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Manual MultiPress-II

English Version1.0

LPKF Laser & Electronics AGOsteriede 7D-30827 Garbsen

Telephone : ++ 49 - 51 31 - 70 95 - 0 Fax : ++ 49 - 51 31 - 70 95 - 90Email : [email protected] : http: //www.lpkf.de

2 MultiPress II

Copyright (c) 1999 LPKF AGDistribution or reproduction of this manual and use of its content permitted only with the written approval of LPKF AG. Right to make modifications reserved. No liability is accepted for the content. In particular, we accept no liability for damage caused by information given, information absent, or erroneous information. Trademarks: HP-GL is a registered trademark of the Hewlett-Packard Comp. All other trademarks registered to their relevant owners.

MultiPress II 3

Using this manual

The information contained in this document may be modified without prior notification. No part of this document may be reproduced or trans-ferred for any purpose or in any form by any means without the express written permission of LPKF AG. We have taken great trouble to ensure the accuracy and completeness of the information in this document. However, LPKF AG accepts no liability for the use of the document, including breach of copyright or other infringement against third parties which may arise from this.

The LPKF MultiPress II multilayer press is use for pressing multilayer cir-cuit boards. Thanks to a microprocessor, the pressing cycle can be pro-grammed within wide limits. Custom temperature/pressure/time profiles which are independent of each other can be applied.

There is a duty of care on the machine operator to ensure that the following points are observed. It must be ensured that

• the machine is only used, in accordance with its intended purpose, for pressing multilayer PCBs or solder masks.

• this manual is always kept in a legible and complete condition at the site of use of the machine

• the machine is only operated by properly qualified and authorized personnel

• such personnel are familiar with this manual and the safety instructions contained in it.

4 MultiPress II

I. Conventions used in this manual

Bold print is used to emphasize important information or identify individual terms.

Illustrations are numbered by a system indicating the section number and the illustration number. Example: Figure 5-11: illustration 11 in section 5

› Prompts for actions are identified with an arrow.

Indent in italics shows the reaction as a consequence of an action.

Menu items are shown in italics.

Bold italic text is used to indicate a keyboard input

<...> identifies a key on the keyboard, eg <F4> is the label for function key F4

II. Notes on the symbols used

DangerThis symbol is used to highlight danger to life or health.

Caution This symbol is used to identify hazards which may result in damage being caused. Note This symbol is used for notes intended to help you avoid faults during operation or to help you improve your operational procedures.

III. Key

Prepreg : Intermediate layer used for cementing printed boards or foils together

Copper laminate : An especially thin board material, which is only used for pressing multilayer circuit boards.

Board material : Substrate of main board coated with copper foil

Solder-stop sheet : Special foil for milling the connections to be soldered.

IV. Target group

This manual is intended for persons who have basic knowledge of the manufacture of printed-circuit boards including multilayer circuit boards for the electronics sector.

