interference technology emc symposium guide

interferencetechnology.com

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EMC Symposium Guide August 14-19 Long Beach2011

Your Comprehensive Guide to the IEEE International Symposium on EMC

SYMPOSIUM OVERVIEW .......... 7

SYMPOSIUM AT-A-GLANCE .. 14

TECHNICAL PROGRAM .......... 16

TECHNICAL COMMITTEE MEETINGS ................................ 63

COMPANY PROFILES ............. 65

SOCIAL EVENTS ..................... 78

EXPLORE LONG BEACH .......................... 80

http://www.interferencetechnology.com

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2 interference technology emc SympoSium guide 2011

[ contents ]

S u b s c r i p t i o n sITEM, InterferenceTechnology—The EMC Directory & Design Guide, The EMC Symposium Guide, The EMC Test & Design Guide and The Europe EMC Guide are distributed annually at no charge to engineers and managers who are engaged in the application, selection, design, test, specification or procurement of electronic components, systems, materials, equipment, facilities or related fabrication services. Subscriptions are available through interferencetechnology.com.

2011 EMC Symposium Guide

ITEM™

PublisherPaul Salotto

Publisher EmeritusRobert D. Goldblum

PresidentGraham S. Kilshaw

USA1000 Germantown Pike, F-2

Plymouth Meeting, PA 19462Phone: (484) 688-0300

Fax: (484) 688-0303E-mail:

[email protected]

chinA, tAiwAn, hong kongLeadzilLily Liu

+86-010-65250537E-mail: [email protected]

JAPAnTÜV SÜD Ohtama, Ltd.

Midori Hamano+81-44-980-2092

E-mail: [email protected]

ITEM PublIcaTIonS endeavors to offer accurate information, but assumes no liability for errors or omissions. Information published herein is based on the latest information available at the time of publication. Furthermore, the opinions contained herein do not necessarily reflect those of the publisher.

ITEMTM, InterferenceTechnology™ and InterferenceTechnology.comTM are trademarks of ITEM PublIcaTIonS and may not be used without express permission. ITEM, InterferenceTechnology and InterferenceTechnology.com are copyrighted publications of ITEM PublIcaTIonS. contents may not be reproduced in any form without express permission.

Copyright © 2011 • ITEM Publications • ISSN 0190-0943

EditorSarah Long

Editorial AssistantCait O'Driscoll

graphic DesignerAnn Schibik

Marketing SpecialistJacqueline Gentile

Business Development ManagerBob Poust

Business Development ExecutivesTim Bretz · Daryl McFadyen

Leslie Ringe · Jan Ward

Administrative ManagerEileen M. Ambler

Administrative AssistantsKaren Holder · Irene Nugent

Product Development ManagerHelen S. Flood

Message from the Chairman ..................4

Symposium Overview ......................... .14

[ tecHnIcAL PRoGRAM ]

Monday ............................................. 16

Tuesday..............................................26

Wednesday ........................................36

Thursday ............................................44

Friday .................................................50

Experiments & Demonstrations ........57

ANSI/iNARTE ....................................60

Global University ..................................62Technical Committees ..........................63Exhibit Hall Map ...................................64Company Profiles .................................65Consultant Services ............................ 71Product Finder .....................................72Social Events ........................................78Companion Program ...........................80Restaurants .........................................82Attractions ............................................86Index of Advertisers ............................88

Photos by Long B

each Convention & V

isitors Bureau


[ chairman’s message ]T

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Dear EMC Society Members, EMC Colleagues, and EMC Community

You are cordially invited to take part in the IEEE EMC Society’s International Symposium on Electromagnetic Compatibility (ISEMC) in Long

Beach, California this August. We have a beautiful location right in downtown Long Beach at the Long Beach Convention & Entertainment Center. Long Beach is located

at the southern end of Los Angeles county, and boasts weather that cannot be beat. As it is said, ”it never rains in southern California”!

The treasure of 2011 ISEMC is the Technical Program. We have planned a diverse range of technical sessions, meetings, experiments, demonstrations, professional development, and society awards. We are pleased to be offering some Special Sessions on EMC in Space, co-chaired by Ray Perez and Jim Lukash. Global EMC University is back again, now in its fifth year. We have a wide range of Workshops and Tutorials offering a wealth of information on basic EMC, measurements and testing, reverberation chambers, modeling, electronic vehicles and transportation, standards, and more. This year, our Visual Presentations of the

Poster Papers will be located in the foyer outside of the meeting rooms. Meetings with the authors will have a dedicated time not conflicting with paper presentations.

We have a rare opportunity this year to meet two well known experts in the field who are both gifted and experienced educators. Mr. Henry Ott will be chairing the Tutorial Session on the Fundamentals of EMC, and Dr. Howard Johnson will be chairing a Special Session on Signal Integrity. Henry Ott is considered by many to be the nation’s leading EMC educator, and has over 40 years experience in the field of EMC. Howard Johnson is a foremost authority on signal integrity, and has over 30 years of experience. He is also an engaging and informative author and speaker.

For our companions, we have something different this year – a raffle! – everything from lovely jewelry to local artist items to cuddly stuffed animals! For every tour purchased, 5 free tickets will be given and, to everyone registered for the Companion Program, 10 free raffle tickets will be given. The Companion Program will feature a breakfast every morning in the Companion Suite, and spouses will again be invited to join their registered companions for breakfast.

Given the wealth of beaches, museums, and local attractions, five distinctive tours have been chosen to enhance your companion’s visit. In addition to these, we have arranged for a post symposium trip on Saturday to Catalina Island, which is just 22 miles off the coast from Long Beach. Catalina Island has long been the home of fishermen and traders, smugglers, miners, and militia. More recently, Santa Catalina Island has served as the location for the filming of over 500 motion pictures, documentaries, television programs and commercials. The history of this island is truly unique, and is a fitting place to wind up your week at 2011 ISEMC.

Join us at 2011 ISEMC, and you will return technically enriched, professionally updated, personally refreshed, and ready to solve any EMC challenge.

General ChairmanRay Adams

Vice Chairman Janet O’Neil

Volunteer CoordinatorBob Davis

Secretary Mark Frankfurth

TreasurerJohn Lasalle

Technical Program ChairBruce Archambeault

Technical PapersJun Fan

Experiments and Demonstrations Sam Connor & Bob Scully

Special and Invited Sessions Colin Brench

Workshops and TutorialsJohn Maas

Registration ChairBronwyn Brench

Exhibits ChairGene Taylor

Publications (Design)John Rohrbaugh

Publications (Content)Randy Flinders

MarketingAlee Langford

Arrangements ChairDennis Lewis

Special Liaison: AdvisorDan Hoolihan

Companions ProgramSue Archambeault

Special EventsJanet Nichols

Global University ChairChuck Bunting

Junior Technical Program Gayla Burns

EMC 2011 SYMPOSIUM COMMITTEE

Ray AdamsGeneral [email protected]

Visit http://goo.gl /pC7N4 to find out more.Come See Us at IEEE EMC 2011

Long Beach Convention Center, Long Beach, CA, August 16 -18

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We’re getting more expandable too. Our “A” Series amps now cover the 10 kHz to 250 MHz frequency range. So you can test to virtually any standards.

They feature the latest FET technology, and can be controlled remotely with IEEE, RS-232, USB and Ethernet interfaces. And with all these innovative features, our “A” Series amps use less energy, that’s good for you and good forthe environment. Our new “A” series also comes with enhanced cooling technology.

At 40 years old, AR is still exceeding the grade, in quality, value, technology, craftsmanship, and service after the sale.And that makes these new “A” Series amplifiers a no-brainer.

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ITEM EMC_A+ Series:Layout 1 6/2/11 2:54 PM Page 1

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ShowDaily

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• Daily schedule, including technical program and social events

• Pictures and videos from the beach to the exhibit fl oor

• Information on attractions in and around Long Beach

• Latest news and product announcements

Sponsorships Available: [email protected] Publishing Careers With

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Long BeachAugust 14-19, 2011

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Symposium Overview

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Welcome to Long Beach and the 2011 IEEE Symposium on Electromagnetic Compatibility. This Symposium Overview is designed to give you a day-by-day summary of the technical, social, and educational programs available to attendees of the IEEE EMC Symposium and their families. Use it to plan your days and nights and get the maximum benefit of five days plus of non-stop immersion in everything EMC.*

Power Of ChoiceThe

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SympoSium overview Sponsored by

*All events are subject to change. Check www.emc2011.org and the Registration Area daily for updates.

ThurSday, auguST 11

1:00 p.m. - 5:00 p.m. ANSI C63 Workshop - Interlab Compari-

son

Friday, auguST 12

8:30 a.m. - 5:00 p.m. ANSI C63.4 Workshop

SaTurday, auguST 13

8:30 a.m. - 5:00 p.m. ANSI C63.5 and Time Domain Workshop

6:30 p.m. - 9:30 p.m. IEEE EMC Society Board of Directors

Executive Committee (ExCom) Meeting

SuNday, auguST 14

8:30 a.m. - 5:30 p.m.IEEE EMC Society Board of Directors

Meeting

9:00 a.m. - 5:00 p.m.NVLAP Assessor Training Workshop

9:00 a.m. - NoonIEC 6100-4-21 - SC77B- CISPR/A Joint

Task Force on Reverberation Cham-bers

6:30 p.m. - 10:00 p.m.dB Society Event

7:00 p.m. - 10:00 p.m.ITI TC-5 Meeting

moNday, auguST 15

7:00 a.m. - 9:00 a.m.Technical Advisory Committee (TAC)

Meeting #1

7:30 a.m. - 10:30 a.m.EMC Society Standards Development

Committee (Part 1 of 2)

8:00 a.m. - 12:00 p.m.iNARTE Examinations Preparation Tuto-

rial

MORNING WORKSHOP & tutORIalS PROGRaM

8:30 a.m. - NoonMO-AM-1 FundAMentAls OF eMCMO-AM-2 Application of Reverberation

ChambersMO-AM-3 Low Frequency EMC Includ-

ing Power Quality in Relation to Renewables, Energy Efficient Devices, Electrical Vehicles and Smart Grid

MO-AM-4 Addition of ESD and Lightning Requirements and Testing to MIL-STD-461

MO-AM-5 Introduction to EMI Modeling Techniques

10:30 a.m. - 3:30 p.m.Wine Tasting & Beach Cruise

10:45 a.m. - 11:15 a.m.SETCom Meeting Standards Education &

Training Committee

11:15 a.m. - 11:45 a.m.SACCom Meeting Standards Advisory

and Coordination Committee

Noon - 1:30 p.m.RAC/SACCom Luncheon

Noon - 1:30 p.m.Technical Committee 6 Spectrum Man-

agement

afteRNOON WORKSHOP & tutORIalS PROGRaM

1:30 p.m. - 5:30 p.m.MO-PM-1 FundAMentAls OF eMCMO-PM-2 EMC Aspects of Smart GridMO-PM-3 Hot Topics in EMC Measure-

ments: Site Validation, Time Domain and Antenna Characterization

MO-PM-4 How to Break Down Complex Systems into Realistic, Solvable and Accurate Models

MO-PM-5 Fundamentals of Signal Integrity

3:00 p.m. - 5:00 p.m.ACIL/USCEL Conformity Assessment

(CAS) Meeting

3:30 p.m. - 6:30 p.m.Chapter Officers Training Session

4:00 p.m. - 6:00 p.m.US TAG to CISPR/A

4:30 p.m. - 6:00 p.m.University Grant Committee

5:30 p.m. - 6:30 p.m.SC - 1 Special Committee on Smart Grid

5:30 p.m. - 7:00 p.m.Global University Reception

6:30 p.m. - 8:30 p.m.Chapter Chair Dinner

TueSday, auguST 16

7:00 a.m. - 8:30 a.m.STDS WG P1642

903 South Second Street • Ronkonkoma, NY 11779Tel: 631-467-8400 • Fax: 631-467-8558 • E mail: [email protected] • www.ifi.com

Freq Min Pwr Min SatModel Range Out GainNumber (MHz) (Watts) (dB)

M/TCCX/SCCX Series • .01-220 MHzSCCX300 .01-220 300 55SCCX500 .01-220 500 57M404 .01-220 500 57M406 .01-220 1000 60TCCX2000 .01-220 2000 63TCCX2200 .01-220 2200 63TCCX2500 .01-220 2500 64

CMX/SMX Series • .01-1000 MHzSMX301 .01-1000 300/100 55/50SMX302 .01-1000 300/200 55/53SMX303 .01-1000 300/300 55/55SMX501 .01-1000 500/100 57/50SMX502 .01-1000 500/200 57/53SMX503 .01-1000 500/300 57/55CMX10001 .01-1000 1000/100 60/50CMX100010 .01-1000 1000/1000 60/60

Freq Min Pwr Min SatModel Range Out GainNumber (MHz) (Watts) (dB)

SMCC Series • 200-1000 MHz

SMCC350 200-1000 350 55SMCC600 200-1000 600 58SMCC1000 200-1000 1000 60SMCC2000 200-1000 2000 63

SMC Series • 80-1000 MHzSMC250 80-1000 250 54SMC500 80-1000 500 57SMC1000 80-1000 1000 60

SMX-CMX Series • .01-1000 MHzSMX100 .01-1000 100 50SMX200 .01-1000 200 53SMX500 .01-1000 500 57

SVC-SMV Series • 100-1000 MHzSVC500 100-500 500 57SMV500 500-1000 500 57

Solid StateTetrode Tube and

Combination Amplifiers

Microwave Solid Stateand TWT Amplifiers

Solid StateAmplifiers

Freq Min Pwr Min SatModel Range Out GainNumber (GHz) (Watts) (dB)T-200 Series • 200-300 Watts CW 1-21.5 GHz

T251-250 1-2.5 250 54T82-250 2-8 250 54T188-250 7.5-18 250 54T2118-250 18.0-21.7 250 54

T-500 Series • 500 Watts CW 1-18 GHzT251-500 1-2.5 500 57T7525-500 2.5-7.5 500 57T188-500 7.5-18 500 57

MMT Series • 5-150 Watts, 18-40 GHzT2618-40 18-26.5 40 46T4026-40 26.5-40 40 46S/T-50 Series • 40-60 Watts CW 1-18 GHz

S21-50 1-2 50 47T82-50 2-8 50 47T188-50 8-18 50 47

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7:00 a.m. - 9:00 a.m.Technical Committee 1 EMC Manage-

ment

7:30 a.m. - 8:30 a.m.Technical Committee 2 EMC Measure-

ments

8:00 a.m. - NoonGlobal EMC University morning session


8:30 a.m. - 10:00 a.m.TU-AM-1 Antennas 1TU-AM-2 Signal Integrity 1TU-AM-3 EBG Technologies and ICTU-AM-4 Electrostatic Discharge 1TU-AM-5 Nanotechnology and Ad-

vanced Materials

8:30 a.m. - 4:30 p.m.Hooray for Hollywood

9:00 a.m. - 11:30 a.m.Junior Technical Program- Workshop 1

9:30 a.m. - 11:30 a.m.Computer Modeling & Simulation Dem-

os- Improving EMC Test Productivity with Automated EMC Test Software

9:30 a.m. -11:30 a.m.Hardware Experiments & Demos- Cir-

cuit Techniques to Reduce EMI in an Electronic System

9:30 a.m. -11:30 a.m.Hardware Experiments & Demos- Seam

Leakage in Coated Plastic Enclosures

Noon - 1:30 p.m.EMC Transaction Associate Editor

Luncheon

Booth 516

SympoSium overview

Power Of ChoiceThe

Noon - 1:30 p.m.SC - 2 Special Committee on Low Fre-

quency EMC

Noon - 1:30 p.m.Technical Committee 9 Computational

Electromagnetics

Noon - 2:30 p.m.G46 EMC Subcommittee Meeting


1:30 p.m. - 5:30 p.m.TU-PM-1 Antennas 2TU-PM-2 Signal Integrity 2TU-PM-3 PCB and FiltersTU-PM-4 Cavities and Enclosures

tu-PM-5 sPeCiAl sessiOn: sOlving lArge eM PrObleMstu-PM-6 sPeCiAl sessiOn: eMC in sPACe

1:30 p.m. - 5:30 p.m.Global EMC University afternoon session

2:00 p.m. - 3:30 p.m.PAR 1309 Working Group/Committee

Meeting

2:00 p.m. - 4:00 p.m.Computer Modeling & Simulation Dem-

os- Hybrid MoM/MTL Approaches for the Calculation of EMC Problems of Complex Systems

2:00 p.m. - 4:00 p.m.Computer Modeling & Simulation

Demos- Modeling the Coupling to Cables in a 3D Environment

2:00 p.m. - 4:00 p.m.Hardware Experiments & Demos- In-

duced Voltages and Pickups

2:00 p.m. - 4:00 p.m.Hardware Experiments & Demos- I Ef-

ficient Testing Using a Reverberation Chamber – with “Real Time” Ex-amples

7:00 p.m. - 10:00 p.m.Welcome Reception (Aquarium of the

Pacific)

8:00 p.m. - 9:30 p.m.GOLD Introduction and Ice Cream Social

IFI — Broadest Range of Amplifiers Available Today

http://www.ifi.com

8:00 p.m. - 9:30 p.m.IEEE EMC Symposium Gold Event

wedNeSday, auguST 17

7:00 a.m. - 9:30 a.m.EMC Society Standards Development

Committee (Part 2 of 2)

7:00 a.m. - 9:00 a.m.Education and Student Activities Com-

mittee (ESAC) Meeting

7:00 a.m. - 9:00 a.m.Technical Committee 3 Electromagnetic

Environments

7:00 a.m. - 9:00 a.m.TILE! Users Group



8:30 a.m. - 10:00 a.m.WED-AM-1 Emissions 1WED-AM-2 Signal Integrity 3WED-AM-3 Shielding TheoryWED-AM-4 Topics in hPemWED-AM-5 Cables and Coupling

8:30 a.m. - 11:30 a.m.PAR-1688 Working Group Meeting

8:30 a.m. - 4:00 p.m.Los Angeles Shopping, Arts, & Historical

Tour

9:00 a.m. - 11:30 a.m.Junior Technical Program- Workshop 2

9:30 a.m. - 11:30 a.m.Computer Modeling & Simulation

Demos- Modeling and Simulation for Cosite EMI Analysis


Demos-2D Cross-Sectional Analysis in Signal Integrity

Sponsored by

IFI — Broadest Range of Amplifiers Available Today

9:30 a.m. - 11:30 a.m.Hardware Experiments & Demos-Poor

Placement of Probes Proves to Be Problematic

9:30 a.m. - 11:30 a.m.Hardware Experiments & Demos-

Effectiveness of Shielding Materials and Impact of Slots and Bonding of Shields on PCB Radiation and Im-munity

10:00 a.m. - NoonGOLD Session

10:30 a.m. - NoonFeatured Signal Integrity Experi-

ment- “Mixed-Signal Isolation” Film Presentation

11:30 a.m. - 1:30 p.m.Founders & Past Presidents Luncheon

Noon - 1:00 p.m.Technical Committee 10 Signal Integrity

Noon - 1:30 p.m.HAM - Amateur Radio Lunch

Noon - 1:30 p.m.SAE AE-4 Electromagnetic Compatibility

Committee Meeting

Noon - 1:30 p.m.Technical Committee 5 High Power

Electromagnetics

Noon - 1:30 p.m.Technical Committee 11 Nanotechnology



1:30 p.m. - 5:30 p.m.WED-PM-1 Emissions 2WED-PM-2 Signal Integrity 4WED-PM-3 ElectromagneticsWED-PM-4 Transients and Material

Characterizations


http://www.ifi.com

THU-AM-4 Electrostatic Discharge 2THU-AM-4 Information Leakage

tHu-AM-5 sPeCiAl sessiOn: Full CHAnnel CHArACterizAtiOn And link PAtH AnAlysis FOr HigH-sPeed interCOnneCttHu-AM-6 sPeCiAl sessiOn: eMC in sPACe

8:30 a.m. - 4:30 p.m.Santa Monica Famous Fun


Demos- Real World EMI Correlation Challenges and Techniques


Demos-Full-wave EM Simulation of High-Speed PCB/Package Designs

9:30 a.m. - 11:30 a.m.Hardware Experiments & Demos- Refer-

ence (Ground) Noise in Digital Logic

12:30 p.m. - 2:00 p.m.Awards Luncheon


2:30 p.m. - 5:30 p.m.THU-PM-1 ImmunityTHU-PM-2 Signal Integrity 5THU-PM-3 PCB SimulationsTHU-PM-4 Information LeakageTHU-PM-5 EMC EnvironmentTHU-PM-6 EMC Management


Booth 516

IFI — We Are Power – The Power of Choice

SympoSium overview Sponsored by

Power Of ChoiceThe

4:00 p.m. - 5:45 p.m.EMC 2011 Wrap-Up Meeting

5:30 p.m. - 7:30 p.m.WG IEEE 299.1

6:00 p.m. - 9:30 p.m.IEEE EMC Society Board of Directors

Meeting

Friday, auguST 19

7:00 a.m. - 8:30 a.m.SC - 3 Special Committee on Transporta-

tion Systems EMC

7:30 a.m. - 8:30 a.m.IEEE Std 473 Working Group

8:00 a.m. - 5:00 p.m.iNARTE Certification Examinations


8:30 a.m. - NoonFR-AM-1 EMC Leadership TrainingFR-AM-2 Transportation System EMCFR-AM-3 Basic EMC MeasurementsFR-AM-4 Advanced Antenna and Probe

TopicsFR-AM-5 EMC and Wireless Devices

8:30 a.m. - 3:45 p.m.Getty Museum Architectural Tour

Noon - 6:30 p.m.Jet Propulsion Laboratory (JPL)

Technical Tour


1:30 p.m. - 5:30 p.m.FR-PM-1 EMC Consultant’s ToolkitFR-PM-2 Transportation System EMCFR-PM-3 Relationships Between Trans-

fer Impedance and Shielding Effec-tiveness

FR-PM-4 Predicting Cosite Interference


Wed-PM-5 sPeCiAl sessiOn: signAl integrity FOr HigH sPeed COnneCtOrsWed-PM-6 sPeCiAl sessiOn: eMC in sPACe


Demos- Simulation of Complex EMC problems involving cables using combined field and Transmission Line Approach


Demos-EMC Issues on Printed Circuit Boards

2:00 p.m. - 4:00 p.m.Hardware Experiments & Demos-Effects

of Impedance on Field-Coupled Crosstalk

2:00 p.m. - 4:00 p.m.Hardware Experiments & Demos-Near

Field Probes in EMI/EMC/RF Design and Troubleshooting

6:00 p.m. - 10:00 p.m.Gala Evening Event (Queen Mary)

7:00 p.m. - 9:00 p.m.Technical Committee 4 Electromagnetic

Interference Control

ThurSday, auguST 18

7:00 a.m. - 9:00 a.m.TAC Meeting #2

8:00 a.m. - 9:00 a.m.Exhibitor Breakfast


8:30 a.m. - NoonJunior Technical Program- Aquarium

visit


8:30 a.m. - NoonTHU-AM-1 ReverberationTHU-AM-2 Electromagnetic Band Gap

FiltersTHU-AM-3 EMC in Circuits and Devices


[ at a Glance ]t

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emc 2011 aUGUSt 14 - 20

7 AM 8 AM 9 AM 10 AM 11 AM NOON 1 PM 2 PM 3 PM 4 PM 5 PM 6 PM 7 PM

SU

ND

AY Registration Open

Exhibitor Set Up

EMC Society Board of Directors Meeting


MO

ND

AY

Speaker Breakfast Break Lunch Break

Registration Open

Workshop and Tutorials Workshop and Tutorials

Exhibitor Set Up

Chapter Chair Training Chapter Chair Dinner (until 8:30)

Companion Suite Open Wine Testing & Beach Tour


TUE

SD

AY

Speaker Breakfast

Break Lunch Break Welcome Reception @ Aquarium of the Pacific

(until 10 pm)

Registration OpenTechnical Paper

Sessions Meet Poster Paper Authors Technical Paper Sessions

Poster Paper Sessions: Set Up Display, 9-10 am; Meet the Author 10 am-Noon; Display, Noon-5 pmGOLD intro

& Ice Cream @ Aquarium

(8 to 9 :30)

Exhibit Hall Open

Experiments & Demos Experiments & Demos

Global EMC University Global EMC University

Junior Technical Program

Companion Suite Open

Hollywood Tour


WE

DN

ES

DA

Y

Speaker Breakfast Break Lunch Break Gala Evening Event on

the Queen Mary (until 10:30 pm)Registration Open

Founders Luncheon

GOLD Session HAM Radio Lunch

Technical Paper Sessions Technical Paper Sessions

Exhibit Hall Open

Experiments & Demos Experiments & Demos


Junior Technical Program


Hollywood Tour


THU

RS

DA

Y

Speaker Breakfast Break Awards

LuncheonRegistration Open

Technical Paper Sessions Technical Paper Sessions

Exhibit Hall Open

Experiments & Demos EMC 2011 Wrap-Up Meeting (until 5:45 pm)

EMC 2011 BOD Meeting (until 9 :30 pm)


Junior Technical Program @ Aquarium of Pacific


Santa Monica Famous Fun Tour

7 AM 8 AM 9 AM 10 AM 11 AM Noon 1 PM 2 PM 3 PM 4 PM 5 PM 6 PM 7 PM

FRID

AY

Speaker Breakfast

Registration Open

Workshops and Tutorials Workshops and Tutorials

JPL Technical Tour


Getty Museum Architectural Tour

SATURDAY Post Symposium Catalina Island Adventure

BOOTH 740


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MONDAY INCLUDES:*

Workshops/Tutorials• Fundamentals of EMC

• Application of Reverberation Chambers

• Low Frequency EMC Includ-ing Power Quality in Relation to Renewables, Energy Efficient Devices, Electrical Vehicles and Smart Grid

• Addition of ESD and Lightning Requirements and Testing to MIL-STD-461

• Introduction to EMI Modeling Techniques

• EMC Aspects of Smart Grid

• Hot Topics in EMC Measurements: Site Validation, Time Domain and Antenna Characterization

• How to Break Down Complex Sys-tems Into Realistic, Solvable and Accurate Models

• Fundamentals of Signal Integrity

Exhibitor Set Up

Meetings (Page 63) • Technical Advisory Committee (TAC) Meeting #1

• TC-6 Spectrum Management

• SC1 Special Committee on Smart Grid

Other Events• iNARTE Examinations Preparation

Tutorial (Page 60)

• Global University Reception (Page 62)

• Chapter Officers Training Session

• Chapter Chair Dinner

Tours• Wine Tasting & Beach Cruise

(Page 80)

* All events are subject to change. Check www.emc2011.org and the Registration Area daily for updates.

Fundamentals of EMC MO-AM-1 | Full-day Tutorial | Room 102BC

Chair: Henry W. Ott, Henry Ott Consultants, Livingston, NJ, USAAbstractOrganized by the EMC Society Education and Student Activities Committee, this tutorial is designed to present the basics of EMC to those who are new to the field of EMC, those who are seeking information on an aspect of EMC that they have not previously encountered, or those who desire a refresher on the proposed EMC topics.

Planned Speakers and Topics

Introduction [ 8:30-8:40 ]Henry W. Ott, Henry Ott Consultants, Livingston, NJ, USA. Introduction to Electromagnetic Fields and Waves [ 8:40-10:00 ]Andy Marvin, University of York, York, United KingdomConductors and "Conductive Paths" — What is Really Happening (although why should anyone care?) [ 10:30- Noon]Mark Steffka, University of Michigan, Dearborn, MI, USAShielding for EMC [ 1:30-3:00 ]Donald Sweeney, DLS Electronics, Wheeling, IL, USAPrinted Circuit Board EMC Design [ 3:30-4:30 ]Bruce Archambeault, IBM, Durham, NC, USADipoles for Dummies (As well as all the rest of us without a PhD in Electromagnetics) [ 4:30-5:30 ]Henry W. Ott, Henry Ott Consultants, Livingston, NJ, USA

Sponsored by Education and Student Activities Committee

* See Page 17 for details on this session.

Application of Reverberation Chambers MO-AM-2 | Half-day Tutorial | Room 103A

Chair: Chuck Bunting, Oklahoma State University, Stillwater, OK, USA

AbstractThis tutorial will provide an introduction to recent applications of reverbera-tion chambers. It is intended to provide EMC engineers who are interested in applying reverberation chambers to various measurement issues and the extension of reverberation chambers to solve a variety of EMC problems. This half day tutorial provides a brief overview of RC theory, followed by recent applications of RCs. The tutorial material will be updated to reflect recent research results and implications.


