ieee ottawa section | the ieee section for the region of ottawa. - … · 2013. 10. 29. · title:...

Omar M. RamahiUniversity of WaterlooWaterloo, Ontario, Canada

© Copyright Omar M. Ramahi, 2010

Traditional Material!!

ElectromagneticWaveWave

rr με ,

The only properties an electromagnetic wave sees:1 Electric permittivity ε

3

1. Electric permittivity, ε2. Magnetic Permeability, μ


Metamaterial and Bandgap Structures!!g p

if what But0 ,0 <

orμε 0,0 >< rr με

or0 ,0 rr με

if0or,0

ifeven ≈≈

orμε

4

0or ,0 rr με


Negative Index or Double Negative MediaNegative Media

Positive mediaHE μβ =×Maxwell Equations

Positive mediaOr Right Handed

E HH Eεβ

μβ−=×

×

Negative mediaOr Left HandedE H

H Eεβ

μβ=×

−=×

Dispersion Relationship:p p

dii

media positive ; 222

222yx

ββ

ββεμω +=

medianegative; 222 yx ββεμω +=5© Copyright Omar M. Ramahi, 2010

Index of Refraction:Need Consistent Interpretation with MEp

2 n2 =ε μ

mediapositive 1n ;+=

1n ±=media negative 1n ;−=

6© Copyright Omar M. Ramahi, 2010

The case of μ , ε < 0

Positive Index Medium Negative Index MediumPositive Index Medium Negative Index Medium

ε>0μ>0

ε

Flat Lens!(without optical axis!)(without optical axis!)

Perfect focusingε < 0μ < 0

gof traveling waves

I

Source

Image

Image stillIncomplete!


Flat Lens!

0Perfect focusingof traveling waves ε < 0

μ < 0of traveling waves

Image

Evanescent wave

Source

g

Traveling wave

To complete the imageneed remaining spectrum,The evanescent part

Note: If the source is faraway from the NIR media,the evanescent spectrumThe evanescent part the evanescent spectrum will be lost forever.


Time-Domain Simulation

Right Handed medium Left Handed medium

Source

Image

Source: Zilkowski; Optics Express, April 2002


diµ-ε diagram

E

S

kH

SE

K

S

H

EK K


Metamaterial!!

ifh tB0,0

if what

IC subject to Internal and External Noise

ICIC Package Subject to

External Noise

Via 3 (Radiator) (Internal Source of Noise )

Via 4 (Subject to Noise )

IC

DieDieDieMulti Layer Stack up Package Multi Layer Stack up

PCB

External Noise

Via 1 (Radiator) (Source of Noise )


15

(Source of Noise )


EBGs Can Take Various Shapes

SubstratePatch

SubstratePatch

Substrate

t

Substrate

t

(a)Via

conductor (a)Via

conductor

gg

T=a+g

d

T=a+g

d

17

a(b)

a(b)


18

Source: D. Seivenpiper, High Impedance Electromagnetic Surfaces, PhD Thesis, UCLA, 1999


Textured (High Impedance) SurfacesIdeal for EMI/EMC Applications/ pp

19

Source: D. Seivenpiper, High Impedance Electromagnetic Surfaces, PhD Thesis, UCLA, 1999


Design of EBG structure using S-parameters simulationparameters simulation

Filt / tFilter/resonator

20

Ports


EBGs as an EM Wave SuppressorSuppressor

-20-15-10-50

s

-50-45-40-35-30-25

para

met

ers

0 2 4 6 8 10 12 14 16 18 20-75-70-65-60-55

S11 S12

S_p

0 2 4 6 8 10 12 14 16 18 20

Frequency (GHz)


Surface Wave Mitigation using EBG Materials

EBG MaterialsEBG Materials

BUT ill th b k f t ?22

BUT… will the above work for any antenna?


t a

g

1

W

LCfres π2

1=Top view of HIS with square patches

Surface wave propagation Resonance comes from lumped

behavior of vias and patches period must be much smaller

– TM waves at low Freq. – No propagation around fres– TE waves at high Freq

23

than wavelength:TE waves at high Freq.


a

M

aa

M

g/2

XΓ

g/2g/2

XΓ

678

z] M d 2

Mode 3fH

Topview

www

345

uenc

y [G

Hz Mode 2

Light Line

BAND GAP

fL

PEC

012Fr

equ

Mode 1

BAND GAPsideview

PEC

Γ-X M-ΓX-M

Anal sis of a nit cell pro ides Phase constant β

24

Analysis of a unit cell provides eigenmode solutions for Maxwell’s equations

β


Characterization using Dispersion Equations (approximate Analysis)