MultiPress II 5

Table of contents

1.0 Intended use . . . . . . . . . . . . . . . . . . . . . . 7

2.0 Scope of delivery . . . . . . . . . . . . . . . . . . 7

3.0 Necessary installations . . . . . . . . . . . . . 7

4.0 Safety instructions . . . . . . . . . . . . . . . . . 8

5.0 Installation/maintenance/transportation9

5.1 Transportation. . . . . . . . . . . . . . . . . . . . . . . . . . 9

6.0 Structure of a multilayer (4-layer) . . . . 10

7.0 Materials and dimensions . . . . . . . . . . 10

8.0 Procedure for creating a multilayer . . 12

8.1 The phases of the pressing cycle . . . . . . . . . .13

9.0 Operation . . . . . . . . . . . . . . . . . . . . . . . . 16

9.1 Program selection mode . . . . . . . . . . . . . . . . .17

9.1.1 Flow chart - program selection software . . . . 19

9.2 Modification mode. . . . . . . . . . . . . . . . . . . . . .20

9.2.1 Flow chart - modification mode . . . . . . . . . . . 20

9.3 Error messages . . . . . . . . . . . . . . . . . . . . . . .21

6 MultiPress II

10.0 Materials. . . . . . . . . . . . . . . . . . . . . . . . 21

10.1 Recommended materials . . . . . . . . . . . . . . . 22

10.2 Storage of materials . . . . . . . . . . . . . . . . . . . 22

11.0 Step by step to the multilayer . . . . . . 23

11.1 Practical tips . . . . . . . . . . . . . . . . . . . . . . . . . 25

11.2 EasySolder for MultiPress . . . . . . . . . . . . . . 26

11.2.1 Accessories . . . . . . . . . . . . . . . . . . . . . . . . 26

11.2.2 Solder-stop sheet . . . . . . . . . . . . . . . . . . . . 27

11.2.3 Pressing parameters for solder-stop sheet. 27

11.3 Step by step to the solder mask . . . . . . . . . . 28

11.3.1 Processing data in CircuitCAM . . . . . . . . . . 28

12.0 Consumables. . . . . . . . . . . . . . . . . . . . 32

13.0 Technical data . . . . . . . . . . . . . . . . . . . 33

14.0 Declaration of conformity (German) . 34

15.0 Declaration of conformity (English) . 35

16.0 Index . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Intended use

MultiPress II 7

1.0 Intended use

The LPKF MultiPress II multilayer press is used only for multilayer PCBs or solder masks for use in the electronics industry. Any other use is not considered to be in accordance with the "intended use" and shall render any liability claims made against LPKF AG invalid.

When pressing multilayer circuit boards, it must be ensured that the size of the press package is as large as the pressing surface of the machine, if possible.If the surface of the press package is considerably smaller than the machine pressing surface, there is a danger of the press being damaged / destroyed.Caution: Never use material smaller than A4 format.

2.0 Scope of delivery

• MultiPress press (dimensions: WxHxD - 440 mm x 680 mm x 530 mm)

• This manual

• Gloves

• 2 x press sheet

• 2 x press plate

• 3 x 2.5mm2 / 2m mains supply line

• Compressed air line

• Table (optional)

• Compressor for 6 bar (option)

3.0 Necessary installations

• Footprint: approx. 0.25 m², approx. 1 m² with bench

• Compressed air port: 6-8 bar / 30 l/min

• Power supply: 230V/10A or 115V/20A

Safety instructions

8 MultiPress II

4.0 Safety instructions

Danger: The user must have read this manual and the documentation provided with the machine, paying particular attention to the safety instructions printed in bold, to ensure safe working with this system.

• Ensure that only trained personnel operate the press.

• If you modify the equipment yourself, the equipment's safety can no longer be guaranteed and no guarantee claims can be accepted.

• Risk of being burned behind the front cover (hood). Ensure that the press has cooled down to at least 50°C before opening the hood (temperature indicator in the display).

• Risk of being burned at the press plates after opening the press. Use the gloves provided when placing the hot multilayers in the press and removing them from it.

• Do not place hot multilayers on a flammable surface or surfaces at risk from melting.

• Do not bend or chafe the compressed air hoses between the press, control unit and compressor.

• Use only suitable materials. Please take note that some materials may produce carcinogenic dust or hazardous gases. Ask your materials supplier.

• Keep the workplace tidy.

• You should also take account of additional safety instructions in the attached documentation.

Installation / maintenance / transportation

MultiPress II 9

5.0 Installation / maintenance / transportation

• Place the multilayer press on a level, steady bench.

• The following connections must be made:

• 230V mains cable (3 x 2.5mm2) to the control unit.• Compressed air port (6 bar)

1. Compressed air port (6 bar)

2. Pressure reducer display

3. Mains supply

Fig. 5-1: Electrical and pneumatic connections on back wall of control unit

The following maintenance work must be carried out after the multilayer press has been used:

• Replace the press padding after every 3rd pressing cycle

• Replace the press sheet if it is dirty or damaged

• Remove any remaining adhesive from the pressing tool

• Change the oil in the hydraulic system every 300 operating hours

5.1 Transportation

Caution: A heavy-duty eyebolt is bolted on to the upper side of the machine for transportation purposes. The bolt must be removed after transportation to the operating location. Leaving the bolt in the machine would result in the top of the machine heating up severely.

32

1

Structure of a multilayer stack (4-layer)

10 MultiPress II

6.0 Structure of a multilayer stack (4-layer)

Fig.:6-1:Multilayer stack in the press

7.0 Materials and dimensions

Board material:

FR4 material 1mm thick, with 35µm copper coating on both sides

Standard dimension:420 mm x 360 mm max. usable gross pressing sur-face).

Recommendation: 6*7628 (35/35 µm) by Isola / Düren

Copper laminate:

5 µm copper laminate with additional adhesive coating layer (0.2 mm in total) and protective copper foil

Standard dimension: 420 mm x 360 mm

Recommendation: 2*2112 ( 0/5 µm ) by Isola / Düren

Materials and dimensions

MultiPress II 11

Prepreg:

2 x 0.1 mm insulating layer (gel time approx. 2-3 min)

Caution: Observe the manufacturer's storage regulations.

