intel hpc update

INTEL CONFIDENTIAL

Intel® HPC Portfolio

and Roadmap Update

Gareth Tucker

IBM Technical Account Manager EMEA

INTEL CONFIDENTIAL

This slide MUST be used with any slides removed from this presentation

Legal Disclaimers

2

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel’s current plan of record product roadmaps.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. This document contains information on products in the design phase of development.

All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copyright © 2013, Intel Corporation. All rights reserved. *Other names and brands may be claimed as the property of others.

INTEL CONFIDENTIAL

Legal Disclaimers Continued Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different

processor families. Go to: http://www.intel.com/products/processor_number

Intel® HT Technology available on select Intel® processors. Requires an Intel® HT Technology-enabled system. Consult your system manufacturer.

Performance will vary depending on the specific hardware and software used. For more information including details on which processors support HT

Technology, visit http://www.intel.com/info/hyperthreading.

Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor (VMM). Functionality,

performance or other benefits will vary depending on hardware and software configurations. Software applications may not be compatible with all

operating systems. Consult your PC manufacturer. For more information, visit http://www.intel.com/go/virtualization

No computer system can provide absolute security under all conditions. Intel® Trusted Execution Technology (Intel® TXT) requires a computer system

with Intel® Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-compatible

measured launched environment (MLE). Intel TXT also requires the system to contain a TPM v1.s. For more information, visit

http://www.intel.com/technology/security

Requires a system with Intel® Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available on select

Intel® processors. Consult your PC manufacturer. Performance varies depending on hardware, software, and system configuration. For more

information, visit http://www.intel.com/go/turbo

Intel® AES-NI requires a computer system with an AES-NI enabled processor, as well as non-Intel software to execute the instructions in the correct

sequence. AES-NI is available on select Intel® processors. For availability, consult your reseller or system manufacturer. For more information,

see http://software.intel.com/en-us/articles/intel-advanced-encryption-standard-instructions-aes-ni/

Intel, Intel Xeon, the Intel Xeon logo and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States

and other countries. Other names and brands may be claimed as the property of others

3

This slide MUST be used with any slides removed from this presentation

http://www.intel.com/products/processor_number

http://www.intel.com/info/hyperthreading

http://www.intel.com/go/virtualization

http://www.intel.com/technology/security

http://www.intel.com/go/turbo

http://software.intel.com/en-us/articles/intel-advanced-encryption-standard-instructions-aes-ni/















INTEL CONFIDENTIAL

Legal Disclaimers: Performance Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as

measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other

sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on

the performance of Intel products, Go to: http://www.intel.com/performance/resources/benchmark_limitations.htm.

Relative performance is calculated by assigning a baseline value of 1.0 to one benchmark result, and then dividing the actual benchmark result for the baseline platform

into each of the specific benchmark results of each of the other platforms, and assigning them a relative performance number that correlates with the performance

improvements reported.

SPEC, SPECint, SPECfp, SPECrate. SPECpower, SPECjAppServer, SPECjEnterprise, SPECjbb, SPECompM, SPECompL, and SPEC MPI are trademarks of the Standard

Performance Evaluation Corporation. See http://www.spec.org for more information.

SAP and SAP NetWeaver are the registered trademarks of SAP AG in Germany and in several other countries. See http://www.sap.com/benchmark for more information.

Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or

configuration may affect actual performance.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and

MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the

results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the

performance of that product when combined with other products.

4

This slide MUST be used with any slides with performance data removed from this presentation

http://www.intel.com/performance/resources/benchmark_limitations.htm

http://www.spec.org/

http://www.sap.com/benchmark

INTEL CONFIDENTIAL

Legal Disclaimers INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Intel does not control or audit the design or implementation of third party benchmarks or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmarks are reported and confirm whether the referenced benchmarks are accurate and reflect performance of systems available for purchase.

Relative performance is calculated by assigning a baseline value of 1.0 to one benchmark result, and then dividing the actual benchmark result for the baseline platform into each of the specific benchmark results of each of the other platforms, and assigning them a relative performance number that correlates with the performance improvements reported.

