lms thermal/vacuum test reports · lms thermal/vacuum test reports pagi 1 of 170 l date 7-9-71 the...

NO. RIY. NO.

ATM 10Z9

LMS Thermal/Vacuum Test Reports PAGI 1 OF 170

l DATE 7-9-71

The compiled reports contained herein represent the total

data accumulated in the testing of the LMS components in a simulated

lunar environment.

Prepared By: AL~ A. S. Tente

Approved By:

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LMS Thermal/Vacuum Test Reports PAGE 2 OF_

DATE 7-9-71

CONTENTS

1. LMS Heat Distribution Tests

2. LMS Engineering Thermal/Vacuum Tests

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····,._a•pace stems Dlvlelon DATE 7-9-71

LMS HEAT DISTRIBUTION TESTS

I INTRODUCTION

The Lunar Mass Spectrometer (LMS) electronics assembly is comprised of seven (7) multilayer printed circuit boards assembled to the LMS radiator plate. These PC boards are mounted directly to the radiator plate either by means of posts integral with the radiator plate or by spacers which mechanically tie the boards to the radiator plate. These attachments, in addition to providing a mechanical connection, also provide a thermal path to -conduct the heat from the individual boards to the radiator plate, which in turn radiates the heat to space.

Each circuit has been designed to provide the maximum efficiency at a given operating temperature, and it is desirable to establish the operating temperature for each board under expected operating conditions. In order to provide information concerning the operating characteristics of the circuits, and to determine the thermal properties of the multilayer printed circuit boards themselves, a thermal vacuum test has been conducted on the individual circuit boards.

These tests were conducted on test equipment set-up in the LMS laboratory. A description of this equipment is given in Section IV -Test Equipment.

II PUR.POSE

Briefly stated, the purpose of this test is to verify the thermal resistance profile and the thermal conductivity of each complete multilayer printed circuit board under various levels of operation simulating both lunar noon and lunar night operating conditions.

ill CONCLUSIONS

There were no conclusions drawn from the tests as conducted. The accumulated data were forwarded to Thermal Engineering for analysis and correlation with computer program output.

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LMS Thermal/Vacuum Test Reports PAGI! 4 OF-

DATE 7-9-71

IV TEST EQUIPMENT

The thermal/vacuum test program was conducted in the LMS mechanical laboratory utilizing equipment that was set-up specifically for these tests. Figure 1 shows the test equipment set up in the laboratory.

The test equipment can be divided into four (4) basic units: . vacuum system, temperature conditioner, electrical input, and temperature measurement systems.

A. Vacuum System

The vacuum system consisted of two components: the chamber and the vacuum pump. The vacuum chamber included a 1411 diameter bell jar and a phenolic baseplate, which contained all the electrical and fluid feed-throughs as well as mounting provisions for the circuit board under test. This is shown in Figure 2.

The vacuum pump used was a Welch Duo-Seal model 140~4system. This unit is capable of vacuum levels of 0. 1 microns, or 1 x 10 Torr, and a displacement of 5. 6 cubic feet per minute.

B. Temperature Conditioning System

This system established the temperature of the baseplate to simulate the two extreme lunar conditions, lunar noon and lunar night. To accomplish this a liquid solution of ethelyne-glycol and water was circulated through coils to which a sub-baseplate was attached. The baseplate was in turn bolted to the sub-baseplate. The ethelyne-glycolwater solution was heated by means of a controlled electric heater to provide a baseplate temperature of 125°F, and cooled by means of liquid nitrogen to provide a baseplate temperature of 40°F or lower. The heated or cooled liquid was circulated by means of a Simen Model M40K "Mini-Vac" pump capable of circulating 350 gallons of water per hour at standard pressure and temperature.

: : I

~ 'ystems Division

LMS Thermal/Vacuum Test Reports

FIGURE 1

LMS Thermal/Vacuum Test Set-up

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FIGURE 2

LMS Thermal/Vacuum Chamber

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C. Electrical Power Supply

Electrical power was supplied by using Hewlett Packard Model 6215A power supplies as required. Power was provided for two (2) purposes: the first was to provide a known heat source at some given location on the board, and the second was to provide current and voltage to certain pins in order to energize selected components.