Standard dimension: 380 mm x 320 mm

Recommendation: Type 2125 (15 ST 01) by Isola / Düren

Procedure for creating a multilayer circuit board

12 MultiPress II

8.0 Procedure for creating a multilayer circuit board

• Make 3 mm registration holes (special 1 mm board material) in the board material.

• Drill insulation holes in both inner layers of the board material.

• The prepreg must be stored for at least 16 hours at room temperature.

• Press the foils and prepreg in the multilayer circuit board press together with the board material.The area around the registration holes must remain clear.

• After the pressing cycle, the material must cool down to room temperature using LPKF materials and systems (store for at least 16 hours), for the prepreg to cure properly.

• Then drill the multilayer circuit board. If the multilayer circuit board has not been stored properly there is the danger that the inner layers in the boreholes will become blocked. This may result in poor plated-through holes.

• Make through-hole plating in the multilayer circuit board.

• Mill outer layers.

• Clean the multilayer circuit board as you would a conventional circuit board.

Fig. 8-1: Production of a multilayer circuit board (cross-sectional view)


MultiPress II 13

8.1 The phases of the pressing cycle

Definitions:

P: Pressure [ N / cm² ] Display in N/cm2

T: Temperature [ °C ] Display in ° Celsius

T: Time [ min ] Display in minutes

Fig. 8-2: Temperature / pressure / time profile

Preheating phase ( 1 )

The preheating phase is used for preheating the press. The end of this phase is identified by an acoustic signal.

Caution: The door of the press should be closed before the pre-heating phase is started, to accelerate the preheating cycle.

The multilayer package is only inserted in the press once the preheating temperature has been reached. The prepreg gel zone is quickly passed by doing so. The temperature of the gel zone depends on the FR4 mate-rial and the prepreg. It normally lies between 160 and 180 ºC. Irreversi-

1 432

0 Time (min.)

Temp. (°C)

Pressure (N/cm2)


14 MultiPress II

ble shrinkage occurs when this softening range has been reached. The severity of the shrinkage depends on the type of fabric, resin, laminate thickness and also the circuit layout. The more copper remaining, the less the shrinkage (favourable: LPKF milling process).

Recommendation: Preheating temperature = 180 ºC.

Prepress phase ( 2 )

The multilayer package can only be pushed into the press once the pre-heating temperature has been reached. The prepress phase is started up by closing the door and pressing the Enter key. The multilayer pack-age is pressed together here with reduced pressure. Any trapped air bubbles could not escape easily at full pressure. Such prepress phases are mandatory for some materials (long-time prepreg). The prepress time should correspond to the gel time (approximately 10 mins).There would be an excessive resin flux if change-over to the final pres-sure took place prematurely. In the case of the recommended material, the gel time is approximately 2- 3 mins. However the prepress time should be at least approximately 20 minutes, to ensure that the air can escape safely.

Recommendation: Prepress pressure = 110 N/cm²; prepress time = 20 min

Main pressing phase ( 3 )

The temperature and pressure are kept constant during the main press-ing phase. It generally lasts approximately one hour. The actual pressing of the multilayer circuit boards takes place during this time.

Recommendation: Main pressure: 150 N/cm²;main pressing time = 60 min.

Cooling phase ( 5 )

The multilayer circuit board should not be cooled down too quickly. It is important that the pressure does not drop during the cooling phase. The multilayer circuit board could otherwise become distorted. The multi-layer package may only be removed once the temperature has fallen to around 50°C.

Recommendation: Pressure = 150 N/cm²


MultiPress II 15

Removal

After the multilayer circuit board has been removed, it should be left to rest at room temperature for around 16 hours before it is drilled. The pre-preg can cure during this time.

Caution: If the conditioning time is not observed, the inner layers in the boreholes may smear during drilling. In the event of a smeared inner layer it is not possible to make a securely plated through-hole. (This smearing can only be subsequently removed by means of a special etching process using very aggressive chemicals.)

Operation

16 MultiPress II

9.0 Operation

Fig. 9-1: Buttons and displays on the MultiPress II control unit

The following display appears in the indicator when the unit is switched on:

LPKF AG

MultiPress II

Version 1.0 Status : ready

The unit is now in the waiting position in the START menu. The following functions can then be carried out with the keys on the press control sys-tem:

ESC: Change-over to the modification modeUp arrow: Not yet functional Down arrow: Not yet functionalEnter: Change-over to the program selection mode

There are 2 modes in which it is possible to select or change various programs or program parameters.

