march 5 - 8, 2017 mesa, arizona archive session 7...bits 2017 teaming up - handler / test cell...

Teaming Up - Handler / Test Cell BiTS 2017 Session 7 Presentation 4

March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org

Archive – Session 7

March 5 - 8, 2017

Hilton Phoenix / Mesa Hotel

Mesa, Arizona

© 2017 BiTS Workshop – Image: tonda / iStock

BiTS 2017


Copyright Notice

The presentation(s)/poster(s) in this publication comprise the Proceedings of the 2017 BiTS Workshop. The content reflects the opinion of the authors and their respective companies. They are reproduced here as they were presented at the 2017 BiTS Workshop. This version of the presentation or poster may differ from the version that was distributed in hardcopy & softcopy form at the 2017 BiTS Workshop. The inclusion of the presentations/posters in this publication does not constitute an endorsement by BiTS Workshop or the workshop’s sponsors. There is NO copyright protection claimed on the presentation/poster content by BiTS Workshop. However, each presentation/poster is the work of the authors and their respective companies: as such, it is strongly encouraged that any use reflect proper acknowledgement to the appropriate source. Any questions regarding the use of any materials presented should be directed to the author(s) or their companies. The BiTS logo and ‘Burn-in & Test Strategies Workshop’ are trademarks of BiTS Workshop. All rights reserved.



BiTS Workshop 2017 Schedule

Session

Session Chair

Solutions Day Wednesday March 8 - 8:00 am

Teaming Up

"Applying FEA Simulation for Test Interface Unit" Jason Koh - Test Tooling Solutions Group

"BI RHINO Handling Solution" Yaniv Raz- Intel Corporation

"Optical Device Testing at Wafer Level and Package Devices" Carl Kasinski – Aehr

"Fan-in WLCSP Test Requirements" Mike Frazier - Mike Frazier

7 Mike Ramsey



Fan-In WLCSP Test

Strategy

Mike Frazier

Xcerra Corporation

BiTS Workshop

March 5 - 8, 2017

Conference Ready mm/dd/2014



Contents

• WLCSP Market Overview

• Changes in the Industry (Inflection Point)

• Post Saw Test Process Description

• Evaluation Summary

• Conclusion

Fan-In WLCSP Test Strategy 5



Fan Out WLCSP


• Definition

– Fan out implies that the ball grid array is

larger than the die

– Die is encapsulated in molding with RDL

layer covering die AND molding

– Package sizes up to 25mm X 25 mm today

• Advantages

– Multi-chip and/or passive integration possible

– Lower cost and smaller package compared

to FCBGA

– Larger area for contact balls

• Disadvantages

– Higher cost and larger die than FI-WLCSP

– Yield (associated with placement accuracy)



Fan-In WLCSP

• Definition

– Fan in implies that the contact balls fit within the die size

– Bare die or encapsulated up to 7mm X 7mm

• Advantages

– Smallest possible package size (X,Y and Z dimensions)

– Lowest possible packaging cost (No Substrate – RDL)

– High performance (no bond wires, short signal length, low cap.)

• Disadvantages

– Limited pin count (space for contact balls)

– Reliability (chipping, cracks, shipping….)

– Single die, no support for passives


Fan In WLCSP devices make up 30%

of packages in cell phone today



Fan In Market Summary

• Fan in WLCSP market is significantly larger than FO-

WLCSP

– RF Transceivers - PMIC

– Baseband - RF Power amps

– Touch controllers - MEM’s

• End applications

– Cell Phones - Automotive

– Tablets - Wearables

– IOT - more

• Fine Pitch

– 0.4 mm ball pitch is typical

– 0.3mm is leading edge for “direct to board”

– 0.2mm is leading edge for substrate placement


CAGR ~9%



Quality Demand of the Industry


• Automotive has been traditionally the driver

for low defect requirements

• Consumer devices had less stringent quality

standards…but this has changed

Drive to near zero defect parts per million (PPM)

defect parts per billion (PPB)



Traditional Process Flow

Fan-In WLCSP Test Strategy

Wafer Saw T&R with vision

Inspection

Wafer Test

10

Challenges:

