MEMS/Sensors

Roadmap Update February 2014

Bill Bader

CEO of iNEMI

1

Agenda

• Very Brief iNEMI Overview

• Roadmapping Methodology and Scope

• MEMS Roadmap Players

2

About iNEMI

International Electronics Manufacturing Initiative (iNEMI) is an industry-led

consortium of around 100 global manufacturers, suppliers, industry

associations, government agencies and universities. A Non Profit Fully

Funded by Member Dues; All Funding is Returned to the Members in High

Value Programs and Services; In Operation Since 1994.

Visit us at www.inemi.org

5 Key Deliverables:

• Technology Roadmaps

• Collaborative Deployment

Projects

• Research Priorities Document

• Proactive Forums

• Comprehensive Project

Reports

Mission: Forecast and Accelerate improvements in the Electronics

Manufacturing Industry for a Sustainable Future.

3

Active in MEMS iNEMI Members

3

The Industries Broadest

Technology Roadmap

55

5

2011 Technology Working Groups (TWGs)

Organic PCBBoard

Assembly Customer

RF Components &

Subsystems

OptoelectronicsLarge Area, Flexible Electronics

Energy Storage &

Conversion Systems

Modeling, Simulation,

and Design

Packaging

&

Component

Substrates

Semiconductor

Technology

Final

Assembly

Mass Storage (Magnetic & Optical)

Passive Components

Information

Management

Systems

Test, Inspection &

Measurement

Environmentally

Conscious

Electronics

Ceramic

Substrates

Thermal

Management

Connectors

MEMS/

Sensors

Green=Engineering Purple=Manufacturing Blue=Component &

Subsystem

Solid State Illumination

Photovoltaics

6

Roadmap Development

Product Emulator Groups TWGs

Medical Products

Automotive

Defense and Aerospace

Desig

n T

ech

no

log

ies

Man

ufa

ctu

ring

Tech

no

log

ies

Mo

de

ling

, Th

erm

al, e

tc.

Board

Assem

bly

, Test, e

tc.

Product Sector Needs vs. Technology Evolution

Bu

sin

ess P

rocesses

Portable / Consumer

Office / Large Systems

Highend (e.g. netcom, server)

En

viro

nm

en

tally

Su

sta

inab

le

Ele

ctro

nic

s

Pro

d L

ifecycle

Info

rma

tion M

gm

t.

Co

mp

./Su

bsys

t. Tech

no

log

ies

Pa

cka

gin

g, S

ubstra

tes, D

isp

lays, e

tc.

7

• > 650 participants

• > 350 companies/organizations

• 18 countries from 4 continents

• 20 Technology Working Groups (TWGs)

• 6 Product Emulator Groups (PEGs)

• > 8 Man Years of Development Time

• > 1900 pages of information

• Roadmaps the needs for 2013-2023

2013 Roadmap

7

Highlights of MEMS Roadmap

MEMS Market Forecast 2012-2018

Source: MEMS Executive Congress, Napa CA, Nov 2013

11

Microelectromechanical Systems (MEMS)