SPEC, SPECint, SPECfp, SPECrate. SPECpower, SPECjAppServer, SPECjbb, SPECjvm, SPECWeb, SPECompM, SPECompL, SPEC MPI, SPECjEnterprise* are trademarks of the Standard Performance Evaluation Corporation. See http://www.spec.org for more information. TPC-C, TPC-H, TPC-E are trademarks of the Transaction Processing Council. See http://www.tpc.org for more information.

Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see here

Intel® Turbo Boost Technology requires a Platform with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your platform manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see http://www.intel.com/technology/turboboost

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to: Learn About Intel® Processor Numbers

Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. All dates and products specified are for planning purposes only and are subject to change without notice

Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel’s current plan of record product roadmaps.

Xeon® is a trademark of Intel Corporation in the U.S. and/or other countries.

Copyright © 2013 Intel Corporation. All rights reserved. Intel, the Intel logo, Xeon and Intel Core are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. All dates and products specified are for planning purposes only and are subject to change without notice

5


*Other names and brands may be claimed as the property of others.

http://www.intel.com/design/literature.htm

http://www.spec.org/

http://www.tpc.org/

http://www.intel.com/info/hyperthreading/

http://www.intel.com/technology/turboboost



INTEL CONFIDENTIAL

Optimization Notice

6

Optimization Notice

Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations

that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSE3 instruction

sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any

optimization on microprocessors not manufactured by Intel.

Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors.

Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer

to the applicable product User and Reference Guides for more information regarding the specific instruction

sets covered by this notice.

Notice revision #20110804


INTEL CONFIDENTIAL

Intel® Xeon® Processor

E5-2600 v2 Product Family

Solve Real Problems, Deliver Real Results

INTEL CONFIDENTIAL

Tick-Tock Development Model: Sustained Microprocessor Leadership

8

Intel® Core™ Microarchitecture

New Micro-

architecture

Xeon® 5300

65nm

TOCK

Xeon® 5400

New

Process Technology

45nm

TICK

Intel® Microarchitecture Codename Nehalem

New Micro-

architecture

Xeon® 5500

45nm

TOCK

Xeon® 5600

32nm

New

Process Technology

TICK

Intel® Microarchitecture Codename Sandy

Bridge

Xeon® E5- 2600

32nm

New Micro-

architecture

TOCK

22nm

New

Process Technology

TICK

Intel® Microarchitecture Codename Haswell

Haswell

22nm

New Micro-

architecture

TOCK

Future

14nm

New

Process Technology

TICK

Xeon® E5- 2600 v2

Latest Micro-architecture on Leading Process Technology

Intel® Xeon® Processor E5-2600 v2 Product Family

INTEL CONFIDENTIAL

.2

Secure

Improved security with Intel® Secure Key &

Intel® OS Guard for additional HW embedded

security plus enhanced AES-NI

Efficient

Leading 22nm manufacturing process

reduces power usage. Supports Intel® Node

Manager & Intel® Data Center Manager

Software

Up to 12 cores and 30MB cache

expected to deliver up to 30%1 more

performance in same power envelope

vs previous generation

Powerful

At the Heart of a Modern Data Center

Intel ® Xeon ® E5-2600 v2 product family

9 Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are

measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult

other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

1 Source: Intel internal measurements. {SPECint*_rate_base2006, 28 March 2013, E5-26xxv2 (12C, 2.5GHz,) vs. E5-2600 (8C, 2.9Ghz, ). Results have been simulated and are provided for informational purposes only. Results were derived using simulations run on an architecture simulator or model.

Any difference in system hardware or software design or configuration may affect actual performance. Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel’s current plan of record product roadmaps.. For

more information go to http://www.intel.com/performance



http://www.intel.com/performance


INTEL CONFIDENTIAL

Unrelenting Focus on Power Efficiency

1. Source: Intel internal measurements: [Baseline Configuration and Score on SPECPower_ssj2013* benchmark. Idle power based on , Intel® Xeon ® processor E5- 26xx v2 (12C, 2.5GHz, 95W), 28 March 2013]. Results have been simulated and are provided for informational purposes only. Results were derived using simulations run on an architecture simulator or model. Any difference in system hardware or software design or configuration may affect actual performance. Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel’s current plan of record product roadmaps. For more information go to http://www.intel.com/performance