Introduction: Rationale for RC Testing Vignesh Rajamani, Oklahoma State University, Stillwater, OK, USAOverview of RC Theory Chuck Bunting, Oklahoma State University, Stillwater, OK, USAModels for Antennas in Reverberation Chambers John Ladbury, NIST, Boulder, CO, USA

Morning SeSSionS | 8:30 aM-noon

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Characterization of EM Environments Using Reverberation Chamber Techniques Chuck Bunting/Vignesh Rajamani, Oklahoma State University, Stillwater, OK, USATime-Domain Modeling and Measurements of RF Propagation Between Coupled Complex Cavities Greg Tait, Naval Surface Warfare Center, Dahlgren, VA, USA

Low Frequency EMC Including Power Quality in Relation to Renewables, Energy Efficient Devices, Electrical Vehicles and Smart Grid MO-AM-3 | Half-day Tutorial | Room 103C

Chair: Magnus Olofsson, Elforsk AB, Stockholm, SwedenAbstractThis tutorial will highlight the importance of Low Frequency EMC within electrical systems. The scope is related to conducted disturbances up to the range of a few hundred kilohertz. In-creased use of electronics in renewables, i.e. solar and wind, energy efficient devices such as luminaries, electrical vehicles and smart grid applications are examples where EMC is in-creasingly fundamental. The transition from passive elements such as the glow wire in incandescent lamps into electronically based luminaries and to frequency control of electrical motors may lead to interference between equipment due to conducted disturbances. Wind power plants cause very slow voltage variations in weak networks that may interfere with connected equipment due to improper Power Quality and/or immunity. Furthermore, conducted disturbances in the range of 2 - 150 kilohertz may lead to interference due to lack of standards.Planned Speakers and Topics

Low Frequency EMC and Power Quality — Develop-ment of Standards Towards Convergence Magnus Olofsson, Elforsk AB, Stockholm, SwedenAssessment of Interference in Electrical Power Systems Due to Emission and Immunity in the 2 - 150 Kilohertz Range Dr. Anders Larsson, Luleå University of Technology, Skellefteå, Sweden Smart Grid and Low Frequency EMC — What Is Needed to Make It Work? Alex McEachern, Power Standards Lab, Alameda, CA, Power Quality and EMC, the Impact of Power Elec-tronics on Power Systems Such as with Renew-ables and Electrical Vehicles David Thomas, University of Nottingham, Nottingham, UK

Sponsored by SC2

Morning SeSSionS | 8:30 aM-noon

Special Event

Spotlight OnSpecial Event

Special Event

SpecialEvent

Fundamentals of EMCHenry Ott will be chairing and presenting in this Tutorial Session. Ott is considered by many to be one of the nation's leading EMC educators, and has over 40 years experience in the field of EMC. He is the author of "Electromagnetic Compatibility Engineering." Interference Tech-nology asked Ott for a preview of the session.

How did you choose the speakers and topics? A number of people have expressed their opinion that over the last few years, the Fundamentals of EMC session has become too theo-retical, and has gotten away from its intent as a session for those new to EMC or those looking for a refresher on EMC fundamentals. As a result Bruce Archambeault, Technical Program Chairman for the conference, asked me if I would organize the session this year and bring it back to its original focus. I agreed.In choosing the speakers, I wanted people whom not only knew their material, and were well respected by their peers, but were also capable of communicating that knowledge to others. In inviting the speakers I emphasized that this was a “fundamentals” session and the material they presented should be “down to earth,” practical, and with a minimum of complex mathematics. Rather than picking, or even suggesting, the topics for each speaker, I asked each potential speaker to pick a subject that they were “passionate about,” and that they thought would be appropriate for the focus of the session. My reasoning being, that if they were passionate about their topic, they would give a better presentation. This approach seems to have worked well, since the proposed topics fit well together to form a coherent session.

Who would most benefit from this presentation?This session is intended to educate new EMC engineers and techni-cians, the future leaders of our industry and society, as well as those looking for a refresher on EMC fundamentals. I think that manag-ers and non-EMC specialists will also benefit from the session, by giving them an awareness and understanding of some of the basic principles of EMC. Historically, the Fundamentals of EMC session has been one of the best-attended sessions at the Symposium, so there must be a large number of symposium attendees with an interest in the subject.

How will you give attendees a better understanding of dipole antenna theory without using equations? Or will you sneak in a little math? This is an excellent question; however, you will have to attend the session to find out the answer. I must confess that I will sneak in a little math, but only the multiplication of two numbers. To an engineer, that should not be considered math. I have given this presentation before, at a number of IEEE EMC Chapter meetings. A comment that I received after one of the meetings was, “I learned more about antennas from your short presentation, than I did from the two electromagnetic fields courses that I had in college.” Most electromagnetic fields courses in college are just math courses.

Can engineers expect to leave with knowledge that can be applied to real world product design and testing?With the roster of speakers that we have, their experience, and their ability to communicate, I believe that we will be able to deliver on that expectation.

Spotlight On


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Addition of ESD and Lightning Requirements and Testing to MIL-STD-461 MO-AM-4 | Half-day Workshop | Room 101A

Chair: Fred Heather, US Navy, Patuxent River, MD, USACo-chair: Manuel Rodriguez, US Air Force, OH, USA

AbstractThis workshop is a follow-up to the 2010 workshop to answer some of the questions that were brought up at the 2010 work-shop. The workshop on Addition of ESD and Lightning Require-ments and Testing to MIL-STD-461 will go over the proposed draft of the requirements and testing. The additions included conducted lighting transient and ESD testing similar to DO-160 Section 23, a radiated lightning test built on RS105, and direct effects lightning testing for equipment with similarity to DO-160. The workshop for 2011 will focus on the test methods for lightning testing and stress/response of electronics to ESD.


Overview of Proposed Draft Addition of ESD and Lightning Requirements and Testing to MIL-STD-461 [ 8:30-9:00 ]Fred Heather, US Navy, Patuxent River, MD, USA Airframe Integrator Perspective for Lightning Test-ing [ 9:00-9:30 ] Travis Flanagan, NAVAIR, Patuxent River, MD, USA Lightning and Conducted Transient and Direct Ef-fects Test Methods [ 9:30-10:00 ]Ed Rupke, Lightning Technologies Incorporated, Pitts-field, MA, USARoot Cause Analysis of ESD Induced Soft Errors [ 10:30-11:00 ]Dr. David Pommerenke, University of Science and Technology, Rolla, MO, USADiscussion Panel [ 11:00-Noon ]

Sponsored by TC5

Introduction to EMI Modeling Techniques MO-AM-5 | Half-day Tutorial | Room 101B

Chair: Giulio Antonini, Università degli Studi dell’Aquila, L'Aquila, Italy

AbstractThis tutorial will provide an introduction to all of the commonly used numerical EMC modeling techniques. It is intended to provide EMC engineers who are interested in learning the basics of these modeling techniques a fundamental under-standing of all the different techniques, without the need for detailed math. Practicing modelers will also benefit from

learning the fundamentals of modeling techniques they are currently not using. Each technique will be presented along with their strengths and weaknesses, so engineers can decide which techniques are appropriate for their types of problems.


Overview of Electromagnetic Modeling Software Todd Hubing, Clemson University, Clemson, SC, USA The Transmission Line Method David Johns, CST of America, Framingham, MA, USA Introduction to the Partial Element Equivalent Circuit Technique Francesco Ferranti, Ghent University, Ghent, Belgium Introduction to the Finite Difference Time-Domain (FDTD) Technique Sam Connor, IBM, Research Triangle Park, NC, USA Introduction to the Finite Element Methods Chuck Bunting, Oklahoma State University, Stillwater, OK, USA Integral Equation Methods (MOM) in Numerical Mod-eling Ji Chen, University of Houston, Houston, TX, USA The Finite Integration Technique Antonio Ciccomancini Scogna, CST of America, Framing-ham, MA, USA

Sponsored by TC9

Fundamentals of EMC MO-PM-1 | Full-day Tutorial | Room 102BC

Chair: Henry W. Ott, Henry Ott Consultants, Livingston, NJ, USA * See MO-AM-1 on Page 16 for details

Sponsored by ESAC

EMC Aspects of Smart Grid MO-PM-2 | Half-day Tutorial | Room 103A

Chair: Don Heirman, Don HEIRMAN Consultants, Lincroft, NJ, USA AbstractThis tutorial will present the application of EMC in supporting the design of a workable Smart Grid system that interoper-ates in the RF environment where it will be deployed. It will also review the primary EMC standards work being done around the world in identifying applicable EMC standards that need to be taken into account for a robust Smart Grid system. Presentations will be made by knowledgeable EMC speakers who are fully engaged in entering EMC consider-ations in most aspects of a Smart Grid system, both on the utility side of the building mounted SG monitor/controller and the user side within the building.

Morning SeSSionS | 8:30 aM-noon aFTernoon SeSSionS | 1:30- 5:30 PM

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Introduction of Worldwide Efforts to Deal with Smart Grid with Emphasis on EMC [ 1:30-2:00 ]Don Heirman, Don HEIRMAN Consultants, Lincroft, NJ, USA EMC Aspects- The Utility Side of the Smart Grid [ 2:00-2:30 ]John Tengdin, OPUS Consulting Group, San Clemente, CA, USA Overview of NIST Activities and the Activities of the Smart Grid Interoperability Panel (SGIP) WG on EM Interoperability Issues (EMIIWG) [ 2:30-3:00 ]Galen Koepke, National Institute of Standards and Tech-nology, Gaithersburg, MD, USA Smart Grid Activities in Europe with Emphasis on EMC [ 3:30-4:15 ]Magnus Olofsson, Elforsk AB, Stockholm, Sweden High Power EM Concerns with Smart Grid [ 4:15-5:00]Bill Radasky, Metatech, Goleta, CA, USA Panel Discussion [ 5:00-5:30 ]

Sponsored by SC1

Hot Topics in EMC Measurements: Site Validation, Time Domain and Antenna Characterization MO-PM-3 | Half-day Tutorial | Room 101A

Chair: Dr. Vince Rodriguez, ETS-Lindgren, Cedar Park, TX, USACo-chair: Janet O’Neil, ETS-Lindgren, Sammamish, WA, USA

AbstractFor some time now, the American National Standards Institute (ANSI) Accredited Subcommittee (ASC) C63® (Electromagnet-ic Compatibility) has had a working group tasked with develop-ing new procedures for validating EMC radiated emission test sites above 1 GHz as well as performing antenna calibration. IEC/CISPR is addressing this topic as well as other associated topics such as measurement methods and test instrumenta-tion in this frequency range. This tutorial is intended to bring a number of contributors together to detail the progress to date and look at options available for such EMC testing at higher frequencies in the future. This tutorial will provide an introduction to the validation and calibration techniques that are likely to be required in the near future, as well as discus-sion of the difficulties likely to be faced and will include the status of associated test instrumentation and measurement methods above 1 GHz. The new requirements for knowledge of the half power beamwidth (HPBW) and radiation pattern of antennas are discussed. Measured results for the patterns of typical EMC antennas are shown as well as a discussion on any issues that users may face when using the pattern data.

Topics to be addressed by the speakers include antenna characteristics above 1 GHz, HPBW and Pattern measure-ments as well as a review of antenna theory; using ordinary EMC antenna types to perform high-resolution time-domain chamber evaluations; comparison of VSWR and TDR methods for chamber validation above 1 GHz; instrumentation usage and techniques for time domain measurements.

Planned Speakers and Topics Measurement Considerations when Using a Vector

Network Analyzer for Site Validation Above 1 GHz Jeff Poole, Agilent Technologies, Anaheim, CA, USA

Time-Domain Anechoic Chamber Performance Met-rics R. T. Johnk, P. M. McKenna, J. D. Ewan and N. De-Minco, Institute for Telecommunication Sciences (NTIA/ITS), Boulder, CO, USA On the Radiation Patterns and Half Power Beam-widths of Typical EMC Radiated Emission Antennas Vince Rodriguez, ETS-Lindgren, Cedar Park, TX, USA

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How to Break Down Complex Systems Into Realistic, Solvable and Accurate Models MO-PM-4 | Half-day Tutorial | Room 101B

Chair: David Johns, CST of America, Framingham, MA

AbstractThis tutorial will introduce the audience to the techniques used to simplify real world complex systems into models for full wave simulation that are able to be solved with today’s software tools, while maintaining the required accuracy to solve the problem of interest. Validation of these simplified models will also be discussed.


Introduction [ 1:30-1:40 ]David Johns, CST, Framingham, MA, USA

Modeling Complex Systems for EMC and Signal Integrity [ 1:40-2:20 ]Bruce Archambeault, IBM, Durham, NC, USA Influence of Geometry Simplification and Simula-tion Settings on Results [ 2:20-3:00 ]Federico Centola, Apple Computer, Cupertino, CA, USACreating Detailed Model Partitions for Solving Com-plex EMC Problems [ 3:30-4:10 ]Colin Brench, Amphenol High Speed Interconnects, Nashua, NH, USA Comprehensive Vehicle System EMI/EMC Model with Realistic Structures and Cabling [ 4:10-4:40 ]Carl G. Baldwin, Lockheed Martin Missiles and Fire Control, Dallas, TX, USA Partitioning, Transient Co-Simulation and Equiva-lent Sources in EMC/EMI Modeling [ 4:50-5:30 ]David Johns, CST of America, Framingham, MA, USA

Sponsored by TC9

Fundamentals of Signal Integrity MO-PM-5 | Half-day Tutorial | Room 103C

Chair: Prof. Tzong-Lin Wu, National Taiwan University, TaiwanCo-chairs: Jay Diepenbrock, IBM, Research Triangle Park, NC, USA; A. Ege Engin, San Diego State University, San Diego, CA, USA

AbstractThis workshop will focus on fundamental theory and design concept for signal/power integrity (SI/PI) in high-speed cir-cuit systems. The first topic includes the basic concept of signal integrity and the channel performance characterized by S-parameters. The second topic will focus on how to cor-relate high speed interconnects models between measure-ment and simulation using TDR and VNA as the measured examples. The third topic will start with the basic crosstalk theories, and then proceed to the "less-known" effect of the

crosstalk behavior that includes the phase relationship of the crosstalk coupling. The fourth topic will start with a review of electromagnetic simulation techniques for power integrity. It will then introduce new power-integrity design methods that can provide sensitivity of the power delivery network imped-ance with respect to design variables and allow incremental simulation for what-if scenarios. The fifth topic will cover signal integrity issues of cross-talk and reflections resulting from signal nets transitioning from layer-to-layer and over plane cut-outs such as splits in ground or power planes. The sixth topic will focus on estimation of common-mode currents by circuit simulation due to discontinuities on transmission-line systems.


Data Mining the Rich Mother Lode of S-Parameters Eric Bogatin, Bogatin Enterprises, Olathe, KS, USA Simulation and Measurement Correlation for High Speed Interconnect Xiaoning Ye, Intel, Hillsboro, OR, USA Crosstalk Re-visited

Amy Chen, Intel, Santa Clara, CA, USA Electromagnetic Simulation for Power Integrity: From Analysis to Design A. Ege Engin, San Diego State University, San Diego, CA SI/EMC Coupling Issues in High-Speed Electronic Pack-ages Jerry Aguirre, Kyocera America, San Diego, CA, USA SI/EMC Issues with Discontinuities in the Imbalance Factor of Transmission Lines Yoshitaka Toyota, Okayama University, Okayama, Japan

Sponsored by TC10

TIPS FROM The Locals

John O'BrienRegional Sales Director, WEMS ElectronicsHawthorne, Calif.

Place I call home Simi Valley, Calif. California credentials I’m a lifelong resident of Southern California and got my degree from Cal State University, Northridge. Must-

see attraction Los Angeles Music Center. Best celebrity

spotting LA Dodger Manager Tommy Lasorda at Cold Stone in Calabasas. Family-friendly activities The beach or the moun-tains. Favorite outdoor recreation Golf. Entertainment

venues LA Music Center, Dodger Stadium, Staples Center, Griffith Observatory. Place to eat LA Farmers Market. Best

view: View from the south-facing slope of Mount Hollywood at Griffith Observatory.

See Page 87 for details on the LA Farmers Market.

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TUESDAY INCLUDES:*

Workshops / Tutorials• Antennas 1

• Signal Integrity 1

• EBG Technologies and IC

• Electrostatic Discharge 1

• Nanotechnology and Advanced Materials

• Antennas 2


• PCB and Filters

• Cavities and Enclosures

• Solving Large EM Problems

• EMC in Space

Experiments & Demonstrations (Page 57-59)

Exhibitor Hall Open

Meetings (Page 63)

• TC-1 EMC Management

• TC-2 EMC Measurements

• TC-9 Computational Electromagnetics

• SC2 Low Frequency EMC

Other Events• Global University classes (Page 62)

Social Events (Page 78)

• Welcome reception at the Aquari-um of the Pacific

• IEEE EMC Symposium Gold Event

Companion Program• Hooray for Hollywood (Page 80)


Antennas 1TU-AM-1 | Room 101A

Chair: Chris Hauser, Kofax, Washington, D.C., USA

Tracing E-field Probe Responses to the Dipole Antenna Factor [ 8:30-9:00 ]* Nominated for Best Symposium Paper Award T. Morioka, National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Japan Electric Field Coupling Suppression Using Via Fences for Magnetic Near-Field Shielded-Loop Coil Probes in Low Temperature Co-Fired Ceramics [ 9:00-9:30 ]Y. Chou and H. Lu, Nation Taiwan University, Taipei, Taiwan Stand-alone Electric-field Probe for Measurements within Enclosures [ 9:30-10:00 ] H. Funato and T. Suga, Hitachi Ltd., Yokohama, Japan

Sponsored by TC2

Signal Integrity 1TU-AM-2 | Room 101B

Chair: Zhiping Yang, Cisco, San Jose, CA, USA

Coupling Analysis of Through-Silicon Via Arrays in Silicon Interposers for 3D Systems [ 8:30-9:00 ]B. Xie, M. Swaminathan, and J. Xie, Georgia Institute of Technology, Atlanta, GA, USAK. Han, IBM Watson Research Center, Yorktown Heights, NY, USA Measurement and Analysis of Vertical Noise Coupling on Low Noise Amplifier from On-chip Switching-mode DC-DC Converter in 3-D IC [ 9:00-9:30 ]K. Koo, M. Kim, S. Lee, and J. Kim, KAIST, Daejeon, Republic of Korea Analysis of Die-to-Die Vertical Crosstalk between Clock-tree and Volt-age Controlled Oscillator in 3-D IC [ 9:30-10:00 ]S. Lee, K. Koo, and J. Kim, Terahertz Interconnection and Package Lab, Daejeon, Republic of Korea

Sponsored by TC10

EBG Technologies and ICTU-AM-3 | Room 102BC

Chair: Todd Hubing, Clemson University, Clemson, SC, USA

EMI Suppression of 10Gbit/s Optical Transceiver by using EBG Struc-ture [ 8:30-9:00 ] D. Kawase, H. Oomori, M. Shiozaki, and H. Kurashima, Sumitomo Electric Industries, LTD., Yokohama City, Japan Mitigation of Electromagnetic Field Leakage from Apertures and En-closures Using Electromagnetic Bandgap (EBG) Structures [ 9:00-9:30 ]M. Bait-Suwailam and O. Ramahi, University of Waterloo, Waterloo, ON, Canada Improving the Immunity of Smart Power Integrated Circuits by Control-ling RF Substrate Coupling [ 9:30-10:00 ]

morning sessions | 8:30 am-noon

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P. Schroeter, S. Jahn and F. Klotz, Infineon Technologies, Neubiberg, Germany

Sponsored by TC4

Electrostatic Discharge 1TU-AM-4 | Room 103A

Co-Chair: Dr. William Radasky, Metatech Corporation, Goleta, CA, USACo-Chair: Michael McInerney, U.S. Army Corps of Engineers, Champaign, IL, USA

Property Analysis of Micro-gap Air Electrostatic Dis-charge with Moving Electrode [ 8:30-9:00 ] F. Ruan, L. Wu, H. Wang, X. Wang, and Z. You, Guizhou Nor-mal University, Guiyang, ChinaF. Zhou, Metrology Center of Communication, Beijing, China Model of Secondary ESD for a Portable Product [ 9:00-9:30 ] J. Xiao, D. Pommerenke, and J. Drewniak, Missouri University of Science and Technology, Rolla, MO, USAH. Shumiya, T. Yamada, and A. Kenji, Sony Corporation, Tokyo, Japan

An Evaluation of TVS Devices for ESD Protection [ 9:30-10:00 ] R. Chundru, C. Lam, F. Centola, and R. Steinfeld, Apple Inc., Cupertino, CA, USAZ. Li, D. Pommerenke, and K. Kam, Missouri University of Science and Technology, Rolla, MO, USA

Sponsored by TC5

Nanotechnology and Advanced MaterialsTU-AM-5 | Room 103B

Co-Chair: Marina Koledintseva, Missouri University of S & T, Rolla, MO, USACo-Chair: Christopher L. Holloway, NIST, Boulder, CO, USA

Design of Electromagnetic Wave Absorber by Use of Metal Wire Array Sheet [ 8:30-9:00 ] S. Yamamoto, D. Ishihara, and K. Hatakeyama, University of Hyogo, Himeji, Japan Electromagnetic Field Radiation from MWCNTs and SW-CNT bundles: A Comparative Analysis [ 9:00-9:30 ] A. D’Aloia, M. Sarto, and A. Tamburrano, Research Center on Nanotechnology Applied to Engineering, Rome, Italy High Frequency Permeability of Fe-Al-Si Granular Com-posite Materials [ 9:30-10:00 ] T. Tsutaoka, T. Ono, and A. Tsurunaga, Hiroshima University,


Jodi HendersonWearer of Many Hats, A.H. Systems, Inc.Chatsworth, Calif.

Place I call home Thousand Oaks, Calif. I’ve lived in California All my life. Must-see attractions Universal Studios, Disneyland, Knotts Berry Farm, Magic Mountain, LE-GOLAND, the beach, Catalina Island, Dodgers game. Celebrity

hotspot Malibu. Family-friendly activities Of course, the theme parks, staying in San Diego, camping, hiking, bowling, backyard BBQ parties, going to the beach, going to the movies and hanging out with family friends. Favorite outdoor recreation

RV Camping. Entertainment venues Hollywood Blvd., Venice, Staples Center, LA Live and the Santa Monica Pier. Place to

eat Minato Sushi. My family and I eat there once a week. Best fresh fish ever. Must-have souvenir Mickey Mouse hat with ears. Best view: From my parents’ backyard; you can see a 180 degree view of the San Fernando Valley. Awesome. Also, on top of the Santa Monica Mountains looking out over the ocean. Spectacular.

See Pages 86-87 for details on LEGOLAND and Disneyland.


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Higashi-Hiroshima, JapanT. Kasagi, Tokuyama College of Technology, Tokuyama, JapanK. Hatakeyama, University of Hyogo, Himeji, JapanM. Y. Koledintseva, Missouri University of Science and Tech-nology, Rolla, MO, USA

Sponsored by TC11

Antennas 2TU-PM-1 | Room 101A

Chair: Bob Hofmann, Hofmann EMC Engineering, Naperville, IL, USA

Proposal of Simple Reference Antenna Method for EMI Antenna Calibration [ 2:00-2:30 ] J. Park, G. Moon, D. Yu, B. Lee, and W. Kim, Radio Research Agency of Korea Communication Commissions, Icheon, Re-public of Korea

Effi cient Experimental Procedure for Antenna Calibration in Plastic/Concrete/Metallic Conduits [ 2:30-3:00 ] R. Stefanelli and D. Trinchero, iXem Labs - Politecnico di Torino, Torino, Italy

A Comparison between Three-Antenna Method and Equivalent Capacitance Substitution Method for Calibrat-ing Electrically Short Monopole Antenna [ 3:30-4:00 ] M. Ishii, S. Kurokawa, and Y. Shimada, National Institute of Advanced Industrial Science and Technology, Tsukuba, Japan

A Novel Method for Determining the Lower Bound of An-tenna Effi ciency [ 4:00-4:30 ] * Nominated for Best Symposium Paper Award J. B. Coder and J. M. Ladbury, National Institute of Standards and Technology, Boulder, CO, USAM. Golkowski, University of Colorado Denver, Denver, CO, USA

Electro-Optical Sensor for Shielding-Effectiveness Mea-surements of Motor-Control-Unit Enclosures [ 4:30-5:00 ]L. A. Thiele and R. Geise, TU Braunschweig, Braunschweig, Germany

Sponsored by TC2

Signal Integrity 2TU-PM-2 | Room 101B

Co-Chair: Jianming Zhang, Intel, Hillsboro, OR, USACo-Chair: Amy Chen, Intel, Hillsboro, OR, USA

Design and Experimental Verifi cation of On-chip Signal Integrity Analyzer Scheme for Eye Diagram Monitoring of a High-speed Serial Link [ 1:30-2:00 ] M. Shin, K. Koo, J. Kim, M. Kim, and S. Kong, KAIST, Daejeon, Republic of Korea

Quantifi cation of Crosstalk for Broadside and Edgeside Stripline [ 2:00-2:30 ] B. Holmes, IBM, Tucson, AZ, USA

S. Connor and B. Archambeault, IBM, Research Triangle Park, NC, USA

Parametric Study on the Effect of Asymmetry in Multi-Channel Differential Signaling [ 2:30-3:00 ] K. Han, X. Gu, and Y. H. Kwark, IBM Watson Research Center, Yorktown Heights, NY, USAZ. Yu, D. Liu, and J. Fan, Missouri University of Science and Technology, Rolla, MO, USAB. Archambeault and S. Connor, IBM, Research Triangle Park, NC, USA

Modeling and Analysis of a Trace Referenced to a Meshed Ground Plane [ 3:30-4:00 ] S. Wu, H. Shi, M. Herndon, B. Cornelius, M. Halligan, and J. Fan, Missouri University of Science and Technology, Rolla, MO, USA

Statistical Estimation of Root Mean Square Crosstalk in SFP+ Cable Evaluations [ 4:00-4:30 ] * Nominated for Best Symposium Paper Award D. Liu and J. Fan, Missouri University of Science and Technol-ogy, Rolla, MO, USAJ. Chen and Z. Yang, Cisco Systems, Inc., San Jose, CA, USA

Transient Analysis of PCB Lines with the Inclusion of Parameters Uncertainties [ 4:30-5:00 ] P. Manfredi, I. S. Stievano, and F. G. Canavero, Politecnico di Torino, Torino, Italy

Effi cient Design Optimization of Complex Electromagnetic Systems using Parametric Macromodeling Techniques [ 5:00-5:30 ] F. Ferranti, T. Dhaene, and L. Knockaert, Ghent University - IBBT, Ghent, BelgiumG. Antonini, Universita’ degli Studi dell’Aquila, L’Aquila, ItalyA. Ciccomancini Scogna, CST of America, Framingham, MA, USA

Sponsored by TC10

PCB and FiltersTU-PM-3 | Room 102BC

Co-Chair: Kermit Phipps, AMS Technology Center, Knox-ville, TN, USACo-Chair: John Rohrbaugh, Northrop Grumman, Clearfi eld, UT, USA

Estimation of Crosstalk among Multiple Stripline Traces Crossing a Split by Compressed Sensing [ 1:30-2:00 ] T. Wang, Y. Shi, S. Wu, and J. Fan, Missouri University of Sci-ence and Technology, Rolla, MO, USA

Electromagnetic Radiation Resulting from Strip Line Structure Driven by a Feed Cable [ 2:00-2:30 ] Y. Kayano and H. Inoue, Akita University, Akita, Japan

EMI Noise Reduction Between Planes Due to a Signal Via

AFTERNOON SESSIONS | 1:30 PM-5 PM

BOOTH 339

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with a Ground via at Various Distances [ 2:30-3:00 ] A. Jaze, IBM, Poughkeepsie, NY, USAS. Connor and B. Archambeault, IBM, Research Triangle Park, NC, USA Method for Direct Interconnection of PCB Power Layer to Chassis to Minimize Radiated Emissions [ 3:30-4:00 ] D. Moongilan, Alcatel-Lucent, Murray Hill, NJ, USA Optimizing Decoupling Capacitor Placement to Reduce Effective Inductance [ 4:00-4:30 ] B. Archambeault and S. Connor, IBM, Research Triangle Park, NC, USAJ. Kim and J. Fan, Missouri University of Science and Technol-ogy, Rolla, MO, USA Chokeless Power-Line Filters with Integral Surge Protec-tion [ 4:30-5:00 ] P. F. Keebler and K. O. Phipps, Electric Power Research In-stitute, Knoxville, TN, USA Common Mode Choke Investigation for Low Pass Filter Application [ 5:00-5:30 ] J. Shafii, H. Chai, and R. Gadow, Hamilton Sundstrand, Rock-ford, IL, USA

Sponsored by TC4

Cavities and EnclosuresTU-PM-4 | Room 103A

Co-Chair: Vignesh Rajamani, Oklahoma State University, Stillwater, OK, USACo-Chair: Alistair Duffy, De Montfort University, Leicester, United Kingdom

Estimation of the Electromagnetic Field Radiated by a Microwave Circuit Encapsulated in a Rectangular Cavity [ 1:30-2:00 ] S. Khemiri, A. Ramanujan, M. Kadi, Z. Riah, and A. Louis, IRSEEM, Saint Etienne de Rouvray, France Wave Chaotic Analysis of Weakly Coupled Reverberation Chambers [ 2:00-2:30 ]G. Gradoni, J. Yeh, T. M. Antonsen, S. Anlage, and E. Ott, University of Maryland, College Park, MD, USA Optimal Plane-Wave Representation of Random Fields in a Reverberation Chamber [ 2:30-3:00 ]* Nominated for Best Symposium Paper Award J. C. West, C. F. Bunting, and V. Rajamani, Oklahoma State University, Stillwater, OK, USA Shielding Performance of Transparent Thin Films Loading Apertures in Metallic Enclosures Excited by Inner Dipole Sources [ 3:30-4:00 ]* Nominated for Best Symposium Paper Award R. Araneo, G. Lovat, S. Celozzi, and M. D’Amore, University of Rome, Rome, Italy Statistical Characterization of Complex Enclosures with Distributed Ports [ 4:00-4:30 ]T. M. Antonsen, G. Gradoni, E. Ott, and S. Anlage, University

of Maryland, College Park, MD, USA Reverberation Chambers: Full 3-D FDTD Simulations and Measurements of Independent Positions of the Stirrers F. Moglie and V. Mariani Primiani, Università Politecnica delle Marche, Ancona, Italy [ 4:30-5:00 ]Stochastic and Statistics in Superposition of Multipole Radiators [ 5:00-5:30 ]O. Doering, A. Kreth, and H. Garbe, Leibniz Universität Han-nover, Hannover, Germany

Sponsored by TC9

Special Session: Solving Large EM ProblemsTU-PM-5 | Room 103B

Co-Chair: Albert Ruehli, Missouri University of Science and Technology, Rolla, MO, USACo-Chair: Giulio Antonini, University of L’Aquila, L’Aquila, Italy

Electromagnetics-Thermal Co-analysis of Real-life 3-D ICs Using Non-conformal Domain Decomposition Method [ 1:30-2:00 ] Y. Shao, Z. Peng, and J. Lee, Ohio State University, Colum-bus, OH, USA Multipoint Model Order Reduction of Delayed PEEC Sys-tems [ 2:00-2:30 ]F. Ferranti, T. Dhaene, and L. Knockaert, Ghent University, Ghent, BelgiumM. Nakhla, Carleton University, Ottawa, CanadaG. Antonini, University of L’Aquila, L’Aquila, ItalyA. E. Ruehli, Missouri University of Science and Technology, Rolla, MO, USA An H2-Based Linear-Complexity Solution of Surface Inte-gral Equations for 3-D Impedance Extraction [ 2:30-3:00 ]W. Chai and D. Jiao, Purdue University, West Lafayette, IN, USA Skin-Effect Model for Time and Frequency Domain PEEC Solver [ 3:30-4:00 ]G. Antonini, University of L’Aquila, L’Aquila, ItalyA. Ruehli, Missouri University of Science and Technology, Rolla, MO, USA Solution of Large Multiscale EMC Problems with Method of Moments Accelerated via Low-Frequency MLFMA [ 4:00-4:30 ]J. Aronsson, M. Shafieipour, and V. Okhmatovski, University of Manitoba, Winnipeg, Canada A Novel Characterization Method of the Radiation Emis-sion for Electromagnetic Compatibility [ 4:30-5:00 ]P. Li and L. Jiang, University of Hong Kong, Pokfulam, Hong Kong

aFternoon sessions | 1:30 Pm-5 Pm

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34 INTERFERENCE TECHNOLOGY EMC SYMPOSIUM GUIDE 2011

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AFTERNOON SESSIONS | 1:30 PM-5 PM

Special Session: EMC in Space TU-PM-6 Room 103C

Co-Chair: Ray Perez, Jet Propulsion Laboratory, Pasadena, CA, USACo-Chair: James Lukash, Lockheed Martin, Sunnyvale, CA, USA

Design Approach and Spacecraft EMI Test Methodology for High Power Communication Spacecraft [ 1:30-2:00 ]A. L. Bogorad, K. August, M. Deeter, and R. Herschitz, Lock-heed Martin Space Systems, Newtown, PA, USAJ. A. Lukash, Lockheed Martin Space Systems, Sunnyvale, CA, USA Application of the Power Balance Method to E-Field Calculation in the ARIANE 5 Launcher Payloads Cavities [ 2:00-2:30 ] A. Schaffar and P. Gineste, EADS ASTRIUM Space Transpor-tation, Les Mureaux, France EMI/EMC, Lightning, and ESD Design Approach for the Falcon 9 Launch Vehicle: Part I [ 2:30-3:00 ]W. Elkman, J. Trinh, P. McCaughey, and W. Chen, Space Exploration Technologies, Hawthorne, CA, USA

EMI/EMC, Lightning, and ESD Design Approach for the Falcon 9 Launch Vehicle: Part II [ 3:30-4:00 ] W. Elkman, J. Trinh, P. McCaughey, and W. Chen, Space Exploration Technologies, Hawthorne, CA, USA Overview of the Impact of Intense Geomagnetic Storms on the U.S. High Voltage Power Grid [ 4:00-4:30 ]W. A. Radasky, Metatech Corporation, Goleta, CA, USA Effects of Hostile Space Weather on Satellite Operations [ 4:30-5:00 ] D. N. Baker, University of Colorado, Boulder, CO, USA Modeling from Local to Subsystems Level Effects in Analog and Digital Circuits due to Space Induced Single Event Transients [ 5:00-5:30 ]R. J. Perez, Jet Propulsion Laboratory, Pasadena, CA, USA

Poster Paper Sessions

The Poster Papers will be on display from noon-5 p.m. Tuesday in the atrium of Room 102A. Authors will be present from 10 a.m.-noon to discuss their papers in detail with attendees in an interactive format. Once the interactive format is done, the post-ers will be moved into Room 102A for the remainder of Tuesday afternoon. See Page 77 for a list of papers.

