July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 1

WBS 1.1.1.5(& W.B.S. 1.1.1.6.2 & Services)

Pixel Module Assembly & Test

1. Technical Status2. Goals for 20043. Service Panels

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 2

Technical Status

• Thinning and dicing

• Module Assembly

• Pigtails are gone

• Adhesives

• Sector loading

• Production testing

• Burn-in setup

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 3

Technical Status: Thinning and Dicing• This is going very well. Great work by Amanda, Aldo, & Al Clark. Vendor GDSI has been

very reliable. Cost under control.• Only issue with FE-I1

was suspected silicon particle contamination leading to shorts during flip chip. This may not be an issue for FE-I1 (or it may be worse). Chip squashing tests are under way.

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 4

Technical Status: Module Assembly 1/2

• FE-I1 used to “shake down” the module assembly process.

• Yield of all steps has steadily improved. Not quite at planned levels yet, but plateau probably not yet reached.

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IZM AMS LBNL Total "Detector grade"

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 5

Technical Status: Module Assembly 2/2• Fixturing is very simple and works

well. What we have is good enough for production.

• Assembly time with new adhesive tape is literally less than 1 hour per module

• Wire bonding with new machine is a breeze. But we need to buy such a machine! (availability assumed in cost and schedule)

• Only outstanding issue is how exactly to pot the bonds to avoid magnetic field resonance. Work in progress.

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 6

Technical Status: Pigtails Gone 1/3

• Original design had cable soldered to flex pigtail, in turn wire-bonded to module

• In fixing a defective pigtail bypassing it with wires, we realized that the pigtail was hurting more than helping.

• Now cable soldered directly to flex.

• Fewer things to test, fail and assemble.

• No wire bonded connections to module

• All modules for a given disk are identical (before needed 2 flavors)

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 7

Technical Status: Pigtails Gone 2/3implications for US assembly flow

Flex + SMT

LBL for cable

Albany for HV test

OU for MCC

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 8

Technical Status: Adhesives

• Flex Hybrid To module Attachment– Original scheme of no glue under flex bond pads did not work

due to flex bow

– Switched to silicone tape adhesive under bond pads.

– Allows for excellent wire bonding and instant assembly.

– Radiation tested OK. Some further qualification needed (thermal cycling, etc.)

• Module to Sector Attachment– SE-4445 Silicone accepted as new universal baseline

– Modules on sector being loaded with this glue now (used to be CGL). Very good initial experience.

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 9

Technical Status: Sector Loading

• Major development here

• First and only real sector was loaded “by hand” with makeshift fixtures

• Original tooling, now 2 years old, had many problems.

– Pickup of real modules built with Dyconex flex was a problem

– Sector tubing design evolved and no longer fit.

– No provision for survey of module position

• New concept introduced for sector safe handling, storage, survey, testing. “Sector frame”. Similar concept to flex frame.

• Entirely new tooling designed around frame. All parts have need built and are almost ready for first use (build second real sector). (aside: Fred charges all this to SCT account)

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 10

Technical Status: Production Testing

• Have been pushing for a documented module, sector and stave QA plan. Collaboration has been slow to respond.

• Nevertheless, a fairly clear picture is emerging of the resources needed.

• Basically:– Characterize each module with PC test setup

– Burn-in and thermal cycle each module (new burn-in setup needed)

– Burn-in, survey, thermal cycle, and IR image each sector (same burn-in setup as module)

– Undecided: test each sector with ROD.

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 11

Technical Status: Burn-in Setup

• Finally started development at LBL

• Students + Eng. Div. drafter.

• Design “specs”– Keep it simple

– Add-on to existing single module test setup

– Cheap and easy to replicate (we expect everyone will want one).

New burn-in board

New burn-in board

New burn-in board

New burn-in board

USB port or USB hub

ISEG supplies for HV, bulk supply for LV power

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 12

Goals For 2004• Start Production!• Finish production in early FY05!• Try to get collaboration to buy into this “5th disk”

– Gain time on ramp-up– If it ends up working more or less it becomes half of a 3rd hit

Jun Jul Aug Sep Oct Nov Dec Jan-04

FE-I2-Rev.1 XXXXXXXXXXXMCC-I2-Rev.1? XXXXXXXXXXXXXProbe FE wafers XXXXBump FE wafers XXXXThin, dice, reprobe XXXXXXXXXXXFlip XXXXXXXXXXXXXXXXXXFlex bidsFlex smt assy XXXXXXXAdd disk Type 0 wires XXXXXHV test XXXXXXXXLoad MCC & test XXXXBare module probe XXXXXXXXXXXXXXXXXXDisk module assy. XXXXXXXXXXXXXXXDisk module test XXXXXXXXXXXXXXXXSector loading XXXXXXXXXXXXXXSector test & burn-in XXXXXXXXXXXXXX

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 13

2004 Goals: Type 0 Cable Production

• There is no flex pigtail fabrication (1.1.1.4.3.2 -> 0)• Copper clad wire and other materials ($5K)

• PCB for PP0 connector end of cable ($1.7K)

• Cables attached to flex hybrid at LBL (600hrs tech.)