Heating was accomplished by placing Dale RH-10 wire-wound resistors on the board as selected by Thermal Engineering and providing a given current and voltage level to provide the necessary heating levels.

Voltage and current levels to the selected pins were supplied by Electrical Engineering personnel and verified by them at time of test.

D. Temperature Measurement System

Temperature measurement was provided by using copper-constantan thermocouples cemented to various locations on the boards, as selected by Thermal Engineering. and measuring the voltages by means of a Leeds and Northrup Potentiometer BSD Serial Number 1151650.

V TEST PROCEDURE

The following represent an outline of the test as it was conducted for each card. Variations were required from card to card or as circumstances dictated.

1. 0 Assemble P. C. board onto heat sink and make all necessary electrical connections.

2. 0 Cover ass em b1y with thermal bag and place belljar cover over unit~

3. 0 Evacuate belljar to vacuum level.

4. 0 Establish heat sink temperature at low temperature level.

4. 1 Turn on test item to operating power level (s) to the board components.

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LMS Thermal/Vacuum Test Reports. 8 PAGE 0, ./~apace . 'stems Dlvllllon

7-9-71 DATE

4.2 Hold test condition until equilibrium is reached and record data.

4.3 Remove operating power input.

4.4 Input low power to heater element.

4.4.1 Hold test condition until equilibrium is reached and record data.

4.5 Increase power to heater element to intermediate level.

4. 5. 1 Hold test condition until equilibrium is reached and record data.

4.6 Increase power to heater element to maximum level.


4.7 Remove all power.

5.0 Increase heat sink temperature to 125°F.

5. 1 Turn on test item to operating level (s) to the board components.

5.2 Hold test condition until equilibrium is reached and record data.

5.3 Remove operating power input.

5.4 Input low power to heater element.

5. 4. I Hold test condition until equilibrium is reached and record data.

5.5 Increase power to heater element to intermediate level.

5. 5. I Hold test condition until equilibrium is reached and record data.

5. 6 Increase power to heater element to maximum level.


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ATM 1029

LMS Thermal/Vacuum Test Reports PAGI 9 OF-

DATE 7-.9-71

5. 7 Remove all power.

6. 0 Turn off heat sink power.

7. 0 Turn off experiment and pressurized chamber.

8. 0 Repeat above steps for all P. C. boards until all circuits have been tested.

NO. REV. NO •

. ATM 10Z9

LMS Thermal/Vacuum Test Reports PAGI 10

OF-

DATE 7-9-71

VI

Data Sheets

MO. RIV. MO.