BOOTH 331

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36 interference technology emc Directory & Design guiDe 2011

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WEDNESDAY INCLUDES:*

Workshops / Tutorials• Emissions 1


• Shielding Theory

• Topics in HPEM

• Cables and Coupling

• Emissions 2


• Electromagnetics

• Transients and Material Character-izations

• EMC in Space


Exhibitor Hall Open

Meetings (Page 63)

• TC-3 Electromagnetic Environment

• TC-4 Electromagnetic Interference Control

• TC-5 High Power Electromagnetics

• TC-10 Signal Integrity

• TC-11 Nanotechnology and Advanced Materials



• Gala Evening Event on the Queen Mary

• Ham Radio Lunch

Companion Program• Los Angeles Shopping, Arts & Historical Tour (Page 81)


Emissions 1WED-AM-1 | ROOM 101A

Chair: Ghery Pettit, Intel Corporation, DuPont, WA, USA

High Harmonic Distortion in a New Building due to a Multitude of Elec-tronic Equipment [ 8:30-9:00 ] R. B. Timens and F. J. Buesink, University of Twente, Enschede, Netherlands; V. Cuk, J. F. Cobben, and W. L. Kling, Eindhoven University of Technology, Eindhoven, Netherlands; F. B. Leferink, Thales Nederland B.V., Hengelo, Netherlands Assessment of the Usability of the Workbench Faraday Cage Method [ 9:00-9:30 ] M. Soerensen, O. Franek, G. F. Pedersen, and H. Ebert, Antennas, Propaga-tion and Radio Networking, Aalborg, Denmark S. K. Christensen, Bang & Olufsen a/s, Struer, Denmark A Round-Robin Test on Effectiveness of a VHF LISN for Radiated Emis-sion MeasurementsC. Miyazaki, Mitsubishi Electric Corporation, Kamakura, Japan K. Tanakajima, Intertek Japan K.K., Kamisu, Japan M. Yamaguchi, EMC Education, Machida, Japan K. Endo, TUV SUD Ohtama, Ltd., Kawasaki, Japan H. Muramatsu, NEC AccessTechnica, Ltd., Kakegawa, Japan J. Kawano, VCCI Council, Minato, Japan

Sponsored by TC2

Signal Integrity 3WED-AM-2 | ROOM 101B

Co-Chair: Antonio Ciccomancini Scogna, CST, Framingham, MA, USACo-Chair: Francesco Ferranti, Ghent University, Ghent, Belgium

FPGA Core PDN Design Optimization [ 8:30-9:00 ] Z. Liu, S. Sun, and P. Boyle, Altera Corporation, San Jose, CA, USA Measurement of Multiple Switching Current Components through a Bulk Decoupling Capacitor Using a Lab-Made Low-Cost Current Probe [ 9:00-9:30 ] L. Li, J. Kim, H. Wang, S. Wu, and J. Fan, Missouri University of Science and Technology, Rolla, MO, USA Y. Takita, H. Takeuchi, and K. Araki, Sony Corporation, Tokyo, Japan Analytical Expressions for Transfer Function of Supply Voltage Fluctua-tion to Jitter at a Single-Ended Buffer [ 9:30-10:00 ] J. Kim, S. De, K. Shringarpure, J. Fan, and J. L. Drewniak, Missouri University of Science and Technology, Rolla, MO, USA S. Pan and B. Achkir, Cisco Systems, Inc., San Jose, CA, USA

Sponsored by TC10

Shielding TheoryWED-AM-3 | ROOM 102BC

Co-Chair: Vil Arafiles, DoD, Washington, D.C., USACo-Chair: John Kraemer, Rockwell Collins, Cedar Rapids, IA, USA

Shielding Effectiveness of Metallic Enclosure with Rectangular Aper-tures at Various Polarizations [ 8:30-9:00 ]


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BOOTH 111

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H. Yoo, S. Lee, J. Lee, and D. Park, Chungnam National Uni-versity, Daejeon, Republic of Korea; E. Kim and S. Ryu, Korea Automotive Technology Institute, Cheonan, Republic of Korea High-Performance Laminated Thin-Film Shield with Conductors and Magnetic Material Multilayer [ 9:00-9:30 ] K. Yamada and M. Ishida, Toshiba Corporation, Yokohama, Japan M. Yamaguchi and Y. Shimada, Tohoku University, Sendai, Japan Application of Double Layer Frequency Selective Surface for SMPS Shielding [ 9:30-10:00 ] T. R. Suresh Kumar, Muthayammal Engineering College, Salem, India C. Venkatesh, EBET Group of Institutions, Erode, India

Sponsored by TC4

Topics in HPEMWED-AM-4 | ROOM 103A

Co-Chairs: Dr. William Radasky, Metatech Corporation, Go-leta, CA, USA; and Michael McInerney, U.S. Army Corps of Engineers, Champaign, IL, USA

An Equivalent Source Model for the Study of Radiated Electromagnetic Fields in Multi-Machine Electric Drive Systems [ 8:30-9:00 ] M. Barzegaran, A. Sarikhani, and O. Mohammed, Florida International University, Miami, FL, USA Zero CM Voltage Multilevel Inverters for Smart Grid Ap-plications [ 9:00-9:30 ] R. Smolenski, A. Kempski, J. Bojarski, and P. Lezynski, Uni-versity of Zielona Gora, Zielona Gora, Poland Behavioral Circuit Modeling of Chokes With Multi-Reso-nances Using Genetic Algorithm [ 9:30-10:00 ] S. Skibin and I. Stevanovic, ABB Switzerland Ltd., Baden Dättwil, Switzerland

Sponsored by TC5

Cables and CouplingWED-AM-5 | ROOM 103B

Chair: Philip Keebler, EPRI, Knoxville, TN, USA

Modeling of Common Mode Currents Induced by Motor Cable in Converter Fed AC Motor Drives [ 8:30-9:00 ] J. Luszcz, Gdansk University of Technology, Gdansk, Poland On EM Disturbances over Digital Equipment Used for Monitoring and Events Recording in a Power System [ 9:00-9:30 ] P. T. Nicolae, D. Purcaru, and I. Nicolae, University of Craiova, Craiova, Romania G. Mihai and M. Duta, ICMET Craiova, Craiova, Romania Scrambling Data Signals For EMC Compliance [ 9:30-10] * Nominated for Best Symposium Paper Award A. D. Norte, InfoPrint Solutions Company, Boulder, CO, USA

Sponsored by TC4

Emissions 2WED-PM-1 | ROOM 101A

Co-Chair: Don Heirman, Don HEIRMAN Consultants, Lincroft, NJ, USACo-Chair: Tom Fagan, Raytheon Missile Systems, Tucson, AZ, USA

Digital Automatic Calibration Method for a Time-Inter-leaved ADC System used in Time-Domain EMI Measure-ment Receiver [ 1:30-2:00 ] H. H. Slim and P. Russer, Technische Universität München, Munich, Germany A Novel Time-domain EMI Measurement System for Mea-surement and Evaluation of Discontinuous Disturbance According to CISPR 14 and CISPR 16 [ 2:00-2:30 ] S. M. Braun, Gauss Instruments GmbH, Munich, Germany Noise Cancelling Algorithms for FPGA-based Time-domain EMI Measurements in Real-time [ 2:30-3:00 ] A. Frech, Gauss Instruments GmbH, Munich, Germany S. Limmer and P. Russer, Technische Universität München, Munich, Germany A Broadband High-Dynamic Time-Domain System for EMI Measurements in K-Band up to 26 GHz [ 3:30-4:00 ]C. Hoffmann and P. Russer, Technische Universität München, Munich, Germany Examining the Effect of Source Type on the Accuracy of Inverse Distance Fall-Off for Radiated EMI Measurements [ 4:00-4:30 ] J. S. Maas, IBM Corporation, Rochester, MN, USA S. R. Connor, IBM Corporation, Research Triangle Park, NC, USA D. D. Hoolihan, Hoolihan EMC Consulting, Lindstrom, MN, USA Interference Tests for 900 MHz Frequency-Hopping Public-Safety Wireless Devices [ 4:30-5:00 ]K. A. Remley, W. F. Young, D. G. Kuester, D. R. Novotny, and J. R. Guerrieri, NIST, Boulder, CO, USA M. R. Souryal, NIST, Gaithersburg, MD, USA New Method of IEEE 802.15.4a UWB Impulse Radio Spec-trum Sharing [ 5:00-5:30 ]J. Sadowski and R. Katulski, Gdansk University of Technology, Gdansk, Poland

Sponsored by TC2

Signal Integrity 4WED-PM-2 | ROOM 101B

Co-Chairs: Xiaoning Ye, Intel, Hillsboro, OR, USA; and Jun Fan, Missouri University of Science and Technology, Rolla, MO, USA Automated Dielectric Constant and Loss Tangent Characterization Using Cavity Resonators [ 1:30-2:00 ]

aFTernoon sessions | 1:30 Pm-5 Pm

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P. Pasunoori and A. E. Engin, San Diego State University, San Diego, CA, USA Effect of Anisotropy on Extracted Dielectric Properties of PCB Laminate Dielectrics [ 2:00-2:30 ]M. Y. Koledintseva and J. L. Drewniak, Missouri University of Science and Technology, Rolla, MO, USA; S. Hinaga, Cisco Systems, San Jose, CA, USA Roughness Characterization for Interconnect Analysis [ 2:30-3:00 ]Y. Shlepnev, Simberian Inc., Las Vegas, NV, USA C. Nwachukwu, Isola Group USA, Chandler, AZ, USA Nickel Characterization for Interconnect Analysis [ 3:30-4:00 ]Y. Shlepnev, Simberian Inc., Las Vegas, NV, USA S. McMorrow, Teraspeed Consulting Group LLC, Narragansett, RI, USA Modeling SMT Ferrite Beads for SPICE Simulation [ 4:00-4:30 ]C. Rostamzadeh, Bosch, Plymouth, MI, USA F. Grassi, Politecnico di Milano, Milan, Italy F. Kashefi, Khavaran Institute of Science and Technology, Mashhad, Iran Ferrite Bead Model Extraction and Its Application in High-Performance ASIC Analog Power Filtering [ 4:30-5:00 ]J. Zhang, K. Qiu, L. Yin, and R. Brooks, Cisco Systems, San Jose, CA, USA B. Chen, Tsinghua University, JiaXing, China

Sponsored by TC10

ElectromagneticsWED-PM-3 | ROOM 102BC

Chair: Dan Hoolihan, Hoolihan EMC Consulting, Lindstrom, MN, USA Near-Field H to E Transformation Using Plane Wave Spec-trum Theory [ 1:30-2:00 ]Z. Yu, Y. Zhang, M. S. Halligan, and J. Fan, Missouri University of Science and Technology, Rolla, MO, USAS. Sajuyigbe, R. Camacho, J. A. Mix, and K. Slattery, Intel Corporation, Hillsboro, OR, USA Comparison of NEC Simulation and Measurement Meth-ods for the Solution of Coupling between Airborne Anten-nas [ 2:00-2:30 ]M. E. Aydemir, Turkish Air Force Academy, Istanbul, Turkey Modeling Electromagnetic Field Coupling from an ESD Gun to an IC [ 2:30-3:00 ]* Nominated for Best Symposium Paper Award J. Zhang, D. G. Beetner, and D. Pommerenke Missouri Uni-versity of Science and Technology, Rolla, MO, US R. Moseley and S. Herrin, Freescale Semiconductor, Austin, TX, USA On the Possibility to Detect and Visualize Electromagnetic Coupling Paths [ 3:30-4:00 ]H. Li, V. Khilkevich, D. Pommerenke, Y. Zhang, and J. Fan, Mis-

souri University of Science and Technology, Rolla, MO, USA Suppression of RF Interference Using Balanced Filter in Communication System [ 4:00-4:30 ]H. C. Chen and T. L. Wu, National Taiwan University, Taipei, Taiwan Methodological Approach to Making an Electromagnetic Chart of an IT Object [ 4:30-5:00 ]F. Baidin, M. Zhukovsky, R. Kirichek, and V. Chvanov, FSUE “CenterInform,” Saint-Petersburg, Russian Federation Sponsored TC4

Transients and Material CharacterizationWED-PM-4 | ROOM 103A

Co-Chair: Al Roden, Aerospace Corp, Chantilly, VA, USACo-Chair: Chuck Bunting, Oklahoma State University, Still-water, OK, USA

Full-Wave EMC Simulations Using Maxwell Garnett Model for Composites with Cylindrical Inclusions [ 1:30-2:00 ]M. Nisanci, F. de Paulis, and A. Orlandi, University of L’Aquila, L’Aquila, Italy M. Koledintseva, Missouri University of Science and Technol-ogy, Rolla, MO, USA Investigation on Electromagnetic Responses of Some Complex Wire-Surface Composite Objects using Hybrid TDIE-TDPO Based MOT Method [ 2:00-2:30 ]* Nominated for Best Symposium Paper Award W. Luo, W.Y. Yin, M.D. Zhu, and J.F. Mao, Center for Microwave and RF Technologies (CMRFT), Shanghai, ChinaSolution of Time-Domain MFIE and CFIE Using Adaptive MOO Method for Transient Scattering in the Presence of an EMP [ 2:30-3:00 ]M. Zhu and X. Zhou, Center for Microwave and RF Technolo-gies (CMRFT), Shanghai, ChinaW. Yin, Center for Optical and EM Research (COER), State Key Lab of MOI, Hangzhou, ChinaTransient Electromagnetic Topology-Based Analysis of EMP Interaction with a Computer Network [ 3:30-4:00 ]* Nominated for Best Symposium Paper Award H. Xie, J. Wang, and R. Fan, Northwest Institute of Nuclear Technology, Xi’an, China Mixed Finite Element Time Domain Method Based on Iterative Leapfrog Scheme for Fast Simulations of Elec-tromagnetic Problems [ 4:00-4:30 ]T. Sekine, Graduate School of Science and Technology, Shizuoka University, Hamamatsu, Japan; H. Asai, Shizuoka University, Hamamatsu, Japan Analytical and Numerical Simulation Models for Cal-culating EMI into Circuits Due to ESD Radiated Fields [ 4:30-5:00 ]S. Caniggia, EMC Consultant, Milano, Italy F. Maradei, Sapienza Università di Roma, Rome, Italy


BOOTH 532


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A Comparison of Electric Field Sensor Distortion Char-acteristics in the Hermite-Gauss Signal Subspaces [ 5:00-5:30 ]S. Saboktakin Rizi and B. Kordi, University of Manitoba, Win-nipeg, Canada

Sponsored by TC9

Special Session: Signal Integrity for High Speed ConnectorsWED-PM-5 | ROOM 103B

Chair: Dr. Howard Johnson, Signal Consulting Inc., Twisp, WA, USA

High-Speed Backplane Connectors [ 1:30-2:00 ]H. W. Johnson, Signal Consulting Inc., Washington, USA

Multiport VNA Measurement Uncertainty - Signal Integrity Applications [ 2:00-2:30 ]B. D. Grossman and J.M. Peterson, Intel Corporation, Oregon, USAJ. L. Torres, Intel Corporation, Arizona, USA

Benefits of Reversing the Circuit Manufacturing and As-sembly Processes for Electronic Products [ 2:30-3:00 ]J. C. Fjelstad, Verdant Electronics, California, USA

Panel Discussion [ 3:30-5:00 ]

Special Session: EMC in SpaceWED-PM-6 | Room 103C

Co-Chair: Ray Perez, Jet Propulsion Laboratory, Pasadena, CA, USA Co-Chair: James Lukash, Lockheed Martin, Sunnyvale, CA, USA

Design and Development of an Equipotential Voltage Reference (Grounding) System for a Low-Cost Rapid-Development Modular Spacecraft Architecture [ 1:30-2:00 ]J. A. Lukash, Lockheed Martin Space Systems, Sunnyvale, CA, USA E. T. Daley, NASA Ames Research Center, Moffet Field, CA, USA

An Electromagnetic Modeling Tool for Radio Frequency Interference Caused by Plasma Plumes [ 2:00-2:30 ]M. Bandinelli and L. Pandolfo, IDS Ingegneria dei Sistemi, Pisa, Italy; J. Araque Quijano and G. Vecchi, Polytechnic of Turin, Turin, Italy; H. Pawlak, OHB-System AG, Bremen, Germany; F. Marliani, European Space Agency, Noordwijk, Netherlands

EMI/EMC, Lightning, Radiation Shielding Design Ap-

proach for the Dragon COTS Spacecraft: Part I [ 2:30-3:00 ]W. Elkman, J. Trinh, P. McCaughey, and W. Chen, Space Exploration Technologies, Hawthorne, CA, USA

EMI/EMC, Lightning, Radiation Shielding Design Ap-proach for the Dragon COTS Spacecraft: Part II [ 3:30-4:00 ]W. Elkman, J. Trinh, P. McCaughey, and W. Chen, Space Exploration Technologies, Hawthorne, CA, USA

Geosynchronous ESD Environment Characterization via in situ Measurements on Host Spacecraft [ 4:00-4:30 ]J. J. Likar, A. L. Bogorad, R. E. Lombardi, and R. Herschitz, Lockheed Martin Space Systems, Newtown, PA, USA D. Pitchford, SES Engineering, Luxembourg, Luxembourg

Solar Radio Burst Effects on Wireless Systems [ 4:30-5:00 ]D. E. Gary, New Jersey Institute of Technology, Newark, NJ, USA


Special Event


Special Event

SpecialEvent

Signal Integrity for High Speed Connectors

Dr. Howard Johnson will chair and present in a Special Session on signal integrity. Dr. Johnson, an expert in signal integrity with over 30 years experi-ence, is the author of “High-Speed Digital Design: A Handbook of Black Magic.” Interference Technology asked Dr. Johnson for the scoop on his session.

In short: Are your connectors and packages driving you crazy? This session discusses state-of-the-art in electrical interconnec-tions, some reasons why it’s as bad as it is, and what we can do about it in the future.

The problem: Failure of industry to shrink PC boards. People experience a lot of pain in this area. The performance of connectors used to be so much better; you just plugged it in and no problem. But ramped-up speed exposed poor performance of connectors at high speeds.

The solution: Connectors need to be 10 to 100 times smaller. If you shrink it, it goes faster.

The rundown: Brent Grossman of Intel Corporation will discuss signal integrity applications of multiport VNA measurement un-certainty, followed by Dr. Johnson's talk on high-speed backplane connectors. Joe Fjelstad of Verdant Electronics will wrap up with a presentation on the benefits of reversing the circuit manufacturing and assembly processes for electronic products. After the break, Dr. Johnson hopes to reconvene for a panel discussion.

Spotlight On


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THURSDAY INCLUDES:*

Workshops / Tutorials• Reverberation

• Electromagnetic Band Gap Filters

• EMC in Circuits and Devices

• Electrostatic Discharge 2

• Information Leakage

• Special Session: Full Channel Char-acterization and Link Path Analysis for High-Speed Interconnect

• Special Session: EMC in Space


• PCB Simulations

• Information Leakage

• EMC Environment

• EMC Management


Exhibitor Hall Open

Meetings (Page 63)

• Technical Advisory Committee (TAC) #2



• Awards Luncheon

Companion Program• Santa Monica Famous Fun (Page 81)

* All events are subject to change.Check www.emc2011.org and the Registration Area daily for updates.

ReverberationTH-AM-1 | ROOM 101A

Chair: Diane Kempf, Naval Air Warfare Center Aircraft Division, Patuxent River, MD, USA

Impact of Statistical Parameter Options on Reverberation Chamber Test Environment [ 8:30-9:00 ]V. Rajamani, Oklahoma State University, Stillwater, OK, USA G. Freyer, Consultant, Monument, CO, USA The Reverberation Chamber’s Unstirred Field: A Validation of the Image Theory Interpretation [ 9:00-9:30 ]R. J. Pirkl, J. M. Ladbury, and K. A. Remley, NIST, Boulder, CO, USA Simulating MIMO Techniques in a Reverberation Chamber [ 9:30-10:00 ]K. A. Remley, H. Fielitz, H. A. Shah, and C. L. Holloway, NIST, Boulder, CO, USA Statistical Distributions of the Re-Radiated Spectrum from Two Cor-related Non-Linear Devices in a Reverberation Chamber [ 10:30-11:00 ]C. Jiaqi, A. Marvin, I. Flintoft, and J. Dawson, University of York, York, United Kingdom Influence of Apertures on the Electromagnetic Field Behavior Within Aeronautical Metallic Halls used as Reverberation Chambers [ 11:00-11:30 ]G. Andrieu and A. Reineix, Xlim Laboratory, Limoges, France F. Tristant, Dassault Aviation, Saint-Cloud, France Fabrics SE Measurements in a Reverberation Chamber by an Apertured TEM Cell and by a Small Nested Reverberation Chamber [ 11:30-Noon ]M. R. Pocai, EMC Consultant, Pisa, Italy; I. Dotto, CISAM - Centro Interforze Studi per le Applicazioni Militari, San Piero a Grado, Italy; D. G. Festa, IBD International Business Development, Chiari, Italy

Sponsored by TC2

Electromagnetic Band Gap FiltersTH-AM-2 | ROOM 101B

Co-Chair: Tzong-Lin Wu, National University of Taiwan, Taiwan Co-Chair: Francesco De Paulis, University of L’Aquila, L’Aquila, Italy

Analysis and Design of GHz Power Noise Isolation Using 45° Rotated Photonic Crystal Fence [ 8:30-9:00 ]A. Ciccomancini, CST, Framingham, MA, USA; A. Orlandi, University of L’Aquila, L’Aquila, Italy; T. Wu and T. Wang, National Taiwan University, Taipei, Taiwan Compact Configuration of a planar EBG Based CM Filter and Crosstalk Analysis [ 9:00-9:30 ]F. de Paulis, L. Raimondo, and A. Orlandi, University of L’Aquila, L’Aquila, Italy; B. Archambeault and S. Connor, IBM Corporation, Research Triangle Park, NC, USA Noise Isolation Modeling of Partial EBG Power Bus using Segmentation Method and Cavity Model in Multi-layer PCBs [ 9:30-10:00 ]M. Kim, K. Koo, and J. Kim, KAIST, Daejeon, Republic of Korea Bandwidth-Enhanced EBG Structure for Power Noise Suppression in 60 GHz RF SiP [ 10:30-11:00 ]


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C. D. Wang and T. L. Wu, National Taiwan University, Taipei A Novel and Cost-effective Method to Suppress GHz Common-mode Radiation for Slot-crossing Differential Lines [ 11:00-11:30 ] H. Chuang and T. Wu, National Taiwan University, Taipei

Sponsored by TC10

EMC in Circuits and DevicesTH-AM-3 | ROOM 102BC

Co-Chairs: Philip Keebler, EPRI, Knoxville, TN, USA; and Randy Flinders, RTF Compliance, Orange County, CA, USA

A Fast Analysis of Electromagnetic Immunity Responses of RF Amplifier Circuit under CW/Digital-Modulation Schemes [ 8:30-9:00 ]H. Hsieh, C. Wang, and C. Chen, National Taiwan University, Taipei, Taiwan; J. Chen, Bureau of Standards, Metrology & Inspection, Taipei, Taiwan; C. Chiu, Da-Yeh University, Chan-ghua, Taiwan; M. Lin, National Yunlin University of Science and Technology, Yunlin, Taiwan

EMC Problems of Power Electronic Converters [ 9:30-10 ]P. Drabek, West Bohemia University, Pilsen, Czech Republic Numerical and Metrological Investigations for Pacemak-ers with Unipolar and Bipolar Electrodes in Electric and Magnetic Fields [ 10:30-11:00 ]S. Hille and K. F. Eichhorn, HTWK Leipzig, Leipzig, Germany K. H. Gonschorek, TU Dresden, Dresden, Germany Detect VR Noise Coupling Sources through Near Field Scanning [ 11:00-11:30 ]X. Ye and A. Luoh, Intel Corporation, Hillsboro, OR, USA

Sponsored by TC4

Electrostatic Discharge 2TH-AM-4 | ROOM 103A

Co-Chair: Dr. William Radasky, Metatech Corporation, Goleta, CA, USA Co-Chair: Mr. Michael McInerney, U.S. Army Corps of Engineers, Champaign, IL, USA

Can Intentional Electric Discharges Be Used for Hp.m. Protection? [ 8:30-9:00 ]* Nominated for Best Symposium Paper Award M. G Bäckström, Combitech AB, Linköping, Sweden

http://www.retlif.com


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U. Jordan, Swedish Defense Research Agency FOI, Linköping, Sweden D. G. Andersson, Chalmers University of Technology, Göte-borg, Sweden A. V. Kim, Institute of Applied Physics, Nizhny Novgorod, Russian Federation M. Lisak, Chalmers University of Technology, GöteborgO. Lundén, Swedish Defense Research Agency FOI Induced Currents on Electric Detonators for Improvised Explosive Device Pre-Detonation [ 9:00-9:30 ]J. Galuga and J. R. Bray, Royal Military College of Canada, Kingston, Canada

Sponsored by TC5

Information LeakageTH-AM-4 | ROOM 103A

Co-Chairs: Dr. Tetsuya Tominaga, NTT Corporation, Tokyo, Japan; and Dr. William Radasky, Metatech Corporation, Go-leta, CA, USA Non-Invasive EMI-Based Fault Injection Attack against Cryptographic Modules [ 10:30-11:00 ] * Nominated for Best Symposium Paper Award Y. Hayashi, N. Homma, T. Sugawara, T. Mizuki, T. Aoki, and H. Sone, Tohoku University, Sendai, Japan Practical Results of EM Cartography on a FPGA-based RSA Hardware Implementation [ 11:00-11:30 ]L. Sauvage, S. Guilley, and J. Danger, Institut Télécom, Télé-com ParisTech, Paris, France N. Homma and Y. Hayashi, Tohoku University, Miyagi, Japan Identification of Information Leakage Points on a Cryp-tographic Device with an RSA Processor [ 11:30-Noon ]O. Meynard, S. Guilley, and J. Danger, Telecom-ParisTech, COMELEC, Paris, France Y. Hayashi and N. Homma, Tohoku University, Sendai, Japan

Sponsored by TC5

Special Session: Full Channel Characterization and Link Path Analysis for High-Speed InterconnectTH-AM-5 | ROOM 103

Co-Chair: Dr. Zhiping Yang, Cisco Systems, San Jose, CA, USA Co-Chair: Amy Chen, Intel Corporation, Santa Clara, CA, USA High Speed Differential I/O Overview and Design Chal-lenges on Intel Enterprise Server Platforms [ 8:30-9:00 ] B. Lee and M. Mazumder, Intel Corporation, Santa Clara, CA R. Mellitz, Intel Corporation, Columbia, SC, USA Signal Transition Structure Optimization for 16 Gbps SFP Cage and PCB Interface [ 9:00-9:30 ]J. Zhang, J. Lim, K. Qiu, and R. Brooks, Cisco Systems Inc., San Jose, CA, USA H. Wang, Missouri University of Science and Technology,

Rolla, MO, USA B. Chen, Yangtze Delta Region Institute of Tsinghua University, JiaXing, China Intentional and Unintentional Far End Crosstalk Cancel-lation in High Speed Differential Link [ 9:30-10:00 ]X. Ye, Intel Corporation, Hillsboro, OR, USA Statistical Link Analysis and In-Situ Characterization of High-Speed Memory Bus in 3-D Package Systems [ 10:30-11:00 ]K. Oh, S. Chang, J. Ren, L. Yang, H. Lan, C. Madden, and R. Schmitt, Rambus Inc., Sunnyvale, CA, USA Full Link Impedance Optimization for Serial IOs [ 11-11:30 ]C. Ye and X. Ye, Intel, Dupont, WA, USA E. Vargas and O. Argueta, Intel Tecnologia de Mexico SA de CV, Tlaquepaque, Mexico 25 Gbps Backplane Links Frequency and Time Domain Characterization - Correlation Study Between Test and Full-wave 3D EM Field Simulation [ 11:30-Noon ]P. Amleshi and V. Shah, Molex Inc., Lisle, IL, USA Z. Yang, Cisco Systems Inc., San Jose, CA, USA J. Mohan and T. Mukherjee, National Semiconductor Corp., Santa Clara, CA, USA

Sponsored by TC5

morning sessions | 8:30 am-noonTIPS FROM The Locals

Michelle BranumService Advisor, CKC Laboratories, Inc.Brea, Calif.