2013 Technology Working Group

Akihiro Koga

Arthur Morris

Asif Chowdhury

Brian Jamieson

Buzz Hardy

Chengkuo Lee

Chris Apanius

Chris van Hoof

Christian Rembe

Chuck Richardson

Dave Howard

Dimitrios Peroulis

Dominique Schinabeck

Don DeVoe

Edward Chiu

Erik Jan Lous

Fabio Pasolini

Fabrice Verjus

Fumihiko Nakazawa

Goro Nakatani

Hebert Bennett

Henne van Heeren

Toshiba

Wispry

Analog Devices

SB Microsystems

MEMSCAP

National U of Singapore

Promeus

IMEC

PolyTec

iNEMI

Jazz Semiconductor

Perdue

Acutronic

University of MD

Asian Pacific Micro

NXP

ST Micro

KFM Technology

Fujitsu

Rohm

NIST

enablingMNT

Hiroshi Toshiyoshi

Ingrid De Wolf

Jae Sung Yoon

Jim Spall

Jim Mrvos

Jianmin Miao

John Rychcik

Joost van Beek

Josh Molho

Karen Lightman

Kevin Chau

Koji Fukumoto

Marcie Weinstein

Mark Crockett

Mary Ann Maher

Mervi Paulasto-Kröckel

Michel Brillouet

Monica Takacs

Patric Salomon

Pete Loeppert

Raj Gupta

Raji Baskaran

Rakesh Kumar

University of Tokyo

IMEC

KIMM

Delphi

Lexmark

Nanyang Tech Univ

Multitest

NXP

Caliper

MEMS Industry Group

MEMStaff

Sony

Akustica

SEMI

SoftMEMS

Aalto University

LETI

MEMS Industry Group

4m2c

Knowles Acoustics

Volant Technologies

Intel

Global Foundries

Randall Wagner

Philippe Robert

Robert De Nuccio

Robert Tsai

Rob O’Reilly

Ron Horwath

Ron Lawes

Sacha Revel

Scott Bryant

Shawn Blanton

Stephane Donnay

Stephen Bart

Steve Breit

Steve Greathouse

Steve Walsh

Takashi Mihara

Tetsu Tanaka

Tony Stamper

Veljko Milanovic

Wei-Leun Fang

Wendy Chen

Xiaoming Wu

Yasutaka Nakashiba

NIST

LETI

ST Micro

TSMC

Analog Devices

Glimmerglass Ltd.

Imperial College

Accutronic

MANCEF

Carnegie Mellon University

IMEC

MKS Instruments

Coventor

Plexus

MANCEF

Micromachine Center

Tohoku University

IBM

Mirrorcle Technologies

NTHU

KYEC

Lexmark

Renesas Electronics

Chair: Mike Gaitan (NIST), Chair

Co-Chairs: Akihiro Koga (Toshiba), Chris van Hoof (IMEC), Philippe Robert (LETI)

About 65 People; All Over the World

12

Microelectromechanical Systems (MEMS)

2013 Sub-Group Chairs

Inertial Sensors: Philippe Robert (LETI)

Microphones: Jianmin Miao (NTU) and Marcie Weinstein (Akustica)

RF MEMS: Arthur Morris (Wispry)

Consumer Portable: Mike Gaitan (NIST)

Automotive: Rob O’Reilly (Analog Devices)

Wearables: Chris van Hoof (IMEC)

Modeling and Design: Steve Breit (Coventor)

Fabrication: Buzz Hardy (MEMSCAP)

Assembly and Packaging: Asif Chowdhury (Analog Devices)

Testing: John Rychcik (Multitest)

Standards Association

Important Outcome for 2013MEMS Industry Group Releases

Standardized Sensor Performance Definitions

MEMS Sensor StandardsCommitteeElectron Devices Society

iNEMI Project on MEMS Accelerometer Test Methods

http://www.memsindustrygroup.org/spd

iNEMI MEMS Plans for 2014

• The new iNEMI project to survey accelerometer device testing

practices targeted to identify opportunities for device testing

standards and drive the standardization effort within MIG

• The future of semiconductor road mapping is moving towards

More than Moore and Heterogeneous Integration.

• We plan to expand our MEMS road map deeper dives to

include automotive and “wearables.”

• We plan to continue our discussions on the concept of sensor

integration path, using “wearables” as a case study. We will be

seeking information to support these discussions.

Accelerometers

Gyroscopes

Magnetometers

Pressure Sensor

Microphone

Temperature Sensor

Conductivity Sensor

Camera/Optical Sensor

Micro Speakers

eNose

pH Sensor

Humidity Sensor

Galvanic Skin Response

Caloric Consumption

Exercise Intensity

Exercise Safety

Sleep Patterns

Heart Rate

Blood Pressure

Walking Directions

Gas Monitor

Altitude

Motion

Shock

Messaging

Emergency Response

Nike

BodyMedia

Fitbit

Devices Applications

Samsung

“2015 Deeper Dive: Wearables”

Integration Path; With This Comes Key Industry Challenges

ElectronicComponents

System in a PackageSystem on a Chip

From: Discussion topic in the MEMS Technology Working Group

Key MEMS Manufacturing Challenges

• They revolve around scalability, cost optimization, and reliability

• Existing iNEMI project on Accelerometer Test Standard Protocol developments

• Completed definition of two other potential iNEMI projects in:

– University/Research Lab/Industry Cooperative Development of Curriculum and Labs – Workforce Development

– Optimization of Reliability Testing Methods

• For both of these to move forward we need a few additional Industry players to Step Forward

– Contact Bill Bader with interest or requests for more information

17

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Summary

• The strong history of iNEMI global road map

development is on-going

65 people involved in 2013 in the MEMS Chapter

The 2015 RM development is well underway

Will be available to members in December 2014

• Get Involved!!

In both the road map development and Collaborative R&D

Projects

Thank You

www.inemi.orgEmail contacts:

Chuck Richardson

crichardson@inemi.org

Grace O’Malley

gomalley@inemi.org

Bill Bader

Bill.bader@inemi.org