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LMS Thermal/Vacuum Test Reports 11 PAGE OF

~~~~..,.,., •p•oa · )'llteme Dlvl•lan

DA Tl! 7-9-71

Control and Monitor Card

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FIGURE 3

Control and Monitor Card Front

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DATE 7-9-71

: : . ~ ... '-'ospace

vstems Division


FIGURE 4

Control and Monitor Back

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PAGE 13 OF __ _

DATE 7-9-71

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/···"'aD apace l8teme Dlvllllan

' LMS Thermal/Vacuum Test Reports

Counter and Data Compressor Card

NO. REV. NO.

ATM 1029

PAGE 20 OF

DATE 7-9-71

: :- '

Aerospace Systems Division


FIGURE 5

Counter and Data Compressor Card Front

NO. REV.

ATM 1029

21 PAGE OF

DATE 7-9-71

: . . LMS Thermal/Vacuum Test Reports

FIGURE 6.

Counter and Data Compressor Card Back

NO. REV. NO.

ATM 1029

22 PAGE OF

DATE 7-9-71

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NO. REV. NO.

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: :. . ~ \erospace

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Signal Conditioner and Command DE·coder Card

NO. REV. NO.

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• . :. . Aerospace Systems Division


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~TM 1029

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ATM 1029

4,tara••~•oe ...... Divllllon


DATE 7-9-71

LMS ENGINEERING THERMAL VACUUM TESTS

I INTRODUCTION

Following the thermal/vacuum tests on the individual circuit boards, the boards were assembled onto the engineering model radiation plate, electrically tied together with a special test cable, and the unit covered with a thermal bag. The assembled unit was then placed in the 4' x 8' thermal vacuum chamber and tested at various radiator plate temperatures and electrically cycled by means of the LMS Engineering Test Set.

U PURPOSE

The purpose of this test is to establish the thermal profile for the various circuits and selected components when assembled and functioning at various temperatures in a vacuum environment.

m TEST EQUIPMENT

The LMS Engineering Thermal/Vacuum Tests were conducted in the Bendix 4 1 x 8 1 thermal vacuum chamber. The LMS electronics were assembled onto the engineering model radiator plate and covered with the thermal bag. Each of the circuit boards, the radiator plate and the thermal bag were instrumented with thermocouples to record the temperature of selected portions of the LMS assembly. Figures 17 thru 22 show these components ready for assembly. Figure 23 shows the LMS assembled and ready for installation in the chamber, while Figure 24 shows the instrument inside the chamber and the LMS engineering test set (ETS) set up.

IV TEST PROCEDURES

The following document, BSD No. 2365599, represents the test procedures followed in these tests.

: : I •



FIGURE 17

Radiator Plate

NO. REV. NO.

ATM 1029

PAGE 138 OF

DATE 7-9-71

NO. REV. HI

: ; . . ATM 1029

LMS Thermal/Vacuum Test Reports PAGE l39 OF-

DATE 7-9-71

FIGURE 18

Interior

Exterior

LMS Thermal Bag

NO. REV. NO.

: ; I ~ ATM 1029

LMS Thermal/Vacuum Test Reports PAGE 140

OF

DATE 7-9-71

FIGURE 19

Control and Monitor

Housekeeping Multiplexer

NO. REV. NO.

: ; . . ATM 1029


DATE 7-9-71

FIGURE 20

Signal Command & Decoder

Counter and Data Compressor

