ls y876 - osram...ls y876 1 version 1.2 | 2018-02-12 produktdatenblatt | version 1.1 ls y876 micro...

22
LS Y876 1 Version 1.2 | 2018-02-12 www.osram-os.com LS Y876 Micro SIDELED ® 3010 Micro SIDELED is a SMT LED with side emission. Due to its low package height it is ideal for applica- tions in limited space environments. Applications Electronic Equipment White Goods Features: Package: white SMT package, colorless clear resin Chip technology: InGaAlP Typ. Radiation: 120° (Lambertian emitter) Color: λ dom = 633 nm ( super red) Optical efficacy: 5 lm/W Corrosion Robustness Class: 3B

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  • LS Y876

    1 Version 1.2 | 2018-02-12

    Produktdatenblatt | Version 1.1 www.osram-os.com

    LS Y876

    Micro SIDELED® 3010 Micro SIDELED is a SMT LED with side emission. Due to its low package height it is ideal for applica-tions in limited space environments.

    Applications — Electronic Equipment — White Goods

    Features: — Package: white SMT package, colorless clear resin

    — Chip technology: InGaAlP

    — Typ. Radiation: 120° (Lambertian emitter)

    — Color: λdom = 633 nm (● super red)

    — Optical efficacy: 5 lm/W

    — Corrosion Robustness Class: 3B

  • LS Y876

    2 Version 1.2 | 2018-02-12

    Ordering Information Type Luminous Intensity 1) Ordering Code

    IF = 20 mAIv

    LS Y876-P2S1-1-Z 56 ... 224 mcd Q65110A2412

  • LS Y876

    3 Version 1.2 | 2018-02-12

    Maximum RatingsParameter Symbol Values

    Operating Temperature Top min. max.

    -40 °C 100 °C

    Storage Temperature Tstg min. max.

    -40 °C 100 °C

    Junction Temperature Tj max. 125 °C

    Forward current TS = 25 °C

    IF max. 30 mA

    Surge Current t ≤ 10 µs; D = 0.005 ; TS = 25 °C

    IFS max. 500 mA

    Reverse voltage 2) TS = 25 °C

    VR max. 12 V

    ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM)

    VESD 2kV

  • LS Y876

    4 Version 1.2 | 2018-02-12

    CharacteristicsIF = 20 mA; TS = 25 °C

    Parameter Symbol Values

    Peak Wavelength λpeak typ. 645 nm

    Dominant Wavelength 3) IF = 20 mA

    λdom min. typ. max.

    627 nm 633 nm 639 nm

    Spectral Bandwidth at 50% Irel,max ∆λ typ. 16 nm

    Viewing angle at 50 % IV 2φ typ. 120 °

    Forward Voltage 4) IF = 20 mA

    VF min. typ. max.

    1.80 V 2.00 V 2.30 V

    Reverse current 2) VR = 12 V

    IR typ. max.

    0.01 µA 10 µA

    Temperature Coefficient of Peak Wavelength -10°C ≤ T ≤ 100°C

    TCλpeak typ. 0.14 nm / K

    Temperature Coefficient of Dominant Wavelength -10°C ≤ T ≤ 100°C

    TCλdom typ. 0.05 nm / K

    Temperature Coefficient of Forward Voltage -10°C ≤ T ≤ 100°C

    TCVF typ. -2 mV / K

    Real thermal resistance junction/ambient 5), 6) RthJA real max. 630 K / W

    Real thermal resistance junction/solderpoint 5) RthJS real max. 350 K / W

  • LS Y876

    5 Version 1.2 | 2018-02-12

    Brightness Groups Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7)

