lte cat-m1 / iot antenna · the lsp69001299tr lte nb-iot antenna can be designed into many wireless...

Application Note: LSP69001299TR

LTE Cat-M1 / IoT Antenna Specifications

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LTE Cat-M1 / NB-IoT Antenna SpecificationsApplication Note | Part No. LSP69001299TR

The Important Information/Disclaimer is incorporated in these specifications by reference and should be reviewed in full before placing any order.

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FEATURES LTE Cat-M1/NB-IoT Quicker time to market Standard Product Smaller Form Factor & Ground Clearance Requirements

ADVANTAGES Eliminates External antennas Fewer design changes. Simple implementation Speeds development time and reduces costs since reduces NRE

and custom development time Can be used in a variety of custom form factors and applications

DESIGN GUIDELINESINTRODUCTIONThe LSP69001299TR LTE NB-IoT Antenna can be designed into many wireless product types using small form factor board. The following sections explain Ethertronics’ recommended layouts to help the designer integrate the antennas into a product with optimum performance.

ELECTRICAL SPECIFICATIONSTypical performance antenna measured on 60 x 40 mm PCB

Frequency (MHz)

On 60x40 mm PCBB12 B13 B20 1710 - 2170

Return Loss <-2.5 dB <-3 dBEfficiency 15 % 42 %Peak Gain -2.4 dBi @ 740 MHz -2.8 dBi @ 750 MHz -3.0 dBi @ 815 MHz 1.3 dBi @ 2030 MHz

Impeadance 50 ohms unbalanced

MECHANICAL SPECIFICATIONSOrdering Part Numbers LSP69001299TR

Dimensions (mm)35.00 ± 0.10 length 9.00 ± 0.10 width

3.20 ± 0.10 thickness

Mechanical mounting SMT (P&P)

Weight (grams) 0.2 grams

Color Black

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FEATURESTypical layout dimensions in mm

Additional vias : Diam. 0.2 mm to be placed around antenna, (no vias on transmission lines)

Via holes must be covered by solder mask

Pin# Description

1 Dummy Pad

2 Dummy Pad

3 Ground

4 Feed

5 Ground

6 Dummy Pad

7 Dummy Pad

Top Solder Mask

Default Pi matching Network values with instructions can be found under Antenna Matching Network.

50 Ohms Trace

Top Metal

Pin #2 Pin #3 Pin #4 Pin #5

Pin #1

Pin #6

Pin #7

Antenna Outline

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ANTENNA LOCATIONThe Figure below shows LSP69001299TR typical landing location of LTE Cat-M1/NB-IoT Antenna

ANTENNA TUNING GUIDELINESThe board size and antenna location are the most important factor for antenna performance. The smaller the board size, the lower the low band performance will be. Nonetheless, antenna performance can be improved by optimizing the matching components.

Here are some studies to help identifying the optimum circuit matching and the best battery position far from antenna:

Study 1: Antenna performance using the circuit matching Study 2: Antenna performance variation based on R1 and R2 effect Study 3: Antenna performance variation based on S1 effect Study 4: Antenna performance variation with different battery position

9001299-01.B

60 mm

40 mm

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RETURN LOSS AND EFFICIENCY PLOTSTypical Performance measured with 60 x 40 mm PCB

Z Y

-1 5

-1 2

-9

-6

-3

0

698 724.2 750.4 776.6 802.8 829 855.2 881.4 907.6 933.8 960

Ret

urn

Loss

(dB)

Frequency (MHz)

-15

-12

-9

-6

-3

0

1710 1756 1802 1848 1894 1940 1986 2032 2078 2124 2170

Ret

urn

Loss

(dB)

Frequency (MHz)

0

5

10

15

20

25

30

35

40

45

50

698 724.2 750.4 776.6 802.8 829 855.2 881.4 907.6 933.8 960

Effic

ienc

y (%

)

Frequency (MHz)0

10

20

30

40

50

60

70

80

90

100

1710 1756 1802 1848 1894 1940 1986 2032 2078 2124 2170

Effic

ienc

y (%

)

Frequency (MHz)

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LOW BAND RETURN LOSS

LOW BAND EFFICIENCY HIGH BAND EFFICIENCY

HIGH RETURN LOSS

5



RADIATION PATTERN PLOTSTypical performance measured with 60 x 40 mm PCB Measured at 700, 750, 850, 900, 1800, 1900, 2100 MHz

Z

X

Y

Mea

sure

d at

700

, 750

, 80

0, 9

00 M

Hz

Mea

sure

d at

180

0, 1

900,

21

00 M

Hz

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ANTENNA MATCHING NETWORK (LSP69001299TR)Typical matching values on 60 x 40 mm PCB

Antenna Matching(Antenna Matching):

pads are directly inline with the antenna feed trace.