Place I call home Chino Hills, Calif. Years spent living in California 26. Must-see attractions Aquarium of the Pacific, The Queen Mary and Harbor Breeze Yacht Charters and Cruises are all conveniently located in Long Beach. Family-

friendly activities L.A. Zoo and amusement parks such as Disneyland, Knott’s Berry Farm and Universal Studios Hollywood. Best celebrity spottings Several sports stars (Mark Sanchez, Troy Polamalu and John Wooden to name a few) have been spot-ted at a restaurant called Phil Trani’s located on Long Beach Blvd. There is also a restaurant called The Ivy located in Los Angeles on Robertson Blvd. that is known for its celebrity sightings and the paparazzi. Favorite outdoor recreation Shoreline Pedestrian/Bikepath in Long Beach is an open (and free) area to walk, jog, skate and bike. Best view: Hilltop Park located in Signal Hill, Calif. offers spectacular views of Long Beach. Griffith Observatory and Park offer stunning views of Los Angeles and the Hollywood sign. Best entertainment venues: Gibson Amphitheater, The Greek Theater, Staples Center, Nokia Theatre, Honda Center, Anaheim Stadium, Dodger Stadium.

See Pages 86 for details on Knott's Berry Farm.


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Special Session: EMC in Space TH-AM-6 | ROOM 103C

Co-Chair: Ray Perez, Jet Propulsion Laboratory, Pasadena, CA, USA Co-Chair: James Lukash, Lockheed Martin, Sunnyvale, CA, USA

Crew Quarters and Electromagnetic Interference Mea-surement Facility Combined Impedance Study [ 8:30-9:00 ]R. Scully, NASA, Houston, TX, USA Tailoring MIL-STD-464A and MIL-STD-461F Requirements for Space Systems Applications [ 9:00-9:30 ]D. Brumbaugh, The Boeing Company, Seattle, WA, USAJ. Chott, Orbital Sciences Corporation, Gilbert, AZ, USA K. Javor, EMC Compliance, Huntsville, AL, USA J. A. Lukash, Lockheed Martin Space Systems CompanyFalcon 9 and Dragon Spacecraft Lightning and Tribo-Electric Charging Design and Protection Approach [ 9:30-10:00 ]W. Elkman, J. Trinh, P. McCaughey, and W. Chen, Space Exploration Technologies, Hawthorne, CA, USA Experimental Measurement of the Response of a Twisted-Wire Pair Exposed to a Plane-Wave Field [ 10:30-11:00 ]G. Spadacini and S. A. Pignari, Politec-nico di Milano, Milan, Italy F. Marliani, European Space Agency (ESA, ESTEC), Noordwijk, Netherlands Prediction of DC Magnetic Fields for Magnetic Cleanliness on Spacecraft [ 11:00-11:30 ]A. Junge and F. Marliani, ESA, Noord-wijk, Netherlands Controlling Low Frequency Interfer-ence from Direct Energy Transfer Spacecraft Power Systems [ 11:30-Noon ]K. E. Blackburn and B. J. Lessard, Lock-heed Martin Space Systems, Denver, CO, USA; D. L. Kirchner and W. S. Kurth, University of Iowa, Iowa City, IA, USA

ImmunityTH-PM-1 | ROOM 101A

Co-Chair: Galen Koepke, NIST, Boulder, CO, USACo-Chair: Ghery Pettit, Intel Corporation, DuPont, WA, USA

20V-High Speed Low Cost Arbitrary Waveform Generator for ICs Immunity Test [ 2:30-3:00 ]X. Gao, T. Li, N. B. Mentesana, Z. Yu, A. Y. Gafarov, L. Ren, H. An, and

D. Pommerenke, Missouri University of Science and Technol-ogy, Rolla, MO, USA A Method to Determine the Injected Real Power into an IC Pin in Case of a Conducted Immunity EMC Test [ 3:00-3:30 ]M. Frick and R. Eidher, Robert Bosch GmbH, Reutlingen, Germany R. Weigel, Friedrich-Alexander-University of Erlangen-Nurem-berg, Erlangen, Germany Low-Frequency Characterization of Composite Panels from a Near-Field Magnetic Shielding Effectiveness Mea-surement [ 4:00-4:30 ]G. Andrieu and A. Reineix, Xlim Laboratory, Limoges, France J. Panh, CNES, Toulouse, France P. Pelissou, Astrium EADS, Toulouse, France C. Girard, Axessim, Strasbourg, France X. Romeuf, Esa-Estec, Noordwijk, Netherlands Fast and Accurate Radiated Susceptibility Testing by Us-ing the Reverberation Chamber [ 4:30-5:00 ]* Nominated for Best Symposium Paper Award M. Höijer, Swedish Defence Research Agency FOI, SE-581 11 Linköping, Sweden

aFternoon sessions | 2:30 Pm-5:30 Pm

BooTH 445

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System Throughput and Immunity Analysis of a 802.11n WLAN in a Large Reverberation Chamber [ 5:00-5:30 ]V. Mariani Primiani and F. Moglie, Università Politecnica delle Marche, Ancona, Italy

Sponsored by TC2

Signal Integrity 5TH-PM-2 | ROOM 101B

Co-Chair: Giulio Antonini, Univeirsity of L’Aquila, L’Aqilia, ItalyCo-Chair: Al Ruehli, Missouri University of Science and Tech-nology, Rolla, MO, USA Pseudo-Balanced Signaling Using Power Transmission Lines for Parallel Links [ 2:30-3:00 ]S. Huh, M. Swaminathan, and D. Keezer, Georgia Institute of Technology, Atlanta, GA, USA A Passive Analytical Per-Unit-Length Internal Imped-ance Matrix Model for Multiconductor Interconnections [ 3:00-3:30 ]F. Broyde and E. Clavelier, Tekcem, Maule, France A Novel Imaging Method for the Impedance Calculation of Power and Ground Planes [ 4:00-4:30 ]

* Nominated for Best Symposium Paper Award D. Yang, X. Wei, and E. Li, Zhejiang University, HangZhou, China A Novel Common Mode Choke and Its Application for 5 Gbps USB 3.0 [ 4:30-5:00 ]* Nominated for Best Symposium Paper Award C. Tsai, J. Hsu, L. Ao Ieong, and T. Wu, National Taiwan Uni-versity, Taipei, Taiwan

Sponsored by TC10

PCB SimulationsTH-PM-3 | ROOM 102BC

Co-Chairs: Jun Fan, Missouri University of Science and Tech-nology, Rolla, MO, USA; and Marina Koledintseva, Missouri University of Science and Technology, Rolla, MO, USA

The Convolutional PML For FDTD Analysis: Transient Electromagnetic Absorption from DC to Daylight [ 2:30-3 ]J. A. Roden and T. C. Kramer, The Aerospace Corporation, Chantilly, VA, USA Analysis of Via Impedance Variations with a Polynomial Chaos Method [ 3:00-3:30 ]J. Shen and J. Chen, University of Houston, Houston, TX, USA H. Wang and J. Fan, Missouri University of Science and Tech-nology, Rolla, MO, USA

Minimizing the Number of Basis Functions in Chip-Package Co-Simulation Using Lauerre-FDTD [ 4:00-4:30 ]M. Ha and M. Swaminathan, Georgia Institute of Technology, Atlanta, GA, USA Application of Integrated Transmission Line Modeling and Behavioral Modeling on Electromagnetic Immunity Synthesis [ 4:30-5:00 ] X. Gao, E. Chua, and E. Li, Institute of High Performance Computing, Singapore, Singapore Equivalent Circuit Model Order Reduction by Real-Coefficient AFS [ 5:00-5:30 ]S. Kahng, University of Incheon, Incheon, Republic of Korea R. Mittra, Pennsylvania State University, State College, PA

Sponsored by TC9

Information LeakageTH-PM-4 | ROOM 103A

Co-Chairs: Dr. Tetsuya Tominaga, NTT Corporation, Tokyo, Japan; and Dr. William Radasky, Metatech Corporation, Goleta, CA, USA

Suppression of Information Leakage from Electronic Devices Based on SNR [ 2:30-3:00 ]T. Ikematsu, Y. Hayashi, T. Mizuki, N. Homma, T. Aoki, and H. Sone, Tohoku University, Sendai, Japan On-Board Decoupling of Cryptographic FPGA to Improve Tolerance to Side-Channel Attacks [ 3:00-3:30 ]K. Iokibe, T. Amano, and Y. Toyota, Okayama University, Okayama, Japan Compromising Emanations of LCD TV Sets [ 4:00-4:30 ]

aFternoon sessions | 2:30-5:30 Pm

Wireless – Military – NEBS – Automotive

California | Texas | Maryland | N. Carolina | China | Korea | Taiwan

For a free project review: Email: [email protected] Toll Free: (877) 271-2296

Web: www.metlabs.com/EMCreview.aspx

We crack the tough nuts.

Specializing in EMC testing that other labs can’t do.

BOOTH 340


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M. G. Kuhn, University of Cambridge, Cambridge, United Kingdom Towards Large-scale EM-leakage Evaluation by means of Automated TOE Synchronization [ 4:30-5:00 ]T. Watanabe, Hitachi Ltd., Kokubunji-shi, Japan K. Franke, Gjovik University College, Gjovik, Norway H. Sako, Hitachi Ltd., Chiyoda-ku, Japan Estimation of Receivable Distance for Radiated Distur-bance Containing Information Signal from Information Technology Equipment [ 5:00-5:30 ]H. Sekiguchi, Osaka University, Suita, Japan S. Seto, Mitsubishi Electric Corp., Amagasaki, Japan

EMC Environment TH-PM-5 | ROOM 103B

Chair: Fred Heather, US Navy, Washington, D.C., USA

Hazards of Electromagnetic Radiation to Ordnance (HERO) assessment of Electro-Explosive Devices and Validation of Extrapolation Method for Estimation of the Safety Margin at HERO Electromagnetic Environments [ 2:30-3:00 ] R. Kichouliya, D. Thikkala, V. V. Ramasarma, D. S. Reddy, and V. G. Borkar, Research Centre Imarat (DRDO), Hyder-abad, India “Good-but-Imperfect" Electromagnetic Reverberation in a VIRC [ 3:00-3:30 ]R. Serra, University of Twente, Enschede, Netherlands F. Leferink, Thales Nederland B.V., Hengelo, Netherlands F. Canavero, Politecnico di Torino, Turin, Italy Industrial Environment Characterization for Future M2M Applications [ 4:00-4:30 ]J. Chilo, Center for RF Measurement Technology, University of Gävle, Gävle, Sweden J. Ferrer Coll, KTH, Stockholm, Sweden P. Angskog, Swedish Defense Research Agency, Linköping, Sweden Effect on Digital TV of Disturbances from Electrical Equip-ment Evaluated Using an Actual Broadcasting Signal [ 4:30-5:00 ]N. Kuwabara, S. Yanagi, and H. Miyake, Kyushu Institute of Technology, Kitakyushu, Japan Empirical Estimation of Probability Distribution for Electric Field Strength in Automotive Cabin [ 5:00-5:30 ]N. Maeda and S. Fukui, Nippon Soken, Inc., Nishio, Japan N. Ishihara and T. Naito, Toyota Motor Corporation, Toyota, Japan

Sponsored by TC3

aFternoon sessions | 2:30-5:30 Pm EMC Management TH-PM-6 | ROOM 103C

Co-Chairs: Kimball Williams, Denso International America, Southfield, MI, USA; and Doug Kramer, Rockwell-Collins, Cedar Rapids, NE, USA

The Education of EMC - The Strategy and Teaching Over-view at the UWB [ 2:30-3:00 ]P. Drabek and V. Kus, West Bohemia University, Pilsen, Czech Republic Managing Engineers for Success [ 3:00-3:30 ]S. W. Mee, Johnson Controls, Cergy, France J. E. Teune, Gentex Corporation, Zeeland, MI, USA Opportunities in the Risk Management of EMC [ 4:00-4:30 ]K. Armstrong, Cherry Clough Consultants Ltd, Stafford, UK Estimation of Standards Compliance Uncertainty for Radi-ated Emission Measurement in the PT Program [ 4:30-5:00 ]K. Osabe and T. Kato, Voluntary EMC Laboratory Accreditation Center Inc., Tokyo, Japan Developing Immunity Testing to Cover Intermodulation [ 5:00-5:30 ]K. Armstrong, Cherry Clough Consultants Ltd, Stafford, UK W. Grommes, Independent Consultant, Niederkassel, Germany

Sponsored by TC1

BOOTH 623

http://www.intermark-usa.com

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EMC Leadership TrainingFR-AM-1 | Half-day Tutorial | Room 103C

Chair: Kimball Williams, Denso Americas International, MI, USACo-Chair: Doug Kramer, NCEE Labs, NE, USA

AbstractSufficient training in the ‘soft skills’ is often lacking in the curricula of engineers. The industry approach of ‘sink or swim’ can be harsh. This session will provide opportunities to learn or brush up on critical communications and business skills necessary for career success as an engineer in today’s market.

Speakers and Topics

Effective Memos and Reports [ 8:30-9:30 ]Robert Scully, NASA, Houston, TX, USA Networking Skills [ 9:30-10:00 ]Dan Hoolihan, Hoolihan EMC Consulting, MN, USA Effective Presentations [ 10:30-11:15 ]Bruce Archambeault, IBM, NC, USA Effective Meetings [ 11:15-Noon ]John LaSalle, Northrop Grumman Corporation, Bethpage, NY, USA

Sponsored by TC1

Transportation System EMCFR-AM-2 | Full-day Workshop | Room 101B

Chair: Mark Steffka, University of Michigan, MI, USA

AbstractThe global shift towards the engineering of efficient and manufacturable electric propulsion systems will result in new challenges in meeting trans-portation system EMC requirements in order to assure customer satisfac-tion and safety, meet legal requirements, or support mission performance goals. Much of the existing methods to address EMC of motor drives (primarily conducted and radiated emissions) are based upon "legacy" low voltage components and systems. The high voltage (typically 300 to 600 volts) and high current (hundreds of amps peak demand) in propulsion systems will require new analytical approaches, test methods, and effec-tive use of simulation/modeling. This workshop will also discuss the de-velopment of electric motors from "small scale" to large drive motors, the mechanical constraints of motor EMC compliance, guaranteeing the EMC integrity of the propulsion mechanisms and their control systems, systems integration methods of today, and possible solutions for the future.

Speakers and Topics

Modeling of System Level EMC Issues in the Transportation Industry David Johns, CST of America, Framingham, MA, USA EMC Aspects of Railway Systems David Turner, Turner Engineering Corporation, Venice, CA, USA EMC Design Practices for Aircraft Systems Tom Jerse, The Citadel, Charleston, SC, USA

morning SeSSionS | 8:30 am - noon

FRIDAY INCLUDES:*

Workshops/Tutorials• EMC Leadership Training

• Transportation System EMC

• Basic EMC Measurements

• Advanced Antenna and Probe Topics

• EMC and Wireless Devices

• EMC Consultant's Toolkit

• Relationships between Transfer Impedance and Shielding Effectiveness

• Predicting Cosite Interference

Other Events• iNARTE Certification Examination (Page 60)

Meetings• SC3 Transportation System EMC (Page 63)

Social Events• Jet Propulsion Laboratory (JPL) Technical Tour (Page 79)

Tours• Getty Museum Architectural Tour (Page 81)

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Automotive EMC Testing — The Challenges of Testing Battery Systems for Electric and Hybrid Vehicles: Part 1 — Defining the Test Methodology Using System Engi-neering James Muccioli, Jastech EMC Consulting LLC, Plymouth, MI Automotive EMC Testing — The Challenges of Testing Battery Systems for Electric and Hybrid Vehicles: Part 2 — Test Laboratory Practical ImplementationDale Sanders, TUV America EMC Testing; Jastech EMC Consulting, Plymouth, MI, USA Automotive Component EMC Testing: CISPR 25, ISO 11452-2 and Equivalent Standards Vince Rodriguez, ETS-Lindgren, Cedar Park, TX, USA

Sponsored by SC3

Basic EMC MeasurementsFR-AM-3 | Half-day Tutorial | Room 102BC

Chair: Don Heirman, Don HEIRMAN Consultants, Lincroft, NJ

AbstractThis tutorial will be an introduction to basic EMC measure-

ments with primary focus on emission testing and consider-ations for immunity testing. The latest activity in national and international standards related to EMC measurements and application will be presented including activity above 1 GHz, what to expect from an EMC test lab, and measurement un-certainty. Where possible, attendees will be asked questions as to what they learned and have an opportunity for extended questioning of the speakers’ subjects at the end of the session.

Speakers and Topics

Emission Measurements for Tabletop Equipment [ 8:30-8:50 ]Steve Koster, Washington Labs, Gaithersburg, MD, USA Emission Measurements for Floor-Standing Equipment [ 8:50-9:10 ]H. R. (Bob) Hofmann, Hofmann EMC Engineering, Naperville, IL, USA IEC Transient-Immunity Testing Overview [ 9:10-9:30 ]Thomas E. Braxton, Braxton EMC Consulting, Niles, IL, USA Immunity to Continuous RF Disturbances [ 9:30-10 ] John Maas, IBM Corporation, Rochester, MN, USA

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Basic Measurement Sites, Methods and Associated Errors [ 10:30-11:00 ]Don Heirman, Don HEIRMAN Consultants, Lincroft, NJ Selecting a Quality Lab [ 11:00-11:30 ]Daniel D. Hoolihan, Hoolihan EMC Consulting, Lindstrom, MN Uncertainty Considerations in Stating Pass/Fail [ 11:30-Noon ]Don Heirman, Don HEIRMAN Consultants, Lincroft, NJ

Sponsored by TC2

Advanced Antenna and Probe Topics FR-AM-4 | Half-day Tutorial | Room 101A

Chair: Zhong Chen, ETS-Lindgren, Cedar Park, TX, USACo-Chair: Janet O’Neil, ETS-Lindgren, Sammamish, WA

AbstractThis tutorial covers application specific and advanced topics on the usages of antennas and probes for EMC measure-ments. Emphases will be given to appropriate applications of antenna factors and probe correction factors to achieve low measurement uncertainties. Other topics include calibration of field probes for complex signals, such as multi-tone, digital and pulsed waves, and calibration challenges and techniques for frequencies up to 300 GHz. Time domain methods used for antenna calibrations and test site validations will also be dis-cussed. Technical experts will share with tutorial participants physical insights on how and why time domain techniques can improve measurement efficiency and accuracy in antenna calibrations and site validation measurements.

Speakers and Topics

Introduction to Antennas and Pattern Parameters Vince Rodriguez, ETS-Lindgren, Cedar Park, TX, USA Time-Domain Analysis and Use of Antennas for EMC Dennis Camell, National Institute of Standards and Technol-ogy (NIST), Boulder, CO, USA Applying Calibration Factors for Electric Field Probes Zhong Chen, ETS-Lindgren, Cedar Park, TX, USA

EMC and Wireless DevicesFR-AM-5 | Half-day Tutorial | Room 103A

Chair: Dan Hoolihan, Hoolihan EMC Consulting, Lindstrom, MN, USA

AbstractThe overall tutorial will provide key information on EMC con-cerns as they pertain to present and future wireless/smart phone technologies and associated packaging issues. More specifically, this tutorial will address the electromagnetic interference (EMI) aspects of the proliferation of modern wireless devices such as current radio and smart-phone


technologies. It will address both EMI from product to prod-uct such as cellular phones and lap-top computers as well as intra-product interference issues.Topics to be discussed will include:• Radio Frequency Interference: The Problem and Its

Scope• EMI for Unlicensed Cell and Wireless Transmitters• Structure of RFI Source Signals• The Impact Performance Improvements (Smart Phones)

on RFI

Speakers and Topics

Wireless EMC Tutorial Presentation [ 8:30-9:15 ]Harry Skinner, Intel, Hillsboro, OR, USA Package RF Interference [ 9:15-10:00 ]Kevin Slattery, Intel, Hillsboro, OR, USA Intra-System EMI: Characterization and Modeling [ 10:30-11:15 ]Jun Fan, University of Science and Technology, Rolla, MORound-Table Discussion [ 11:15-Noon ]

Sponsored by TC1


Dan ReederManager, Corporate Communications, Wyle LaboratoriesEl Segundo, Calif.

Places I call home La Mirada & Lomita, Calif. Years spent living in

California All of them. I’m a lifelong resident of Southern California and got my degree from Long Beach State University. Must-see attraction Hollywood (Sunset Strip). Best celebrity spottings Anne Heche, Peter McNicol, A.J. Cook and Tiger Woods at the Starbucks on Rose-crans in El Segundo a couple times. Family-friendly activities

The beach or the museums. Favorite outdoor recreation Golf. Entertainment venues Staples Center, Dodgers Stadium, Honda Center, Anaheim Stadium and the Nokia. Place to eat

Balboa Island, Calif. Best view: Atop Palos Verdes (either looking at Catalina during the day or at the Los Angeles basins at night). Hidden gem The original Art Deco bar in the bow of the Queen Mary in Long Beach. If you really want to step back in time to the 1930s, have a cocktail in the bar. Priceless.

See Page 78 for details on the Gala Evening Event on the Queen Mary.

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afTernoon SeSSionS | 1:30 Pm - 5:30 Pm

EMC Consultant’s ToolkitFR-PM-1 | Half-day Workshop | Room 102BC

Chair: Jerry Meyerhoff, JDM Labs LLC, IL, USA

Abstract

As more engineering and design firms outsource and reduce staff, more qualified EMC engineers are finding themselves “homeless.” On the other hand, there are hundreds of companies that do not have the resources to hire a full-time EMC engineer. The purpose of this workshop is to provide an introduction to the technical, business and marketing skills to interested EMC engineers so that they can successfully locate, market and provide effective services to these companies at a fair profit and with job satisfaction.

Topics to be addressed include practical tools and skills in the following areas: EMC troubleshooting and applying fixes; precompliance testing at the designer’s bench or on-site; new and low-cost troubleshooting tools & equipment; how to use social media marketing (such as LinkedIn and Twitter); networking practices; advertising; setting up your office; pricing your services; tracking your time; best business practices; how to present yourself professionally; tax & legal obligations and other issues (such as how to review contracts and non-disclosure agreements).


Marketing Yourself as a Consultant

Speaker: Jerry Meyerhoff, Principal of JDM LABS LLC

In short: With more than three decades of experi-ence in automotive, industrial, and commercial manufacturing applications, Meyerhoff offers

extensive knowledge in the design and control of RF and EMC effects in analog systems, digital systems, and motors.

Contact: [email protected]

Practical EMC Troubleshooting and Measurements, Plus Use of Social MediaSpeaker: Kenneth Wyatt, Senior EMC Engineer, Wyatt Technical Services, LLC

Sneak Peek: Wyatt will present practical DIY and low-cost tools for EMC troubleshooting

and pre-compliance testing. One highlight will be a demonstration of a low-cost spectrum analyzer anyone can afford. He'll wrap up by describ-ing how to add value to your website and will cover the basics of social networking using LinkedIn and Twitter and how that helps attract clients to his consulting business.

In short: A prolific author and presenter, he has written or presented topics including RF amplifier design, RF network analysis software, EMC design of products and use of harmonic comb generators for predicting shielding effectiveness.

Contact: www.emc-seminars.com

Consulting War Stories

Speaker: Henry Ott, President, Henry Ott Consultants

In short: Prior to starting his own consulting company, Ott worked for AT&T Bell Labo-ratories (now Alcatel-Lucent) for 30 years,

where he worked on projects relating to missile guidance systems, nuclear effects instrumentation, analog and digital tape recorders, telephone transmission and signaling systems, microprocessors, and acted as a consultant on Electromagnetic Compatibility. He is the author of two books.

Contact: www.hottconsultants.com

Presenting Yourself Professionally Speaker: Patrick André, Principal Consultant, André Consulting Inc.

Sneak Peek: What does it take to go from just another guy at a desk to highly respected consultant? Knowledge and experience

helps. However, much depends on perception and appearance. There are unspoken cues your clients will tune into that take your words and concepts from “just another opinion” to authoritative and respected. Several concepts will be shared from your company setup, to business cards, and much more.

Background: André has worked in the military and aerospace en-vironment for more than 25 years, and worked in the commercial electronics environment for the last 16. André has a strong ability in the test and measurement area of EMC.

Contact: http://andreconsulting.com/

So, You Want to be a Consultant?Speaker: Daryl Gerke, Kimmel Gerke Associates

Background: Daryl received his BSEE from the University of Nebraska, and has worked in the electronics industry for over

40 years. His experience ranges from product and systems design to sales/application engineering and technical marketing with industry leaders such as Collins Radio, Sperry, Tektronix, and Intel. Since 1987, he has been involved exclusively with EMC engineering as a founding partner of Kimmel Gerke Associates, Ltd.

Contact: www.emiguru.com

Panel Discussion

Special Event


Special Event

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Transportation System EMC FR-PM-2 | Full-day Workshop| Room 101B

Chair: Mark Steffka, University of Michigan, Dearborn, MI, USASee FR-AM-2 for details

Sponsored by SC3

Relationships between Transfer Impedance and Shielding EffectivenessFR-PM-3 | Half-day Workshop | Room 103A

Chair: John G. Kraemer, Rockwell Collins, Inc, Cedar Rap-ids, IA, USA; Co-chair: Kermit O. Phipps, Analysis Measure-ment Sytems, Knoxville, TN, USA

AbstractThe question of which characteristic, surface transfer impedance or shielding effectiveness, should be used to solve EMC problems has been creating controversies since the middle of the last century. Shield-ing effectiveness, the ratio of the electric or magnetic fields at a point with and without the barrier in place (IEEE definition), was traditional. However, besides being only one of a number of definitions of shielding effectiveness, it seemed that one could get a range of results by choosing a definition that gave an answer that met the specifi-cation. In addition, one could make a few measurements at whatever frequency one desired and get a shielding effectiveness number, whether it was meaningful or not. There was no standard “shielding artifact” that could be used to establish the cred-ibility of the measurement. In the 1930s Shelkunoff introduced the concept of sur-face transfer impedance (the electric field - voltage - on the victim side of the shield due to a magnetic field - current - on the culprit side of the shield) for analyzing the shielding performance of cables. Special cable samples, with known characteris-tics, could be used to establish credibility. Unfortunately, surface transfer impedance measurements became more difficult and less meaningful as the frequencies of in-terest increased into the microwave region where the samples were electrically large. In addition, stirred mode chamber tech-niques have been developed that make shielding effectiveness measurements useful to the EMC engineer. Experience gained over the last decades has shown that each shielding characteristic has a place in EMC problem solving. In general, surface transfer impedance measures the electromagnetic shielding characteristics of electrically small components and systems like cables, connectors and shielding ma-

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terials. Stirred mode shielding effectiveness techniques mea-sure the shielding performance of electrically large systems, like enclosures. This workshop will introduce the concept of transfer impedance and how it may, and may not, be used to predict cable and EMI gasket shielding effectiveness. Methods of measuring transfer for cable-connector shielding systems and EMI gaskets will be discussed.