Power

0

MultiPress II

Display

Function keysLine switch

Operation

MultiPress II 17

9.1 Program selection mode

You can enter this mode from Start menu by pressing ENTER. The fol-lowing 4 different programs can be selected and started:

• Multilayer 1

• Multilayer 2

• Multilayer 3

• Solder-stop sheet

Preset program sequences have been stored to these programs in the factory for the most frequent applications:

Multilayer I (380x320 prepreg size)This program was developed from factory trials. It is used for pressing multilayers with prepreg dimensions of 380x320mm.

Multilayer II (240x170 prepreg size)This program was developed from factory trials. It is used for pressing multilayers with prepreg dimensions of 240x170mm.

Multilayer IIIThis program was developed from factory trials for pressing circuit boards in the double Euro format (prepreg).

Solder-stop sheetThis program was developed for pressing solder-stop sheets onto assembled circuit boards.

The factory parameters are shown in the following table:

Table 9-1: Pressing parameters

Program parameters Multilayer 1 Multilayer 2 Multilayer 3Solder-stop sheet

Dimension X-direction:(cm) 38 24 32 30

Dimension Y-direction: 32 17 20 21

Preheating temperature (ºC) 180 180 180 175

Prepress pressure (N/cm2) 110 135 135 240

Prepress time (min.) 20 20 20 20

Main pressing temperature (°C)

180 180 180 175

Main laminating pressure (N/cm2)

150 180 180 240

Main pressing time (min.) 50 50 50 40

Hardening pressure(N/cm2) 150 180 180 240

Hardening time (min.) 60 60 60 5

Operation

18 MultiPress II

The values given in the table can be changed by the user in modification mode. Details of this will be given later on.

The flow chart shown below tells you how to select programs and which steps have to be taken manually whilst the program is running. The flow chart refers to the Multilayer I program.

All other programs have the same structure, only the stored tempera-tures and times are different.

This symbol shows a manual press of the Enter key.

This symbol shows a manual press of the ESC key.

This symbol shows a possible setting or selection of a parameter using the arrow keys on the MultiPress keyboard.

The texts in these oval windows always contain action commands for the operator.

Operation

MultiPress II 19

9.1.1 Flow chart - program selection software

Operation

20 MultiPress II

9.2 Modification mode

You can manually change all parameters as and when you like. In this way, it is possible to specify special pressing parameters on the basis of materials from different manufacturers, production requirements and empirical values.The basic operation is identical to the program selec-tion mode.The deviating program structure is shown in the following fig-ure.

If required, you can use the “Factory settings” function to return the pressing parameters of all programs to the “as delivered” condition.

9.2.1 Flow chart - modification mode

Operation

MultiPress II 21

9.3 Error messages

In the event of technical defects or faults in the voltage or compressed air supply, the MultiPress II reports error messages relevant to the fault. These error messages all lead to the program being halted. In such cases, the error message must be noted, the machine shut down and the fault rectified.

Caution: Never repair technical defects yourself. Consult your dealer if the machine has to be dismantled.

In the event of the following error messages, the fault must be noted, the machine shut down and the relevant dealer consulted:

• “Upper temp short.”

• “Upper temp open”

• “Lower temp short”

• “Lower temp open”

• “Pressure low”

• “Pressure Interlock”

Check the relevant parameters if the following error messages appear:

• “Pressure low”

› Check the pressure provided by your compressed air supply.

• “Hood opened”

- The hood is not closed, but the machine is at a point in the program which requires that the cover (hood) be closed in order for it to continue.

› Close the cover (hood).

Note: the hood must be closed throughout the entire pressing phase.

Materials

22 MultiPress II

10.0 Materials

10.1 Recommended materials

• Board material: ISOLA, 6*7628 (35 / 35 µm)

• Copper laminate: ISOLA, 2*2112 (0 / 5 µm)

• Prepreg: ISOLA, 2125 (15 ST 01)

These materials can also be obtained as a set from LPKF AG.

Order number: Multilayer set for MultiPress II: 106836

Caution: Observe storage instructions, particularly for the prepreg.Delivery delays may occur if you order large quantities, as LPKF keeps only smaller quantities in store in order to be able to supply new materials every time.

10.2 Storage of materials

• The board material, the copper laminate and the prepreg must be stored flat to ensure that the material does not become distorted.

• The prepreg can be stored for up to 3 months at a temperature of +20/-2° C, max 50% air humidity and if sufficiently protected against UV radiation.

