mems clean room - fraunhofer€¦ · mems clean room 1500 m 2, class 10 150 mm (6”) wafer line 3...
TRANSCRIPT
![Page 1: MEMS CLEAN ROOM - Fraunhofer€¦ · MEMS CLEAN ROOM 1500 m 2, class 10 150 mm (6”) Wafer line 3 shift preparation for R&D and pilot fabrication (24x5) Access to external services](https://reader034.vdocuments.net/reader034/viewer/2022051322/601ccf547a289c286e6600a5/html5/thumbnails/1.jpg)
© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 1
MEMS CLEAN ROOM
1500 m2, class 10
150 mm (6”) Wafer line
3 shift preparation for R&D and pilot fabrication (24x5)
Access to external services
Technological parameter supervising system
MES / PPS based planning and documentation
ISO 9001 certification
![Page 2: MEMS CLEAN ROOM - Fraunhofer€¦ · MEMS CLEAN ROOM 1500 m 2, class 10 150 mm (6”) Wafer line 3 shift preparation for R&D and pilot fabrication (24x5) Access to external services](https://reader034.vdocuments.net/reader034/viewer/2022051322/601ccf547a289c286e6600a5/html5/thumbnails/2.jpg)
© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 2
MEMS Clean Room Layout Aktuelle Clusterung
HIGH TEMPERATURE
LITHOGRAPHY
WET ETCH / CLEANING
DRY ETCH / PVD
BA
CK
EN
D
BA
CK
EN
D
CVD
INLINE METROLOGY
CHARACTERIZATION &
TEST
LAB
CMP
EXTERNAL PARTNERS
SEM
LOGISTICS
GOWNING AREA
![Page 3: MEMS CLEAN ROOM - Fraunhofer€¦ · MEMS CLEAN ROOM 1500 m 2, class 10 150 mm (6”) Wafer line 3 shift preparation for R&D and pilot fabrication (24x5) Access to external services](https://reader034.vdocuments.net/reader034/viewer/2022051322/601ccf547a289c286e6600a5/html5/thumbnails/3.jpg)
© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 3
MEMS Clean Room: Characterization & Test
![Page 4: MEMS CLEAN ROOM - Fraunhofer€¦ · MEMS CLEAN ROOM 1500 m 2, class 10 150 mm (6”) Wafer line 3 shift preparation for R&D and pilot fabrication (24x5) Access to external services](https://reader034.vdocuments.net/reader034/viewer/2022051322/601ccf547a289c286e6600a5/html5/thumbnails/4.jpg)
© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 4
MEMS Clean Room: Lithography
![Page 5: MEMS CLEAN ROOM - Fraunhofer€¦ · MEMS CLEAN ROOM 1500 m 2, class 10 150 mm (6”) Wafer line 3 shift preparation for R&D and pilot fabrication (24x5) Access to external services](https://reader034.vdocuments.net/reader034/viewer/2022051322/601ccf547a289c286e6600a5/html5/thumbnails/5.jpg)
© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 5
MEMS Clean Room: Wet Etch / Cleaning
![Page 6: MEMS CLEAN ROOM - Fraunhofer€¦ · MEMS CLEAN ROOM 1500 m 2, class 10 150 mm (6”) Wafer line 3 shift preparation for R&D and pilot fabrication (24x5) Access to external services](https://reader034.vdocuments.net/reader034/viewer/2022051322/601ccf547a289c286e6600a5/html5/thumbnails/6.jpg)
© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 6
MEMS Clean Room: Wet Etch / Cleaning
![Page 7: MEMS CLEAN ROOM - Fraunhofer€¦ · MEMS CLEAN ROOM 1500 m 2, class 10 150 mm (6”) Wafer line 3 shift preparation for R&D and pilot fabrication (24x5) Access to external services](https://reader034.vdocuments.net/reader034/viewer/2022051322/601ccf547a289c286e6600a5/html5/thumbnails/7.jpg)
© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 7
MEMS Clean Room: Dry Etch / Strip Resist
![Page 8: MEMS CLEAN ROOM - Fraunhofer€¦ · MEMS CLEAN ROOM 1500 m 2, class 10 150 mm (6”) Wafer line 3 shift preparation for R&D and pilot fabrication (24x5) Access to external services](https://reader034.vdocuments.net/reader034/viewer/2022051322/601ccf547a289c286e6600a5/html5/thumbnails/8.jpg)
© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 8
MEMS Clean Room: Backend (Bonding, Dispense)
![Page 9: MEMS CLEAN ROOM - Fraunhofer€¦ · MEMS CLEAN ROOM 1500 m 2, class 10 150 mm (6”) Wafer line 3 shift preparation for R&D and pilot fabrication (24x5) Access to external services](https://reader034.vdocuments.net/reader034/viewer/2022051322/601ccf547a289c286e6600a5/html5/thumbnails/9.jpg)
© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 9
MEMS Clean Room: Inline Metrology
![Page 10: MEMS CLEAN ROOM - Fraunhofer€¦ · MEMS CLEAN ROOM 1500 m 2, class 10 150 mm (6”) Wafer line 3 shift preparation for R&D and pilot fabrication (24x5) Access to external services](https://reader034.vdocuments.net/reader034/viewer/2022051322/601ccf547a289c286e6600a5/html5/thumbnails/10.jpg)
© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 10
MEMS Clean Room: Inline Metrology
![Page 11: MEMS CLEAN ROOM - Fraunhofer€¦ · MEMS CLEAN ROOM 1500 m 2, class 10 150 mm (6”) Wafer line 3 shift preparation for R&D and pilot fabrication (24x5) Access to external services](https://reader034.vdocuments.net/reader034/viewer/2022051322/601ccf547a289c286e6600a5/html5/thumbnails/11.jpg)
© Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 11
MEMS Clean Room: SEM