• Total:– $6.7K this is part of

– 600 hours labor ($40K) module assy. in WBS

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 14

2004 Goals: Wafer Thinning, Dicing, Die-probing Production

• 100x Bumped FE-I wafer thin ($15K)

• Cleaning & re-coating in Microlab (100hrs student)

• Inspection (25hrs student)

• Dicing ($20K)

• Cleaning resist in Microlab (100hrs student)

• Single Die Probing & inspection (1760hrs student)

• Supplies (gel packs, etc) ($12K)

• Totals:– $47K ETC03 prod. total– 2000 hours student ($30K) 29K+28K

+20K

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 15

2004 Goals: Production Module Assembly

• Shipping Covers & supplies ($8K)• Equipment maintenance ($5K)• Technician Assembly Labor (600hrs)• Technician tests (bond pulls, etc.) (300hrs)• Shops (100hrs)• Totals

– $13.3+6.7= $20K ETC03 prod. total

– 1160+600 hours ($60K) 24K+176K(type 0 cable)

-120K

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 16

2004 Goals: Burn-in System Development• Being developed by students + eng. Div. Drafter. • First prototype by end of summer => Much of this cost is

in FY03!• At that point will need a lot of software help (new

postdoc to jump in…) • Same system to be used for sector burn in.• See Module QA for operation of burn-in system • Copies of system likely to be requested by collaborators

– $20K board fabrications and purchases – 440 hours drafter ($20K)– 880 hours student ($12K)– 80 hours shop ($6K) ETC03 – Total: $58K 46K

+12K

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 17

2004 Goals: Production Module QA• Still hard to estimate how long it will take per module for 1

person + TDaq setup.• Optimistically assume 4 hours per module.• Need dedicated setup and a lot of disk space. • Note this is different setup than burn-in. That’s a second

dedicated setup. • => Do we need one more TDaq setup? Yes.

– New Tdaq setup & pwr supplies ($15K)– 1760 hrs student ($25K)

• Burn-in setup operation– Operating supplies ($5K) – 880 hrs student ($12K) ETC03 Prod. Total

• Total QA: $20K + $37K $45K + $75K-63K

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 18

2004 Goals: Production Sector Loading

• This should not be a very labor intensive operation

• Ideally will be done by an engineering tech. now F/T on mechanics, to be trained by FRED.

• Important cost is frame holders for production modules and possibly additional tooling. – Misc. tooling, & supplies ($7K)

– 20 frames, 16shop hours each ($16K) ETC03 Prod. Total

– 440hrs. Mech. tech. ($16K) $7K + $24K

+8K

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 19

2004 Goals: Production Sector QA

• Involves IR, Metrology, Thermal cycling, and electrical burn-in

• Assume 1 sector/week

• => 1 FTE for this job (student OK)– Fixtures, storage ($25K) ETC03 Prod. Total

– 1760 hrs student ($25K) $36K + $12K

• What about database? ETC03 has $11K

+2K

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 20

Module Production Summary • Adding up the labor we need 4.1FTE students in FY04.

– We have ~1.

– New postdocs can pick up some of the work

– Probably still need to hire at least 2 temps (eg. finishing undergrads) or find visitors or other help.

• Technicians needed: 1.6FTE. Seems OK.

• Assuming we can find this many students, looks like significant reduction compared to ETC03. (about 140K).

• But, part of these savings are not real because we are spending “production” money on continued prototype work in FY03. I have not tried to add up FY03 standing army cost and subtract it from production budget.

July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 21

Service Panel Production (2004)For 3-Hit System (everything up to PP1 tapes)

• 57Kg Cu-Clad Al Wire (+overage) $81K• Flex fabs, connectors, vendor assy. $66K• LBNL Tech. Labor 3648Hrs

• Total for Electrical component of Service panel production: $293K

• (2 hit total is $226K)

This is the slide from last year. New estimate looks a tiny bit less (10-20%), but uncertainty is still too large to reduce this.