• If kept in the refrigerator, it can be stored for up to 6 months at a temperature of +6/-2° C.

• The press padding must be stored in a dry place.

Step by step to the multilayer

MultiPress II 23

11.0 Step by step to the multilayer

Caution: This procedure can only succeed if the MULTIPRESS II is properly installed and programmed. Read the preceding text, too, for a better understanding of the MultiPress.

› Before pressing, remove the prepreg from the refrigerator and condition at room temperature for 16 hours.

› Make the usual registration holes in the board material (special 1mm board material, as described under “Layer construction of a multilayer stack”) using the LPKF milling-drilling plotter. Mark one corner of the board material with a drill or by cutting it off, so that the correct layer can be found again after pressing and through-hole plating have taken place. Preheat the press in the meantime. To do this, switch the press on, select the desired pressure/temperature/time curve and press START.

Caution: Use only standard sizes of Cu laminate and board material. There is a danger that the press plates may become distorted if smaller dimensions are used (see also Practical tips) Material plates smaller than A4 format must not be pressed.

› Mill the isolation in both inner layers using the LPKF milling-drilling plotter.

› Clean the board material by hand, rinse with water and wipe down with spirit. Then check the quality and cleanliness of the material.

› Cut the prepreg (2 layers) and copper laminate such that the registration holes of the board material and marking for the layer are not covered when the material is subsequently pressed. Make a notch on the prepreg and copper laminate at the points where the alignment pins are located on the board material. Then lay the individual sheets one of top of the other.

Fig. 11-1: Prepreg

Ensure that the holes for the alignment pins remain clear. The prepreg should be somewhat smaller than the board material and the copper laminate, since the resin from the prepreg might otherwise escape at the sides when the material is pressed.


24 MultiPress II

› Wear the gloves provided and place the press package in the press, as far as the limit stop of the pressing tool.

› Then close the press and press the “Enter” key.

› The pressing cycle is started automatically after the press is closed and the “Enter” key pressed.

Caution: The pressing cycle is interrupted if the cover is opened.There is a risk of being burned by hot press plates.

The sensor emits an acoustic signal at the end of the pressing cycle and the press plates open when the cover is opened.

› Put the gloves on again (risk of burning hands) and remove the press package.

Caution: The material must now be allowed to cool down to room temperature for at least 2 hours and must then rest for 16 hours so that the prepreg resin can fully harden.

› Place the multilayer board on the machine, secure it with the alignment pins and drill it with the LPKF milling-drilling plotter (use new drills if possible)

Caution: If the multilayer is not conditioned for a sufficient length of time, there is the danger that the inner layers in the boreholes will become blocked (smearing effect), resulting in the inner layers not being properly joined in through-hole plating. Ensure that the drilling time is kept to a minimum.Furthermore, any projecting, non-pressed corners on the press package must be cut off. There is a risk otherwise that the chemical bath fluid will gather in the gaps which appear and be transferred into another bath. This would lead to reduced efficiency.

› Through-plate the multilayer in the same way as double-sided printed boards, except that it is necessary to double the time for the first cleaning bath in this case.

› Mill the outer layers using the LPKF milling-drilling plotter.

› Clean the multilayer in the usual way.


MultiPress II 25

11.1 Practical tips

› Fine boreholes can be made more reliably in materials with a fine glass fabric.

› The greater the copper area, the smaller the changes in dimension (shrinkage).

› The prepreg should always be stored in the refrigerator, as this increases the shelf life.

› The prepreg must be conditioned for 16 hours at room temperature.

Caution: Do not completely remove non-connected soldering pads in the inner layers, choose instead isolation milling, as pressing will not be even if they are removed and the void could result in short-circuits. See figure below. With smaller multilayers there is the danger that the press plates will become distorted as a result of the uneven laminating pressure. For this reason, smaller multilayers must be centred on the pressing surface or several small parts used.

Fig. 11-2: Creation of short-circuits


26 MultiPress II

11.2 EasySolder for MultiPress

LPKF EasySolder is an application for the manufacture of printed board prototypes. This procedure can be used for permanently fixing a previ-ously milled solder-stop sheet to a printed board using glue, in order to simplify the soldering process, particularly in the case of printed boards with SMD components. The LPKF MultiPress II can be used for pressing on the foil.

