INFORMATION NOTE

N° 119/14

2014-12-18 Page 1 of 2

DCB and bond wire optimization for IHV-B 3.3kV

Subject of Change: DCB and bond layout of IHV-B 3.3kV modules will be optimized due tocontinuous improvement

Products affected: All IHV-B 3.3kV modules, see attached table

Reason of Change: Continuous improvement

Description of change:

Assessment:

Old New

Different length of gate wires Gate wires have uniform length

Minor change.No change of electrical parameters and no negative impact to quality andreliability.The specifications of the mentioned modules remain unchanged accordingto JEDEC Standard JESD46-C: fit, form, function and reliability.

Time schedule: Planned implementation: from January 2015 onwards.During ramp up time there could be deliveries with both old and newDesigns.

If you have any questions, please do not hesitate to contact your local Sales office.

INFORMATION NOTE

N° 119/14

2014-12-18 Page 2 of 2

Affected Products:

Module type Ordering code Material numberOPN

(Orderable Part Number)

FZ1500R33HL3FD1000R33HE3-KFZ1500R33HE3FZ1200R33HE3FZ1500R33HL3FD1000R33HL3-KFZ1500R33HL3_S2FZ1000R33HL3FZ1000R33HE3FZ1000R33HL3_S2

SP001181564SP001181570SP001181576SP001181602SP001181608SP001181626SP001181684SP001181818SP001181824SP001182002

40174401774018040183401864020240205401974019540199

FZ1500R33HL3BPSA1FD1000R33HE3KBPSA1FZ1500R33HE3BPSA1FZ1200R33HE3BPSA1FZ1500R33HL3BPSA2FD1000R33HL3KBPSA1FZ1500R33HL3S2BDSA2FZ1000R33HL3BPSA1FZ1000R33HE3BPSA1FZ1000R33HL3S2BDSA2