay around 500mS and the upgrade function will be finish. Annotation:

a）HW flash corresponding address：The flash address of first buffer is 0xED00, the second buffer address is 0xED80.

b）SW flash corresponding address：The flash address of first buffer is 0xEE00,the second buffer address is 0xEE80. c）In STEP2,data packet form (133byts/buffer) as follows : Packet

head

Flash address

H Byte

Flash address

L Byte

DATA packet

length H Byte

DATA packet

length L Byte

FW data FW data

Data0 Data1 Data2 Data3 Data4 Data5 ... Data132

0xBF Flash corresponding address 0x00 0x80 data ... data





10.2.3 IIC Timing Chart The power on sequence for update requirement：

The RESET time sequence for update requirement： IIC data transmission chronological chart：

I2C start Slave_addr Data0 …… DataN Stop

Td Td Td

Td > 10us

Power on

I2C I2C Idle SLV_ADDR

20<Tp＜70ms Tw＞50us

0xFF+0x90

I2C

RESET

I2C Idle

Tw＞50us 20<Tp＜70ms

Trst＞5ms

SLV_ADDR 0xFF+0x90





11. HYCON IC PIN Definition

11.1 HY4613-N048 pin definition

48pin，6mm*6mm QFN

VS

SA

1 2 3 4 5 6 7 8 9 10 11

TX

20

VS

S

HY4613QFN48

TX

21

TX

19

TX

18

TX

17

TX

16

TX

15

TX

14

TX

13

RX10

RX338

48

47

46

45

44

43

42

41

40

39

NC

RX12

RX11

RX9

RX8

RX7

RX4

RX5

RX6

RX237

2627282930313233343536

INT

WA

KE

MIS

O

SS

EL

/SC

L

SC

K

MO

SI/S

DA

RS

T

RX

1

VD

DA

TE

ST

_E

N

25

VD

D1

8

TX7

14

15

16

17

18

19

20

21

22

23

24

TX4

TX2

TX1

TX6

TX5

TX3

VDD5

VDD3

TX8

13

12

TX9

TX10T

X1

2

TX

11

11.2 HY4614-N68 pin definition 68pin，8mm*8mm QFN

RX14

65

48

TX1

VS

SA

1 2 3 4 5 6 7 8 9 10 11

31

32

33

34

495051

68

67

66

NC

VSS

VDD5

NC

VD

D1

8

NC

VDD3

HY4614QFN68

NC

TX

28

TX

27

TX

26

TX

25

TX

24

TX

23

TX

22

TX

21

NC

RX15

RX16

RX9

RX2

53

64

63

62

61

60

59

58

57

56

55

54

RX12

RX11

RX10

RX8

RX7

RX6

RX13

RX3

RX4

RX5

RX1

52

363738394041424344454647

MIS

O

MO

SI/S

DA

SS

EL

/SC

L

GP

IO_1

GP

IO_2

GP

IO_3

SC

K

WA

KE

RS

T

INT

NC

GP

IO_0

35

TE

ST

_E

N

30

19

20

21

22

23

24

25

26

27

28

29

TX10

TX8

TX7

TX12

TX11

TX9

TX6

TX5

TX4

TX3

TX2

18

TX

20

12 13 14 15 16 17

TX

18

TX

19

TX

17

TX

16

TX

15

TX13

TX14

PWR





12. Edition record Version Data Record Author Note

V1.0 2013-11 First version Loomis

V1.1 2014-6 Revise all Loomis

V1.2 2014-7 Revise all Bruce

V1.3 2014-10 a. Add register description b. Revise FW update description c. Add HW/SW update description

Loomis Translator: Bruce

V1.4 2014-11 Typesetting Bruce

V2.0 20150402 Revise All Loomis Translator: Bruce

V2.1 20150901 a. Modify firmware update procedure.

b. Add enable writing flash and ECC function.

Loomis Translator: Bruce

V2.2 2016-0222 a. Page8-Page10:TouchID[3:0] b. Page11:add registers c. Page12: 10.2.3 timing

Loomis Typesetting: Bruce

Translator: Bruce


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