11.2.1 Accessories

The accessories for the LPKF EasySolder for MultiPress can be ordered separately:

Order number: 106244

The following parts are included in the scope of supply:

• 2 x A4 press sheet

• 10 x A4 press padding

• 10 x A4 solder-stop sheet

• 2 x A4 pressure compensation film

• 10 x A4 drill pad sheet

• 10 x micromills

• 3 x transparent adhesive tape

• 1 x adhesive film

• 1 x scalpel

• 1 x scalpel blade


MultiPress II 27

11.2.2 Solder-stop sheet

Material: Polyimide Glue: Acrylic, flame-retarding

Note: The solder-stop sheet is provided with flame-retarding acrylic glue. The flame protection agent does not contain any polybrominated biphenyl/diphenyl mixtures and therefore no toxic or aggressive gases are generated as it burns.

The solder-stop sheet can resist a soldering bath temperature of 288°C for 5 minutes.The electrical properties comply with the IPC requirements.

11.2.3 Pressing parameters for solder-stop sheet

This curve for pressing the solder-stop sheet is set in the factory.

Tab.: 11-1

Program parameters Input value

Dimension in X-direction 30 cm

Dimension in Y-direction 21 cm

Prepress pressure 240 N / cm²

Prepress time 20 min.

Preheating temperature 175°C

Main pressure phase: 240 N/cm²

Main pressing time 40 min.

Main pressing temperature 175°C

Cooling pressure 240 N/cm²

Cooling time 60 min


28 MultiPress II

11.3 Step by step to the solder mask

11.3.1 Processing data in CircuitCAM

CircuitCam 3.X

Import the solder mask files (Gerber) with FILE, IMPORT, OPEN or the IMPORT icon in the front-to-end toolbar, with the SolderMaskTop and SolderMaskBottom layers being assigned.

To export, select the LPKF CircuitBoardPlotter entry with FILE, OPEN or click on the icon shown below. The file created is saved to the working directory under the same name as the CircuitCAM file but with the file extension “.LMD”. The relevant button can be found in the front-to-end toolbar:

Export LPKFCircuitBoardPlotter

Preparing the solder-stop sheet for milling

› Cut the solder-stop sheet to size, ensuring that it is at least 10 mm larger on all sides than the circuit board layout.

› Use two drill pad sheets, one on top of the other, for milling to avoid damage to the milling tool.

› Check whether the solder-stop sheet has a protective film. Remove the film if this is the case.

› Lay the solder-stop sheet on the two drill pad sheets with the matt side facing upwards.

› Secure the solder-stop sheet using the adhesive film supplied. When securing the sheet, make sure the solder-stop sheet is lying flat and no air is trapped.

Notes on milling the circuit board:Ensure that the circuit board material is 10 mm larger on all sides than the layout to be milled so that the solder-stop sheet can be subsequently more easily fixed to the printed board.


MultiPress II 29

Milling the solder-stop sheet using BoardMaster

Settings:

Tool: 0.1-0.15 mm micromill (0.1 mm microcutter)Tool diameter: 0.1 mmRevs: 40,000 (20,000) rpmSpeed: 10 (5) mm/s

Values in brackets apply to milling-drilling plotters with direct-current motor.

› Set the milling depth using an edge area of the solder-stop sheet which is not used. Use the traverse buttons in BoardMaster to mill a 2 x 2 mm square with the motor switched on and set the mill depth.

› Switch on the extraction system.

› Start the milling process with the data prepared by CircuitCAM.

› At the end of the milling procedure, check that all the pads have been cut out. Start the milling procedure a second time if this is not the case.

Prepare the ready-milled circuit board

› Clean and polish the printed board as described in the milling-drilling plotter manual to ensure that the solder mask adheres perfectly to the circuit board.

› Clean the circuit board once more with spirit before the pressing cycle.

Preparing the pressure compensation film

› The pressure compensation film should be replaced after every 20 pressing cycles.

Securing the solder-stop sheet to the circuit board

We recommend that you secure it using a glue stick and two small adhesive points on the printed board.

Fig. 11-3: Fixing the solder-stop sheet

Ensure that the adhesive dabs are outside the layout area.

Spots of adhesiveCircuit boardLayout areaSolder stop film


30 MultiPress II

Layer make-up of the press package

Place in sequence, centred on a press plate:

1. the press padding for the underside

2. the press sheet for the underside

3. the pressure compensation film for the underside of the circuit board

4. the circuit board with solder-stop sheet(s)

5. in the case of double-sided circuit boards: the pressure compensa-tion film for the top face of the circuit board

6. the press sheet for the top face

7. the press padding for the top face

8. and finally place the second press plate with press padding on the stack.