10

Active Power

Delivering up to 45%1 power efficiency improvements through enhanced fine grain

power controls and 22nm tri-

gate process

Dynamic Power

Efficient Turbo that

intelligently adapts to peak

workloads conditions and

disengages when Memory

and I/O are the bottlenecks

Idle Power

Low leakage process

technology and power gating

technology contribute to Idle

Power of up to 23%1 lower than previous generation

Xeon E5-2600 v2


INTEL CONFIDENTIAL

REAL Performance Where it Counts Xeon E5-2600 v2

11

IMPROVED

integrated IO (PCIe 3.0)

NEW

security features

NEW

virtualization feature

IMPROVED

faster memory

50% MORE

cores / threads

50% MORE

last-level cache

~30%1 less

idle power

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are

measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult

other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

1. Source: Intel internal measurements: [idle power, Intel® Xeon ® processor E5- 26xx v2 (12C, 2.5GHz, 95W), 28 March 2013]. Results have been simulated and are provided for informational purposes only. Results were derived using simulations run on an architecture

simulator or model. Any difference in system hardware or software design or configuration may affect actual performance. Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel’s

current plan of record product roadmaps. For more information go to http://www.intel.com/performance

* Other names and brands may be claimed as the property of others



INTEL CONFIDENTIAL

Reduce Bottlenecks

1. Source: Intel internal measurements of average time for an I/O device read to local system memory under idle conditions comparing Intel® Xeon® processor E5-2600 product family (230 ns) vs. Intel® Xeon® processor 5500 series (340 ns). See notes in backup for configuration details .2. Source: 8 GT/s and 128b/130b encoding in PCIe* 3.0 specification enables double the interconnect bandwidth over the PCIe* 2.0 specification (www.pcisig.com/news_room/November_18_2010_Press_Release/). * Other names and brands may be claimed as the property of others with Intel® Integrated I/O

12

Unleash the full I/O capabilities of Xeon® E5

with Intel® Ethernet X540 Server10GbE Adapter

or Intel® True Scale 7300 series HCAs

Better Together

NETWORKING STORAGE APPLIANCES Increase I/O Performance

HPC TRADING Reduce I/O Latency LARGE SCALE

ANALYTICS

with Intel® Integrated I/O


INTEL CONFIDENTIAL

13

Intel® Xeon® processor E5-2600 v2 Product Family

Socket compatible replacement

for Intel® Xeon® processor

E5-2600 product family

Up to 12 cores and 30MB

cache expected to deliver up to

50%1 more performance in

same power envelope

Improved security with Intel®

Secure Key & Intel® OS Guard

for additional HW embedded

security

Up to 30MB Shared Cache

Intel Xeon Processor E5-2600 v2

Integrated PCI Express* 3.0

Up to 40 lanes per socket

4 channels of up

To DDR3 1866

MHz memory

* Other names and brands may be claimed as the property of others

1 1Baseline Configuration and Score on SPECVirt_sc2013* benchmark. Please contact your Intel representative to obtain Intel’s current plan of record product roadmaps. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance



World Record Performance

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Source: http://newsroom.intel.com/community/intel_newsroom/blog/2013/06/17/intel-powers-the-worlds-fastest-supercomputer-reveals-new-and-future-high-performance-computing-technologies 14

• E5-2600 v2 featured in the #1 supercomputer “Milky Way-2” on the

Top500 list

• With 12 cores running up to 2.7 GHz, E5-2600 v2 delivers 259 GFlops

per socket, a 56% increase over the previous generation

• E5-2600 v2 also in 2 other supercomputers on the Top500 list - #54

and #329

http://newsroom.intel.com/community/intel_newsroom/blog/2013/06/17/intel-powers-the-worlds-fastest-supercomputer-reveals-new-and-future-high-performance-computing-technologies




























INTEL CONFIDENTIAL 15

Advanced

Standard

LGA2011 (E5) LGA2011 (E5)