In

⎤⎡ BA ⎤⎡ ⎤⎡

In 1+Zs

Vn⎥⎦⎤

⎢⎣

⎡DCBA

⎥⎦

⎤⎢⎣

⎡DCBA

⎥⎦

⎤⎢⎣

⎡DCBA

Vn 1++

−

+

−

L LVs ZL

d BA γFloquet’s theorem :

⎥⎦

⎤⎢⎣

⎡⎥⎦

⎤⎢⎣

⎡=⎥

⎦

⎤⎢⎣

⎡

+

+

1

1

n

n

n

n

IV

DCBA

IV 0=

−−

d

d

eACBeA

γ

γ

In order to have a l ti

⎥⎦

⎤⎢⎣

⎡=⎥

⎦

⎤⎢⎣

⎡ −+

+

n

nd

n

n

IV

eIV γ

1

1

YZ

solution

25

nn jβαγ += )sin(2)cos()cosh( dYZjdd w ββγ +=


Transmission Line and Periodic Structure Theory (TLPS) Modeling

)sin(2

)cos()cosh( dYZjdd w ββγ +=

y ( ) g

)sin(2

)cos()sin()sinh()cos()cosh( 1111 dYZjdddjdd w βββαβα +=+

• For the first cell:

2

• Case 1, α1= 0: (outside the gap, wave propagation)

)sin(2

)cos()cos( 1 dYZ

jdd w βββ +=

• Case 2, α1 ≠ 0 and β1 = 0 or π: (inside the gap, amplitude decay)

)i ()()()h( dYZddd βββ

26

)sin(2

)cos()cos()cosh( 11 dYZjddd w βββα +=


EBGs for Switching Noise Suppression


EBGs for Switching Noise Suppression

Vss

Driver

VssVdd

Vdd

LoadPowersupply

Vss

Switching noise sourceg


Switching and switching noise

Vss

Driver

Vdd

Vdd

LoadPowersupply

Vss

Switching noise source


Switching noise: Propagation point of viewpoint of view

Signal passing through the power planes

Device subject to noiseNoise-generating device

Power planes radiate like patch antennas

power planes

P b lSignal layers Power bus layersSignal layers


Model for Power Plane Analysisy

LoadMetallic planes Cavity resonances

oss

[dB]

Model for noise source

εr

nser

tion

LoIn

Frequency [GHz]


10 cm10 cm

10 cm10 cm -20

-10

0

10 cm

Port 2

10 cm

Port 2 -40

-30

-20

S12(

dB)

Port 1Port 1

-70

-60

-50

experimental data with decaps from [5]simulation with decapssimulation without decaps

0 0.5 1 1.5 2 2.5 3 3.5 4Frequency (GHz)

1

32

LjRCj

Zcap ωω++=

1


Noise mitigation with decoupling capacitors around noise sourcep

Surface Current on Ground Plane (No Capacitors)

33

Surface Current on Ground Plane (99 Capacitors)


RC dissipative edge termination

Separation of Vdd planeStops parallel-plate

Mitigates low frequencyDoes not address

ll l l

Stops parallel plate propagation to and from sensitive deviceslocalized solution

parallel-plate resonance

Embedded capacitanceDoes not remove parallel-plate resonanceWorsens reliability of b d (f l )

34

board (fragile)


Switching noise suppression in the presence of EEBG structuresp

Power Bus

Buried via EBG PatchBuried via EBG Patch


gVdd Pl

g

t

d

Vdd Plane

a

g

36

w a


What is the result of using them?

v

g

vd

wh2

h1

-10

0

dB)

d

40

-30

-20

de o

f S21

(d

w

2hr2

-60

-50

-40

Mag

nitu

dd

2

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Frequency (GHz)


Experimental setup


Wide Band Noise Mitigation

-10

0

B)

Without EEBG

-40

-30

-20

e of

S21

(dB

80

-70

-60

-50

Mag

nitu

de

With EEBG

0 1 2 3 4 5 6 7 8 9 10

-80

Frequency (GHz)


EMI suppression

Power planes edge di tiradiation


EMI reduction: Experiment setup

Board under test (6.5 cm x 10 cm) fabricated on commercial FR4.