Relationships Between Surface Transfer Impedance and Shielding Effectiveness [ 1:30-2:00 ]K.O. Phipps, Analysis Measurement Systems, Knoxville, TN, USA and Lothar (Bud) Hoeft, Consultant, Albuquerque, NM, USA Transfer Impedance - Characterization of EMI Gaskets [ 2:00-2:30 ]R. J. Mohr, R. J. Mohr Associates, Inc., Norhtport, NY, USA Transfer Impedance of EMI Gaskets - Test Method per SAE, APR-1705 [ 2:30-3:00 ]G. M. Kunkel, Spira Manufacturing Corp., North Hollywood, CA, USA

TEM-cell and Bulk Current Injection Testing of Cable-Connector Shielding Systems [ 3:30-4:00 ] R. J. Hare and A. T. Bradley, NASA Langley Research Center, Langley, VA, USA Common Mode Noise from High Speed Differential Cable/Connector Systems [ 4:00-4:30 ]Bruce Archambeault, IBM, Durham, NC, USA Transfer Impedance Measurements vs. Shielding Effectiveness Measurements Using a Reverberation Chamber [ 4:30-5:00 ]Bruce Archambeault, IBM, Durham, NC, USA

Sponsored by TC4

Predicting Cosite Interference FR-PM-4 | Half-day Tutorial | Room 103C

Chair: Tom Jerse, The Citadel, SC, USA

AbstractThe ever rising demand for the wireless transmission of in-formation has made it increasingly attractive to place a large

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number of emitters and receivers on a single vehicle or tower. Suppressing interference between all possible combinations of these radios has stretched the limits of EMI control, and has made careful wideband system modeling and planning more vital than ever. This presentation will outline interference mechanisms and the models used to predict the close-range EMI between systems located on the same platform.

Speakers and Topics

Cosite Interference and Linear Modeling Methods Dr. Fred German, Delcross Techologies, Champaign, IL, USA Antenna-to-Antenna Coupling Prediction Robert Kipp, Delcross Technologies, Champaign, IL, USA Nonlinear Effects Dr. Thomas Jerse, The Citadel, Charleston, SC, USA Examples of Cosite Interference Modeling Dr. Fred German, Delcross Technologies, Champaign, IL, USA


Allie GerberMarketing Assistant, DNB Engineering, Inc. Fullerton, Calif.

Place I call home Fullerton, Calif.California credentials I’ve lived in southern California my whole life and received my business degree from Cal State University of Long Beach. Must-see attraction Griffith Observatory. Best

celebrity spotting Kevin Bacon at the Red O Mexican Res-taurant in Los Angeles. Family-friendly activities Aquarium of the Pacific in Long Beach, Disneyland and Universal Studios Hollywood. Favorite outdoor recreation Hanging out at the beautiful southern California beaches. Entertainment

venues Staples Center, Nokia Center, Dodgers Stadium, Angels Stadium of Anaheim, Honda Center. Place to eat The Stinking Rose in Beverly Hills.

See Page 85 for details on the Griffith Observatory.

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Tuesday, August 16 [ 9:30-11:30 ]

Improving EMC Test Productivity with Automated EMC Test SoftwarePresenter: Joe Tannehill, ETS-LindgrenAbstract: With increasingly shorter product cycle “time to market,” the need for increasingly efficient EMC testing becomes more urgent. There are many options available today for automated EMC test software that can greatly improve EMC test productivity. This dem-onstration will provide practical tips on how to evaluate the software available, how to utilize your existing test instrumentation, and how to generate reports. Simple steps will be shown to improve your pro-ductivity for emissions and immunity testing. Common pitfalls will be reviewed and suggestions will be provided for building your automated system incrementally to address budget constraints.

Effective 3D Full-Wave SimulationsPresenter: Alexander Razmadze, Missouri University of Sci-ence & TechnologyAbstract: There are powerful, mature, commercial 3D full-wave EM tools available in the market. Though, it’s still the engineer’s and scientist’s responsibility to use them in a meaningful fashion. This demonstration will cover several practical examples to show how 3D full-wave simulations can be employed effectively.

Tuesday, August 16 [ 2:00-4:00 ]

Hybrid MoM/MTL Approaches for the Calculation of EMC Problems of Complex SystemsPresenter: Dr. Roman Jobava, EMCoS Ltd.Abstract: We will demonstrate EMC modeling at component, equip-ment and complete system level for such complex systems like automobiles, aircrafts and ships. This will be done using a software package EMC Studio, which is based on hybridization of MoM with MTL approach combined with circuit simulations.

Modeling the Coupling to Cables in a 3D EnvironmentPresenter: Paul Duxbury, CST UKAbstract: In many applications, such as lightning strike as well as other EMC susceptibility and emission scenarios, it is necessary to include in the 3D model an accurate representation of the often complex cable bundles which can be both inside and outside of any shielding enclosure. Due to the large aspect ratio which can exist between the enclosures (typically meters) and the cross sections of the individual conductors in the cable (often millimeters), this can be a very challenging problem. This demonstration will show how correct modeling of the cable within the enclosure is critical in ensuring that an accurate answer is obtained.

Wednesday, August 17 [ 9:30-11:30 ]

Modeling and Simulation for Cosite EMI AnalysisPresenter: Fred German, Delcross TechnologiesAbstract: This demonstration will show the application of numerical simulation tools for predicting system-level cosite interference in complex RF environments involving multiple emitters and victims. We will show how antenna-to-antenna coupling and RF sub-system models are combined to produce EMI margin predictions and how the fidelity of the individual component models can affect the results.

2D Cross-Sectional Analysis in Signal IntegrityPresenter: Alexander Razmadze, Missouri University of Science & TechnologyAbstract: The key goal of this demonstration is to show how 2D cross-sectional analysis tools can be successfully used for highlighting physics about capacitance, inductance, and impact in design for cross-talk. For these purposes several practical problems will be considered.


Simulation of Complex EMC Problems Involving Cables Using Combined Field and Transmission Line ApproachPresenters: Gopinath Gampala and C. J. Reddy, EM Software & SystemsAbstract: In modern systems (such as automobiles, aircrafts etc.) cables play a dominant role. In these systems, cables, which either radiate through imperfect shields and cause coupling into other cables, devices or antennas, or which receive (irradiation) external electromagnetic fields (radiated from antennas or leaked through other devices) and then cause disturbance voltages and currents potentially resulting in a malfunctioning of the system. It is crucial that in the design process of electromagnetic systems such coupling (radiation / irradiation) effects involving cables are taken into account from an EMC perspective.

EMC Issues on Printed Circuit BoardsPresenter: Matthias Troescher, CST AGAbstract: Many of the EMC issues on a Printed Circuit Board (PCB) are related to unintended current return paths of intended signals. Currents always flow in a loop. A signal propagating from one IC to another is related to a current that flows from a source along a net to a specific destination. From there it needs to find a way back to its source. When dealing with differential nets the current return path is usually the differential mate, but in general the current return path is in a nearby reference plane, especially if the differential signals are skewed and if common mode currents are induced. If we take care of such return currents and don’t leave it up to “black magic” where they flow many EMC issues can be fixed up front. This demonstration explains the main reason for EMC issues on PCBs and shows how to overcome them.

Thursday, August 18 [ 9:30-11:30 ]

Real World EMI Correlation Challenges and TechniquesPresenters: Rajen Murugan, Souvik Mukherjee, Texas Instruments USA; Claudio Girardi, Lionel Pauc, Texas Instruments France SA; Dipanjan Gope, Swagato Chakraborty, Daniel N. de Araujo, Vikram Jandhyala, Physware Inc.Abstract: The aim of this demo is to show the detailed investigation of near field distribution in electromagnetic measurement and simula-tion environments. Two experiments will be explored where one is a canonical structure for baseline correlation to analytical formulation and a second more complex system package on PCB.

Full-wave EM Simulation of High-Speed PCB/Package DesignsPresenter: Darryl Kostka, CSTAbstract: Nowadays high-speed IC/package design methodologies require thorough power and signal integrity (PI/SI) analysis using full-wave 3D electromagnetic (EM) simulation technology. With RF and analog content, design engineers simulate ICs in context of package parasitics. The ability to use a repeatable flow throughout the design cycle is a key requirement to meet tightly managed product sched-ules. This can be accomplished by an integrated flow that combines full-wave solver technology with IC/package design, analysis and simulation. This proposed workflow presents a full-wave 3D EM signal integrity simulation of a complex package design imported from an EDA layout tool using a Finite Integration Technique (FIT) based solver. Standard outputs like S-parameters and Time Domain Reflection (TDR) will be generated along with the RLC network circuit extraction and the full 3D-field visualization.

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Tuesday, August 16 [ 9:30-11:30 ]

Circuit Techniques to Reduce EMI in an Electronic SystemPresenter: Harihara Subramanian, ON SemiconductorAbstract: This experiment will showcase circuit techniques to reduce EMI, namely:1. Frequency modulation of signals (known as Spread Spectrum

generation). A circuit demonstration on problems that can and cannot be solved by this technique.

2. Cancelling EMI by creating a transmitter array to offset EMI cre-ated by a given signal.

Seam Leakage in Coated Plastic EnclosuresPresenter: William Kimmel, Kimmel Gerke Associates Abstract: Conductively coated plastics are becoming increasingly popular in RF shielding. Unfortunately, the shield often fails to perform as expected, largely due to the inadequate closure of the conductive mating surfaces. This experiment shows the compara-tive shielding effectiveness of an uncoated enclosure and various seam closure techniques. A spectrum analyzer and small antenna will be used as the demonstration instrument.

Tuesday, August 16 [ 2:00-4:00 ]

Induced Voltages and PickupsPresenter: Christopher Semanson, University of Michigan Dearborn

Abstract: The first part of this experiment uses a homemade probe to probe a simple resistive circuit, using the flux the current generates a voltage is induced in the probe. In the second part of this experi-ment, a similar experiment is done, but with a more complex circuit.

Efficient Testing Using a Reverberation Chamber – with “Real Time” ExamplesPresenters: Dennis Lewis, Boeing; Garth D'Abreu, ETS-Lind-grenAbstract: Reverberation chambers were once primarily used for military and automotive testing. Today, reverberation chambers are increasingly used for new, diverse test applications due to their inherent efficiency and cost effectiveness. Examples include using reverberation chambers for aircraft testing, to simulate a wireless environment, for determining shielding effectiveness, and to calibrate devices such as antennas and probes.


Poor Placement of Probes Proves to Be ProblematicPresenter: Christopher Semanson, University of Michigan DearbornAbstract: Using a CurlE box originally conceived by Henry Ott, this lab demonstrates that the poor placement of probes in an electronic circuit can lead to widely varying measurements event at the same point of measurement. Many people believe the result of this lab is a malfunction of equipment.

Hardware experimentS and demonStrationS


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Effectiveness of Shielding Materials and Impact of Slots and Bonding of Shields on PCB Radiation and ImmunityPresenters: Jim Teune, Gentex Corp; Bogdan Adamczyk, Grand Valley State UniversityAbstract: This hardware demo will address the shielding effectiveness of various materials on E- and H- field attenuation and the impact of slots and bonding of shields on PCB radiation and immunity. Various shielding materials of varying thickness will be evaluated for high frequency 100-1000 MHz attenuation. Low frequency attenuation characteristics for switched mode power supply applications will also be addressed. A miniature comb generator placed under a shield will be used to demonstrate the impact of slots of different geometries on RF energy leakage. Bonding of shields onto PCB and their impact on radiation and immunity will be demonstrated.


Effects of Impedance on Field-Coupled CrosstalkPresenter: Christopher Semanson, University of Michigan DearbornAbstract: Using regular twin lead power cable and a potentiometer, the effects of impedance on the different types of coupled fields can be experimented with to show that high impedance denote an efficient electric field coupling mechanism, while low impedance denote an efficient magnetic field coupling mechanism.

Near Field Probes in EMI/EMC/RF Design and TroubleshootingPresenter: Arturo Mediano, University of Zaragoza

Abstract: People in electronic field are usually very interested in EMI fundamentals because they experiment their effects on the lab (EMI and “RF black magic”) or production work (EMC). A lot of them usually need to solve the problems in a short time, under pressure and by trial and error. In that process, electric and magnetic near field probes are very useful tools. Near field probes are useful too for RF engineers as for example tuning circuits in a “non-invasive” way.

Thursday, August 18 [ 9:30-11:30 ]

Reference (Ground) Noise in Digital LogicPresenter: Christopher Semanson, University of Michigan DearbornAbstract: This lab showcases the difference between mutual induc-tance and self inductance, and how they can be used to minimize voltage spikes in a switching digital circuit. The experiment allows the change of wire gauge, measurement length, and how closely coupled the signal and return path are.

Video Demonstrations of Extreme EM PhenomenaA collection of video clips featuring experiments with extreme electromagnetic phenomena will be shown near the Experiments & Demonstrations area on Tuesday, Wednesday, and Thursday when the Experiments & Demonstrations are running.

Featured Signal Integrity ExperimentDr. Howard Johnson will present his latest film, "Mixed-Signal Isola-tion" at 10:30 am on Wednesday, August 17 in Room 102A. This lively film details the means of achieving 120 dB isolation from DC to 1 GHz between adjacent components on the same printed circuit board.

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New iNARTE Certifications for 2011

At IEEE EMCS 2012, iNARTE will offer examinations in our traditional disciplines. However, this year we have something new to offer: EMC Design Engineer

Certification.At the instigation, and with the cooperation of industry

leaders in the U.S. and Japan, iNARTE has developed a set of EMC Certifications specifically for engineers whose primary responsibility is the design and development of new products. There are to be three (3) levels of this certification.

EMC DEsign EnginEEr: Intended for the recent graduate who has the knowledge and skill to apply EMC principles to electronics design when starting a career. A typical candidate will have included several EMC elective courses in an EE degree curriculum, and will be seeking a position in industry, or will have been employed in industry for less than three years. Applicants who do not have a bachelor’s degree will be accepted if they have four or more years of related work experience. Undergraduates my also apply and will be awarded an Associate level certification pending graduation. Applicants will need to provide a reference, proof of education, pass the examination and write two original examination questions.

sEnior EMC DEsign EnginEEr: This level can be attained by an individual who has held an EMC Design Engineer certification for three years and passes an upgrade examination. Applications will also be accepted from individuals with an appropriate bachelor’s degree and have four or more years of related work experience. Applicants will need to provide three references, proof of education, pass the Senior level examination and write five original examination questions.

MastEr EMC DEsign EnginEEr: This level is currently reserved for Grandfathering of acknowledged experts in the field. Applications under the Grandfathering scheme will be received until Dec. 31, 2011. Applicants must hold a bachelor’s degree in a related discipline, an advanced degree is preferred. Applicants must have a minimum of five years applicable work experience and provide four references, one of which should be from an academic institute or an industry association, one from a manager or customer and two from peers. Grandfather applicants will not be asked to examine but will need to provide ten (10) new questions in categories that iNARTE will define.

Application forms for all these levels are available from the iNARTE website. These forms contain greater detail on the certification requirements and the nature of the examination. All examinations are CLOSED BOOK. Certifications in this discipline will be awarded for life with no annual renewal requirement or fee. However, Design Engineers will be invited to upgrade to Senior level and eventually to Master level.

The first examination for the EMC Design Engineer level will be ad-ministered at the IEEE EMCS 2011 on Friday, Aug. 19. (See sidebar). Se-nior EMC Design Engineer examinations will not be available until later in the year. The Master level application with examination will not be available until 2012, following the end of the Grandfathering period. MiL-stD EMC spECiaList CErtifiCation:

iNARTE has developed a new certification specifically for Engineers and Tech-nicians involved with testing and designing for compliance to the MIL STDs. The requirements are similar to the structure of our traditional EMC certification program, but not as demanding. The examination will consist of 48 questions, but only 40 are to be answered. Half of the 48 questions will be taken from the MIL STDs. The remainder will be from other EMC fundamentals, such as Antennas, Amplifiers, Filters, Shielding and Bonding.

MIL STD practitioners who do not have six years of related experience should still take the examination. Upon passing they will be awarded an Associate Certification, which will be automatically upgraded when the six-year mark has been reached.

All above application files can be downloaded from the iNARTE website at www.narte.org.

Monday, Aug. 15The iNARTE Examinations Prepara-tion Tutorial is a recommended work-shop for all who register to take the iNARTE Certification Examinations on Friday, Aug. 19. This year we will offer two different EMC Certification examinations: our traditional eight-hour examination for EMC engineers or technicians, and a new six-hour examination leading to a certification for EMC design engineers. This is a brand-new certification discipline being offered in the USA for the first time with less emphasis on Testing, Metrology, and Standards. This new program has been developed with the cooperation of leading electronics and automotive corporations in the USA and Japan. At the workshop, we will discuss the format of both examinations, and the best approach to ensure success. The last two hours of the workshop will be devoted to a trial examination paper, where we will present 20 or so typical questions.

Friday, Aug. 19The iNARTE Certification Examina-tions will be held at the Convention Center from 8 AM to 5 PM. This is an ideal time and place to take the Examination element of our Certifica-tion process. The traditional exams for EMC Engineer and EMC Technician will run concurrently. Each is a two-part paper, and each part is scheduled to run for four hours with an optional one-hour break at lunchtime. The new EMC Design Engineer examination is also a two-part paper, with each being just three hours long with an optional one-hour break. Examinees for the tradi-tional program may bring any reference materials and a PC to the examination room. We do not guarantee to provide either AC power or wireless Internet access, but if it is available, it may be used. Examinees for the EMC Design Engineer certification may bring only their own notebooks and a scientific calculator; no reference books or lap-tops will be allowed.

Tuesday, Aug. 16 to Thursday, Aug. 18iNARTE will be at our Booth #523 each day in the Exhibition Hall. You can register for any of the Friday Ex-aminations at our booth. We will also have on display and for purchase, books and CDs that may be used as Study Guides for the Examinations.

Brian LawrenceExecutive [email protected]


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New for 2011 | Interlab Comparisons and Data Reduction plus Emission Measurements (ANSI C63.4), Antenna Calibration (ANSI C63.5) and Time Domain (TD) Applications.

ILC workshop objectives: • Elements of ISO 17025, Clause 5.9 • Collecting/analyzing data • Setting control limits/uncertainty • Computing/presenting results • Lab experience with comparisons

C63.4 workshop objectives: • Emission measurement pro-cedures • Regulatory implications • Test facility and instrumenta-tion requirements • Test arrangements and con-figurations

C63.5 workshop objectives: • General test conditions

• Appropriate measurement geometry • Application of standard site method • Rationale for geometry specific correction factors for biconicals • Measurement uncertainty guidelines • Changes proposed for 2012 edition

TD workshop objectives: • Application for site validation • Application for antenna calibration • Tips on using TD instrumen-tation in a ten meter semi-anechoic chamber

Support Material • A complete lecture notebook • FCC handouts and references

Who Should Attend Product Managers and develop-ers, EMC engineers and test technicians, regulatory compli-ance managers, test instrumen-tation developers, calibration labs/technicians, accreditation bodies, lab quality assessors, test instrumentation and cham-ber manufacturers, and data reduction analysts

Date and Location Aug. 11-12: Host Hotel - Hilton Aug. 13: Northwest EMC, Irvine

Expert Instructors Workshops feature indus-try leaders and ANSI C63® members, including Don Heir-man, Workshop Director, Bob Hofmann, Greg Kiemel, Harry Hodes, Dennis Camell, Victor Kuczynski and Zhong Chen

Agenda Interlab Comparison Aug. 11: Class, 1-5 PM ANSI C63.4Aug. 12: Registration, 8:30 AM Class, 9 AM-5 PM ANSI C63.5 and Time DomainAug. 13: Registration, 8:30 AM Class, 9 AM-5 PM

The photoetching process improves design fl exibility enabling the manufacture of complex shapes without expensive tooling, including new Low-Profi le SlimShield with heights down to .060".

2-Piece Standard Designsare comprised of a fence and cover, plus multiple mounting options. Interactive PDF sales drawings are available at the website.

Custom Designs offer unlimited possibilities for materials and shapes. Product engineers can help you develop the best design for your application.

2-Piece Low-Profi le Standard Designs with dimpled covers offer heights as low as .060". Interactive PDF sales drawings are available at the website.

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This workshop is presented now in four parts over a two and a half day period: (1) Introduction , (2) review of ANSI C63.5-2006 and proposed changes for the next edition and (3) application of TD for test site validation and antenna calibration. These workshops are designed to increase your understanding of these standards and the TD approach. For the C63.4 workshop, there will be an analysis of the test site validation, including using the CISPR SVSWR method or arranging absorber material on the ground plane for use above 1 GHz. The C63.5 portion of the second

workshop will lead the user through the document, highlighting which technique should be used based on the type of antenna being calibrated and how it is changed from the 1988 and 1998 editions. This is essential to ensure that the right antenna factor is obtained, especially when validating semi-anechoic chambers. Proposed application of the same TD method to validating test sites will also be presented. As time permits, attendees will get a chance to apply what they learned by solving real world applica-tions. Visit www.c63.org for more information.


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Global EMC Univer-sity is 20 hours of instruction on basic EMC-related topics that is run in parallel with the traditional technical sessions at the symposium.

Students are en-couraged to partici-pate in symposium workshops, exhibits and social activities when they are not in class. Classes are taught by an inter-national panel of educators. The targeted audience is EMC engineers who have been in the EMC profession less than 5 years. The overall objective of this sequence of lectures is to provide a comprehensive discussion of the basic concepts and skills that are used in the EMC profession.

Transmission Lines: Time-Domain and Signal IntegrityJim Drewniak, Missouri University of Science and TechnologyAn introduction to the time-domain solution of the transmis-sion line equations, SPICE solutions, effects of mismatch, signal distribution, power distribution and decoupling, and the effects of losses.

Conducted Emissions and Power Supply FiltersMark Steffka, University of MichiganA brief review of the conducted emission regulatory require-ments, the LISN, common-mode and differential-mode cur-rents, and analysis of typical power supply filters.

AntennasAndy Marvin, University of YorkThis talk will describe the basic properties of antennas with specific reference to EMC applications. The use of antennas for both transmission (radiated immunity) and reception (radi-ated emissions) will be highlighted. The criteria for near-field to far-field operation will be described. Exercises will rely on students obtaining and using antenna data from exhibitors.

How to Understand, Identify and Reduce Radiated Emissions From Electronic Products During DesignLee Hill, Silent Solutions, LLCThis talk will discuss how radiated electromagnetic fields are produced in an electronic product and design methods that reduce those emissions. Fundamental sources and antenna structures that cause strong radiated emissions will be dis-cussed using a combination of conceptual and mathematical definitions based on published IEEE EMCS research, and illustrated using hardware demonstrations that combine ob-servations and measurements of high frequency noise.

EM Shielding Theory and PracticeColin Brench, Amphenol High Speed Interconnects

This session will present the basic physics of RF shielding and examine the practical details that must be addressed to achieve good shielding performance in real products. Shield-ing examples, both computation and real product data, are used to illustrate the subtle factors that must be addressed. (It is anticipated that a software demo will be arranged to demonstrate further details of system EMI shielding.)

Signal Integrity and Crosstalk Analysis of High Speed InterconnectsGiulio Antonini, Università degli Studi dell’AquilaThe lecture is intended for Engineers working in EMC, digital and RF circuit design, for whom understanding transmission lines and inductive and capacitive coupling is essential to explain signal integrity and crosstalk effects and which are the most effective remedies.

PCB Layout for EMC ComplianceBruce Archambeault, IBMDemonstrate printed circuit board layout techniques that re-duce radiated emissions and improve a product’s immunity to external threats.

Overview of Numerical MethodsChuck Bunting, Oklahoma State UniversityA brief overview of numerical methods for solving problems in electromagnetics including FDTD, BEM, FEM techniques and the software that employs them emphasizing practical problems to solve.

Standards for EMC ComplianceDon Heirman, Don HEIRMAN ConsultantsThis talk will present a practical perspective on standards and the role played by EMC engineers in developing worldwide compliance.

Global EMC UnivErsityMonday, August 155:30-6:30 PM, Students and Speakers Reception Tuesday, August 168 AM-Noon, Morning Session1:30-5:30 PM, Afternoon Session

Wednesday, August 178 AM-Noon, Morning Session1:30-5:30 PM, Afternoon Session

Thursday, August 188 AM-1 PM, Morning Session3-5:30 PM, Afternoon Session


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m[ emc SocieTy Technical commiTTeeS ]

august 15 - august 19MEETINGS

Monday, August 15Technical Advisory Committee (TAC) #1TC-6 Spectrum ManagementSC1 Special Committee on Smart Grid

Tuesday, August 16TC-1 EMC ManagementTC-2 EMC MeasurementsTC-9 Computational ElectromagneticsSC2 Low Frequency EMC

Wednesday, August 17TC-3 Electromagnetic EnvironmentTC-4 Electromagnetic Interference ControlTC-5 High Power ElectromagneticsTC-10 Signal IntegrityTC-11 Nanotechnology and Advanced Materials

Thursday, August 18Technical Advisory Committee (TAC) #2

Friday, August 19SC3 Transportation System EMC

Technical commiTTees play an important role in the overall success of the EMC Society by promoting activities in their fields and providing expert knowledge and assistance to generate and review technical papers, organize and operate sessions at symposia, generate and develop standards and evaluate the "state of the art" in EMC science. All meetings are open to ev-eryone; join them for breakfast, a break, lunch or dinner; listen to the discussions, learn what they are working on. Join your peers who volunteer to make EMC better, just by being there you too can be part of the solution and the future of EMC!

Technical CommitteesTechnical Committee 1: EMC Management

Technical Committee 2: EMC Measurements

Technical Committee 3: Electromagnetic Environment

Technical Committee 4: Electromagnetic Interference Control

Technical Committee 5: High Power Electromagnetics

Technical Committee 6: Spectrum Management

Technical Committee 8: Electromagnetic Product Safety

Technical Committee 9: Computational Electromagnetics

Technical Committee 10: Signal Integrity

Technical Committee 11: Nanotechnology and Advanced Materials

New in 2011special commiTTee 1: special commiTTee on smarT Grid

This special committee is concerned with coordinating the EMC Society activity on providing EMC principles for those organiza-tions and associated documentation and specifications that ad-dress the efficient use of the AC power grid including the control of power entering and in some cases exiting a house or building.

special commiTTee 2: low Frequency emc

This special committee is concerned with low-frequency EMC including Power Quality in electric power systems. The committee is focusing on application of fundamental EMC concepts also to low frequency conducted disturbances. EMC in power systems is expected to be increasingly important. This is due to increased use of electronics in renewable, electric vehicles, energy efficient technologies and Smart Grid applications.

special commiTTee 3: TransporTaTion sysTem emc

This committee is concerned with the component and system design, testing, and modeling/simulation of transportation sys-tems. This includes both passenger carrying and non-passenger vehicles such as automobiles, trucks, trains/trams, and aircraft. Special emphasis is on the latest developments in high power and high voltage systems used for propulsion or control.