Pin# Description

1 Dummy Pad

2 Dummy Pad

3 Ground

4 Feed

5 Ground

6 Dummy Pad

7 Dummy Pad

ANTENNA MATACHING CIRCUITS1/S3 S2 P1 P2/P3/P4 R1 R2

Defaulting Matching 0 Ohm 2pF 13NH DNI 20nH 22nH

Part Number RC0402J R-070RL

04025JR0P BS

LQW15AN13 NG00D

LQW15AN20 NG00D

LQW15AN22 NG00D

1 2 3 4 5 6 7

R1 R2

S2 S3

P1 P2 P3 P4

50 Ohms

(Antenna Matching)S1

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R1 S1

S2S3

P1

P2

P3

P4

R2

[[[

[[ [[

[ [

[[[[[ [[

[

[

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STUDY 1: ANTENNA MATCHING NETWORK FOR B12, B13 AND B20Measured on 60 x 40 mm PCB

S1/S3 S2 P1 P2 P3/P4 R1 R2

B12 Matching 0 Ohm 2.6pF 8.2nH 8.2nH DNI 22nH 22nH

B13 Matching 0 Ohm 3.5pF 10nH DNI DNI 18nH 18nH

B20 Matching 0 Ohm 1.5pF 22nH DNI DNI 18nH 18nH

RETURN LOSS AND EFFICIENCY PLOTSBelow are typical performances using Ethertornics Standard demo-board.

-15

-12

-9

-6

-3

0

698 724.2 750.4 776.6 802.8 829 855.2 881.4 907.6 933.8 960

Ret

urn

Loss

(dB)

Frequency (MHz)

B12 B13 B20

-15

-12

-9

-6

-3

0

1710 1756 1802 1848 1894 1940 1986 2032 2078 2124 2170

Ret

urn

Loss

(dB

)

Frequency (MHz)

0

5

10

15

20

25

30

35

40

45

50

698 724.2 750.4 776.6 802.8 829 855.2 881.4 907.6 933.8 960

Effic

ienc

y (%

)

Frequency (MHz)

B12 B13 B20

0

10

20

30

40

50

60

70

80

90

100

1710 1756 1802 1848 1894 1940 1986 2032 2078 2124 2170

Effic

ienc

y (%

)

Frequency (MHz)

Low Band Return Loss

Low Band Efficiency

High Band Return Loss

High Band Efficiency

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STUDY 2: ANTENNA MATCHING NETWORK / THE R1 AND R2 EFFECT ON THE LOW BAND PERFORMANCEMeasured on 60 x 40 mm PCB

S1/S3 S2 P1 P2 P3/P4 R1 R2

Config1 0 Ohm 2.6pF 8.2nH 8.2nH DNI 15nH 15nH



RETURN LOSS AND EFFICIENCY PLOTSMeasured on 60 x 40 mm PCB

-15

-12

-9

-6

-3

0

698 724.2 750.4 776.6 802.8 829 855.2 881.4 907.6 933.8 960

Ret

urn

Loss

(dB)

Frequency (MHz)

B12 B13 B20

-15

-12

-9

-6

-3

0

1710 1756 1802 1848 1894 1940 1986 2032 2078 2124 2170

Ret

urn

Loss

(dB)

Frequency (MHz)

0

5

10

15

20

25

30

35

40

45

50

698 724.2 750.4 776.6 802.8 829 855.2 881.4 907.6 933.8 960

Effic

ienc

y (%

)

Frequency (MHz)

B12 B13 B20

0

10

20

30

40

50

60

70

80

90

100

1710 1756 1802 1848 1894 1940 1986 2032 2078 2124 2170

Effic

ienc

y (%

)

Frequency (MHz)


Low Band Return Efficiency


High Band Return Efficiency

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STUDY 3: ANT ENNA MATCHING NETWORK / THE EFFECT OF S1 ON THE HIGH BAND PERFORMANCEMeasured on 60 x 40 mm PCB

S3 S2 P1 P2 P3/P4 R1 R2Config1 0 Ohm 2.6pF 8.2nH 8.2nH DNI 15nH 15nH

Config1 Config A Config B Config C Config DS1 0 Ohm 1nH 2nH 6.8pF 10pF

RETURN LOSS PLOT AND EFFICIENCY PLOTSMeasured on 60 x 40 mm PCB

-15

-12

-9

-6

-3

0

698 724.2 750.4 776.6 802.8 829 855.2 881.4 907.6 933.8 960

Ret

urn

Loss

(dB)