    IF = 20 mA IF = 20 mA IF = 20 mAmin. max. typ.Iv Iv ΦV

    P2 56 mcd 71 mcd 190 mlm

    Q1 71 mcd 90 mcd 240 mlm

    Q2 90 mcd 112 mcd 300 mlm

    R1 112 mcd 140 mcd 380 mlm

    R2 140 mcd 180 mcd 480 mlm

    S1 180 mcd 224 mcd 610 mlm

  • LS Y876

    6 Version 1.2 | 2018-02-12

    Group Name on Label Example: P2-1Brightness Wavelength

    P2 1

  • LS Y876

    7 Version 1.2 | 2018-02-12

    OHL00235

    4000

    20

    40

    60

    80

    100

    450 500 550 600 650 700nm

    %Irel

    λ

    yelloworangeambersuper-red

    Relative Spectral Emission 7) Irel = f (λ); IF = 20 mA; TS = 25 °C

    0

    0.2

    0.4

    1.0

    0.8

    0.6

    ϕ

    1.0 0.8 0.6 0.4

    0˚10˚20˚40˚ 30˚ OHL01660

    50˚

    60˚

    70˚

    80˚

    90˚

    100˚0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚

    Radiation Characteristics 7) Irel = f (ϕ); TS = 25 °C

  • LS Y876

    8 Version 1.2 | 2018-02-12

    I

    OHL10233

    F

    V (20 mA)IIV

    010 110 102mA

    110

    -210

    100

    10-1

    super-redyelloworange/amber

    Relative Luminous Intensity 7), 8)Iv/Iv(20 mA) = f(IF); TS = 25 °C

    OHL00232

    10 -11.4 1.8 2.2 2.6 3 V 3.4

    010

    110

    10 2

    5

    5

    mA5

    1

    FV

    FI

    Forward current 7)IF = f(VF); TS = 25 °C

  • LS Y876

    9 Version 1.2 | 2018-02-12

    T

    OHL00238

    0

    VI

    -20 0 20 40 60 ˚C 100

    orange

    j

    0.4

    0.8

    1.2

    1.6

    2.0IV(25 ˚C)

    yellowambersuper-red

    super-redamberyellow

    orange

    Relative Luminous Intensity 7)Iv/Iv(25 °C) = f(Tj); IF = 20 mA

  • LS Y876

    10 Version 1.2 | 2018-02-12

    0

    OHL00090

    IF

    ˚C0 20 40 60 80 100

    T

    temp. solder pointtemp. ambientTA

    TS

    TS

    AT

    mA

    5

    10

    15

    20

    25

    30

    35

    Max. Permissible Forward CurrentIF = f(T)

    OHL00687

    10-5

    pt

    FI

    10-4 10-3 10-2 10-1 100 1010

    A

    210s

    DtPT=

    T

    PtIF

    0.01

    0.05

    0.20.1

    0.005

    0.02

    0.5

    D =

    1

    0.1

    0.2

    0.3

    0.4

    0.6

    0.5

    Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle; TS = 25 °C

  • LS Y876

    11 Version 1.2 | 2018-02-12

    Dimensional Drawing 9)

    GPLY6058

    0 ... 0.1 (0 ... 0.004)

    3.1

    (0.1

    22)

    2.9

    (0.1

    14)

    0.7 (0.028)

    0.5 (0.020)

    1.0 (0.039)

    1.2 (0.047)

    Cathode

    0.3

    (0.0

    12)

    0.5

    (0.0

    20)

    (15˚

    )

    2.3

    (0.0

    91)

    2.1

    (0.0

    83)

    1.3 (0.051)

    1.1 (0.043)

    (0.4 (0.016))

    (0.6 (0.024))

    0.25 (0.010)

    0.20 (0.008)

    Light emitting areatyp. 1.7 × 0.7

    A

    C

    Approximate Weight: 6.0 mg

    Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC 60068-2-43)

  • LS Y876

    12 Version 1.2 | 2018-02-12

    For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning.

    Recommended Solder Pad 9)

    OHPY1315

    0.8 (0.031)

    2.2

    (0.0

    87)

    0.7

    (0.0

    28)

    Component location on padBauteil positioniert

    Padgeometrie für

    C A

    verbesserte Wärmeableitung

    heat dissipationPaddesign for improved

    LötstopplackSolder resist

    C

    A

  • LS Y876

    13 Version 1.2 | 2018-02-12

    Reflow Soldering ProfileProduct complies to MSL Level 2 acc. to JEDEC J-STD-020D.01

    00

    s

    OHA04525

    50

    100

    150

    200

    250

    300

    50 100 150 200 250 300t

    T

    ˚C

    St

    t

    Pt

    Tp240 ˚C

    217 ˚C

    245 ˚C

    25 ˚C

    L

    Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum

    Ramp-up rate to preheat*)25 °C to 150 °C

    2 3 K/s

    Time tSTSmin to TSmax

    tS 60 100 120 s

    Ramp-up rate to peak*)TSmax to TP

    2 3 K/s

    Liquidus temperature TL 217 °C

    Time above liquidus temperature tL 80 100 s

    Peak temperature TP 245 260 °C

    Time within 5 °C of the specified peaktemperature TP - 5 K

    tP 10 20 30 s

    Ramp-down rate*TP to 100 °C

    3 6 K/s

    Time25 °C to TP

    480 s

    All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

  • LS Y876

    14 Version 1.2 | 2018-02-12

    Taping 9)