BooTh 327

2Comu . . . . . . . . . . . . . . . . . . . 3383M . . . . . . . . . . . . . . . . . . . . . 123A . H . Systems, Inc . . . . . . . . . . . . . 222A2LA The American Association for Laboratory Accreditation . . . . . . . . . 530Aberdeen Test Center . . . . . . . . . . 846Advanced Test Equipment Rentals . . . 445AE Techron, Inc . . . . . . . . . . . . . . 435Aeroflex . . . . . . . . . . . . . . . . . . 735Agilent Technologies . . . . . . . . . . . 223A-Jin Electron . . . . . . . . . . . . . . . 231ANDRO Computational Solutions, LLC 522ANSYS, Inc . . . . . . . . . . . . . . . . . 547Apache Design Software . . . . . . . . . 433API (Amber Precision Instrument) . . . . 546Applied EM Technology & EMS-PLUS . 344AR . . . . . . . . . . . . . . . . . . . . . 111ARC Technologies, Inc . . . . . . . . . . 745Avalon Equipment Corp . . . . . . . . . . 728Axiom Test Equipment, Inc . . . . . . . . 120Boeing . . . . . . . . . . . . . . . . . . . 625Bose Corporation . . . . . . . . . . . . . 124Braden Shielding Systems, LLC . . . . . 424Brightking Electronics Inc . . . . . . . . . 247Captor Corporation . . . . . . . . . . . . 629Chamber Services Inc . . . . . . . . . . . 739CKC Laboratories, Inc . . . . . . . . . . . 654Communications and Power Ind . CPI . . 334Compatible Electronics, Inc . . . . . . . 531Compliance Testing LLC . . . . . . . . . 238Com-Power Corporation . . . . . . . . . 118CST of America, Inc . . . . . . . . . . . . 339Cuming Lehman Chambers . . . . . . . 639Curtis Industries/Filter Networks . . . . . 234D .L .S . Electronic Systems, Inc . . . . . . 127Dayton T . Brown . . . . . . . . . . . . . 644Delcross Technologies . . . . . . . . . . 345Detectus - (Interfax) . . . . . . . . . . . . 545DNB Engineering . . . . . . . . . . . . . 452Electro Magnetic Applications, Inc . . . . 738Elite Electronic Engineering Inc . . . . . . 535EM Software & Systems (USA)-FEKO . 635EM Test USA, Inc . . . . . . . . . . . . . 631EMCOS Consulting and Software . . . . 447EMI Software LLC . . . . . . . . . . . . 727EMSCAN . . . . . . . . . . . . . . . . . 323ETS-Lindgren . . . . . . . . . . . . . . . 311Evaluation Engineering . . . . . . . . . . 743Fair-Rite Products Corp . . . . . . . . . . 327Filconn, Inc . . . . . . . . . . . . . . . . . 450Fischer Custom Communications, Inc . . 331Genisco Filter Corp . . . . . . . . . . . . 838Haefely EMC . . . . . . . . . . . . . . . 122HV Technoloies, Inc . . . . . . . . . . . . 423IEEE EMC Society . . . . . . . . . . . . 134IEEE History Committee . . . . . . . . . 143IN Compliance . . . . . . . . . . . . . . 429iNARTE . . . . . . . . . . . . . . . . . . 523Instruments For Industry (IFI) . . . . . . 516Intelligent RF . . . . . . . . . . . . . . . 722Interference Technology . . . . . . . . . 417ITEM Publications . . . . . . . . . . . . 417Intermark USA . . . . . . . . . . . . . . 623Isodyne Inc . . . . . . . . . . . . . . . . 550Jacobs Technology . . . . . . . . . . . . 446Jiangsu WEMC Technology Co . LTD . . 128Laird Technologies . . . . . . . . . . . . 239Leader Tech, Inc . . . . . . . . . . . . . . 551Liberty Labs . Inc . - World Cal . Inc . . . . . 630MET Laboratories . . . . . . . . . . . . . 340Metal Textile Corp . . . . . . . . . . . . . 618Michigan Scientific Corp . . . . . . . . . 616

Microwave Journal . . . . . . . . . . . . 332Moss Bay EDA . . . . . . . . . . . . . . 346National Technical Systems . . . . . . . 740NAVAIR . . . . . . . . . . . . . . . . . . 647Nemko USA, Inc . . . . . . . . . . . . . . 734Nexio . . . . . . . . . . . . . . . . . . . . 532NIST/NVLAP . . . . . . . . . . . . . . . 444Noise Laboratory Co ., Ltd . . . . . . . . . 622Northwest EMC inc . . . . . . . . . . . . 330Ophir RF, Inc . . . . . . . . . . . . . . . . 227Panashield . . . . . . . . . . . . . . . . 322Pearson Electronics, Inc . . . . . . . . . . 325Radius Power Inc . . . . . . . . . . . . . 650Restor Metrology . . . . . . . . . . . . . 230RF Exposure Lab, LLC . . . . . . . . . . 431Rohde & Schwarz . . . . . . . . . . . . 217RTP Company . . . . . . . . . . . . . . 347Safety & EMC Magazine . . . . . . . . . 655Schlegel Electronic Materials, Inc . . . . . 534Schurter Inc . . . . . . . . . . . . . . . . . 426Sigrity, Inc . . . . . . . . . . . . . . . . . . 425Souriau PA&E . . . . . . . . . . . . . . . 628Spira Manufacturing Corp . . . . . . . . . 525

SVAD-White Sands Missle Range . . . 235Syfer Technology, Ltd . . . . . . . . . . . 828TDK Corporation . . . . . . . . . . . . . 119TDK-Lambda Americas . . . . . . . . . 342Techmaster Electronics . . . . . . . . . 624Teseq Inc . . . . . . . . . . . . . . . . . . 317Test Equipment Repair Corp . . . . . . . 651Thermo Fisher Scientific . . . . . . . . . 730Timco Engineering Inc . . . . . . . . . . . 232Transient Specialists, Inc . . . . . . . . . 533TUV Rheinland of North America . . . . 646TUV SUD America, Inc . . . . . . . . . . 422Universal Shielding Corp . . . . . . . . . 724Vanguard Products Corp . . . . . . . . . 529Vermillion Inc . . . . . . . . . . . . . . . . 451VTI Vacuum Technologies, Inc . . . . . . 454WEMS Electronics . . . . . . . . . . . . 847Wurth Electronics Midcom Inc . . . . . . 645

[ exhibit hall Map ]

64 interference technology emc symposium guide 2011


[ COMPANY PROFILES ]

AA.H. Systems, Inc.A.H. Systems has been in business since 1974. We manufacture a complete line of individually calibrated EMC test Antennas, Preamplifiers, Current Probes and High-Frequency Low-Loss Cables that satisfy FCC, MIL-STD, VDE, IEC and SAE testing standards. We have rental

programs for our equipment, and we also provide recalibration services for all of our Antennas and Current Probes, including others manufactured worldwide. Delivering high quality products with prompt technical sup-port for the entire product line are goals we strive to achieve, including next-day, on-time delivery.A.H. Systems 9710 Cozycroft Ave. Chatsworth, CA 91311 Tel: (818) 998-0223 Fax: (818) 998-6892 Email: [email protected] http://www.AHSystems.com

Page 29 ....................................................................Booth 222

A2LA American Association for Laboratory Accreditation ........ Booth 530 5301 Buckeystown Pike, Suite 350, Frederick, MD 21704 USA; 301-644-3248; Fax: 301-662-2974; [email protected]; www.A2LA.org

Aberdeen Test Center ......................................................................Booth 846 400 Colleran Road, Aberdeen Proving Ground, MD 21005 USA; [email protected]; www.atc.army.mil

Advanced Test Equipment Rentals .................................. Page 47, Booth 445 10401 Roselle St., San Diego, CA 92121 USA; 888-544-ATEC (2832); Fax: 858-558-6570; [email protected]; www.atecorp.com

AE Techron, Inc. ..............................................................................Booth 4352507 Warren St., Elkhart, IN 46516 USA; 574-295-9495; Fax: 574-295-9496; [email protected]; www.aetechron.com

Aeroflex ...........................................................................................Booth 735Wichita Division, 10200 West York St., Wichita, KS 67215-8935 USA; 316-522-4981; 800-835-2352; Fax: 316-524-2623; www.aeroflex.com

Agilent TechnologiesAgilent Technologies is the world’s premier measurement company. Agilent is committed to providing innovative measurement solutions that enable its customers and partners to deliver the products and services that make a measurable difference in the lives of people everywhere.

Agilent offers EMI measurement solutions for EMC compliance and pre-compliance testing. The Agilent MXE EMI receiver is fully compliant with CISPR 16-1-1 2010 and includes X-Series signal analysis and graphical measurement tools that make it easy to diagnose EMI problems. To ensure successful compliance testing, MXE-identical measurements can be made—at a fraction of the price—with any X-Series signal analyzer and the EMC measurement application. Agilent Solutions Partners offer a single point of contact to purchase a complete EMC solution that meets MIL-STD and commercial specifications, combining Agilent’s products with value-added integration, software, probes, antennas, chambers, and more.

For more information visit www.agilent.com/find/emc or contact an Agilent representative at 1-800-829-4444.

Page 1 ...................................................................... Booth 223

A-Jin Electron ................................................................................... Booth231 1567-6, Songjung-Dong, Kangseo-Gu, Busan, South Korea, 618-270; 82-51-831-3036-7; Fax: 82-51-7465408; www.ajinelectron.co.kr

Alco Technologies, Inc. .....................................................................................1815 W. 213th St. #175, Torrance, CA 90501 USA; 310-328-4770; Fax: 310-328-1262; www.alcotech.com

Americor Electronics, Ltd. ..................................................................Page 84675 S. Lively Blvd., Elk Grove Village, IL 60007 USA; 800-830-5337; Fax: 847-956-0300; [email protected]; www.americor-usa.com

ANDRO Computational Solutions, LLC ...................................... Booth 522Beeches Technical Campus Bldg., Suite 4, 7902 Turin Road, Route 26N, Rome, NY 13440-2067 USA; 315-334-1163; http://andro-computational-solutions.sbcontract.com/profile.htm

ANSI-ASC C63 Committee on EMC .............................................. Booth 141 www.ansi.org

ANSYS, Inc. (Ansoft Products) ....................................................... Booth 547 Southpointe, 275 Technology Drive, Canonsburg, PA 15317 USA; 724-746-3304; Fax: 724-514-9494; [email protected]; www.ansys.com

Apache Design Solutions ...................................................Page 22, Booth 433 2645 Zanker Road, San Jose, CA 95134 USA; 408-457-2000; Fax: 408-428-9569; [email protected]; www.apache-da.com

Amber Precision Instruments Inc. (API) ....................................... Booth 546 746 San Aleso Ave., Sunnyvale, CA 94085 USA; 408-752-0199, ext. 101; Fax: 408-752-0335; [email protected]; www.amberpi.com

Applied EM Technology & EMS-Plus ............................................. Booth 344 [email protected]

AR RF/Microwave InstrumentationAR RF/Microwave Instrumentation is a manufacturer and distributor of broadband, high power amplifiers from dc – 45 GHz, 1 – 50,000 watts, antennas, field monitoring equipment, EMC immunity test systems and additional accessories for RF and EMC testing. The majority of AR RF/Microwave Instrumentation’s products support radiated and conducted immunity testing, including IEC, automotive, aviation, military and medi-cal test requirements. We also carry products that support RF testing outside of EMC.

AR Receiver Systems provides a line of products and services for EMC testing including an EMI receiver, leak detectors and impulse generators. AR Receiver System products can be used for a wide variety of EMC testing needs and their products can be purchased through AR RF/Microwave Instrumentation.

AR RF/Microwave Instrumentation 160 School House Road Souderton PA 18964 Tel: 215-723-8181; Email: [email protected] www.arworld.us

Pages 5,23, 27, 37 .................................................Booth 111

http://www.alcotech.com


http://www.AHSystems.com

http://www.atecorp.com



http://www.arworld.us


www.apache-da.com


[ COMPANY PROFILES ]ARC Technologies, Inc. ....................................................................Booth 74511 Chestnut St., Amesbury, MA 01913 USA; 978-388-2993; Fax: 978-388-6866; www.arc-tech.com

Avalon Equipment Corp. / LeCroy Corp. .......................................Booth 728 2453 Cades Way, Building B, Vista, CA 92081 USA; 888-542-8256; Fax: 760-536-0184; [email protected]; www.avalontest.com

Axiom Test Equipment, Inc. ............................................................Booth 120 1704 Ord Way, Oceanside, CA 92056 USA; 760-806-6600; Fax: 760-806-6659; [email protected]; www.axiomtest.com

BBoeing ................................................................................................Booth 625 12000 W. 12th St. MC U4-01, Ogden, UT 84404 USA; 801-315-2396, www.boeing.com

Bose Corporation .............................................................................Booth 124The Mountain, Framingham, MA 01701 USA; 508-879-7330; 800-999 2673

Braden Shielding SystemsGlen Pierandri9260 Broken Arrow ExpresswayTulsa, OK 74145Ph: 918 624-2888 Ext: 102Fax: 918 624-2886gpierandri@bradenshielding.comwww.bradenshielding.comVisit us @ Booth #528

With more than 4,400 installations worldwide, we have the experience, knowledge and capabilities to provide our customers with the finest an-echoic chambers utilizing the world’s most innovative microwave products.

We are committed to uncompromising quality control, quick accurate response to client needs and reliable, competent, on-time service.

Page 25 ..................................................................... Booth 424

Brightking Electronics, Inc. .............................................................Booth 247A:1/F, Lingnan Industrial Park, 7 Tengkeng Rd., Liuyue, Henggang, Longgang, Shenzhen, Guangdong 518116, PRC; +86-755-28504896; www.brightking.com

CCaptor Corporation ..........................................................................Booth 629 5040 South County Road 25A, Tipp City, OH 45371 USA; 937-667-8484; Fax: 937-667-5133; [email protected]; www.captorcorp.com

Chamber Services, Inc. .....................................................................Booth 73911521 Monarch St., Garden Grove, CA 92841 USA; 714-893-5034; Fax: 714-893-5025; [email protected]; www. chamberservicesinc.com

China Electrotechnical Society (CES) ..............................................Booth 754 www.chinamw.ces.org.cn

CKC Laboratories, Inc. .....................................................................Booth 6545046 Sierra Pines Drive, Mariposa, CA 95338 USA; 209-966-5240; Fax: 866-779-9776; www.ckc.com

Communications & Power Industries (CPI) ...................................Booth 334 607 Hansen Way, Palo Alto, CA 94304-1015 USA; 650-846-2900; Fax: 650-846-3276; [email protected]; ww.cpii.com

Compatible Electronics, Inc. ............................................................Booth 531102 Olinda Drive, Brea, CA 92823 USA; 714-579-0500; Fax: 714-528-1992; [email protected]; www.celectronics.com

Compliance Testing LLC ..................................................................Booth 238Ste-107, 3356 N. San Marcos Plaza, Chandler, AZ 85225 USA; 866-311-3268; Fax: 480-926-3100; [email protected]; www.compliancetesting.com

Compliance Worldwide..................................................................................... 357 Main St., Sandown, NH 03873 USA; 603-887-3903; Fax: 603-887-6445; [email protected]; http://cw-inc.com

Com-Power Corporation .................................................................Booth 118114 Olinda Drive, Brea, CA 92823 USA; 714-528-8800; Fax: 714-528-1992; [email protected]; www.com-power.com

CSTCST develops and markets high performance EM field simulation software. Its products allow you to characterize, design and optimize elec-tromagnetic devices before going into the lab or measurement chamber. This can help save substantial costs especially for new or cutting edge products, reduce design risk, and improve overall performance and profitability.

CST’s flagship product, CST MICROWAVE STUDIO, enables the fast and accurate 3D electromagnetic simulation of high frequency

devices such as antennas, filters and multi-layer structures. CST’s cus-tomers operate in industries as diverse as Telecommunications, Defense, Automotive, Electronics, and Medical Equipment. Further information about CST is available on the web at www.cst.com.

Page 31 ................................................................... Booth 339

Cuming-Lehman Chambers.............................................................Booth 639 5800 Cumberland Highway, Chambersburg, PA 17201 USA; 717-263-4101; Fax: 717-263-4102; www.lehman-inc.com/

Curtis Industries / Filter Networks ................................... Page 67, Booth 234 2400 S. 43rd St., Milwaukee, WI 53219 USA; 800-657-0853; 414-649-4200; Fax: 414-649-4279; [email protected]; www.curtisind.com

DD.L.S. Electronic Systems, Inc. .........................................................Booth 127 1250 Peterson Drive, Wheeling, IL 60090 USA; 847-537-6400; Fax: 847-537-6488; [email protected]; www.dlsemc.com

Dayton T. Brown, Inc. ......................................................................Booth 644 1175 Church St., Bohemia, NY 11716 USA; 800-232-6300; Fax: 631-589-0046; [email protected]; www.dtbtest.com

Delcross Technologies, LLC .............................................................Booth 345 3015 Village Office Place, Champaign, IL 61822 USA; 217-363-3396; Fax: 217-363-3398; contact @ delcross; www.delcross.com/

Detectus AB .......................................................................................Booth 545 Hantverkargatan 38B, 782 34 Malung, Sweden; +46 280 41122; Fax: +46 280 41169; [email protected]; http://www.detectus.se/

DNB Engineering .............................................................................Booth 452 3535 W. Commonwealth Ave., Fullerton, CA 92833 USA; 714-870-7781; 800-282-1462; Fax: 714-870-5081; www.dnbenginc.com

http://www.cst.com


http://www.curtisind.com


[ COMPANY PROFILES ]positioners; RF and EMP/HEMP/IEMI power protection filters; as well as RF and microwave absorber - including the new flexible FlexSorb™ absorber. Innovative software offered includes TILE!™ for automated EMC test lab management and EMQuest™ for fully automated 2- and 3-D antenna pattern measurement. Services provided include expert calibration at our A2LA accredited calibration lab and wireless testing at our CTIA Authorized Test Lab (CATL). Chamber relocation and absorber retrofit services are available upon request. Based in Cedar Park, Texas, ETS-Lindgren has ISO 9001:2000 certified facilities in North America, Europe and Asia. For more information: www.ets-lindgren.com

Back Cover ..............................................................Booth 311

Evaluation Engineering ................................................................... Booth 7432500 Tamiami Trail North, Nokomis, FL 34275 USA; 941-966-9521; www.evaluationengineering.com

FFair-Rite Products Corp. .................................................. Page 63, Booth 327 1 Commercial Row, P.O. Box 288, Wallkill, NY 12589 USA; 845-895-2055 ; Fax: 845-895-2629; [email protected]; www.fair-rite.com

Filconn s/w Applied EM Technology ............................................. Booth 450 1347 East University Drive, Tempe, AZ 85281 USA; 480-222-3565; Fax: 480-222-3567; [email protected]; www.filconn.com

Fischer Custom Communications, Inc. ........................... Page 34, Booth 331 20603 Earl St., Torrance, CA 90503 USA; 310-303-3300; Fax: 310-371-6268; [email protected]; www.fischercc.com

EElectro-Magnetic Applications, Inc. ............................................... Booth 738 7655 W. Mississippi Ave., Suite 300, Lakewood, CO 80226 USA; 303-980-0070; Fax: 303-980-0836; [email protected]; www.electromag-neticapplications.com

ELECTRONICS TEST CENTRE - KANATAWe can handle your Lightning and EMI/EMC needsSince 1988, The Electronics Test Centre has provided the highest qual-ity and most reliable compliance testing and certification services to the electronics, telecommunications, medical, military, aeronautical and automotive industries.

Our facility, located just outside Ottawa, boasts 5 Anechoic Chambers, a High Voltage Lab, HIRF Test Facilities, and an Open Air Test Site for Compliance and Custom testing. We have NARTE-Certified EMC test engineers, and have Controlled Goods and Security Clearance.

The Electronics Test Centre is multi-accredited and experienced in MIL-STD, RTCA, SAE and commercial testing. With a combined total of over 50 years of experience, our engineers and technologists have the expertise to handle a wide variety of customer requirements and demands.

Call or visit our website for our attractive laminated RTCA-DO160 Refer-ence Chart for Engineers involved with Lightning Testing!

Page 54........................................................................................

Elite Electronic Engineering Inc. ..........................................Booth 535 1516 Centre Circle, Downers Grove, IL 60515-1082 USA; 800-ELITE-11, 630-495-9770; Fax: 630-495-9785; [email protected]; www.elitetest.com

EM Software & Systems (USA), Inc. .....................................Booth 635 Langley Research Park, 144 Research Drive, Hampton VA 23666 USA; 757-224-0548; Fax: 757-282-5897; [email protected]; www.emssusa.com

EM Test USA .....................................................................Page 87, Booth 6313 Northern Blvd., Unit A-4, Amherst, NH 03031 USA; 603 769 3477; Fax: 603 769 3499; [email protected]; www.emtest.com

EMCOS Consulting and Software .................................................. Booth 44727 Pekin Str., 0160, Tbilisi, Georgia; +995-32-2389091; Fax: +995-32-2389092; [email protected]; www.emcos.com

EMI Software LLC ........................................................................... Booth 727P.O. Box 21518, Sedona, AZ 86341 USA; 928-592-5219; [email protected]; www. emisoftware.com

EMSCAN .......................................................................................... Booth 323 1715 27th Avenue NE Suite 1, Calgary, T2E 7E1 Canada; 877-367-2261; 403-291-0313; [email protected]; www.emscan.com

ETS-LindgrenETS-Lindgren is a leading manufacturer of turn-key systems and com-ponents for EMC, RF, wireless and acoustic testing. Our RF shielded enclosures and anechoic chambers are designed for testing a wide variety of products, from mobile handsets to full size aircraft. Our popular components include antennas; turntables; field probes, monitors, and

Curtis Industries offers a complete line of RFI Power Line Filters.• GENERAL PURPOSE FILTERS• HIGH PERFORMANCE• WIDE BAND• POWER ENTRY • MEDICAL• 3-PHASE• AC AND DC FILTERS• CUSTOM FILTERS• MILITARY FILTERS

All fi lters include 100% Safety and Performance Testing, high quality and on time delivery.

Our engineering and sales departments are ready to address your fi ltering needs with results that are PROFESSIONAL - QUICK - ECONOMICAL - QUIET.

Curtis Industries/Filter NetworksOUTSTANDING PERFORMANCE AND SELECTION

ON RFI POWER LINE FILTERS

For product information contact:

Curtis Industries/Filter Networks2400 S. 43rd Street

Milwaukee, WI 53219

tel: 414-649-4200 or 1-800-657-0853

www.curtisind.com [email protected]

FILTER NETWORKSA Curtis Industries Company

Curtis IndustriesA Div. of Powers Holdings, Inc.

ISO 9001: 2008 Registered

BOOTH 234

http://www.curtisind.com



http://www.emtest.com


http://www.fischercc.com



GGenisco Filter Corporation ..............................................................Booth 838 5466 Complex Street Suite 207, San Diego, CA 92123 USA; 858-565-7405; [email protected]; http://www.genisco.com

HHaefely EMC .....................................................................................Booth 122Lehenmattstrasse 353, CH-4052 Basel, Switzerland; 845-279-3644, ext. 240, www.HaefelyEMC.com; www.haefely-onyx.com

HV Technologies, Inc. ......................................................................Booth 423 P.O. Box 1630, Manassas, VA 20110 USA; 703-365-2330; Fax: 703-365-2331; [email protected]; www.hvtechnologies.com

IIEEE EMC Society .............................................................................Booth 134www.ewh.ieee.org/soc/emcs

IEEE History Committee .................................................................Booth 143www.ieee.org/about/history_center/history_committee.html

IN Compliance Magazine .................................................................Booth 429P.O. Box 235, Hopedale, MA 01747 USA; 508-488-6274; Fax: 508-488-6114; www.incompliancemag.com/

iNARTE, Inc. .....................................................................................Booth 523 840 Queen St., New Bern, NC 28560 USA; 800-89-NARTE; 252-672-0111; Fax: 252-672-0111; [email protected]; www.narte.org

Instruments for Industry, Inc.Celebrating over 55 years of unsurpassed leadership delivering to, and supporting, the commercial and military markets. IFI continues to lead the industry, by de-signing, developing, and manufacturing outstanding amplifiers for standard and custom applications. IFI manufactures Solid-State, TWT, and Tetrode Tube Ampli-fiers; other products are antennas, E-field sensors, and monitoring systems as well as TEM cells and RF/microwave accessories

DC-40 GHz up to 50 kW (CW & Pulse).

IFI’s state-of-the-art technology can be customized for cost-effective so-lutions. We offer laboratory products as well as specialized products for militarized and mobile applications. Testing applications include, but are not limited to: EMC/IEC, Automotive, EW/ECM, Wireless, Medical, Bio-logical, Educational, Military, Space, and Communications installations.

Instruments for Industry, Inc.903 South Second StreetRonkonkoma, NY 11779Phone: (631) 467-8400Fax: (631) 467-8558www.ifi.com

Pages 7-12, 56 ......................................................... Booth 516

Intelligent RF Ca Div. of Steppir Antennas ....................................Booth 722 2112 - 116th Ave. NE, Suite 2-5, Bellevue, WA 98004 USA; 425-453-1910; Fax: 425-462-4415; www.steppir.com

Interference TechnologyFounded in 1971 as ITEM Publications, Interference Technology – the only directory and design guide publisher to focus exclusively on the EMC industry, has become the acknowledged leader in this field. Interference Technology is published three times a year. Interference Technology also publishes: Interference Technology China, Interference Technology Japan, the weekly Interference Technology eNews, and the Interference Technology eGuides. The newly re-launched Interference Technology.com allows EMC engineers and designers to renew their subscriptions, join any or all of ten EMC forums, and visit ten channels organized by the EMC technologies they use the most. New resources on the website in-clude white papers, videos, application notes, and more, while the Buyer’s Guides feature easy-to-request, free sample offers from many suppliers.

Page 6, 77, 85, 88 .................................................... Booth 417

Intermark USA .................................................................. Page 49, Booth 623 1310 Tully Road, Ste. 117, San Jose, CA 95122 USA; 408-971-2055; Fax: 408-971-6033; [email protected]; www.intermark-usa.com

Isodyne ..............................................................................................Booth 550www.isodyneinc.com

JJacobs Technology ............................................................................Booth 446 600 William Northern Blvd., Tullahoma, TN 37388 USA; 931-455-6400; Fax: 931-393-6389; [email protected]; www.jacobstechnology.com

Jiangsu WEMC Technology Co. Ltd. ...............................................Booth 128 No. 8, JianYe road, TianMu Lake Industrial Park, LiYang 213300, JiangSu, China; +86 519 8796 1268; [email protected]; www.wemctech.com

LLaird Technologies ...........................................................................Booth 239 16401 Swingley Ridge Road, Suite 700, Chesterfield, MO 63017 USA; 636-898-6000; Fax: 636-898-6100; www.lairdtech.com/

Leader Tech, Inc. .................................................................Page 51, Booth55112420 Race Track Road, Tampa, FL 33626 USA; 813-855-6921; Fax: 813-855-3291; [email protected]; www.leadertechinc.com

Liberty Labs, Inc................................................................................Booth 630 1346 Yellowwood Road, P.O. Box 230, Kimballton, IA 51543 USA; 712-773-2199; Fax: 712-773-2299; [email protected]; www.liberty-labs.com

MMET Laboratories .............................................................. Page 48, Booth 340914 W. Patapsco Ave., Baltimore, MD 21230 USA; 410-354-3300; Fax: 410-354-3313; [email protected]; www.metlabs.com

Metal Textiles Corporation ..............................................................Booth 618 970 New Durham Road, Edison, NJ 08818 USA; 732-287-0800; www.metexcorp.com

Michigan Scientific Corporation .....................................................Booth 616 321 East Huron St., Milford, MI 48381 USA; 248-685-3939; Fax: 248-684-5406; [email protected]; www.michsci.com

Microwave Journal ............................................................................Booth 332 685 Canton St., Norwood, MA 02062 USA; 781-769-9750; Fax: 781-769-5037; www.mwjournal.com

http://www.ifi.com


http://www.intermark-usa.com



MILMEGAMILMEGA is a leading specialist in the design and manufacture of high power, solid state, wideband amplifiers. 2011 sees the launch of the MILMEGA 80MHz – 1GHz range, with 175W, 250W 500W & 1000W models available. All MILMEGA Series 2000 amplifiers are backed with a full 5-year fully expensed warranty and an established global support network.

MILMEGA LtdRyde Business ParkRydeIsle of WightUKTel: +44 (0)1983 618004Email: [email protected]: www.milmega.co.uk

Page 3 .........................................................................................

Moss Bay EDA/IBM .........................................................................Booth 346 23889 NE 112th Cir #2, Redmond, WA 98053 USA; 206-779-5345; [email protected]; www.mossbayeda.com

N

National Technical Systems Founded in 1961, National Technical Systems (NTS) is a publicly held company (NASDAQ: NTSC) providing a wide range of product design consulting services, testing and certifications services and supply chain management solutions. Globally accredited by leading regulatory agencies, NTS is a trusted partner that helps organiza-tions to access domestic and international markets. Our clients see us an extension of their own engineering teams, filling in their internal gaps and providing the expertise required to build better, stronger, safer, more reliable products and bring those products to market quickly and efficiently. With the largest network of test laboratories in North America and over 50 years of experience to draw from, we don’t just help our clients engineer superior products. We help them engineer success!Contact NTS(800) 270-2516 www.nts.com [email protected]

Page 15 ..................................................................... Booth 740

NAVAIR ............................................................................. Page 39, Booth 64747123 Buse Road, Building 2272, Suite 540, Patuxent River, MD 20670 USA; www.navair.navy.mil

NEMKO USA ....................................................................................Booth 734 802 North Kealy Ave., Lewisville, TX 75057 USA; 972-436-9600; [email protected]; www.nemko.com

NEXIO ................................................................................ Page 41, Booth 532 16, Rue Troyon, 92310 SEVRES, France; +33 561 440 247; [email protected]; www.nexio-online.com

NIST/NVLAP ....................................................................................Booth 444 100 Bureau Drive, M/S 2140, Gaithersburg, MD 20899-2140 USA; 301-975-4016; Fax: 301-926-2884; [email protected]; www.nist.gov/nvlap

Noise Laboratory Co. Ltd. ................................................................Booth 622 1-4-4, Chiyoda, Chuo-ku, Sagamihara City, 252-0237, Japan; 81-42-712-2051; Fax: 81-42-712-2050; [email protected]; www.noiseken.com

Northwest EMC ................................................................................Booth 330 22975 NW Evergreen Pkwy, Suite 400, Hillsboro, OR 97124 USA; 888-364-2378; 503-844-4066; Fax: 503-844-3826; www.nwemc.com

OOphir RF............................................................Inside Back Cover, Booth 227 5300 Beethoven St., Los Angeles, CA 90066 USA; 310-306-5556; Fax: 310-821-7413; [email protected]; www.ophirrf.com/index.php

PPanashield, Inc. .................................................................................Booth 322 185 West Norwalk Road #R, Norwalk, CT 06850-4312 USA; 203-866-5888; Fax: 203-866-6162; [email protected]; www.panashield.com

Pearson Electronics Inc. ...................................................................Booth 325 4009 Transport St., Palo Alto, CA 94303 USA; 650-494-6444; Fax: 650-494-6716; [email protected]; www.pearsonelectronics.com

QQuell ................................................................................... Inside Front Cover 5639-B Jefferson NE, Albuquerque, NM 87109 USA; 505-243-1423; Fax: 505-243-9772; [email protected]; www.eeseal.com

http://www.tri-mag.com



www.ophirrf.com/index.php



RRadius Power Inc. .............................................................................Booth 650 1751 North Batavia St., Orange CA 92865 USA; 714-289-0055; Fax: 714-289-2149; [email protected]; www.radiuspower.com

Restor Metrology ..............................................................................Booth 230 921 Venture Ave., Leesburg, FL 34748 USA; 877-220-5554; www.restormetrol-ogy.com

Retlif Testing Laboratories................................................................... Page 45795 Marconi Ave., Ronkonkoma, NY 11779 USA; 631-737-1500; Fax: 631-737-1497; [email protected]; www.retlif.com

RF Exposure Lab, LLC ......................................................................Booth 431 2867 Progress Place, Escondido, CA 92029-1531 USA; 760-737-3131; [email protected]; www.rfexposurelab.com

Rohde & Schwarz, Inc.Rohde & Schwarz is one of the world’s largest manufacturers of electronic test & measurement, communications and broadcasting equipment. EMC and EMI test equipment and systems from Rohde & Schwarz determine the causes and effects of electromagnetic in-terference. With decades of in-field EMC and EMI measurement experience, Rohde & Schwarz’s broad EMC & field strength test equipment product portfolio provides accurate results across a wide 3 GHz to 67 GHZ frequency range. Rohde & Schwarz not only of-fers EMC, EMI, EMS and EMF test equipment for pre-compliance and full-compliance measurement, but it also provides customers with complete turnkey systems. Rohde & Schwarz test solutions significantly enhance productivity and product performance by en-abling precise results to be achieved when measuring complex waveforms.