NO. REV. NO.

ATM 1029


DATE 7-9-71

FIGURE 21

High & Low Voltage Supply

Pre-amplifier /Discriminator

: ; I ~



FIGURE 22

Emission Control

Emission Control

NO. REV. NO.

ATM 1029

PAGE 143

OF-

DATE 7-9-71

NO. REV. NO.

ATM 1029

LMS Thermal/Vacuum Test Reports 144 PAGE OF

DATE 7-9-71

FIGURE 23

LMS Electronics Assembled

LMS with Thermal Bag

NO. REV. NO.

ATM 1029


DATE 7-9-71

FIGURE 24

LMS in 4' x 8' Chamber

ETS Tied-in to LMS

HO. REV. HO.

: ; I ~ !\.TM 1029


DATE 7-9-71

V CONCLUSIONS

As with the previous thermal/vacuum test, no conclusions were drawn from the data. Instead, the data were forwarded to the Thermal Engineering group for analysis and correlation with computor simulation of identical conditions. Figures 25 to 48 are printouts of the data recorded during these tests.

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BENDIX AEROSPACE SYSTEMS DIVISION LUNAR MASS SPECTROMETER OVT THERMAL VACUUM TEST

ZERO TIME= 000001 OF 05/11/71

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BENDIX REROSPRCE SYSTEMS DIVISION LUNRR MRSS SPECTROMETER OVT THERMAL VRCUUM TEST

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ZERO TIME = 000001 OF 05/11/71

mLHS-111 EMISSION CONTROL BOARD TEMPERATURE- CENTER RIGHT

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ATM No. 1029 of 7-9-71

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Figure 36

BENDIX AEROSPAC~ SYSTEMS DIVISION LUNAR MASS SPECTROMETER OVT THERMAL VACUUM TEST

ZERO TIME= 000001 OF 05/11/71

~l"S-112 E"ISSION CONTROL BORAD TE"PEARTUAE- CENTER LEFT

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Figure 37

BENDIX REROSPRCE SYSTEMS DIVISION LUNRR MRSS. SPECTROMETER DVT THERMAL VRCUUM TEST

ZERO TIME = 000001 OF 05/11/71

mL"S-113 SWEEP CONTROL RSSE"BLY TE"PEftATUAE- CENTER RIGHT ON BAD

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·BENDIX AEROSPACE SYSTEMS DIVISION LUNAR MASS SPECTROMETER OVT THERMAL VACUUM TEST

ZERO TIME = 000001 OF 05/11/71

mLKS-11~ SWEEP CONTROL ASSEMBLY TEMPERATURE- CENTER LEfT_GN BRD

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ZERO TIME= 000001 Of 05/11/71

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BENDIX AEROSPACE SYSTEMS DIVISION LUNAR MASS SPECTROMETER OVT THERMRL VRCUUM TEST

ZERO TIME= 000001 OF 05/11/71

m LMS-116 POWER SUPPLY MODULE BOARD TEMPERATURE

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BENDIX AEAOSPRCE SYSTEMS DIVISION LUNAR MASS SPECTROMETER OVT THEflMAL VACUUM TEST

ZERO TIME= 000001 OF 05/11/71

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ZERO TIME = 000001 OF 05/11/71

ATM No. 1029 of_ Date: 7-9-71

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ZERO TIME= 000001 OF 05/11/71

ATMNo. 1029 of_ Date: 7-9-71

mLMS-102 COUNTER AND DRTR COMPRESSOR TEMP.-CENTER RIGHT ON FCIL ~LMS-027 COUNTER RNO DRTR COMPRESSOR TEMP. -TOP LEFT ON fOIL 6 LMS-097 COUNT~R RND DRTA COMPRESSOR TEMP. - BOTTOM LEFT ON FOIL

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ZERO TIME= 000001 CF 05/11/71

ATM No. 102<> of_ Date: 7-9-71

mLNS-101 COUNTER AND DATA COMPRESSOR TEMP.-CENTEA LEFT ON fOIL ~ LHS-027 COUNTER AND DATA COMPRESSOR TEMP. - TOP LEFT ON FOIL A LMS-097 COUNTER AND DATA COMPRESSOR TEMP. - BOTTOM LEFT ON FOIL

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.... ..,. - ••• ,..,,_,* .a.v-' of_ Date: 7-9-71

LUNAR M~~~~~~E~~~~~~~~~ ~~1T~~~R~~LI~~~~UM TEST ZERO TIME= 000001 OF 05/11/71

