m cubed thermal management materials web
DESCRIPTION
m cubedTRANSCRIPT
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Silicon carbide particle reinforced aluminum (Al/SiC) MMCs provide distinct advantages for thermal management applications. Since Al and SiC offer low density and high thermal conductivity, combining the two materials maintains these important material characteristics. At the same time, CTE can be tailored based on the SiC (CTE of 3 ppm/K) to Al (CTE of 23 ppm/K) ratio in the composite. Key attributes of M Cubeds Al/SiC MMCs are:
M Cubed provides multiple reaction bonded ceramic formulations to meet a broad range of design requirements and product applications. The following three reaction bonded formulations are available for thermal management. In addition, custom formulations are provided where required.
Si/SiC (SSC-802): High thermal conductivity with CTE match to Si Si/SiC + Al (HSC-702): High thermal conductivity with CTE match to AlN Si/SiC + Diamond (Dymonite 100-60): Ultra-high thermal conductivity for heat critical applications
Key attributes of the reaction bonded ceramics include: Near and near-net shape fabrication near zero process shrinkage Complex shape capability with net-shape molding, green machining, and/or preform joining Patent protected processes
M Cubed Technologies, a subsidiary of II-VI Corp., is a leading provider of advanced metal matrix composites (MMCs) and reaction bonded ceramics to the semiconductor equipment, LCD equipment, wear, refractory, optics, defense, and thermal management !Korea, and Japan. M Cubed provides its customers with optimized turn-key solutions, starting with product design and analysis
"#$capability, large manufacturing scale, and tailorable material properties (e.g., CTE matching).
For Thermal Management, M Cubed offers a broad range of fully isotropic, high performance, engineered MMC and ceramic materials. %expansion (CTE) values. This range allows precise matching to the desired mating component. Moreover, thermal conductivity values are high, and in some cases exceed copper. All of M Cubeds thermalmanagement materials are machineable (by cutting, grinding, lapping, and/or EDM), and support a broad range of product cooling channels.
THERMAL MANAGEMENT MATERIALS
TECHNOTE
Metal Matrix Composites (MMCs)
Reaction Bonded Ceramics
Near and near-net shape manufacturing with investment, sand, and permanent mold castingFully machinable, including direct threadingCompatible with standard plating processesGreatly enhanced mechanical and thermal stability relative to traditional metalsHigh toughness relative to ceramicsPatent protected processes
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THERMAL MANAGEMENT MATERIALS
General Inquiries: Phone (203) 304-2940 Sales Inquiries: [email protected] (203) 304-2940, Fax (203) 426-0880
M Cubed Technologies, Inc.31 Pecks Lane, Suite 8Newtown, CT 06470
www.mmmt.com
Property Comparisons
Material
REV 112614
TECHNOTE
(W/mK -RT)
M Cubed ASC-303(Al/SiC-30p MMC)
M Cubed MMC-555(Al/SiC-55p MMC)
M Cubed SSC-802(Reaction Bonded Si/SiC)
M Cubed HSC-702(Reaction Bonded Si/SiC + Al)
M Cubed Dymonite 100-60TM
Si
GaAs
GaN
SiC(Single Crystal)
Cu
Al(6061)
Kovar
Invar 36
Cu/W
Cu/Mo
Al2O3
AIN
BeO
Package/Heat Sink
Package/Heat Sink
Package/Heat Sink
Package/Heat Sink
Package/Heat Sink
Semiconductor
Semiconductor
Semiconductor
Semiconductor
Conductor/Metal
Conductor/Metal
Conductor/Metal
Conductor/Metal
Conductor/Metal
Conductor/Metal
Insulator/Ceramic
Insulator/Ceramic
Insulator/Ceramic
2.8
3.0
3.0
3.0
3.2
2.3
5.2
6.2
3.2
9.0
2.7
8.2
8.0
16-19
9-10
3.9
3.3
2.9
125
200
380
330
650
112
90
...
420
120
70
135
150
...
...
360
300
330
14
11
2.9
4.4
1.5
2.7
6.5
...
3.1
17
23
5.6
1.7
6-8
7-9
6.5
4.5
7.6
160
160
185
200
540
156
54
130
450
394
172
17
11
180-200
190-210
20
150-200
250
Description Density Youngs Modules CTE Thermal
Conductivity (g/cc) (GPa)
(ppm/K-RT to 100C )
(Reaction Bonded Si/SiC + Diamond)