For more information, go to http://www.rohde-schwarz.us/en/prod-ucts/test_and_measurement/emc_field_strength/products/

Page 21 ..................................................................... Booth 217

RTP Company ...................................................................................Booth 3478661A Robert Fulton Drive, Columbia, MD 21046-2265 USA; 410-910-7800; Fax: 410 910-7801; [email protected]; www.rohde-schwarz.com/USA

SSafety & EMC Magazine .................................................................. Booth 655 www.semc.cesi.cn

Schlegel Electronic Materials .......................................................... Booth 534 806 Linden Ave., Suite 100 (14625), Rochester, NY 14602-0310 USA; 585-643-2000; Fax: 585-427-7216; [email protected]; www.schlegelemi.com

Schurter Inc. ....................................................................... Page 17, Booth 426 447 Aviation Blvd., Santa Rosa, CA 95403 USA; 800-848-2600; 707-636-3000; Fax: 707-636-3033; [email protected]; www.schurterinc.com

Sigrity, Inc. .......................................................................................Booth 425900 E. Hamilton Avenue, Suite 500, Campbell, CA 95008 USA; 408-688-0145; Fax: 408-688-0144; [email protected]; www.sigrity.com

Souriau PA&E ...................................................................................Booth 628 434 Olds Station Road, Wenatchee, WA 98801 USA; 509-664-8000; Fax: 509-663-5039; www.pacaero.com

Spectrum AdvancedSpecialty Products Spectrum Advanced Specialty Products, the world leader in EMI filtering products, offers the industry’s broadest line of standard products, including inductors, glass and resin sealed filters, SMT filters, filter plates, filtered connectors, and EMI power filters. As the industry’s only fully

vertically integrated custom solutions and systems provider, Spectrum provides tailored solutions designed to meet the dynamic challenges of your application, whether by modifying an existing component or working from a “clean sheet” approach. Additionally, Spectrum continues grow into new product areas and new markets. New lines include unfiltered and filtered connectors and custom connector harnessing, advanced ceramics and ceramic capacitors, and our modular film capacitors engineered for military and commercial power applications. Put our innovative new products & problem-solving expertise to work for you …Visit our website www.specemc.com or call 814-474-1571.

Page 19 .............................................................................Booth

Spira ManufacturingCorporation – EMI Gaskets & ShieldingExcellence by DesignSpira is AS9100 certified, offering

the finest and most reliable EMI/RFI shielding gaskets and honey-comb filters in the market since 1978. The company was founded by one of the leading EMI design engineers in the industry. Spira’s commitment is to provide quality-engineered products, on-time deliv-ery, superior customer service and technical support. The patented spiral gaskets are easy to use and offer extremely low compression set, long life, and high shielding properties. Our honeycomb filters use a patented process that yields shielding consistent with brass honeycomb material at aluminum prices. New products include an EMI/Environmental Connector-Seal Gasket in front or back mount, and Shielded Honeycomb Fan Filters. Spira Manufacturing Corporation12721 Saticoy Street SouthNorth Hollywood, CA 91605Tel: (818) 764-8222; Fax: (818) 764-9880www.spira-emi.com;[email protected]

Page 33 ..................................................................... Booth 525

SVAD White Sands Missile Range ...................................................Booth 235 TEDT-WSV-EE WSMR NM 88002-5158 USA; 575-678-6107; Fax: 575-678-3999; [email protected]; www.wsmr.army.mil/

Syfer Technology ..............................................................................Booth 828 Old Stoke Road, Arminghall, Norwich, Norfolk, NR14 8SQ, United Kingdom; +44 1603 723300; Fax: +44 1603 723301; [email protected]; www.syfer.com


http://www.retlif.com

http://www.rohde-schwarz.us/en/products/test_and_measurement/emc_field_strength/products.


http://www.schurterinc.com

http://www.spira-emi.com




TTDK Corporation .............................................................................Booth 119 Corporate Headquarters, 525 RXR Plaza, Uniondale, NY USA; 516-535-2600; Fax: 516-294-8318; www.tdk.com

TDK-Lambda Americas Corporation .............................................Booth 342 Corporate Headquarters, 3055 Del Sol Blvd., San Diego, CA 92154 USA; 800-LAMBDA-4 or 800-526-2324; 619-575-4400; Fax: 619-429-1011; www.us.tdk-lambda.com/

Tech-Etch, Inc. ..................................................................................... Page 61 45 Aldrin Road, Plymouth, MA 02360 USA; 508-747-0300; Fax: 508-746-9639; www.tech-etch.com

Techmaster Electronics, Inc. ............................................................Booth 624 Corporate Headquarters, San Diego Laboratory, 2453 Cades Way, Bldg C, Vista, CA USA; 760-536-0227; Fax: 760-536-0234; [email protected]; www.techmasterelectronics.com

TESEQ, Inc. ........................................................................ Page 55, Booth 317 52 Mayfield Ave., Edison, NJ 08837 USA; 888-417-0501; 732-417-0501; Fax: 732-417-0511; [email protected]; www.teseq.com

Test Equipment Repair ..................................................... Page 79, Booth 651 5965 Shiloh Road East, Alpharetta, GA 30005 USA; 678-965-4660; Fax: 678-965-4659; www.testequipmentrepair.com

Thermo Fisher Scientific...................................................................Booth 730 1 Lowell Research Center, Lowell, MA 01852 USA; 978-275-0800; Fax: 978-275-0850; [email protected]; www.thermofisher.com/global/en/home.asp

3M ......................................................................................................Booth 123 Corporate Headquarters, 3M Center, St. Paul, MN 55144-1000 USA; 888-364-3577; www.3m.com

Timco Engineering, Inc. ...................................................................Booth 232 849 NW State Road 45, Newberry, FL 32669 USA; 888-472-2424; 352-472-5500; Fax: 352-472-2030; [email protected]; www.timcoengr.com

Transient Specialists, Inc. .................................................................Booth 533 7704 S. Grant Street, Burr Ridge, IL USA; 866-EMI-RENT; 630-887-0329; www.transientspecialists.com

TUV Rheinland of North America, Inc. ..........................................Booth 646 12 Commerce Road, Newtown, CT 06470 USA; 888-743-4652; 203-426-0888; Fax: 203-426-4009; [email protected]; www.tuv.com

628 LeVander WayS. St. Paul, MN 55075

CONSuLTANT SERvICES

TÜV SÜD America Inc. ....................................................................Booth 422 1775 Old Highway 8 NW, Suite #104, New Brighton, MN 55112 USA; 651-631-2487; Fax: 651-638-0285; [email protected]; www.TUVamerica.com

2COMU .............................................................................................Booth 338 Computer and Communication Unlimited Headquarters, 106 Fairfield Drive, State College, PA 16801 USA; 814-466-6829; Fax: 814-466-7121; [email protected]; www.2comu.com/

u

Universal Shielding Corp. ...............................................................Booth 724 Deer Park, NY USA; 631-667-7900; [email protected]; www.uni-versalshielding.com/

v

Vanguard Products Corp. ................................................................Booth 529 87 Newtown Road, Danbury, CT 06810 USA; 203-744-7265; Fax: 203-798-2351; [email protected]; www.vanguardproducts.com

Vermillion, Incorporated .................................................................Booth 451 4754 South Palisade, Wichita, KS 67217 USA; 316-524-3100; [email protected]; www.vermillioninc.com

VTI Vacuum Technologies, Inc. ......................................................Booth 454 1215 Industrial Ave., Reedsburg, WI 53959 USA; 800-613-7296; Fax: 608-524-9722; www.vactecinc.com

W

WEMS Electronics ............................................................................Booth 847 4650 West Rosecrans Ave., Hawthorne, CA 90250 USA; 310-644-0251; Fax: 310-644-5334; [email protected] www.wems.com/

Wurth Electronics Midcom ..............................................................Booth 645 121 Airport Drive, PO Box 1330, Watertown, SD 57201 USA; 605-886-4385; Fax: 605-886-4486; [email protected]; www.we-online.com

http://www.emiguru.com

http://www.tech-etch.com


http://www.teseq.com


[ product finder ]this product finder lists more than 100 products and services offered by exhibitors and advertisers in this publication to help you find the EMC equipment, components and services you are looking for. Full details of all the suppliers listed within each category can be found in the Company Profiles beginning on Page 65.

Absorber ClAmps ETS-Lindgren ...................................................................... Fischer Custom Communications ......................................

Absorptive filtersInstruments for Industry (IFI) .............................................

AmplifiersAE Techron Inc. ...................................................................Communications & Power Ind. (CPI) .................................

AneChoiC ChAmber testing Electronics Test Centre (ETC) - Kanata ............................ETS-Lindgren ...................................................................... MET Laboratories Inc. ........................................................National Technical Systems (NTS) ................................... TÜV SÜD America Inc. .......................................................

AneChoiC ChAmbers Advanced Test Equipment Rentals ...................................AR RF / Microwave Instrumentation ................................Braden Shielding Systems, LLC .........................................Cuming-Lehman Chambers................................................National Technical Systems ..............................................V Technical Textiles, Inc./Shieldex U.S. ...........................

AneChoiC mAteriAls ETS-Lindgren ......................................................................Fair-Rite Products Corp. .....................................................Leader Tech, Inc. .................................................................

AntennAsA.H. Systems, Inc.Applied Electromagnetic Technology ...............................Com-Power Corporation ....................................................Intelligent RF .......................................................................TDK Corporation .................................................................TDK-Lambda Americas ......................................................

AntennA filtersSpectrum Advanced Specialty Products ..........................

AntennA mAstsETS-Lindgren ......................................................................Rohde & Schwarz, Inc. .......................................................

Automotive testingNational Technical Systems ..............................................TESEQ, Inc. ..........................................................................

bellCore testing, (see telCordiA)

biConiCAl AntennAsA.H. Systems, Inc.National Technical Systems ..............................................TESEQ, Inc. ..........................................................................

bidireCtionAl CouplersInstruments for Industry (IFI) .............................................

ConduCtive mAteriAlsAlco Technologies...............................................................3M Electrical Markets Division .........................................A-Jin Electron .....................................................................ARC Technologies, Inc. .......................................................EMI-tec Elektronische Materialien GmbH .......................Intermark (USA) Inc. ...........................................................Schlegel Electronic Materials Inc. ....................................

ConduCtive tApesLeader Tech, Inc. .................................................................

ConsultAntsEMCOS Consulting and Software.....................................EMI Software LLC ..............................................................ETS-Lindgren ......................................................................ITEM Publications / Interference Technology ..................Leader Tech, Inc. .................................................................Montrose Compliance Services ........................................TÜV SÜD America Inc. .......................................................

Current probesA.H. Systems, Inc. ..............................................................Advanced Test Equipment Rentals ...................................Fischer Custom Communications, Inc. ..............................Rohde & Schwarz, Inc. .......................................................TESEQ, Inc. ..........................................................................

design softwAreAR RF / Microwave Instrumentation ................................CST of America, Inc. ...........................................................

die Cut shielding mAteriAlLeader Tech, Inc. .................................................................Spira Manufacturing Corp. ................................................Tech-Etch, Inc. .....................................................................

direCt lightning testingNational Technical Systems ..............................................TÜV SÜD America Inc. .......................................................

e-field AntennAs A.H. Systems, Inc. ..............................................................Advanced Test Equipment Rentals ...................................AR RF / Microwave Instrumentation ................................Instruments for Industry (IFI) .............................................Rohde & Schwarz, Inc. .......................................................

emi gAsketsEMI-tec Elektronische Materialien GmbH .......................Leader Tech, Inc. .................................................................Spectrum Advanced Specialty Products ..........................Spira Manufacturing Corp. ................................................Tech-Etch, Inc. .....................................................................V Technical Textiles, Inc./Shieldex U.S. ..........................

emi reCeiversAdvanced Test Equipment Rentals ...................................Agilent Technologies, Inc. ..................................................AR RF / Microwave Instrumentation ................................ETS-Lindgren ......................................................................Rohde & Schwarz, Inc. .......................................................

boArd level shields Leader Tech, Inc. .................................................................Tech-Etch, Inc. .....................................................................

books/publiCAtions, emi/emC relAted ENR / Seven Mountains Scientific ....................................Evaluation Engineering ......................................................IN Compliance Magazine ...................................................ITEM Publications / Interference Technology ..................Microwave Journal ............................................................Safety & EMC Magazine ...................................................

broAdbAnd emi deteCtorsAdvanced Test Equipment Rentals ...................................Agilent Technologies, Inc. ..................................................ETS-Lindgren ......................................................................

CAbles & ConneCtorsApplied EM Technology & EMS-PLUS ..............................Filconn Inc. ..........................................................................Laird Technologies ..............................................................Quell Corp. ...........................................................................Wurth Electronics Midcom Inc. .........................................

CAlibrAtion serviCesA.H. Systems, Inc. ..............................................................Advanced Test Equipment Rentals ...................................Fischer Custom Communications, Inc. ..............................IFI - Instruments for Industry .............................................National Technical Systems ..............................................Techmaster Electronics, Inc. ..............................................TESEQ, Inc. ..........................................................................TÜV SÜD America Inc. .......................................................

CertifiCAtion serviCesElectronics Test Centre (ETC) - Kanata ............................MET Laboratories Inc. ........................................................National Technical Systems ..............................................TÜV SÜD America Inc. .......................................................

CoAxiAl filter ConneCtors Curtis Industries/ Filter Networks ...................................Spectrum Advanced Specialty Products ..........................

Competent / Certified ACCrediting bodies testing

MET Laboratories Inc. ........................................................

Computer-Aided AnAlysis serviCesApache Design Solutions ...................................................CST of America, Inc. ...........................................................Electronics Test Centre (ETC) - Kanata ............................ETS-Lindgren ......................................................................National Technical Systems ..............................................TÜV SÜD America Inc. .......................................................

ConduCtive ClothLeader Tech, Inc. .................................................................V Technical Textiles, Inc./Shieldex U.S. ..........................


[ product finder ]TESEQ, Inc. ..........................................................................

emi test AntennAs A.H. Systems, Inc. ..............................................................Advanced Test Equipment Rentals ...................................AR RF / Microwave Instrumentation ................................ETS-Lindgren ......................................................................Instruments for Industry (IFI) .............................................Rohde & Schwarz, Inc. .......................................................

emissions testingNational Technical Systems ..............................................Retlif Testing Laboratories ................................................TÜV SÜD America Inc. .......................................................

emp/lightning effeCts testing MET Laboratories Inc. ........................................................National Technical Systems ..............................................TESEQ, Inc. ..........................................................................TÜV SÜD America Inc. .......................................................

emp generAtorsEM TEST USA .....................................................................EMC Partner AG..................................................................Fischer Custom Communications, Inc. ..............................

emp simulAtorsAdvanced Test Equipment Rentals ...................................EM TEST USA .....................................................................Fischer Custom Communications, Inc. ..............................

environmentAl testingTÜV SÜD America Inc.

esd generAtors Advanced Test Equipment Rentals ...................................EM TEST USA .....................................................................EMC Partner AG..................................................................Fischer Custom Communications, Inc ............................... TESEQ, Inc. ..........................................................................TÜV SÜD America Inc. .......................................................

europeAn CertifiCAtion testing National Technical Systems ..............................................TÜV SÜD America Inc. .......................................................

fACilities & shielded enClosure serviCes

ETS-Lindgren ......................................................................Universal Shielding Corp....................................................V Technical Textiles, Inc./Shieldex U.S. ..........................

fCC pArts 15 & 18 testing National Technical Systems ..............................................TÜV SÜD America Inc. .......................................................

fCC pArt 68 testingAdvanced Test Equipment Rentals ...................................EM TEST USA .....................................................................National Technical Systems ..............................................

feed-through filters Curtis Industries/ Filter Networks ....................................EMI Filter Company ............................................................Quell Corp. ...........................................................................Spectrum Advanced Specialty Products ..........................Tri-Mag, Inc. ........................................................................

ferrite beAds & CoresFair-Rite Products Corp. .....................................................Leader Tech, Inc. .................................................................

ferrite suppression Components Fair-Rite Products Corp. .....................................................Intermark (USA) Inc. ...........................................................Leader Tech, Inc. .................................................................Spectrum Advanced Specialty Products ..........................

fiber optiC CAbles/systemsAdvanced Test Equipment Rentals ...................................Fischer Custom Communications, Inc. ..............................Michigan Scientific Corp. ...................................................

field intensity meters Advanced Test Equipment Rentals ...................................ETS-Lindgren ......................................................................Instruments for Industry (IFI) .............................................

filter ArrAys Curtis Industries/ Filter Networks ....................................Quell Corp. ...........................................................................Spectrum Advanced Specialty Products ..........................

filter CApACitors Curtis Industries/ Filter Networks ....................................EMI Filter Company ............................................................Quell Corp. ...........................................................................Spectrum Advanced Specialty Products ..........................

filter Chokes Curtis Industries/ Filter Networks ....................................Fair-Rite Products Corp. .....................................................Schurter, Inc. .......................................................................

filter Coils Curtis Industries/ Filter Networks ....................................Schurter, Inc. .......................................................................

filter ConneCtors Spectrum Advanced Specialty Products ..........................

filter modulesCurtis Industries/ Filter Networks ....................................Schurter, Inc. ......................................................................Spectrum Advanced Specialty Products ..........................

filter pins/pin ConneCtorsEMI Filter Company ............................................................Quell Corp. ...........................................................................Spectrum Advanced Specialty Products ..........................

filtered power entry modules Americor ..............................................................................Curtis Industries/ Filter Networks ....................................Schurter, Inc. .......................................................................Spectrum Advanced Specialty Products ..........................Tri-Mag, Inc. ........................................................................V Technical Textiles, Inc./Shieldex U.S. ..........................

filters Americor ..............................................................................Captor Corporation .............................................................Curtis Industries / Filter Networks ...................................EMI Filter Company ............................................................Genisco Filter Corp. ............................................................

Jiangsu WEMC Technology Co. Ltd. .................................Radius Power Inc. ...............................................................Souriau PA&E ......................................................................Syfer Technology Ltd. .........................................................WEMS Electronics .............................................................

gtem CellsFischer Custom Communications, Inc. ..............................Instruments for Industry (IFI) .............................................Rohde & Schwarz, Inc ........................................................

h field AntennAsA.H. Systems, Inc. ..............................................................AR RF / Microwave Instrumentation ................................Instruments for Industry (IFI) ............................................. Rohde & Schwarz, Inc. .......................................................

helmholtz CoilsETS-Lindgren ......................................................................Fischer Custom Communications, Inc. ..............................

honeyComb shieldingLeader Tech, Inc. .................................................................Spira Manufacturing Corp. ................................................Tech-Etch, Inc. .....................................................................V Technical Textiles, Inc./Shieldex U.S. ..........................

horn AntennAsA.H. Systems, Inc. ..............................................................Advanced Test Equipment Rentals ...................................AR RF / Microwave Instrumentation ................................ETS-Lindgren ......................................................................Instruments for Industry (IFI) .............................................Rohde & Schwarz, Inc. .......................................................TESEQ, Inc. ..........................................................................

immunity testing A.H. Systems, Inc. ..............................................................National Technical Systems ..............................................Retlif Testing Laboratories ................................................TESEQ, Inc. ..........................................................................TÜV SÜD America Inc. .......................................................

impulse generAtorsAdvanced Test Equipment Rentals ...................................AR RF / Microwave Instrumentation ................................EM TEST USA .....................................................................EMC Partner AG..................................................................TESEQ, Inc. ..........................................................................

induCed Current meters & probesAR RF / Microwave Instrumentation ................................ETS-Lindgren ......................................................................

induCtorsCurtis Industries/ Filter Networks ....................................Schurter, Inc. .......................................................................

interferenCe generAtorsAdvanced Test Equipment Rentals ...................................EMC Partner AG..................................................................

isotropiC field sensorsETS-Lindgren ......................................................................Instruments for Industry (IFI) .............................................


[ product finder ]lightning generAtors

Advanced Test Equipment Rentals ...................................EM TEST USA .....................................................................EMC Partner AG..................................................................Fischer Custom Communications, Inc. ..............................

lightning simulAtorsAdvanced Test Equipment Rentals ...................................EM TEST USA .....................................................................Fischer Custom Communications, Inc. ..............................

lightning strike testingNational Technical Systems ..............................................Retlif Testing Laboratories ................................................TÜV SÜD America Inc. .......................................................

line impedAnCe stAbilizAtion networks (lisns/plisns)

TESEQ, Inc. ..........................................................................

log periodiC AntennAsA.H. Systems, Inc. ..............................................................Advanced Test Equipment Rentals ...................................AR RF / Microwave Instrumentation ................................Instruments for Industry (IFI) .............................................Rohde & Schwarz, Inc. .......................................................

mAgnetiC field probes/meters AR RF / Microwave Instrumentation ................................ETS-Lindgren ......................................................................Fischer Custom Communications, Inc ...............................Rohde & Schwarz, Inc. .......................................................

mAgnetiC shielding gAsketsSpectrum Advanced Specialty Products ..........................Spira Manufacturing Corp. ................................................

miCrowAve AbsorbersLeader Tech, Inc. .................................................................

miCrowAve filters EMI Filter Company ............................................................Instruments for Industry (IFI) .............................................Spectrum Advanced Specialty Products ..........................V Technical Textiles, Inc./Shieldex U.S. ..........................

miCrowAve power Amplifiers Advanced Test Equipment Rentals ...................................AR RF / Microwave Instrumentation ................................Instruments for Industry (IFI) .............................................MILMEGA Ltd .....................................................................Ophir RF ...............................................................................

mil-std 188/125 testingMET Laboratories Inc. ........................................................National Technical Systems ..............................................

mil-std 461/462 testing National Technical Systems ..............................................TÜV SÜD America Inc. .......................................................

mobile shielded roomsAdvanced Test Equipment Rentals ...................................

monopole AntennAsInstruments for Industry (IFI) .............................................Rohde & Schwarz, Inc. .......................................................

mri shieldingETS-Lindgren ......................................................................Leader Tech, Inc. .................................................................Mushield Company .............................................................V Technical Textiles, Inc./Shieldex U.S. ..........................

nAvlAp / A2lA Approved testing National Technical Systems ..............................................TÜV SÜD America Inc. .......................................................

network AnAlyzersAgilent Technologies, Inc. ..................................................

pArAllel plAte line test setETS-Lindgren ......................................................................Fischer Custom Communications, Inc. ..............................Rohde & Schwarz, Inc. .......................................................

portAble test equipmentA.H. Systems, Inc. ..............................................................Advanced Test Equipment Rentals ...................................Instruments for Industry (IFI) .............................................

power line filters Curtis Industries/ Filter Networks ....................................Schurter, Inc. .......................................................................V Technical Textiles, Inc./Shieldex U.S. ..........................

printed CirCuit boArd filtersCurtis Industries/ Filter Networks ....................................Schurter, Inc. .......................................................................Spectrum Advanced Specialty Products ..........................Tri-Mag, Inc. ........................................................................

produCt sAfety testingNational Technical Systems ..............................................Retlif Testing Laboratories ................................................TÜV SÜD America Inc. .......................................................

rAdiAtion hAzArd meters/probesAdvanced Test Equipment Rentals ...................................ETS-Lindgren ......................................................................Instruments for Industry (IFI) .............................................

retrofit filters & ConneCtorsCurtis Industries/ Filter Networks ....................................Quell Corp. ...........................................................................Schurter, Inc. .......................................................................V Technical Textiles, Inc./Shieldex U.S. ..........................

rf power AmplifiersAdvanced Test Equipment Rentals ...................................AR RF / Microwave Instrumentation ................................Instruments for Industry (IFI) .............................................MILMEGA Ltd .....................................................................Ophir RF ...............................................................................TESEQ, Inc. ..........................................................................

rf power metersAR RF / Microwave Instrumentation ................................ETS-Lindgren ......................................................................Rohde & Schwarz, Inc. .......................................................

rf shielding gAsketsSpectrum Advanced Specialty Products ..........................Spira Manufacturing Corp. ................................................Tech-Etch, Inc. .....................................................................

rf shielding mAteriAlRTP Company ......................................................................Spectrum Advanced Specialty Products ..........................Spira Manufacturing Corp. ................................................Tech-Etch, Inc. .....................................................................V Technical Textiles, Inc./Shieldex U.S. ..........................

rs03<200 v/meter testingNational Technical Systems ..............................................TÜV SÜD America Inc. .......................................................

rtCA do-160 testingNational Technical Systems ..............................................Retlif Testing Laboratories ................................................TÜV SÜD America Inc. .......................................................

sCif design, ConstruCtion, & mAintenAnCe

ETS-Lindgren ......................................................................

shielded Air filters ETS-Lindgren ......................................................................Leader Tech, Inc. .................................................................Spira Manufacturing Corp. ................................................Tech-Etch, Inc. .....................................................................

shielded buildingsAdvanced Test Equipment Rentals ...................................ETS-Lindgren ......................................................................MET Laboratories Inc. ........................................................V Technical Textiles, Inc./Shieldex U.S. ...........................

shielded ComponentsSchurter, Inc. .......................................................................Spira Manufacturing Corp. ................................................Tech-Etch, Inc. .....................................................................

shielded doorsETS-Lindgren ......................................................................V Technical Textiles, Inc./Shieldex U.S. ..........................

shielded fAnsETS-Lindgren ......................................................................Leader Tech, Inc. .................................................................Spira Manufacturing Corp. ................................................Tech-Etch, Inc. .....................................................................

shielded room filtersETS-Lindgren ......................................................................V Technical Textiles, Inc./Shieldex U.S. ..........................

shielded roomsAdvanced Test Equipment Rentals ...................................Applied Electromagnetic Technology ...............................Braden Shielding Systems .................................................ETS-Lindgren ......................................................................Panashield ...........................................................................

shielded rooms/ACCessoriesLeader Tech, Inc. .................................................................National Technical Systems ..............................................V Technical Textiles, Inc./Shieldex U.S. ..........................

shielded rooms / leAk deteCtorsETS-Lindgren ......................................................................


[ product finder ]AR RF / Microwave Instrumentation ................................EM TEST USA .....................................................................ETS-Lindgren ......................................................................Fischer Custom Communications, Inc ...............................Instruments for Industry (IFI) .............................................Ophir RF ...............................................................................Rohde & Schwarz, Inc. .......................................................TESEQ, Inc. ..........................................................................

test equipment, leAsing & rentAlA.H. Systems, Inc. ..............................................................Advanced Test Equipment Rentals ...................................AR RF / Microwave Instrumentation ................................Avalon Equipment Corporation .........................................Instruments for Industry (IFI) .............................................TESEQ, Inc. ..........................................................................

test equipment, repAir & CAlibrAtionA.H. Systems, Inc ...............................................................Advanced Test Equipment Rentals ...................................Agilent Technologies, Inc. ..................................................ETS-Lindgren ......................................................................Fischer Custom Communications, Inc. ..............................Instruments for Industry (IFI) Inc. ......................................TESEQ, Inc. ..........................................................................Test Equipment Repair .......................................................

test instrumentAtionA.H. Systems, Inc. ..............................................................Aeroflex ...............................................................................Amber Precision Instruments, Inc. ....................................Axiom Test Equipment Inc. ................................................Brightking Electronics Inc. .................................................Compatible Electronics Inc. ...............................................EMC Partner ........................................................................EMI Instrumentation ..........................................................Haefely EMC ......................................................................HV Technologies Inc. ..........................................................Noise Laboratory Company Ltd. ........................................Pearson Electronics Inc. .....................................................Thermo Fisher Scientific ....................................................

testingA.H. Systems, Inc. ..............................................................Apache Design Solutions ...................................................

shielded tubingMushield Company .............................................................

shieldingAR Tech Engineered Fabric Products ................................Chomerics, a Div. of Parker Hannifin Corp. .......................Intermark (USA) Inc. ...........................................................Isodyne, Inc. ........................................................................Metal Textiles Corp. ...........................................................Mushield Company .............................................................Quell Corp. ...........................................................................Vanguard Products Corp. ...................................................Vermillion Inc. .....................................................................VTI Vacuum Technologies Inc. ...........................................

shielding effeCtiveness testingETS-Lindgren ......................................................................Leader Tech, Inc. .................................................................National Technical Systems ..............................................Retlif Testing Laboratories ................................................TÜV SÜD America Inc. .......................................................

shielding, mAgnetiC fieldSilk Metallic Corporation ...................................................Spira Manufacturing Corp. ................................................

signAl generAtorsAdvanced Test Equipment Rentals ...................................Agilent Technologies, Inc ...................................................AR RF / Microwave Instrumentation ................................Rohde & Schwarz, Inc. .......................................................

signAl line filtersCurtis Industries/ Filter Networks ....................................EMI Filter Company ............................................................ETS-Lindgren ......................................................................Spectrum Advanced Specialty Products ..........................V Technical Textiles, Inc./Shieldex U.S. ..........................

site AttenuAtion testingETS-Lindgren ......................................................................MET Laboratories Inc. ........................................................National Technical Systems ..............................................

site survey serviCes ETS-Lindgren ......................................................................National Technical Systems ..............................................

softwAre, emi/emC relAted2comu ..................................................................................ANSYS, Inc. (Ansoft Products) ..........................................Delcross Technologies, LLC ...............................................Detectus (Interfax) .............................................................Electro-Magnetic Applications, Inc. .................................EM Software & Systems (USA) - FEKO ............................EMSCAN .............................................................................Moss Bay EDA ....................................................................NEXIO ..................................................................................Sigrity, Inc. ..........................................................................

solid-stAte AmplifiersAR RF / Microwave Instrumentation ................................Instruments for Industry (IFI) .............................................MILMEGA Ltd .....................................................................

speCtrum AnAlyzersAgilent Technologies, Inc. ..................................................

