magnetron sputtering equipment simulation

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Plasma Enhanced materials processing and

rarefied GAS dynamics Unified Simulation tools

PEGASUS


Magnetron sputtering equipment

plasma simulation

Modules ： MSSM　　　　　　　 PIC-MCCM


N

S

N

S

N

S

N

S

ターゲット

基板

Coaxial cylinder type

substrate

Target


N

S

S

SN

N

ターゲット

Planar type

Target


UBM (UnBalanced Magnetron) type

基板

磁石

substrate

Magnet


Magnetron sputtering equipments

Simulation of sputtered particles

Modules ： MSSM　　　　　　　 PIC-MCCM SPUTSM DSMCM


Block diagram for simulation of sputtered particles

PIC-MCCMNe, Ni, Φ, Es, Ve,

Vi

MSSM

Magnetic flux density

DSMCMNn,TnPn,Vn

　 Data base（Ｂ H Characteristic ）

SPUTSMSASAMAL　 Data base

Collision cross section

Incident ions to target・ Particle flux・ Energy・ Angle

Sputtered particles・ Sputtering flux・ Sputtering angle・ Sputtering energy

Adsorbed flux to sub.


Simulation of Cu sputtered particles

in Ar plasma


2D円柱座標系でモデル化

substrate

targetmagne

t Modeling of 2-D

axial symmetry

substrate

targetCylin

dric

al a

xis

Computational model

York

50mm


Step1. Magneto-static simulation by MSSM

Line of magnetic force


Step2. Plasma simulation by PIC-MCCM

Ar+density [/m3] Electric potential [V]


Sputtering flux [/m2/s]（ Erosion profile ）

Step3. Sputtering simulation by SPUTSM

Sputtering angular dist. ofsputtered particles


Step4. Simulation sputtered particle by DSMCM

Density dist. ofSputtered Cu atoms[/m3]

Cu adsorbed flux [/m2/s]


Simulation of Si sputtered particles

in Ar/O2 plasma

Facing target magnetron sputtering equip.


N

N

S

S-400 V

Ar,O2:

0.25 Pa

Remanence ： 1 [T]

10080

200

Substrate

Substrate

Computational model


Step1. Magneto-static simulation by MSSM

Magnetic flux densityLine of magnetic force


Step2. Plasma simulation by PIC-MCCM

Electrondensity [/m3]

Ar+

density [/m3] O2+

density [/m3]


O-

density [/m3]Electric

potential [V]Electron

Temp. [eV]


Si sputtering flux [/m2/s]

Step3. Sputtering simulation by SPUTSM

Ar+ ion flux [/m2/s] O2+ ion flux

[/m2/s]


Step4. Simulation sputtered particle by DSMCM

Density dist. ofSputtered Si atoms

[/m3]

Temp. dist. ofSputtered Si atoms

[eV]


Velocity dist. ofSputtered Si atoms

[m/s]

Si adsorbed flux [/m2/s]

magnetron sputtering equipment simulation

Technology