    OHAY1515

    1.5 (0.059)

    4 (0.157)

    2 (0.079)

    3.5

    (0.1

    38)

    1.75

    (0.0

    69)

    8.1

    (0.3

    19)

    0.9 (0.035)

    2.4

    (0.0

    94)

    3.3

    (0.1

    30)

    1.25 (0.049)

    0.3 (0.012) max.1.4 (0.055)

  • LS Y876

    15 Version 1.2 | 2018-02-12

    Tape and Reel 10)

    Reel dimensions [mm]A W Nmin W1 W2 max Pieces per PU

    180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 3000

    330 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 10000

  • LS Y876

    16 Version 1.2 | 2018-02-12

    Barcode-Product-Label (BPL)

    Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

    Dry Packing Process and Materials 9)

    OHA00539

    OSRA

    M

    Moisture-sensitive label or print

    Barcode label

    Desiccant

    Humidity indicator

    Barcode label

    OSRAM

    Please check the HIC immidiately afterbag opening.

    Discard if circles overrun.Avoid metal contact.

    WET

    Do not eat.

    Comparatorcheck dot

    parts still adequately dry.

    examine units, if necessary

    examine units, if necessary

    5%

    15%

    10%bake units

    bake units

    If wet,

    change desiccant

    If wet,

    Humidity IndicatorMIL-I-8835

    If wet,

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  • LS Y876

    17 Version 1.2 | 2018-02-12

    Transportation Packing and Materials 9)

    OHA02044

    PACK

    VAR:

    R077Ad

    ditiona

    l TEXT

    P-1+Q

    -1

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    (6P) B

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    NO:

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    (9D) D

    /C:

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    NO:

    21002199

    8

    123GH

    1234

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    OUP:

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    R

    MLBin

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    -1-20

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    Packing

    Sealing label

    Barcode label

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    Dimensions of transportation box in mmWidth Length Height

    200 ± 5 mm 195 ± 5 mm 30 ± 5 mm

    352 ± 5 mm 352 ± 5 mm 33 ± 5 mm

  • LS Y876

    18 Version 1.2 | 2018-02-12

    Chip Technology: 6: Standard InGalP C: ATON F: Thinfilm InGaAlP G: ThinGaN (Thinfilm InGaN)

    (Subcon: Sapphire) S: standard InGaN low current

    ´ Encapsulant Type / Lens Properties 7: Colorless clear or white volume conversion

    (resin encapsulation) S: Silicone (with or without diffuser)

    Wavelength Emission Color Color coordinates according (λdom typ.) CIE 1931/Emission color: B: 470 nm blue W: white S: 633 nm super red T: 528 nm true green Y: 587 nm yellow R: 625 nm red O: 606 nm orange G: 570 nm green CP: 560 nm pure green L: Light emitting diode

    Package Type Y: Micro SIDELED

    Lead / Package Properties 1: 2808 height: 0,8 mm 8: Reflector Standard

    Type Designation System

    L B Y 8 7 C

  • LS Y876

    19 Version 1.2 | 2018-02-12

    NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-sure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. As is also true when viewing other bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-tion, annoyance, visual impairment, and even accidents, depending on the situation.

    Subcomponents of this LED contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There-fore, we recommend that customers minimize LED exposure to aggressive substances during storage, pro-duction, and use. LEDs that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.

    For further application related informations please visit www.osram-os.com/appnotes

  • LS Y876

    20 Version 1.2 | 2018-02-12

    Disclaimer

    DisclaimerLanguage english will prevail in case of any discrepancies or deviations between the two language word-ings.

    Attention please!The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version on the OSRAM OS webside.

    PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.

    Product safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.

    In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-nate the customer-specific request between OSRAM OS and Buyer and/or Customer.

  • LS Y876

    21 Version 1.2 | 2018-02-12

    Glossary1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal

    reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3).

    2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-tion is not allowed.

    3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro-ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3).

    4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3).

    5) Thermal Resistance: Rth max is based on statistic values (6σ).6) Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16 mm² per pad)7) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data

    or calculated correlations of technical parameters can only reflect statistical figures. These do not nec-essarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.

    8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-ences between single LEDs within one packing unit.

    9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm.

    10) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

  • LS Y876

    22 Version 1.2 | 2018-02-12

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