Workstation Only SKU

Segment Optimized

2.5MB/c cache More cache as noted 8.0 GT/s QPI Intel® HT

Technology DDR3-1866 Intel® Turbo Boost

Technology

Low Power

Basic


6C 80W 2.1GHz E5-2620 v2

4C 80W 2.5GHz E5-2609 v2

10C 115W 2.5GHz E5-2670 v2

8C 95W 2.0GHz E5-2640 v2

4C 80W 1.8GHz E5-2603 v2

6C 80W 2.6GHz E5-2630 v2

10C 130W 3.0GHz E5-2690 v2

10C 115W 2.8GHz E5-2680 v2

8C 95W 2.6GHz E5-2650 v2

10C 95W 2.2GHz E5-2660 v2

12C 130W 2.7GHz 30M E5-2697 v2

12C 115W 2.4GHz 30M E5-2695 v2

8C 150W 3.4GHz E5-2687W v2

8C 130W 3.3GHz 25M E5-2667 v2

6C 130W 3.5GHz 25M E5-2643 v2

4C 130W 3.5GHz 15M E5-2637 v2

10C 70W 1.7GHz E5-2650L v2

6C 60W 2.4GHz E5-2630L v2

2.5MB/c cache 10C 8.0 GT/s QPI 6C 7.2 GT/s QPI DDR3-1600 Intel® HT

Technology Intel® Turbo Boost

Technology

6C-15MB, 8C-20MB cache

7.2 GT/s QPI Intel® HT

Technology DDR3 1600 Intel® Turbo Boost

Technology



Technology DDR3-1866 (skt R) DDR3-1600 (skt B2) Intel® Turbo Boost

Technology


6.4 GT/s QPI DDR3 1333

15

Tray only SKUs T

T

T

T

T


Advanced

Standard

LGA2011 (E5) LGA2011 (E5)


Segment Optimized



Technology

Low Power

Basic

6C 80W 2.1GHz E5-2620 v2

4C 80W 2.5GHz E5-2609 v2

10C 115W 2.5GHz E5-2670 v2

8C 95W 2.0GHz E5-2640 v2

4C 80W 1.8GHz E5-2603 v2

6C 80W 2.6GHz E5-2630 v2

10C 130W 3.0GHz E5-2690 v2

10C 115W 2.8GHz E5-2680 v2

8C 95W 2.6GHz E5-2650 v2

10C 95W 2.2GHz E5-2660 v2

12C 130W 2.7GHz 30M E5-2697 v2

12C 115W 2.4GHz 30M E5-2695 v2

8C 150W 3.4GHz E5-2687W v2

8C 130W 3.3GHz 25M E5-2667 v2

6C 130W 3.5GHz 25M E5-2643 v2

4C 130W 3.5GHz 15M E5-2637 v2

10C 70W 1.7GHz E5-2650L v2

6C 60W 2.4GHz E5-2630L v2



Technology




Technology



Technology DDR3-1866 (skt R) DDR3-1600 (skt B2) Intel® Turbo Boost

Technology



16

Tray only SKUs T

T

T

T

T



Advanced

Standard

LGA2011 (E5) LGA2011 (E5)


Segment Optimized



Technology

Low Power

Basic

6C 80W 2.1GHz E5-2620 v2

4C 80W 2.5GHz E5-2609 v2

10C 115W 2.5GHz E5-2670 v2

8C 95W 2.0GHz E5-2640 v2

4C 80W 1.8GHz E5-2603 v2

6C 80W 2.6GHz E5-2630 v2

10C 130W 3.0GHz E5-2690 v2

10C 115W 2.8GHz E5-2680 v2

8C 95W 2.6GHz E5-2650 v2

10C 95W 2.2GHz E5-2660 v2

12C 130W 2.7GHz 30M E5-2697 v2

12C 115W 2.4GHz 30M E5-2695 v2

8C 150W 3.4GHz E5-2687W v2

8C 130W 3.3GHz 25M E5-2667 v2

6C 130W 3.5GHz 25M E5-2643 v2

4C 130W 3.5GHz 15M E5-2637 v2

10C 70W 1.7GHz E5-2650L v2

6C 60W 2.4GHz E5-2630L v2



Technology




Technology



Technology DDR3-1866 (skt R) Intel® Turbo Boost

Technology



17

Tray only SKUs T

T

T

T

T



Advanced

Standard

LGA2011 (E5) LGA2011 (E5)