Four Rows of 5mm EEBG

Excitation Point

Monopole AntennaBoard under testVector network analyzerVector network analyzer

41SMA connector © Copyright Omar M. Ramahi, 2010

EMI reduction: Experiment results

• EMI suppression is omni-directional

Without EEBG

• Results at different test points are similar

-40

-30

-20

-70

-60

-50

de o

f S21

(dB

)5cm

3.25cm

Board Under Test

-100

-90

-80

Mag

nitu

d

5cm

5cm TP With EEBG

42

0 1 2 3 4 5 6 7 8 9 10-110

Frequency (GHz)© Copyright Omar M. Ramahi, 2010

Ultra Wide-Band EMI Reduction

-30

-20

Four Rows of 5 mm HIS

Four Rows of 10 HIS

Without EEBG

-60

-50

-40

of S

21(d

B)5 mm HIS 10 mm HIS

-90

-80

-70

Mag

nitu

de o

Excitation Point

0 1 2 3 4 5 6 7 8 9 10

-100MFrequency (GHz)

Point

With EEBG


The Challenge of Modeling

C

L

)(21

21 CCLfres +

=π

45

21 ωω

LCjLZ LC −

=


2D Model based on new unit cellModel based on TEM-transmission-line model combined with the LIS model

RsVs

RL

)/(cosh)(2 102163 gdwC rr −−

+=

πεεε

46

hL2

063

μ=−


2D Model based on new unit cell

0HFSSTM simulation

-50

-25

S21(

dB)

-100

-75

nitu

de o

f S

-150

-125Mag Circuit model

using Agilent ADSTM

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Frequency (GHz)

47

Accuracy limited to low frequencies© Copyright Omar M. Ramahi, 2010

Modeling Complex EBG Structures!

-20

-10

0

50

-40

-30

20

ude

of S

21(d

B)

-70

-60

-50

S21 Short Spiral S21 Long Spiral S21 PatchS No Spiral

Mag

nitu

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

-80 S21 No Spiral

Frequency (GHz)


Planar EBG Structures

Patches of different shapes without vias!


L-bridge Lb

30mmCg

Lb: bridge inductance

unit cell Cg: gap capacitance

50

T. L. Wu, C. C. Yang, Y. H. Lin, et al. “A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits” IEEE Microwave and Wireless Components Letters, Vol. 15 No.3, pp. 174-176, 2005


2mm

Unit Cell

Top View

30mm

26mm

Top View

Port 1 Port 2

90mm

1.54mm

150mm

FR4


Physical size of board: 3x5 unit cells ( 90x150mm)

LPKF ProtoMat C100/HF circuit plotter


-20

0

(dB)

-40

de o

f S21

-80

-60

Ref Exp Mag

nitu

d

VNA measurement

0 1 2 3 4 5 6 7 8 9 10 11 12-100

-80 p Ref Sim Meander-L Exp Meander-L Sim

53

Frequency (GHz)


Structure B:

Port 1

Port 2Structure A:

Signal Port 1

ViaEBG

Port 1 Port 2trace

FR4 1.54mmPort 2

54

Side view


1200Input (test signal)1200

400

600

800

1000

Volta

ge (m

V)

pu ( es s g a )

600

800

1000

ge (m

V)

0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4-200

0

200

V

time (ns)

Output (structure B)

200

0

200

400

Volta

g

600

800

1000

1200

(mV

)

0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0-200

time (ns)

0

200

400

Vol

tage

55

0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0-200

time (ns)


1000

1200

V1

V2 3

w=2mm

400

600

800

olta

ge (m

V)

V2 3mm

0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0-200

0

200

Vti ( )time (ns)


V1 w=2mm

V2 3mm


Different Varieties ofDifferent Varieties of Metamaterials

Complementary Structures!Structures!


Split-Ring Resonator andComplementary Split Ring ResonComplementary Split Ring Reson.

aa

E

Hk

rin

b

gH

rout

(a) (b)

CuSRR CSRR

Cu


Excellent very small filter!

Falcone et al IEEE MWCL June 2004Falcone et al., IEEE MWCL, June 2004


Design of PCBs usingSplit-Ring Resonators (Negative media)Split Ring Resonators (Negative media)


Experiment with Rogers Board

0

-20-10

0

0-40-30

2| (d

B)

-70-60-50

|S12

.solid board

0 1 2 3 4 5 6 7 8 9 10-8070

Frequency (GHz)

solid board

Frequency (GHz)


Split-Ring Resonator andComplementary Split Ring ResonComplementary Split Ring Reson.