Rohde & Schwarz, Inc. .......................................................

stAndArds trAnslAtionsANDRO Computational Solutions, LLC .............................TÜV SÜD America Inc. .......................................................

stAtiC Control mAteriAls & equipment

Advanced Test Equipment Rentals ...................................

suppressorsFair-Rite Products Corp. .....................................................Fischer Custom Communications, Inc. ..............................

telCordiA testingMET Laboratories Inc. ........................................................National Technical Systems ..............................................TÜV SÜD America Inc. .......................................................

teleCommuniCAtions test networksAdvanced Test Equipment Rentals ...................................Agilent Technologies, Inc. ..................................................Ophir RF ...............................................................................

tem CellsAdvanced Test Equipment Rentals ...................................ETS-Lindgren ......................................................................Fischer Custom Communications, Inc. ..............................Instruments for Industry (IFI) .............................................Rohde & Schwarz, Inc. .......................................................TESEQ, Inc. ..........................................................................

tempest filtersCurtis Industries/ Filter Networks ....................................Spectrum Advanced Specialty Products ..........................

tempest testing/ test equipmentA.H. Systems, Inc. ..............................................................Advanced Test Equipment Rentals ...................................Fischer Custom Communications, Inc. ..............................National Technical Systems ..............................................Rohde & Schwarz, Inc. .......................................................

test ACCessoriesA.H. Systems, Inc. ..............................................................Advanced Test Equipment Rentals ...................................

Long Beach Convention Center (Courtesy of Long Beach Convention & Visitors Bureau)


[ product finder ]Boeing ..................................................................................Bose Corporation ................................................................DNB Engineering, Inc .........................................................Electronics Test Centre (ETC) - Kanata ............................Jacobs Technology ............................................................NAVAIR ................................................................................Nemko USA Inc. ..................................................................NEXIO ..................................................................................Northwest EMC Inc. ...........................................................Restor Metrology................................................................Retlif Testing Laboratories ................................................RF Exposure Lab LLC ..........................................................SVAD White Sands Missile Range ...................................Timco Engineering Inc. .......................................................TUV Rheinland of North America, Inc. .............................TUV SUD America Inc. .......................................................

testing lAborAtoriesAberdeen Test Center ........................................................Chamber Services Inc. .......................................................CKC Laboratories Inc. .........................................................

D.L.S. Electronics Systems Inc. .........................................Dayton T. Brown .................................................................Elite Electronic Engineering Inc. ........................................Liberty Labs Inc.-World Cal Inc. ........................................National Technical Systems ..............................................Retlif Testing Laboratories ................................................TÜV SÜD America Inc. .......................................................

trAining, seminArs, & workshops A2LA, American Association for Laboratory Accredita-tion .......................................................................................China Electrotechnical Society (CES) ...............................CST of America, Inc. ...........................................................Kimmel Gerke Associates, Ltd. .........................................Leader Tech, Inc. .................................................................TESEQ, Inc. ..........................................................................TÜV SÜD America Inc. .......................................................

trAnsient deteCtion & meAsuring equipment

Advanced Test Equipment Rentals ...................................

AR RF / Microwave Instrumentation .....................

trAnsient generAtorsAdvanced Test Equipment Rentals ...................................AR RF / Microwave Instrumentation ................................EM TEST USA .....................................................................EMC Partner AG..................................................................Fischer Custom Communications, Inc. ..............................TESEQ, Inc. ..........................................................................Transient Specialists, Inc. .................................................

trAveling wAve tube AmplifiersAR RF / Microwave Instrumentation ................................Instruments for Industry (IFI) .............................................

voltAge probesAdvanced Test Equipment Rentals ...................................Fischer Custom Communications, Inc. ..............................Rohde & Schwarz, Inc. .......................................................

wire & CAble filtersSpectrum Advanced Specialty Products ..........................

interferencetechnology.com INTERFERENCE TECHNOLOGY 77

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Tuesday, August 16 [ 10:00 AM - 5:00 PM ]

Chair: Randy Flinders, RTF Compliance, Rancho Santa Margarita, CA, USA Method to Calculate the Positional Sensitivity of a Rogowski CoilM. J. Hagmann, NewPath Research LLC, Salt Lake City, UTNon-invasive Measurement of the Distribution of Current with a Set of Sinusoidally-Wound Toroidal Coils.M. J. Hagmann, NewPath Research LLC, Salt Lake City, UTIntegration of Wireless Communications with ModernizedPower Grids: EMI Impacts and ConsiderationsQ. Yu, Alcatel-Lucent USA, Columbus, OH, USA; R. J. John-son, Alcatel-Lucent USA, Murray Hill, NJ, USAA Method for Measuring Partial InductanceH. J. Song and Y. Yoon, HRL Laboratories, LLC., Malibu, CA, USA; M. A. Steffka, University of Michigan, Dearborn, MI, USA; J. Campbell and R. Young, General Motors Corp., Tor-rance, CA, USAMold-based Compartment Shielding to Mitigate theIntra-system Coupled Noise on SiP ModulesC. Hsiao, C. Huang, C. Wang, K. Liao, C. Shen, C. Wang, and T. Wu, National Taiwan University, Taipei, TaiwanPower Noise Suppression Using Embedded CapacitanceMaterial and Electromagnetic BandGapX. Yu, Huawei Technologies Co., Ltd, Shanghai, China; Q. Chen, 3M China Co., Ltd., Shanghai, ChinaCompensation of CM Voltage in Interfaces for LV Distrib-uted GenerationR. Smolenski, M. Jarnut, A. Kempski, and G. Benysek, Uni-versity of Zielona Gora, Zielona Gora, PolandNumerical Simulation of Blood Vascularization Infl uence in Microwave AblationV. De Santis and M. Feliziani, University of L’Aquila, L’Aquila, Italy; F. Maradei, Sapienza University, Rome, Italy

Advanced Simplifi ed Algorithm for Electromagnetic FieldComputation in the Radiating Near Field of BTS AntennasA. Carta and D. Trinchero, Politecnico di Torino, Turin, ItalyA Capacitor Selector Tool for On-Board PDN Designs inMultiGigabit ApplicationsF. Carri-Argos, V. Gonzílez Millín, E. Sanchis Peris, J. Blasco Igual, and F. Egea Canet, University of Valencia, Burjassot, Spain; D. Barrientos Turrin, IFICUV, Paterna, SpainTransmission Characteristics of a Coaxial Through-sili-con Via InterconnectW. S. Zhao and W. Y. Yin, Zhejiang University, Hangzhou, China; Y. X. Guo, National University of Singapore, SingaporeAnalytical Expressions for Maximum Transferred Power in Wireless Power Transfer SystemsS. Kong, M. Kim, K. Koo, S. Ahn, B. Bae, and J. Kim, KAIST, Daejeon, Republic of KoreaAnalysis of the Source Bus Line Current in LCD Panel Based on a New MSL ModelM. Yamaguchi and S. Dhungana, Tohoku University, Sendai, JapanThe Test Verifi cation and Comparison of SAE-ARP-1173 and MIL-DTL-83528C for EMI Gaskets CharacterizationS. Jing and Q. Jiang, EMC Laboratory, Southeast University, Nanjing, China; W. Wang and J. Huang, China Aero-Polytech-nology Establishment, Beijing, China; C. Liu, Nanjing Institute of Electronic Technology, Nanjing, ChinaPrediction and Reduction of Electromagnetic ConductedEmission in Active Clamp Forward ConverterY. Zhou, Y. F. Zhu, Q. L. Song, Z. G. Jin, and D. Yang, Huawei Technologies, ShenZhen, ChinaThe Rationale to Defi ne when EMC Antennas shall beCalibratedA. Tacchini, B. Audone, and D. Grossi, Reggio Emilia In-novazione, Reggio Emilia, Italy

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Welcome ReceptionAT THE AQUARIUM OF THE PACIFIC7-10 PM, Tuesday, Aug. 16 Join your fellow attendees for a private journey of discovery through the world’s largest ocean at the Aquarium of the Pacific in Long Beach, California. Explore our exhibits and discover sunny Southern California and Baja, the frigid waters of the North Pacific, and the colorful reefs of the Tropical Pacific. Come face-to-face with, and even touch, the ocean’s ultimate predators in Shark Lagoon. And, hand feed lorikeet birds. This event is included in all Full, 5 Day Technical Registra-tions and Companion Program Registrations. All others may purchase a ticket to the Welcome Reception (includes two drink coupons) as an add-on cost to your registration. The Aquarium is a 10-minute walk from the Convention Center. There is a limited, free, Long Beach Shuttle Service to the Aquarium, every 10 minutes from 9:00 AM to midnight on Passport Bus C, boarding directly in front of the Conven-tion Center.

Gala Evening EventON THE QUEEN MARY6-10 PM, Wednesday, Aug. 176:30-8 PM, dinner; 5:15-10:30 PM, round-trip shuttle service, Convention Center to Queen MaryStep back in time for an elegant evening on the ‘High Seas’ and experience what travel was like on board an authentic steamship filled with original art deco fixtures that will bring you back to the ‘30s.Casting an impressive figure against the Long Beach, Cali-fornia skyline, the Queen Mary offers visitors the chance to experience firsthand one of the world's most renowned and remarkable ocean liners. From the time of her Maiden Voyage in 1936, the Queen Mary was regarded as the only way to travel by the elite of high society, carrying some of the world’s most preeminent movie stars, business moguls, politicians, and royalty across the Atlantic. Drafted into ser-vice as a troop carrier, the elegant ship was painted grey from top to bottom so she could travel the seas unseen, and was deemed the Grey Ghost due to her camouflage appearance. During World War II she carried over 750,000 soldiers across more than 500,000 miles of ocean and played a significant role in the success of the Allied Forces. After the war, the Queen Mary was restored to her former glory and reentered passenger service until she was retired to her new home in Southern Cali-fornia in 1967.As you proceed to the stern for din-ner, take your time perusing the his-toric original photos of Hollywood stars, dignitaries, and troops. This event is included in all full 5 day Technical Regis-trations. All others may purchase a ticket to the Gala (includes two drink coupons) as an add-on cost to your registration.

Social EventsIEEE EMC SYMPOSIUM GOLD EVENT8-9:30 PM, Tuesday, Aug. 16The IEEE EMC Society is excited to invite you to the first ever IEEE EMC Symposium Graduates of the Last Decade (GOLD) Event. If you graduated from your first professional degree program within the last ten years, then you are eli-gible to register for the EMC symposium GOLD Event. The first ten years after graduating from your first professional degree can be very challenging. It is common for young and recent graduates to be searching for employment, planning their professional growth and career development, and changing their life status.Come and join us for a fun evening where you will learn more about GOLD, have an opportunity to enter in a raffle and take part in an ice cream social following the welcome reception. This is a great opportunity for you to meet other young professionals, exchange contacts, discuss stories of work (and perhaps find out how similar the stories are, no matter where you work) and your hobbies. You will also have the opportunity to mingle with members of the EMC Society Board of Directors. If volunteering is your thing, we have a number of volunteer opportunities in GOLD EMC.Not enough? Also join us on Wednesday during our first GOLD session where you will hear from some remarkable speakers in the EMC field. I hear they will be offering guid-ance on how to get ahead at work, how to market yourself and much more.

HAM RADIO LUNCHNoon-1:30 PM, Wednesday, Aug. 17You are invited to the HAM Radio Lunch for an opportunity to share past stories and interesting information. Please join Jo (K3SJS) and Tom (W3IA) Chesworth and Ed Hare from the ARRL. You will be able to buy a lunch inside the conven-tion center for $12 and bring it to our meeting. We ended up last year with several "talking" ideas. More information to follow. So we may have a head count and contact informa-tion, please call Jo at (814) 466-6559 or email [email protected].

AWARDS LUNCHEON12:30-2:00 PM, Thursday, Aug. 18

The Exhibit Hall will be closed starting at 1:00 PM, and the technical program will be on break during the awards lun-cheon. The Awards Luncheon will be the last formal opportunity to gather and network with family of EMC professionals from academia, industry, government, military, and retired. The event will start off with a catered sit-down served meal. Afterwards, the EMC Society will take time to recognize members and non-members for their contribution to the society and professional excellence.

Networking events offer attendees times and places to network with their peers in the industry and recognize those who have achieved excellence or contributed to the EMC profession.

T78 interference technology emc SympoSium guide 2011

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For those with a Full Technical Registration (member, non-member, life members, retired, unemployed or student). All others may purchase a ticket to the Luncheon as an add-on cost to your registration.

JET PROPULSION LABORATORY (JPL) TECHNICAL TOURNoon-6:30 PM, Friday, Aug. 19The technical tour begins in the von Karman auditorium where attendees will get an overview / history of JPL and watch the movie Journey to the Planets and Beyond. From there, the visitors will enjoy the von Karman museum, which exhibits models of spacecraft, touch-screen monitors, and items such as meteorites from the comet Vesta and a moon rock. Two fa-cilities that are often visited on a tour of JPL are the Spacecraft Assembly Facility and the Space Flight Operations Facility. The Spacecraft Assembly Facility is where the JPL technicians and engineers assemble the spacecraft. The Spacecraft Assembly Facility is a clean room facility. It is a class 10,000 room, which means per cubic foot there are 10,000 or fewer dust particles. Technicians and engineers wear “bunny suits” to keep the spacecraft from coming in contact with hair and skin. The Space Flight Operations Facility is where JPL has the Deep Space Network. Developed and managed by JPL, the Deep Space Network monitors radio transmissions to determine the health and precise location of each spacecraft, as well as data from the instruments aboard.

The JPL tour is scheduled for 2 PM on Friday, August 19, 2011. The tour is limited to 80 people at a cost of $25.00 per person ($35.00 after July 17, 2011) and is available on a first come basis. The tour length is estimated to be 2.5 hours. Buses will depart the convention center at noon for JPL, so be there on time. Snacks will be provided on the return trip. For more in-formation on JPL, visit their website at www.jpl.nasa.gov. The list of names is required to be provided to JPL three weeks prior to the tour, so register early or you may miss a great tour. Also, everyone is required to show a current photo ID or valid passport to gain entrance to JPL; there will be no exceptions.

POST CONFERENCE TOUR CATALINA ISLAND ADVENTURE8:15 a.m.-5:15 PM, Saturday, Aug. 20Your one-hour boat ride will take you 22 miles across the sea to Catalina. Next, experience one of the island’s many exciting and exclusive tours, like the Glass Bottom Boat or Casino Tour! These tours give you an inside look at the island’s natural his-tory and beauty, don’t forget your camera! Once you’ve done your activity, head to the boardwalk for a group lunch and then roam the town buying souvenirs and taking in the relaxation island style! Contact the Tour Manager, Melina Patrick, at (562) 980-7566 (or email [email protected]) to book your tour. Cost per person $125 Includes: Bottled waters, roundtrip boat transportation, tour and lunch.

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Hooray for HollywoodTuesday, August 16 Depart LBCC 8:30 AM Return LBCC 4:30 PM

Experience the most famous excursion in Southern Cali-fornia, a trip to Hollywood! Head out to downtown L.A. to explore all the places you’ve heard about and have never seen: Historic Olvera Street, Disney Concert Hall, Cathedral of Our Lady of the Angels and one of the country’s last great rail stations, Union Station. Along the way, your guide will point out filming locations of dozens of blockbuster movies, explain fun facts about the city, and even cruise down the world famous Rodeo Drive. Then it’s on to Hollywood to stop at the famous intersection of Hollywood and Highland where you can enjoy lunch at one of the many great restaurants in the area, visit the shops, stop by the famous Grauman’s Chinese Theatre, the Hollywood Walk of Fame, and world-renowned Madame Tussauds’ Wax Museum, and see the home of the Academy Awards, Nokia Theatre. Then, you’ll hop back on the bus and travel up to the Griffith Observa-tory where you can get the best view of the city, the historic Hollywood Sign, and much more. With a wonderful day behind you, return to Long Beach along the most gorgeous ocean drive in Southern California, rounding the lush Palos Verdes Peninsula and its breathtaking view.

Cost per person $70 Includes: Bottled waters and snacks, round-trip transportation and guided tour. This tour will involve some walking.

Tour bus will pick up/drop off at the LB Convention Center.

Wine Tasting & Beach CruiseMonday, August 15Depart LBCC 10:30 AMReturn LBCC 3:30 PM

This is the best wine tasting experience in Southern Califor-nia! The open-top Big Red Bus will pick you up, greet you with a mimosa, and take you for a cruise through downtown Long Beach to your first wine tasting room, The Wine Crush. After your tasting and patio luncheon, the bus will take you down Pacific Coast Highway where you can take pictures of the beautiful Southern California beaches. They’ll drop you off at your second wine tasting room location called Brix, where you can enjoy a range of great wines and cheeses. Once finished, the Big Red Bus will gather everyone for a great relaxing drive back to Long Beach. The two wine bars will supply tastings from a pre-arranged selection based on region and grape (TBD). What wines we taste is up to you! Participants will receive four 2-ounce tastes, as well as dis-counts on select bottles and food at each venue. If you find a bottle you like, we encourage you to bring it on board the bus and enjoy a glass while we roll along side the Pacific Ocean. No long drive, no flight, no hotel needed to enjoy a trip through the finest wine regions in the world. This wine tasting tour offers an adventure for not only your palate, but also your imagination!

Cost per person $70 Includes: Bottled waters, a glass of champagne/mimosa, round-trip transportation, lunch and wine tastings at two lo-cal tasting rooms (NOT WINERIES).

Tour bus will pick up/drop off at the LB Convention Center. A closed top bus will be provided if needed.

The 2011 IEEE International Symposium on Electromagnetic Compatibility's Companion Program will include tours, featuring wine tasting, walking the sandy beaches of Santa Monica, experiencing Hollywood in all its glamour, shopping in Los Angeles, visiting the world famous Griffith Observatory, checking out the La Brea Tar Pits where the dinosaurs once roamed, and visiting several museums including the famous Getty Museum.

Companion spouses are invited to join their registered companions for a full breakfast from 7-11 AM Monday through Friday in the Companion Suite.

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[ COMPANION PROGRAM ]

Los Angeles Shopping, Arts & Historical TourWednesday, August 17Depart LBCC 8:30 AMReturn LBCC 4:00 PM

Enjoy a day of true Los Angeles shopping, art viewing and taking in the scenery at world famous historical landmarks. We will start the day off with a trip to the original L.A. Farmer’s Market where you can explore the biggest and best grocery store in Southern California. You will find this location is a din-ing and shopping experience like no other. After spending time at the market, head next door to the ultimate entertainment destination, The Grove. Don’t forget to keep your eyes peeled for celebrities, since The Grove is often their local hangout. Next, you will hop back on the bus and be taken to your next destination, the Peterson Automotive Museum, encompassing more than 150 rare and classic cars, trucks and motorcycles. For your last stop, head next door to the Page Museum where you will get a guided tour of the exhibits, the park and view the famous La Brea Tar Pits. This tour is simply a great day to be in L.A.!

Cost per person $65Includes: Bottled waters and snacks, transportation, admission and guided tours.This tour will involve some walking. Tour bus will pick up/drop off at the LB Convention Center.

Santa Monica Famous FunThursday, August 18Depart LBCC 8:30 AMReturn LBCC 4:30 PM

This trip will take you on a relaxing tour of some of the most famous areas of Southern California in the vicinity of Santa Monica. Enjoy the famous sites at the Venice oceanfront walk and Muscle Beach, the endless shops of the 3rd Street Prom-enade, and then the fun-filled Santa Monica Pier. As you’re strolling the Venice Boardwalk, keep your eye out for Harry Perry, the turbaned guitar player on roller blades who has appeared in numerous films and TV shows. This is also the spot to see the rubber-snake wrangler, the metal-ball-rolling, Speedo-wearing bodybuilder, the chainsaw juggler and a full complement of palm readers, folk artists and other colorful characters. Next you’ll check out the endless amounts of retail stores, entertainment and dining at the pedestrian-friendly 3rd Street Promenade. Lastly, you will get time to explore the Santa Monica Pier that offers a family friendly environment and great ocean views. After a fun day of exploring L.A.’s favorite tourist spots, you won’t want to go back home!

Cost per Person $30

Includes: Bottled waters and snacks, round-trip transportation.

Getty Museum Architectural TourFriday, August 19 Depart LBCC 8:30 AM Return LBCC 3:45 PM

There is no museum more famous in the city of Los An-geles than The Getty Center comfortably set on a hilltop in the Santa Monica Mountains. From there, visitors can take in the contrasting aspects of Los Angeles’s landscape — the Pacific Ocean, the San Gabriel Mountains, and the vast street-grid of the city. A docent will guide you through the museum and present the many different art forms on display. Make sure you save your appetite for a luncheon on the Getty Patio with those who have accompanied you, while you enjoy the panoramic views of Los Angeles.

Cost per Person $60

Includes: Bottled waters, round-trip transportation, guided do-cent and lunch. This tour will involve some walking.


[ COMPANION PROGRAM ]


Number NiNe Noodles + beer2118 East 4th Street, Long Beach, CA 90814-1003 (562) 434-2009www.numberninenoodles.com

VietnameseSignature dishes: Pho, Bun$7-10 per entrée

sushi studio 4917 East Pacific Coast Highway, Long Beach, CA 90804 (562) 498-9008 www.sushistudiolb.com

JapaneseSignature dish: “Sunrise on Second Street" roll$7-18 per entrée

JohNNy rebs'4663 Long Beach Blvd. Long Beach, CA 90805 (562) 423-7327www.johnnyrebs.com

southernSignature dishes: Babyback Pork Ribs, Catfish$8-23 per entrée

GeorGe's Greek Café5316 E. Second St., Long Beach, CA 90803 (562) 433-1755 www.georgesgreekcafe.com

GreekSignature dishes: Lamb Chops, Saganaki$8-25 per entrée

luCille's smokehouse bar-b-Que4828 E. Second St., Long Beach, CA 90803 (562) 434-7427www.lucillesbbq.com

southern, bbQSignature dish: Ribs, Smoked BBQ Half Chicken$10-28 per entrée

Cafe seVilla loNG beaCh

140 Pine Avenue, Long Beach, CA 90802-9401(562) 495-1111 www.cafesevilla.com

spanish tapas restaurantSignature dish: Seafood Paella$5-29 per entrée

miChael's oN Naples ristoraNte 5620 East 2nd Street, Long Beach, CA 90803 (562) 439-7080 www.michaelsonnaples.com

italianSignature dishes: Branzino, Lasagna$7-29 per entrée

but What if i’m trying to

impress my client?

symposium trips are expensive.

Where can i grab a cheap meal?

[ restaurants ]

interferencetechnology.com interference technology 83interferencetechnology.com interference technology 83

explore

long beach

la Creperie Cafe4911 E. Second St.Long Beach, CA 90803 (562) 434-8499www.lacreperiecafe.net

french bistroSignature dishes: Jambalaya Crêpe, Lobster Crêpe, Lobster Bisque, Croque Monsieur$8-25 per entrée

yeN sushi & sake bar4905 E. Second St. Long Beach, CA 90803 (562) 434-5757www.yenrestaurants.com

asianSignature dishes: Hat Night Roll, Spicy Pataki$9-26 per entrée

yard house loNG beaCh 401 Shoreline Drive, Long Beach, CA 90802 (562) 628-0455www.yardhouse.com

salads, sandwiches, pizza, seafood, steakSignature dishes: California Roll, Crab-cake Hoagie, draft beer served in yards (3-foot-tall glasses)$10-31 per entrée

l'opera 101 Pine Avenue, Long Beach, CA 90802-4415(562) 491-0066www.lopera.com

italianSignature dishes: Cappellacci Di Zucca, Ossobucco Alla Milanese$12-33 per entrée

[ restaurants ]


oriGiNal fish Co.11061 Los Alamitos Blvd., Los Alamitos, CA 90720 (562) 594-4553www.originalfishcompany.com

seafoodSignature dishes: Mesquite Wild Alaskan Salmon, Clam Chowder$10-$50 per entrée

i mean, i really Want to impress

my client.

555 east ameriCaN steakhouse 555 East Ocean Blvd # 107, Long Beach, CA 90802-5048 (562) 437-0626 www.555east.com

steakSignature dishes: Black Angus Prime Beef, Steaks, Filet Mignon$20-50 per entrée

sir WiNstoN'sQueen Mary1126 Queen's Hwy., Long Beach, CA 90802 562-499-1657

steak and seafoodSignature dishes: Châteaubriand, Rack of Lamb, Sir Winston's Wellington$30-50 per entrée

parker's liGhthouse

435 Shoreline Village Dr., Long Beach, CA 90802(562) 432-6500www.parkerslighthouse.com

steak and seafoodSignature dishes: Stuffed Atlantic Salm-on, Mariner Platter$20-58 per entrée

[ restaurants ]

Bringing the world technical articles and EMC buyers’ guidesfrom multiple countries, in multiple languages.

ITEMTM

www.interferencetechnology.eu

The International Journal of Electromagnetic Compatibility

2012 EUROPE EMC GUIDE

http://www.interferencetechnology.eu

LEGOLAND CaliforniaOne LEGOLAND DriveCarlsbad, CA 92008(760) 918-5346http://california.legoland.com/

Whether you’re interested in a water park where you can make your own raft out of tiny bricks, a mini Star Wars land or an Octopus Garden, LEGOLAND has tons of fami-ly-friendly activities. The 128-acre park geared specifically towards children ages 2 through 12 features more than 50 family rides, "hands-on" attractions and shows.

Knott’s Berry Farm8039 Beach BoulevardBuena Park CA 90620(714) 220-5200www.knotts.com/

Featuring a white-water rapids ride, a roller coaster that spins while it drops, and a train ride through a ghost town, Knott’s Berry Farm is America’s first theme park. Thrill rides for adults meet family fun for kids.

Griffith Observatory2800 East Observatory RoadLos Angeles, CA 90027(213) 473-0800www.griffithobservatory.org/

Griffith Observatory offers a great view of the sun, the stars, and even Hollywood. Lo-cated on the southern slope of Mount Hol-lywood, Griffith Observatory has the best views in Los Angeles with planetariums, telescopes, and a roof observation deck. So, don’t just stargaze on the streets of LA, check out the stars in the sky, too!

explore californiaPlanning to stay a few extra days to see what else California has to offer? Our local experts recommend these attractions. For more on their suggestions, see the proFiles on pages 20, 28, 48, 52 and 56.


[ AttrACtiOns ]

Disneyland1313 S. Disneyland Drive, Anaheim, CA 92802(714) 781-4565, http://disneyland.disney.go.com/

From Mickey’s Toontown to New Orleans Square, you’ll find loads to do at Disneyland. But remember, Disneyland is most fun for kids ages 1-100.

The Original Farmers Market6333 West Third StreetLos Angeles, CA 90036(323) 933-9211www.farmersmarketla.com/

Created in 1934, an estimated 3 million people visit this Los Angeles landmark every year. Not only does Farmers Market have fantastic food, but the LA Times said it is “the number one place in L.A. to spot stars.” So, grab a camera and a napkin and see what you’ll find at the Original Farm-ers Market.

explore california

Booth 631


[ AttrACtiOns ]

http://www.emtest.com


[ Index of advertIsers ]


A.H. Systems .................................................................................................29

Advanced Test Equipment Rentals ..........................................................47

Agilent Technologies ....................................................................................1

Alco Technologies .......................................................................................65

Americor Electronics, Ltd. ..........................................................................84

Apache Design Solutions, Inc. ..................................................................22

AR RF/Microwave Instrumentation.......................................... 5, 23, 27,37

Braden Shielding Systems .........................................................................25

Chomerics, Div. of Parker Hannifin Corp. ...............................................58

Compliance Worldwide, Inc. .....................................................................66

CST of America®, Inc. ................................................................................31

Curtis Industries ............................................................................................67

DNB Engineering, Inc. .................................................................................66

EM Test USA ..................................................................................................87

EMC Partner AG ............................................................................................62

EMI Filter Company ......................................................................................28

ENR/Seven Mountains Scientific .............................................................35

ETC – Electronics Test Centre – Kanata .................................................54

ETS-Lindgren ...............................................................................Back Cover

Fair-Rite Products Corporation .................................................................63

Fischer Custom Communications .............................................................34

GORE ..........................................................................................................82, 83

IEEE 2012 Pittsburgh .....................................................................................13

Instruments for Industry (IFI) ............................................................ 7-12, 56

Intermark USA, Inc. ......................................................................................49

Interference Technology / ITEM Publications ..................... 6, 77, 85, 88

Kimmel Gerke Associates, Ltd. .................................................................71

Leader Tech ...................................................................................................51

Mesago Messe Frankfurt GmbH ...............................................................43

MET Laboratories, Inc. ................................................................................48

MILMEGA Ltd. ..................................................................................................3

Montrose Compliance Services ...............................................................71

Mushield Company ......................................................................................59

NAVAIR Advanced Warfare Technologies ............................................39

Nexio ...............................................................................................................41

National Technical Systems .....................................................................15

OPHIR RF .......................................................................... Inside Back Cover

Quell Corp. ........................................................................Inside Front Cover

Retlif Testing Laboratories .........................................................................45

Rohde & Schwarz, Inc. ................................................................................21

Schurter, Inc. .................................................................................................17

Silk Metallic Corporation ...........................................................................56

Spectrum Advanced Specialty Products ................................................19

Spira Manufacturing Corporation ............................................................33

Tech-Etch, Inc. ..............................................................................................61

TESEQ, Inc. .....................................................................................................55

Test Equipment Repair ................................................................................79

Tri-Mag ...........................................................................................................69

TUV SUD America Inc. ................................................................................71

ITEM™

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and their environments.

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Visit www.etdnews.com to subscribe today

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BOOTH 227


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