• Test at start of backend processing

• Device picking and Saw process after test

Source: Microfab

http://www.google.com/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&docid=-invPyl7oeWciM&tbnid=9mD7Ja6D2s94CM:&ved=0CAUQjRw&url=http://www.inseto.co.uk/products/adt-dicingandscribing.htm&ei=RqzZU5OLMIaMyAT1y4LoCA&bvm=bv.72185853,d.aWw&psig=AFQjCNEECiZEBkqOYH5lYJT61IXGRNYeTQ&ust=1406860600527520http://www.google.com/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&docid=39rIqVCS2YSfZM&tbnid=_QG42QH0KIdtqM:&ved=0CAUQjRw&url=http://dicing-solutions.com/&ei=M6rZU4vWA42jyASBuoKAAQ&bvm=bv.72185853,d.aWw&psig=AFQjCNEui8dkH7ALP8h9X51GGYvvg7iLAQ&ust=1406860166210358



Post Saw Test Advantages


Tape & Reel with

Vision Inspection

Singulated Device Test Wafer Saw

11

True Final Test of singulated WLCSP devices • Improved Quality

• Test Process moved to end of back end processing (PST)

• RMA / device retest • Same retest capability as production test

http://www.google.com/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&docid=2HqzGtitc2TBqM&tbnid=lkAJyppNLpQqUM:&ved=0CAUQjRw&url=http://news.thomasnet.com/fullstory/PCB-Electrical-Test-System-handles-3D-packages-618651&ei=_6_ZU_8fg5jIBJ23grAF&bvm=bv.72185853,d.aWw&psig=AFQjCNGU2R5p-WpJHQTnSrY_6Mpjo-PzLQ&ust=1406861670028669http://www.google.com/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&docid=Ms-ST7KrG_YI3M&tbnid=DTnX-_VsggqspM:&ved=0CAUQjRw&url=http://www.smtnet.com/news/index.cfm?fuseaction=view_news&news_id=10036&ei=srDZU6rMCcyxyASaoYHYCw&bvm=bv.72185853,d.aWw&psig=AFQjCNFKTvbuqZqtn2Ivt3GghhV_u9tW7A&ust=1406861768106196http://www.google.com/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&docid=-invPyl7oeWciM&tbnid=9mD7Ja6D2s94CM:&ved=0CAUQjRw&url=http://www.inseto.co.uk/products/adt-dicingandscribing.htm&ei=RqzZU5OLMIaMyAT1y4LoCA&bvm=bv.72185853,d.aWw&psig=AFQjCNEECiZEBkqOYH5lYJT61IXGRNYeTQ&ust=1406860600527520http://www.google.com/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&docid=39rIqVCS2YSfZM&tbnid=_QG42QH0KIdtqM:&ved=0CAUQjRw&url=http://dicing-solutions.com/&ei=M6rZU4vWA42jyASBuoKAAQ&bvm=bv.72185853,d.aWw&psig=AFQjCNEui8dkH7ALP8h9X51GGYvvg7iLAQ&ust=1406860166210358



Post Saw Test Process Steps

(Device Pick)

• Input from sawn Film frame or Tape and

Reel

• Device Placement onto test “substrate” – InCarrier, glass wafer, vacuum chuck….




InCarrier Features and benefits

• Easy handling of hundreds of

singulated WLCSP devices in a strip

format

o Mechanical alignment for highest accuracy

o Device retention exceed “drop test”

o Supports Lots on hold

• Improved throughput with 100% touch

efficiency

• Supports Full Tri-temp test

environment

• Handling WLCSP for Engineering

o Device handling for characterization

o Burn-in / Environmental


Up to 300 devices / InCarrier




(Device Test)

• Present singulated devices to ATE test – Strip Handlers, Probers

• Test is the most expensive process step in back

end processing – Desire is to have highest possible utilization


InStrip with MEM’s stimulus




(Tape and Reel) • Remove tested singulated devices for test

“substrate” for placement into T+R – Device Rotation

– Laser Mark

– Mark Inspection

– Sidewall Inspection

– Ball side Inspection

– Tape and reel

• Pre and post seal inspection


10u crack detection capability



Summary of Results

• System Validation on OSAT floor – ESD, safety, operational validation passed

• Correlation achieved to existing probe results

• Large sample run of parts from T+R – Reject level detected at 500PPM during first pass

– Looped sample of units 4 times with 0 rejects detected

• Demonstrated 14% higher test cell throughput

compared to existing probe solution


Reel InCarrier™

Carrier Singulated

Devices

InCarrier™

Carrier



Conclusion


Quality demand is changing the way people will

test WLCSP devices.

New process flow eliminates test escapes

created by singulation process

– Enables true Final Test of WLCSP devices

Proven Gentle and reliable handling of

singulated WLCSP packages

Improved test cell efficiency

Flexibility for wide range of applications

17

march 5 - 8, 2017 mesa, arizona archive session 7...bits 2017 teaming up - handler / test cell...

Documents