Segment Optimized



Technology

Low Power

Basic

6C 80W 2.1GHz E5-2620 v2

4C 80W 2.5GHz E5-2609 v2

10C 115W 2.5GHz E5-2670 v2

8C 95W 2.0GHz E5-2640 v2

4C 80W 1.8GHz E5-2603 v2

6C 80W 2.6GHz E5-2630 v2

10C 130W 3.0GHz E5-2690 v2

10C 115W 2.8GHz E5-2680 v2

8C 95W 2.6GHz E5-2650 v2

10C 95W 2.2GHz E5-2660 v2

12C 130W 2.7GHz 30M E5-2697 v2

12C 115W 2.4GHz 30M E5-2695 v2

8C 150W 3.4GHz E5-2687W v2

8C 130W 3.3GHz 25M E5-2667 v2

6C 130W 3.5GHz 25M E5-2643 v2

4C 130W 3.5GHz 15M E5-2637 v2

10C 70W 1.7GHz E5-2650L v2

6C 60W 2.4GHz E5-2630L v2



Technology




Technology



Technology DDR3-1866 (skt R) Intel® Turbo Boost

Technology



18

Tray only SKUs T

T

T

T

T


INTEL CONFIDENTIAL INTEL CONFIDENTIAL - USE UNDER NDA ONLY UNLESS TAGGED “PUBLIC AT LAUNCH”. *Other names and brands may be claimed as the property of others


Neusoft CT Intel® Advance Vector Extensions – Float 16

“The Intel Xeon Processor E5-2600 V2 generates complex CT images about

45 percent faster than the previous Intel Xeon Processor E5-2600. A study

that took 20 minutes can now be completed in just 11. Multiply that by the

hundreds of patients in a busy clinic and the time savings stretch to hours

per day. We also see performance gains of up to 1.54X using Float16

Instructions for select workloads. This is absolutely a preferred hardware

platform for Neusoft CT.”

Shuangxue Li, Vice President of Neusoft Medical Systems Co.,

Ltd., General Manager of Diagnostic Imaging Systems Division

19

www.neusoft.com

Intel AVX

0.00

0.20

0.40

0.60

0.80

1.00

1.20

1.40

1.60

1.80

On Intel®

Xeon®

Processor E5-

2600 V2

series without

AVX Float 16

Optimization

On Intel®

Xeon®

Processor E5-

2600 V2

series with

AVX Float 16

Optimization

1.54X

Intel® AVX reduces the diagnosis latency, and helps doctors to make the right decision in the

shortest time

The Higher the Better

Neusoft CT scanners depend, in part, on the efficiency of the

underlying image-generation software and its ability to deliver

high quality images quickly.

Benefits of the Intel® Xeon® processor E5 v2 family—Fast image

generation reduces wait times for patients and medical teams in

busy clinical settings.



0

10

20

30

40

50

60

70

80

SunGard ALM Benchmark 5.8.6 Risk Analytics

“Having successfully migrated to Intel® Xeon® E5-2600 v2, we have seen

significant increases in processing power. We have run the large scenario

simulation engine that is able to take advantage of the increased number

of cores in the new Intel platform; the new platform increased our

performance by more than 38%. These improved results come at a time

when our customers are demanding faster results with even greater

granularity.”

Joe Sass, Director of Product Strategy for SunGard’s Ambit ALM business

20

SunGard’s Asset & Liability Risk Management solution provides

complete multidimensional analysis of the balance sheet,

incorporating interest rate risk, income simulation and market

valuation using deterministic and stochastic modeling.

www.sungard.com

Better Information and Analysis Means Better Decisions. SunGard ALM Risk Management Solutions

Elapsed time in sec

1.38x Faster

Finance

Intel® Xeon®

processorE5-2600

Intel® Xeon®

processor E5-2600 V2

IVB-EP-launch-proofpoint_Sungard_Adaptiv 08 15 2013.xlsx



Paradigm GeoDepth* v2011.3 Seismic Imaging

“Our continued investment in the optimization of the GeoDepth software,

leveraging the Intel compliers and the Intel MKL library, enables our

customers to take immediate advantage of the 50% increase in compute

cores in this latest generation of Intel Xeon processors.” Duane Dopkin,

Executive Vice President, Technology.”

Duane Dopkin, Senior Vice President, Technology

GeoDepth* is the leading system for 3D and 2D velocity model building and

seismic imaging in time and depth. Through the integration of interpretation,

velocity analysis, model building, model updating, model validation, depth

imaging and time-to-depth conversion, GeoDepth provides the continuity

needed to produce high-quality, interpretable images consistent with other

available data.