14mm Port 2

w=1.19mm14mm

41mmPort 1

h


Experiment with FR4

-20-10

0

50-40-3020

dB)

-70-60-50

|S12

| (d

Solid (measured)

0 1 2 3 4 5 6 7 8 9 10 11 12-90-80

Solid (measured) Solid (simulated) CSRRs (measured) CSRRs (simulated)

Frequency (GHz)


Next challenges:


EBG or ?


Dispersion Diagram..How important?How important?

( 1st 2nd 3rd and 4th) propagating modes

6

7

8

R i X

( 1 , 2 , 3 , and 4 ) propagating modes

2

3

4

5

Region: Γ −−−> X

g (M

m/s

)

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

0

1

2v g

Frequency (GHz)


Suppression Bandwidth

20 dB Suppression Band

20

0

20

B)

-60

-40

-20

f S21

(dB

-120

-100

-80

nitu

de o

0 2 4 6 8 10 12 14-160

-140

120

Without EBG Pattern (Reference) With EBG PatternM

agn

0 2 4 6 8 10 12 14

Frequency (GHz)© Copyright Omar M. Ramahi, 2010

Suppression Bandwidth

8

( 1st, 2nd, 3rd, and 4th) propagating modes

Port 1Port 2

5

6

7

8

Region: Γ −−−> X

s)

1

2

3

4

v g (M

m/s

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

0

1

Frequency (GHz)Frequency (GHz)


Suppression Bandwidthvs Bandgap

1.0

vs. Bandgap

0 70.80.9 EBG Patterned Parallel Planes

Solid Parallel Planes

0.50.60.7

on L

oss

0.20.30.4

Rad

iati

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 150.00.1

Frequency (GHz)


IC subject to Internal and External Noise

ICIC Package Subject to

External Noise

Via 3 (Radiator) (Internal Source of Noise )


IC

DieDieDieMulti Layer Stack up Package Multi Layer Stack up

PCB

External Noise

Via 1 (Radiator) (Source of Noise )


71

(Source of Noise )


Reduction of Coupling between Patch antennas


Reduction of Coupling between Patch antennasantennas

Patch AntennaPatch Antenna

hSubstrate


Reduction of Coupling between Patch antennas

Patch AntennaPatch Antenna

antennas

Substrate

S fSurfaceWaves

E


Complementary Split Ring Resonator

SRR CSRR

H EH E


Design of PCBs usingComplementary Split-Ring ResonatorsComplementary Split Ring Resonators

Patch AntennaPatch Antenna SCSRR structure


6

7

8 Bandgap

4

5

6

y (G

Hz)

2

3

4

requ

ency

mode1

00

1

Γ X

Fr mode1 mode 2


Γ−X

8

6

7

Hz)

4

5

ncy

(GH

Bandgap zone

2

3

requ

en

Mode 1

0

1Fr

Mode 2


Γ−X

SCSRR

SCSRR structure


Performance of SCSRR

10

-20

-15

-10 without SCSRRs with SCSRRs

-35

-30

-25

S12

| (dB

)

50

-45

-40

|

4.0 4.5 5.0 5.5 6.0-50

Frequency (GHz)


Antennas MatchingPractically not affected!

0

Practically not affected!

-5

0

-15

-10

i| (d

B)

Air (S11)

-25

-20|Si ( 11)

Air (S22) SCSRRs (S11)SCSRRs (S22)

4.0 4.5 5.0 5.5 6.0-30

Frequency (GHz)

SCSRRs (S22)

Frequency (GHz)


Radiation Patterns

510

030330

510

030330

20-15-10

-50

60

90270

300

20

-15-10

-505

60300

-20 90

120240

270-20-15-10

-50

without SCSRRs with SCSRRs

-20 90

120240

270-20-15-10

-50

without SCSRRswith SCSRRs

150180

2105

10

150180

210

05

10

with SCSRRs

H-plane E-plane© Copyright Omar M. Ramahi, 2010

EBGs…EBGs…Perhaps has the mostp

important application in the field of EMI/EMC!!.


ieee ottawa section | the ieee section for the region of ottawa. - … · 2013. 10. 29. · title:...

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