Frequency (MHz)

-15

-12

-9

-6

-3

0

1710 1756 1802 1848 1894 1940 1986 2032 2078 2124 2170

Ret

urn

Loss

(dB)

Frequency (MHz)

0

5

10

15

20

25

30

35

40

45

50

698 724.2 750.4 776.6 802.8 829 855.2 881.4 907.6 933.8 960

Effic

ienc

y (%

)

Frequency (MHz)

B12 B13 B20

0

10

20

30

40

50

60

70

80

90

100

1710 1756 1802 1848 1894 1940 1986 2032 2078 2124 2170

Effic

ienc

y (%

)

Frequency (MHz)


Low Band Efficiency


High Band Effieciency

S1=0Ω S1=1nH S1=2nH S1=6.8pF S1=10pF

S1=0Ω S1=1nH S1=2nH S1=6.8pF S1=10pF

B12 B13 B20

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STUDY 4: THE BATTERY POSITION EFFECT UNDER THE EVBMeasured on 60 x 40 mm PCB with matching Config1

BATTERY POSITION EFFECT: RETURN LOSS AND EFFICIENCY PLOT (LSP69001299TR WITH MATCHING CONFIG1)Measured on 60 x 40 mm PCB

-15

-12

-9

-6

-3

0

698 724.2 750.4 776.6 802.8 829 855.2 881.4 907.6 933.8 960

Ret

urn

Loss

(dB)

Frequency (MHz)

B12 B13 B20

-15

-12

-9

-6

-3

0

1710 1756 1802 1848 1894 1940 1986 2032 2078 2124 2170

Ret

urn

Loss

(dB)

Frequency (MHz)

0

5

10

15

20

25

30

35

40

45

50

698 724.2 750.4 776.6 802.8 829 855.2 881.4 907.6 933.8 960

Effic

ienc

y (%

)

Frequency (MHz)

B12 B13 B20

0

10

20

30

40

50

60

70

80

90

100

1710 1756 1802 1848 1894 1940 1986 2032 2078 2124 2170

Effic

ienc

y (%

)

Frequency (MHz)

W/o battery 13mm 11mm 5mm 0mm

W/o battery 13mm 11mm 5mm 0mm


Low Band Return Efficiency


High Band Return Efficiency

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Adjust the reflow duration to create good solder joints without raising the antenna temperature beyond the allowed maximum of 260° C.

Paste Stencil RecommendationEthertronics recommends application of paste stencil to a thickness of 0.1mm, applied to within 0.125mm of the solder mask surrounding each exposed metal pad on the PCB. PCB layouts for each antenna are provided in earlier section of this document.

Soldering RecommendationsThe recommended method for soldering the antenna to the board is forced convection reflow soldering. The following suggestions provide information on how to optimize the reflow process for the antenna:

Additional Manufacturing RecommendationsCare should be taken during certain customer-specific manufacturing processes including PCB separation and Ultrasonic Welding to ensure these processes don't create damage to the components

Cleaning RecommendationsAfter the soldering process, a simple wash with deionized water sufficiently removes most residues from the PCB. Most board assembly manufacturers use either water-soluble fluxes with water wash, or "no clean" fluxes that do not require cleaning after reflow.Acceptable cleaning solvents are CFC alternatives, Isopropyl Alcohol (IPA), and water. If the application uses other types of solvents, please consult with Ethertronics.Cleaning processes that should be avoided are ultrasonic cleaning and any abrasive techniques, such as scrubbing with a cotton swab or with an abrasive material.

Rework & Removal RecommendationsThere may be a need to rework or remove the antenna from the PCB. Although Ethertronics’ antennas are designed for ease-of-use, use care when separating them from the PCBs. Careless heating or removal of the antenna can cause thermal, mechanical or lead damage. These degradations may render the antenna useless, impeding any failure analysis and preventing the reuse of the device. Therefore it is recommended to observe the following precautions:• The component can be reworked and soldered by hand using a soldering iron. However care should be used so the temperature does

not exceed 260°C. The soldering iron should not touch the composite material while soldering the leads of the antenna.• The component can be reworked and soldered using a hot air rework station. However, care should be taken to ensure that the

temperature does not exceed 260°C.• Once the solder on the PCB is sufficiently heated, use a vacuum pen to lift the antenna straight up off the PCB. Avoid twisting or rotating

the device while removing it.

Tape & Reel Specifications Product will be shipped in Tape and Reel packaging.

Product specifications subject to change without notice.

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lte cat-m1 / iot antenna · the lsp69001299tr lte nb-iot antenna can be designed into many wireless...

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