Key Intel® Xeon® processor E5 v2 advantage—Increased memory speed

reduces communications overhead; 24-cores per two-socket server provides

application scalability; Intel® Hyper-Threading Technology and Intel® Turbo

Boost Technology provide much higher price performance.

Customer Benefits—Geophysicists can choose to apply the scalable

performance improvements to produce higher resolution images of the

subsurface, or to improved throughput of their existing workload.

21

www.paradigm.com

ENERGY

1

1

1.4

5

1.5

9

CSFWMIG Benchmark CRAM Benchmark

Paradigm 2011.3 Benchmarks

Relative Performance Higher is better

8 core Intel® Xeon® processor E5-2670

12 core Intel® Xeon® processor E5-2697 V2

Scalable performance for high resolution seismic imaging



Star-CCM+* Engineering Analysis (Multi-Disciplinary)

“We redesigned the front end of our chassis almost exclusively using

simulations with CD-adapco software, the redesign added about 50 lbs.

of down force which is enough extra grip to give us about a tenth of a

second a lap.”

Andy Hogg, Aerodynamics manager, Michael Waltrip Racing

22

www.cd-adapco.com

HPC

17.7

13.0 11.5

0.000

2.000

4.000

6.000

8.000

10.000

12.000

14.000

16.000

18.000

20.000

STAR-CCM+ 8.04.007

Lemans 17M

Iteration time, sec - lower is better

Faster performance; High quality digital cinema; Faster time to Market

Ivy Bridge

12-core * 2.7

GHz

Sandy Bridge

8-core @ 2.7

GHz

Ivy Bridge

10-core @ 2.8

GHz

1.53x Faster

CD-adapco STAR-CCM+* provides comprehensive support for solving

complex engineering problems involving flow (of fluids or solids), heat

transfer and stress. It helps engineers automate workflows to perform

iterative design studies with minimal user interaction.

Faster simulation runtimes reduce simulation/prototyping timelines, to

improve design quality, and speed time to market.

Increased memory bandwidth of the E5-2600 v2 series allows better

utilization of its computational resources, significantly improving

run times.

INTEL CONFIDENTIAL

Intel® Xeon Phi™

Co-processor Update

23

24

PARALLELISM IS THE PATH FORWARD Intel is Your Roadmap

• More cores and more threads per core

• Wider Vector instructions

• Higher memory bandwidth

• Common languages, directives,

libraries & tools

• Complements Intel® Xeon® processors

• Performance and energy efficiency for

most workloads

• Parallel, Serial, Multicore + Vector

• Robust security and reliability

• Flexible foundation for growth

and innovation

Most Commonly

Used Parallel Processor

Optimized for

Highly Parallel Application

25

3xxx Family Outstanding Parallel Computing Solution

Performance/$ leadership 3120P 3120A

5xxx Family Optimized for High Density

Environments Performance/watt leadership

5110P 5120D

7xxx Family Highest Performance, Most

Memory Performance leadership

7120P 7120X

16GB GDDR5

352GB/s

>1.2TF DP

8GB GDDR5

>300GB/s

>1TF DP

225-245W

6GB GDDR5

240GB/s

>1TF DP

PRODUCT LINEUP Intel® Xeon Phi™ Coprocessor

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components,

software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the

performance of that product when combined with other products. For more information go to http://www.intel.com/performance 25



26

* Theoretical acceleration using a highly-parallel Intel® Xeon Phi™ coprocessor versus a standard multi-core Intel® Xeon® processor

BIG GAINS FOR PARALLEL APPLICATIONS

Efficient vectorization,

threading, and parallel

execution drives higher

performance for

many applications

Fraction Parallel

% Vector

Performance

7.00

5.00

3.00

1.00

1.00

0.20

0.00

0.40

0.60

0.80

0%

100%

50% 75%

25%

27

145X

FASTER

67.097 SECONDS

0.46 SECONDS

2.3X FASTER

0.197 SECONDS

STEP 2.

USE COPROCESSORS

Run all or part of the optimized code on Intel® Xeon

Phi™ coprocessors

Current Performance

STEP 1.