Figure 11-4: Single-sided circuit board

Figure 11-5: Double-sided circuit board

6)5)4)

3)2)1)

7)6)5)

4)

3)2)1)


MultiPress II 31

Curing in the multilayer press

› Place the stack in the multilayer press.

› Select the program for the solder-stop sheet in program selection mode.

› Start the pressing cycle by pressing the “Enter” key.

DangerUse the gloves provided when removing the pressing stack from the press. There is a danger of burning the hands.

Make sure that the press has cooled down before you remove the circuit board.

Practical tips

It may be the case, following milling of the film with the milling-drilling plotter, that milling chips have adhered to the adhesive underside of the film. We recommend that the milled film be rinsed under running water to remove these chips. Then allow the film to dry for a few minutes.

It is recommended that the board be painted with soldering varnish to protect the solder pads permanently against oxidation of the board, once it has been pressed with the EasySolder film.

To improve milling capability, you can warm up the adhesive side of the film (hot air blower) and then press it down lightly against the drilling base. This enhances precision, as the film is better fixed. Take care to ensure that the film is pressed down flat and there are no air blisters.

Consumables

32 MultiPress II

12.0 Consumables

You may order the following consumables from us:

Tab.: 12-1

Tab.: 12-2

MultiPress II (Art.Nr.: 106836)

Item Unit Order number

Base plate FR4 355 x 260 mm 1 101032

Laminate Multilayer 355 x 260 mm 1 101067

Prepreg 240 x 170 mm 1 101076

Pressing metal sheet 1 103249

Pressing card board cushion 1 101077

EasySolder for MultiPress II (Art.Nr.: 106244)

Item Unit Order number

Solder-Mask foil 10 105795

Pressure compensating cushion rub-ber

10 106084

Pressing metal sheet 1 104421

Pressing coardboard cushion 10 104420

Drill underlay material 1 106388

microcutter 3 mm shank 1 100889

microcutter 1/8” shank 1 100890

Scalpel blade 1 104441

Technical data

MultiPress II 33

13.0 Technical data

Dimensions (HxWxD):.............................. ... 600x530x480mm

Weight:..................................................... ... 210 Kg

Compressed air supply:........................... ... >6 bar - max.10 bar at

30l/min.

Power supply:........................................... ... 230V / 110V

Power consumption:................................. ... 2 KVA

Pressure generation by

pressure transformer: 1bar pneumatic = 100 bar hydraulic

Press force:.............................................. ... 150 KN

Press area:............................................... ... 420 x 360mm = 1500cm²

Total pressure per unit area:.................... ... 100N/cm²

Pressure per unit area on film:................. ... 120N/cm²

Maximum opening of press jaws:............. ... 40mm

Minimum opening of press jaws:.............. ... 15mm

Maximum multilayer thickness:................ ... 36mm

Minimum multilayer thickness:................. ... 20mm

Traverse speed of the press jaws:........... ... 1mm/sec.

Temperature of the heated press jaws:.... ... 180°C

Declaration of conformity (German)

34 MultiPress II

14.0 Declaration of conformity (German)

1. Hersteller der mit LPKF MultiPress-II bezeichneten Maschine ist dieFirma:

LPKFLaser & Electronics AGOsteriede 7D-30827 Garbsen

2. Bei der mit LPKF MultiPress-II bezeichneten Maschine handelt essich um eine Hydraulikpresse, die zum Verpressen von Mehrlagen-multilayerplatinen und Lötstoppfolien geeignet ist. Die Seriennummerder vorstehenden Maschine ist auf der Maschinenrückseite ange-bracht. Weitere Angaben zur Multipress-II sind dem beiliegendenHandbuch zu entnehmen.

3. Die LPKF MultiPress-II entspricht den Bestimmungen der EG-Maschinenrichtlinie 93 /68 vom 22.Juli93, der EG-Nieder-spannungsrichtlinie (89/336/EWG).

4. Die LPKF Multipress-II ist nach dem Stand der Technik und nach denanerkannten sicherheitstechnischen Regeln entwickelt und gebautworden. Bei der Erstellung fanden auch bestehende DIN-Vorschriften Anwendung.

