lcws2013 tokyo denkai co., ltd. rrr and thickness measurements of cu plating hiroaki umezawa,...
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LCWS2013 Tokyo Denkai Co., Ltd.
RRR and thickness measurements of Cu plating
Hiroaki Umezawa, Futoshi SaitoTokyo Denkai Co., Ltd.
Eiji KakoKEK
LCWS2013 Tokyo Denkai Co., Ltd.
Contents• Background• RRR Measurement Method of Cu Plating• Thickness Measurement of Cu Plating• RRR Measurement result• Summary
LCWS2013 Tokyo Denkai Co., Ltd.
BackgroundMaterial for Input coupler• Low thermal conductivity is required to suppress
heat transfer from outside of cryostat.• High electric conductivity (i.e. low resistance) is
required to suppress RF resistance.↓
Very thin copper plated SUS (0.8mm)↓
Evaluation of electric conductivity and thermal conductivity of the cu plating is necessary.
↓RRR measurement of Cu plating (Target value 30-60)
LCWS2013 Tokyo Denkai Co., Ltd.
RRR Measurement System
LCWS2013 Tokyo Denkai Co., Ltd.
How to calculate RRR of the Cu plating
€
RRR =ρ 293Kρ10K
€
1
RCu / SUS=1
RCu+1
RSUS1
ρCu / SUS ⋅l
S1
=1
ρCu ⋅l
S3
+1
ρ SUS ⋅l
S2S1
ρCu / SUS=S3ρCu+S2ρ SUS
S3ρCu
=S1
ρCu / SUS−S2ρ SUS
ρCu =S3
S1ρCu / SUS
−S2ρ SUS
ρCu
ρSUS
ρCu/SUS
tCu tCu/SUS
tSUS
L110mm
W 5mm
S2=W・ tSUS
S3=W・ tCu
S1=W・ tCu/SUS
LCWS2013 Tokyo Denkai Co., Ltd.
Sample preparation• During the input coupler production, heat
history of 800C will be added in hydrogen atmosphere due to the brazing.
• To research the influence of this heat treatment(HT), we prepared 2 types of samples which are heat treated and not heat treated. #Simulation of brazing condition.
• 3 samples from each types are prepared, 2 samples for RRR measurement, 1 sample for Cu plating thickness measurement.
LCWS2013 Tokyo Denkai Co., Ltd.
Sample
Before HT After HT
A1,2,3 A4,5,6 A
B1,2,3 B4,5,6 A
C1,2,3 C4,5,6 A
D1,2,3 D4,5,6 A
E1,2,3 E4,5,6 B
F1,2,3 F4,5,6 B
G1,2,3 G4,5,6 C
H1,2,3 H4,5,6 C
Ni Strike + Cu 11.7 um Copper Cyanide Plating
Ni Strike + Cu 35 um Copper Cyanide Plating
Ni Strike + Cu 5 um Copper Cyanide Plating
Ni Strike + Cu 20 um Copper Cyanide Plating
Ni Strike + Cu 5.4 um Copper pyrophosphate Plating
Ni Strike + Cu 20.6 um Copper pyrophosphate Plating
Au Strike + Cu 5.2 um Copper pyrophosphate Plating
Au Strike + Cu 19.2 um Copper pyrophosphate Plating
Sample No. Plating
Vender
Condition of Cu Plating
Thickness of Cu Plating Plating Method
LCWS2013 Tokyo Denkai Co., Ltd.
Sample
LCWS2013 Tokyo Denkai Co., Ltd.
Cu remove
The copper is melted by HN03
Au Strike Ni Strike
LCWS2013 Tokyo Denkai Co., Ltd.
Digital Micro Scope
LCWS2013 Tokyo Denkai Co., Ltd.
Plating Thickness Measurement
Sample A: 18um Sample B: 3um
LCWS2013 Tokyo Denkai Co., Ltd.
Measurement Result of Plating Thickness
Sample Vender Report Before HT After HT
A 5.2 15.9 18.2
B 19.2 5.9 3.2
C 5.4 20.7 18.8
D 20.6 3.9 2.9
E 5.0 4.0 2.1
F 20.0 6.8 6.6
G 11.7 10.7 10.9
H 35.0 29.1 29.5
(um)
Measured by Microscope
LCWS2013 Tokyo Denkai Co., Ltd.
Thickness of Cu Plating
0
5
10
15
20
25
30
35
40
A B C D E F G H
Sample
Thickness of Cu Plating [um]
Before HTAfter HTNominal Value
LCWS2013 Tokyo Denkai Co., Ltd.
RRR Measurement Result
0
10
20
30
40
50
60
0 5 10 15 20 25 30
Thickness of Cu Plating [um]
RRR
RRR Before HT
RRR After HT
E D B FG A
C
H
E
D
B
F
G
A
C
H
LCWS2013 Tokyo Denkai Co., Ltd.
RRR Measurement Result
0
10
20
30
40
50
60
0 5 10 15 20 25 30
Thickness of Cu Plating [um]
RRR
RRR Before HT
RRR After HT
E D B FG A
C
H
E
D
B
F
G
A
C
H
LCWS2013 Tokyo Denkai Co., Ltd.
RRR Measurement Result
0
10
20
30
40
50
60
0 5 10 15 20 25 30
Thickness of Cu Plating [um]
RRR
RRR Before HT
RRR After HT
E D B FG A
C
H
E
D
B
F
G
A
C
H
LCWS2013 Tokyo Denkai Co., Ltd.
Conclusion• RRR measurement and Cu plating thickness
measurement of SUS used for material of input coupler of SC Cavity was done.
• There is a difference between measured plating thickness by us and nominal plating thickness by plating vender.
• To get high RRR, plating thickness is important.• 800C heat treatment exert a negative effect on
RRR of plating. • To overcome the bad influence from heat
treatment, thickness of the plating must have at least 30 micrometer.