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'·' II ..

BENDIX AEROSPACE SYSTEMS DIVISION MRSS SPECTROMETER DVT THERMAL VRCUUM

ZERO TIME = 000001 OF 05/11/71

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ZERO TIME = 000001 OF 05/11/71

ATM No. 1029 of_ Date: 7-9-71

~LHS-059 THERMAL BAG STIFFNER TEMPERATURE ~LHS-069 7HERHAL BAG SURFACE TEMPERATURE

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Page48

, · BENDIX AEROSPACE SYSTEMS DIVISION LUNAR MASS SPECTROMETER DVT THERMAL VACUUM TEST

ZERO TIME • 000001 OF 05/11/71

ATM No. IOZ~

Page .!.!£ of 17" Date: 7-9-71

mLHS-055 THERMAL BAG STIFFNER TEMPERATURE . ~ LHS-066 THERMAL BAG SURFACE TEHPERRTURE

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NOTE~:

r .. ¥5 Engineering TherinaliV<\CVUrr\ 'fe·~t :.f.'t.ocedure

, Ins-tall l~.O~F-tb.er:plocouple reJtu;~.~nce• _qd cun~ n~ct to. TlC feedthruleads. (Refer'.t,.tl.STM1017J .

Recordfe~dth~u.lead ®mf;>erand referii\q~e J..XJo.>( number .apd .i~ttn.tification in 'I' able 1 (Para;~rraph 7.1) !or cor~aponditig T/C number and Data

· .. Acquisition S.,stern (DAS) char.tnel as~ignrne,nt. . . '• :;

Set up lc~ .S.efe.rence Standard and connect to i50°F referenc~.

Maintain the i'ce reft!rem.'o:: during the cnti?e tt~f,t by v~rifyitlg tn.tll.icieut ico jr. the .v.itCr.

6. 1. f2. lilstall clectrk(\1 }H!Wet c.tnd :-;i~nallea<;is in · <'hi':tmher £8e.dthru for l;.Ms.

t ... I.l3

6.1.14

6.J.J'i

MQun.t the LMS· on the LMS Hw rma.l va.cu~m test . fixtur.e ~ F~l)·t• .'}f li,~ 6 • 3 2 ~ .• Sp -~~~iul · . s Grew ii t h~~~,gb.'·Jtc.·,,_ri .lt:d\tt•' .:QI: -~ plate into the thetnl.ll:l'bag ~ut pla.~~.

Coat ·the h-eat e-xch,:.J+g,<n plate with Dow Co rn.lil)s

he.1t ~ink ·compo•.md No. 3·W.

Place LMS U:u~nrlal v~cutun tl'flt fixture on thP

. 6.1.16

C "" to~::;.:r't",/'::'t: ;~ HK6 (:;~';; fW /( ·. Connect LMS thet'n1ocouple lead:;-; to the;t:mucoJf!le

. fced.thrus. ·. ·~ ~-

NOTE: 1'he approftirnate ln~.J.ti.ons of th.e LMS t:h~ rmo-: co.\lpleat ~.re e.hl>:wn in Ftgur~·s 4-ti>rtl ·1

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6. 1. l7

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·J:- .. Bi;lx HZ ; • ! ' •

Turn dll JS0°F tberrnoeQ.upl~. :r~fer~n,ce J-Box rcfe reU;ctu. '

Check all DAS .cha.nnele for ~)l'Ar:.uit contltlij~~:y. Attach the.~-·~ with di q,ue,f:iouJtble ch~nnel& cleady identitied in T~ble I., lPa.r~.Jraph 7-.,p}.

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' :. _t:

6. 3. L.

NOTE.:·

(,. ~. -~

.. · Ob~in.~i:~ . .ulgau.se.ed ~gu•.ti~ -~for the . l)ata ~tq~isiti~i:l. Syskm. (I)AS) !To~·Uie ·Bendi~ · ·~ta Ct!!n~1:;, 'Re~.Ord the ta.p•.J4~n~/i;.:.ation · ·

" Numbe:r .. (t.~.J· · · · · · . ' ·. ' . ; _;~. ,· . ·. ' ' . ·. .·

·Ro&.fo:~· t'.l S1:'M :HH 1 :t'tn: pr9~t•e to~intr-taU nu-..gruatl~ ~e •n4_ ~indi.ng~ Pl~ce mag:netic tape in.~- PI\$ ~tid wmd JtOllWARD until the silver r~Jl~~~Ye :marker)' rea.ched. .

. ' . : ' . . . . .

u: it appeare th ... t ~he. si-lver t:ef;tec~'V'd.ruarkor at tl:te}te~zin~ ~ ~t> m4lgnciic tap~ lii mi-Ssi.ng,

. DONOYAi?-~Y A MARKER. Return tape to the· · <;omputing q~nter for t-narking and then -r~pe~t

pu'agrapha,}lp.' .. 3. I and 6. 3~ l.. · . . :. . :

Hofer to STM 1017 fo:r scanning and ~:rintout chec~.

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.r

't.fg .. :··:·., ~· .. -~. ~' .

: .. ','·

;• ··,;