OPTIMIZE CODE

Parallelize and vectorize code and continue to run on

multi-core Intel Xeon processors

STARTING POINT

Typical serial code running on multi-core

Intel® Xeon® processors

PARALLELIZING FOR HIGH PERFORMANCE A Two Step Process

27

340X FASTER

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are

measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other

information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Source: Intel Measured results as of October 26, 2012 Configuration Details: Please reference slide speaker notes. For more information go to http://www.intel.com/performance


28

Intel® Xeon Phi™ product family

Based on Intel® Many Integrated Core (Intel® MIC)

architecture

Leading performance for highly parallel workloads

Common Intel® Xeon® programming model seamlessly

increases developer productivity

Launching on 22nm with >50 cores

Single Source

Compilers and Runtimes

Intel® Xeon® processor

Ground-breaking real-world application

performance

Industry-leading energy efficiency

Meet HPC challenges and scale

for growth

Highly-parallel Processing for Unparalleled Discovery Seamlessly solve your most important problems of any scale

28

Other brands and names are the property of their respective owners.

Shown at SC’12, November 2012

29

A GROWING ECOSYSTEM Developing today on Intel® Xeon Phi ™ Co-processors

30

• Application: Sinopec iCluster PSDM is a key module in the

Sinopec iCluster* seismic imaging system. The split step

fourier prestack depth migration (SSF PsDM) algorithm is

ideal for mild lateral velocity variations.

It provides one-way approximation with wave

propagation performed in the frequency domain.

• Status: In house code

• Usage Model: Offload

• Demonstrated Results: Dramatic scaling (5.3x) over

baseline using two server nodes, each with two Intel®

Xeon® processors and two Intel® Xeon Phi™ coprocessors

PERFORMANCE PROOF POINT:

ENERGY INDUSTRY Sinopec iCluster PSDM

30

“This will provide an amazing boost for the performance of the Sinopec iCluster seismic imaging system.”

Zhao Gaishan VP of Sinopec Geophysical Research Institute, November, 2012

1 1.06

5

0

1

2

3

4

5

6

• 2S Intel ® Xeon® processor E5-2680 + 2 Intel® Xeon Phi™ Coprocessor

Two node (pre-production HW/SW)

• 2S Intel® Xeon® processor E5-2680

Speedup (Higher is Better)

• Intel® Xeon Phi™ Coprocessor (pre-production HW/SW)

SOURCE: INTEL RESULTS AS OF JULY, 2013

Code Optimization Strategies:

software.intel.com/en-us/articles/optimize-seismic-imaging-processing-on-intel-xeon-phi

http://software.intel.com/en-us/articles/optimize-seismic-imaging-processing-on-intel-xeon-phi

















31

• Application: Black-Scholes financial modeling requires

raw computational power plus high bandwidth

between

execution cores and memory

• Status: Case Study available

• Highlights: Dramatic scaling for both single- and

double-precision computations

• Demonstrated Results:

• Intel® Xeon Phi™ coprocessor streaming store

provides optimized cache and bandwidth usage

• Intel Xeon Phi coprocessor fast transcendental

functions exp2(), log2() increase performance

and accuracy on SP

• Intel® Xeon® processors also benefit from using

exp2()/log2()

• Compiler based code generation enables plain

C++ code, which delivers higher

performance than vector intrinsics


FINANCIAL SERVICES Black-scholes formula valuation

31


1 1

5.81

2.85

0

1

2

3

4

5

6

7

Single Precision Double Precision


• 2S Intel Xeon processor E5-2670 + Intel® Xeon Phi™ Coprocessor (pre-production HW/SW)

SOURCE: INTEL MEASURED RESULTS AS OF JULY, 2013

Read the Case Study: software.intel.com/en-us/articles/case-study-achieving-superior-performance-on-black-scholes-valuation-computing-using

http://software.intel.com/en-us/articles/case-study-achieving-superior-performance-on-black-scholes-valuation-computing-using























32

• Application: Extends MATLAB with a toolbox for

employing spatially adaptive sparse grids in a flexible,

modular way

• Status: not released yet

• Workload Characteristics:

• Uses MPI, intrinsics, offload pragmas, and OpenMP

• Floating-point intensive and has a complex, non-linear

kernel

• Innermost loop contains an if statement for efficient

handling of high-dimensional grid boundaries

(reduces computational complexity)