5. Bevollmächtigter Unterzeichner dieser Erklärung ist

Herr Bernd HackmannVorstandsmitglied der LPKF AGOsteriede 730827 Garbsen

Bernd Hackmann

Declaration of conformity (English)

MultiPress II 35

15.0 Declaration of conformity (English)

1. The manufacturer of the machine identified as the MultiPress II is:

LPKFLaser & Electronics AGOsteriede 7D-30827 Garbsen

2. The machine identified as the MultiPress II is a hydraulic press, suita-ble for pressing multilayer circuit boards and solder-stop sheets. The serial number of the machine is affixed to the rear side of the machine. Further information regarding the MultiPress II may be found in the Manual supplied.

3. The LPKF MultiPress II complies with the requirements of the EU Machinery Directive 93 /68 dated 22 July 93, of the EU Low Voltage Directive (89/336/EEC).

4. The LPKF MultiPress II has been developed and constructed in accordance with the state of the art and in accordance with the recog-nized rules of safety.Existing DIN specifications have also been applied.

5. The authorized signatory of this declaration is:

Herr Bernd HackmannMember of the board of management of LPKF AGOsteriede 7D-30827 Garbsen

Bernd Hackmann

Index

36 MultiPress II

16.0 Index

AAccessories ......................................................................................26Acrylic ...............................................................................................27Air humidity .......................................................................................22

BBoard material ....................................................................................4BoardMaster .....................................................................................29

CCaution ...............................................................................................4Changes in dimension ......................................................................25CircuitCam ........................................................................................28Compressed air port ...........................................................................7Compressed air supply .....................................................................33Connections ........................................................................................9Consumables ....................................................................................32Conventions used in this manual ........................................................4Cooling phase ...................................................................................14Copper area ......................................................................................25Copper laminate .................................................................................4Creating a multilayer .........................................................................12Cu laminate ......................................................................................23Curing ...............................................................................................31

DDanger ................................................................................................4Declaration of conformity ............................................................34, 35Defects .............................................................................................21Destruction .........................................................................................7Dimensions .......................................................................................33

EEasySolder .......................................................................................26Enter key ..........................................................................................18Error messages ................................................................................21ESC. key ...........................................................................................18

FFactory parameters ..........................................................................17Factory settings ................................................................................20Footprint .............................................................................................7Front panel design ............................................................................16

GGlass fabric .......................................................................................25Gloves ..............................................................................................23

HHeavy-duty eyebolt .............................................................................9Holes for the alignment pins .............................................................23

Index

MultiPress II 37

IIn the event of technical defects ....................................................... 21Intended use ...................................................................................... 7

KKey ..................................................................................................... 4

LLayer make-up ................................................................................. 29Liability claims .................................................................................... 7LPKF materials ................................................................................. 12

MMain pressing phase ........................................................................ 14Mains supply ...................................................................................... 9Maintenance work .............................................................................. 9Materials ............................................................................................. 8Modification mode ............................................................................ 20Modifications ...................................................................................... 8Multilayer I ........................................................................................ 17Multilayer II ....................................................................................... 17Multilayer III ...................................................................................... 17Multilayer set for MultiPress II .......................................................... 22

NNote .................................................................................................... 4

OOil change .......................................................................................... 9Operating chart ................................................................................ 18Operation ......................................................................................... 16Order numbers ................................................................................. 22

PPad ..................................................................................................... 4Phases of the pressing cycle ........................................................... 13Polyimide .......................................................................................... 27Power supply ...................................................................................... 7Practical tips ..................................................................................... 25Preheating phase ............................................................................. 13Prepreg .............................................................................................. 4Prepress phase ................................................................................ 14Press force ....................................................................................... 33Press plate ....................................................................................... 25Press stack ....................................................................................... 23Pressing parameters ........................................................................ 27Pressure compensation film ............................................................. 29Pressure generation ......................................................................... 33Pressure too low .............................................................................. 21Program selection mode .................................................................. 17Program selection software .............................................................. 19

RRecommended materials ................................................................. 22Registration holes ............................................................................ 23Removal ........................................................................................... 15

Index

38 MultiPress II

Revs .................................................................................................29Risk of being burned ...........................................................................8

SSafety instructions ..............................................................................8Scope of delivery ................................................................................7Short circuits .....................................................................................25Soldering bath temperature ..............................................................27Soldering pads ..................................................................................25Solder-stop sheet ...............................................................................4Speed ...............................................................................................29START menu ....................................................................................16Storage regulations ..........................................................................22Structure of a multilayer ....................................................................10Symbols used .....................................................................................4

TTable of contents ................................................................................5Target group .......................................................................................4Technical data ...................................................................................33Through-hole plating .........................................................................23Tool diameter ....................................................................................29Transportation .....................................................................................9

UUV radiation ......................................................................................22

WWeight ..............................................................................................33

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