.. · .. :< ... ·. .·· ... of magnetic a..nd paper tape reeorderH. TTslng ~ '

one (ll ae.cond satl'lp!e time at conth,uot!s :-;c~nnii1g_.-~-· .. _· ~·_·._ : j • ··::

• 3 ... ~

intervalir·, QP~n fO'IIlT (4) \;omplete sequential · · · · scans th:rou.Jh 'au DA.S t:hannel. Operate.t?oth tbc. :. . . · . rnagn.¢t.Lc and' pape .r t<:~ pe p rinti:>ut6. · · . . .·

Remove· tP,e ma.g;q..~tic t..J..{'e fr<>rn tile D.\S ind, ta:ke it to' th~ ~-~tu:iix: Da~ Ct'.!n:ter for ev:l.lttat.icm. Thi~> tape must· he d\.~:nped and returrtcd with the tape du.mp to the En_viromnental 'f(! st Opera tione Engip.e~:t- f?t' -evalttathu~ •

. I I

NOTE: · If th~ coJ:n,pu,ter durnp was n(,}t Huecessful,. rept:at ·A!/A· ,··.

•

pa'ragraphtJ '6~ 3.1 thr-ough ( •• 3~ 4~ · ' ' .

. <Ob.tain anQth~r. ,cl~an deg.iu~ed magnetic tape . · ~ron1 the ~~lldilf l)ata Center. Rct~l~e t,ape···

t, D~. nunJ~er. . · I -:9 9' ·. 'VItttt~Y tet~ttl)t!D .- o~rlf

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001

002

003

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007

IJ09

010

0 11

01~

011

014

01?

. Ol(J

017

018

019

020'

' -'021

ice ref 1

LMS 1

LMS6

LMS.9

LMS ll ·LMS 13

LMS 15

L.M.S 16

LMS 17

LMS 18

LMS J9.

LMS 22.

" '.' t' ·, : -~· ...

',_. 1

',~;."• :cfi./· .. -~

. . . : - . ' . ' 2'36 5.'),<}(f f ··,

LMS Engipeet.ing ~hermal/V'aq.J.~n>.' Test ~oO.eduri · ·

. ' $,

t 3 ' --

.:f: I!" ~-

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7.1

DA$ Channd

o:~2

023

024-

tl26

027

0/.3

03t

0 )3

0 }5

03?

03:-5

O.c•)

(140

tHl

044

()45

Data Svn:tbnl

LMS 33

LMS ~~4

I .?A!j 3 :.;

L:rvtS 36

LMS 37

! •. MS 41

l .• M$ 4;3

LMS 44

LMS 45

LMS-46

l:..MS 47

L.MS' ~ l

LMS )2

LMS 53

L~1S 'i-1

J::' IS :i&

••t' a

Wfli Ut

L!vf,S S 9

LMS (,I

LMS f,J

LMS .6-t

L)4S 65

kO. . . . . . ; . .

I~MS E;ng.ineering Thol;'mal/VC\C>.Imn· T~st Pro:cedure

Fcedthru Nurnbe~ ........ -~

Ref. J nox No. -----...~

1 .. _.......,_. ___ ;o...._....

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,1

· Re.f. .1

'B<>X ldent. .~-~·---

3C..

2Z .

DATE

.::

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>: ,-'~} , "'' ' , : ', ' , ,! ', ~ '~: ~ I :tt ._,;· , } ' t.MS'~guu~edt.g Thermai/v~eu~ .:· ,· Te~t J?:rocedu~e , · ,:; . , · -.. , ,~' <. ·

.. ~ ,· .. (' . ,·,

:. 1 TABLE I (CON'l'INU!;D) '·. . .

DAS Channel

\J4t ..

047

. 048

()54

05H

() r:; ~~

06l

062

()! ?.

064

065

06ll

O&l

06H

D.ata sv;pbol

4MS 66

LMS 67

LMS 68

LMS 94

LMS 9t·

LJ.I45 9 -~

LMS 9'J

LMS 101

LMS 102

LMS 103

LMI'.) 104

L.M$ 105

LMS 106

L.MS 107

LM;S l 08

LMS 109

LM.$. 110

LMS 11 I

I ... MS ~ ll

LMS 113

LMS .11~· LMS 115

L~ 11-6

Feedt,h.tu Numhet<

~-....-......-

. f~

• '·· .t•, •• ; '•

I f~: --''------~....._...___,>:"'--· l ~ " "---~--· ~~_,...,.....,. :.· :.

l fi H ~-----·,,: .. ·, l i.

._t·-r __ ~ Ztl ·2·8 z.·~

__ ZI) · .. · ..

'~""" li A

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. --~~.---............,. ~-.. -------Z.E· ?.f

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r

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7. I ~ .

071

072

071

. 074

07:;

07tl

071'

07S

OHO

. 0~ 1

·os.2

.083

084

086

087

.089

090

. 091

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lms thermal/vacuum test reports · lms thermal/vacuum test reports pagi 1 of 170 l date 7-9-71 the...

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