- Demonstrated Results:

• Highlight: Performance scales well to four

Intel® Xeon Phi™ coprocessors per node

• Supports symmetric configurations with Intel® Xeon®

processors and Intel® Xeon Phi™ coprocessors


GOVERNMENT AND ACADEMIC RESEARCH LRZ/TUM SG++

32

1

3.92

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5



• 2S Intel Xeon processor E5-2670 + 2* Intel® Xeon Phi™ Coprocessors (pre-production HW/SW)

SOURCE: THIRD PARTY MEASURED RESULTS AS OF NOVEMBER, 2012

33

• Application: Weather Research and Forecasting

(WRF)

• Status: WRF V3.5 was released 4/18/13

• Code Optimization:

• Approximately two dozen files with less than

2,000 lines of code were modified (out of

approximately 700,000 lines of code in about

800 files, all Fortran standard compliant)

• Most modifications improved performance for

both the host and the co-processors

• Performance Measurements: Pre release of WRF

3.5 (V3.5Pre) and NCAR supported CONUS2.5KM

benchmark (a high resolution weather forecast)

• Acknowledgments: There were many contributors

to these results, including the National Renewable

Energy Laboratory and The Weather Channel

Companies

PERFORMANCE PROOF-POINT:

WEATHER AND CLIMATE RESEARCH WRF v3.5

33

1

1.4

0

0.2

0.4

0.6

0.8

1

1.2

1.4

1.6


• 2S Intel® Xeon® processor E5-2670 with eight-node cluster configuration

• 2S Intel® Xeon® processor E5-2670 +

Intel® Xeon Phi™ coprocessor (pre-production HW/SW) with eight-node cluster configuration

SOURCE: INTEL MEASURED RESULTS AS OF JULY, 2013

http://www.mmm.ucar.edu/wrf/WG2/bench

34

Next Generation

Intel® Xeon Phi™ Product Family (Codenamed Knights Landing)

All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice.

Available in Intel cutting-edge 14

nanometer process

Stand alone CPU or PCIe coprocessor

– not bound by ‘offloading’

bottlenecks

Integrated Memory - balances

compute with bandwidth

Parallel is the path forward - Intel is your roadmap

34 Note that code name above is not the product name

INTEL CONFIDENTIAL

Intel® HPC Fabric Update

35

36

HPC Expertise

Intellectual Property

World-class Interconnects

HPC Expertise

Fabric Management & Software

Highest Performance, Scalable IB

Products

Low-latency Ethernet Switching

Data Center Ethernet Expertise

High Radix & Low Radix Switch

Products

Market Leading Compute & Ethernet

Products

Platform Expertise

Intel’s

Comprehensive Connectivity and

Fabric

Portfolio

Unprecedented Rate of Innovation in HPC Fabric

Next Front of System Innovation: Fabrics

Other brands and names are the property of their respective owners.

37

Connectionless

- Minimal on-adapter state

- No Chance of cache misses as the cluster/fabric scales

- Maintains low end-to-end latency, even at scale

PSM Layer

- Performance Scaled Messaging light weight interface between MPI (Message

Passing Interface) and the InfiniBand device driver

- High MPI message rate performance

- Excellent short message efficiency

- Collective performance at scale without requiring special/hardware

acceleration

Intel® True Scale HPC Fabric

Key Differentiators

38

Problem:

• Power – System IO Interface Adds “10s Of Watts”

Incremental Power

• Cost & Density – More Components On A Server

Node

• Scalability – Processor Capacity & Memory

Bandwidth Scaling Faster Than System IO

Bandwidth

The Advantages of Fabrics Integration

Solution:

• Removing The System IO Interface From The

Fabrics Solution Reducing Power

• An Integrated Fabrics Results In Fewer Components

On The Server Node

• An Integrated Fabric Balances Fabric and Compute

Scaling Application Performance & Efficiency

Intel® Processor

Today

Tomorrow

Fabric Controller

System IO Interface (PCIe) Fabric Interface

Intel® Processor Fabric Interface

32 GB/sec 10-20 GB/sec

100+ GB/sec

Fabric Controller

Fabrics Integration Required to Scale Performance & Power

Thank You