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TRANSCRIPT
©2017 by System Plus Consulting | mCube MC3672 Accelerometer 1
21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
mCube MC3672WLCSP AccelerometerMEMS report by Audrey LAHRACHMarch 2017
©2017 by System Plus Consulting | mCube MC3672 Accelerometer 2
Table of Contents
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o mCube
o MC3672 Characteristics
Physical Analysis 14
o Synthesis of the Physical Analysis
o Physical Analysis Methodology
o Package 17
Package Views & Dimensions
Package Pin Out
Package Overview
Package Cross-Section
Package Bottom view and Overview
Package Opening
o MEMS Cap 30
o MEMS Sensing Area
View, Dimensions & Marking
Main Blocks Identification
o ASIC Die 44
View, Dimensions & Marking
Delayering
Main Blocks Identification
Process Characteristics
o Cross-Section 50
o MEMS Structure 70
Physical Comparison 73
o mCube Accelerometers Evolutions
o Comparison with competitors
o Package Comparison with Bosch BMA355
Manufacturing Process Flow 86
o Global Overview
o IC Front-End Process
o IC Wafer Fabrication Unit
o MEMS Process Flow
o MEMS Wafer Fabrication Unit
o Packaging Process Flow
o Package Assembly Unit
Cost Analysis 103
o Synthesis of the cost analysis
o Yields Explanation & Hypotheses
o ASIC Front-End Cost
o MEMS Front-End Cost
o MEMS Front-End Cost per process steps
o Total Front-End Cost
o WLCSP Package Cost
o WLCSP Package per process steps
o Component Wafer & Die
o Component Cost
Estimated Price Analysis 120
Company services 125
©2017 by System Plus Consulting | mCube MC3672 Accelerometer 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Executive Summary
With the MC3672, mCube has released the industry’s smallest WLCSP ultra-low power accelerometer for wearables,enabling significantly extended battery life and very small form factors.
This new component should increase the company’s market share. One target is earbud applications, like Apple’sAirPods, where power consumption is a major parameter and the space is very limited.
Unlike its main competitors, Bosch Sensortec and STMicroelectronics, mCube provides monolithic sensor integrationfor consumer electronics in a WLCSP package. This uses only wafer level steps to assemble the ASIC, MEMS sensor,MEMS cap and package. Mainly produced by TSMC, which made great efforts to provide complete platforms forMEMS manufacturing, the component is elegantly designed and better integrated than most of its competitors.
After Bosch Sensortec released a WLCSP 3-axis accelerometer, mCube chose a different approach, although it stilluses a Via-Middle TSV process for the package integration. Two TSV processes are used in this component, includingfor connecting the MEMS sensor to the IC electronics.
The final size is smaller compared than Bosch’s device, at 1.1mmx1.3mmx0.74mm. This is a 45% footprint and 21%thickness reduction compared to the previous 1.6mmx1.6mmx0.94mm mCube MC3635 LGA package and a 64%footprint reduction compared to the present 2mmx2mm LGA package.
The report includes a complete overview of the evolution of mCube’s MEMS accelerometers since the secondgeneration. It also features a detailed technology and cost comparison with leading edge accelerometers from BoschSensortec and STMicroelectronics and a process comparison with Bosch’s WLCSP accelerometer.
©2017 by System Plus Consulting | mCube MC3672 Accelerometer 4
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo MEMS Dieo IC Dieo Cross-Sectiono Structureo Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
1.0
9 m
m
Package View & Dimensions: MC3672
Package Top View Package Bottom View
Package Side View
1.29 mm
0.7
4 m
m
• Package: WLCSP
• Dimensions: 1.09 x 1.29 x 0.74mm
• Pin Pitch: 0.35-0.45mm
• Marking:
GM6 or Y4T
.YE .WE
©2017 by System Plus Consulting | mCube MC3672 Accelerometer 5
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo MEMS Dieo IC Dieo Cross-Sectiono Structureo Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Cross-Section
Package Cross-Section – SEM View
Package Bottom View
©2017 by System Plus Consulting | mCube MC3672 Accelerometer 6
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo MEMS Dieo IC Dieo Cross-Sectiono Structureo Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
MEMS Sensing Area
MEMS Sensing Area – SEM View
©2017 by System Plus Consulting | mCube MC3672 Accelerometer 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso IC Wafer Costo MEMS Wafer Costo Packaging Costo Back-End Costo Component Cost
Selling Price Analysis
About System Plus
ASIC Front-End Cost
©2017 by System Plus Consulting | mCube MC3672 Accelerometer 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso IC Wafer Costo MEMS Wafer Costo Packaging Costo Back-End Costo Component Cost
Selling Price Analysis
About System Plus
MEMS Front-End Cost
©2017 by System Plus Consulting | mCube MC3672 Accelerometer 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso IC Wafer Costo MEMS Wafer Costo Packaging Costo Back-End Costo Component Cost
Selling Price Analysis
About System Plus
WLCSP Packaging Cost
©2017 by System Plus Consulting | mCube MC3672 Accelerometer 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso IC Wafer Costo MEMS Wafer Costo Packaging Costo Back-End Costo Component Cost
Selling Price Analysis
About System Plus
Component Wafer & Die Cost
©2017 by System Plus Consulting | mCube MC3672 Accelerometer 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysiso Manufacturer Price
About System Plus
mCube MC3672 Estimated Manufacturer Price
©2017 by System Plus Consulting | mCube MC3672 Accelerometer 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Feedbackso Contacto Legal
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
MEMS & SENSORS• 3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016
Business Update• Sensors for Cellphones and Tablets 2016• Sensors for Wearable Electronics & Mobile Healthcare
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
MEMS ACCELEROMETER• Safran Colibrys VS1000 Series• mCube MC3635 – 3-Axis Accelerometer• Bosch Sensortec BMA250E – 3-Axis Accelerometer• mCube MC3413 – 3-Axis Accelerometer• Bosch Sensortec BMA355 – 3-Axis Accelerometer
MEMS IMU• 6-Axis OIS IMUs: STMicroelectronics & InvenSense• InvenSense ICM-30630 – 6-Axis Sensor Hub• BOSCH Sensortec BMF055 – 6-Axis Sensor Hub
Related Reports
©2017 by System Plus Consulting | mCube MC3672 Accelerometer 13
COMPANYSERVICES
©2017 by System Plus Consulting | mCube MC3672 Accelerometer 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Feedbackso Contacto Legal
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>40 reports per year)
Costing Tools
Trainings
©2017 by System Plus Consulting | mCube MC3672 Accelerometer 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Feedbackso Contacto Legal
Contact
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