mexi tronic a

8/18/2019 Mexi Tronic A

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Laser Soldering Process

Enrique DuarteThecnical Sesions / MexitronicaGuadalajara, October 2007

P D F C r e a t e d wi t h

d e s k P D F P D F Wr i t e

r -T r i al : : h t t p: / / www

. d o c u d e s k . c om

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Enrique Duarte Introduction

•Electronic Engineer

• 14 years of experience

• Last 11 years working for Electronic Industry in Process Engineering Area.

• Companies:

Process Development Engineer

Black Belt (DMAIC), DFSS (Newthecnologies)






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Purpose:

All information presented in this conference is focused in “Solving ProcessProblems” that we have day to day in Flextronics. Using Six MaxMethodologies for existing processes (DMAIC).

Team Members for this project:Ricardo Pérez, Javier Cervantes, Efrain Amaral, Eduardo Camarena,Guillermo Barajas, Roberto Reyes, Ruben López, Arturo Nuñes, LeopoldoZuñiga, Machine Supplier, Customer.

Scope:

Based on Laser Soldering Process for SMT connectors that can not beprocessed in Reflow Oven because of the plastic properties, they can notsupport high temperatures beyond 150°C. Also, the q uantity of connector pins(200, 300, 400) does not guarantee an acceptable quality soldering by hand.

This project was developed on Flextronics Campus South in Building Five.






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e r i n g P r o c e s s


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Project Goal: Reduce Defects from 2.5% to0.5%. To probe if the machine is capable with

customer requirements .

Project Goal: Reduce Defects from 2.5% to0.5%. To probe if the machine is capable with

customer requirements .

Project Description: –The top detractor (Solder Empty Defect in J1Connector) for the Customer in Flextronics GDL, isgenerating an unstable process with a CPK of 0.7(Laser Soldering Process).

Project Description: –The top detractor (Solder Empty Defect in J1Connector) for the Customer in Flextronics GDL, isgenerating an unstable process with a CPK of 0.7(Laser Soldering Process).

Six Sigma Project Department: D&E Guadalajara Site

Review # R0

Project Title: Laser Soldering Process

Project Leader: Enrique Duarte

Six Sigma Project Department: D&E Guadalajara Site

Review # R0

Project Title: Laser Soldering Process

Project Leader: Enrique Duarte

Customer Issue:

Project Results: Defects reduced to lessthan 0.5%. The machine is not capable towork with customer requirements .

Project Results: Defects reduced to lessthan 0.5%. The machine is not capable towork with customer requirements .

Laser Soldering process defects

Defec ts Distribution (by issue)

55.6%

13.9%

17.0%

2.6%

7.7%

3.2%

2.5%

Solder Issues






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What is the High Level Problem? and Why Is It Important? , Who Are Customersand Stakeholders?

Escapes to China , It causes problems functions in Customer products &Operations lines in Flextronics Guadalajara.

Escapes to China , It causes problems functions in Customer products &Operations lines in Flextronics Guadalajara.

T o o l s :

• P r o c e

s s M a p.

• T e c h n i c a l H

e l p.

• P a r e t o

s C h a r t s.

• F i s h B

o n e D i a

g .

• Q u i c k

I m p r o v

e m e n t

VOC






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Project Definition. Projected BusinessBenefits:

Frecuency= 100% (Families UN's, TN's and KBN's)

Solder Wire Consumption per board= 0.30 grs (Kester Solder Wire P/N 00500098)

Sec Opr-Hour-cost (Dlls) Total (Dlls)

Touch-Up time(Second time)= 120 3.66 0.1342

Inspector time (Second time)= 120 6.42 0.2354

0.3696

Consumption per board (grs) Total (Dlls)

0.144

GRAND TOTAL PER BOARD (DLLS)= 0.5136

180000

104

1200

Production per Year (include all families)=

Amountof Loss per

Year(Dlls)= 217,248.00$

0.0214

0.3

PCB's burned per year =

PCBA Cost per Unit (USDollar) =

Description

Description

Solder Wire= 0.48

CO NT INUE W IT H

NORMAL PROCESS

Cost per gr. (Dlls)

Total cost (Dlls)

0.122

0.214

Opr-sec-cost (Dlls)

0.001016667

0.001783333

Facilities (10%)

0.0122

SODFTBEAM TOUCH-UP V ISUA L IINSPECTION DEFECT FOUND

YES

NO

TOUCH-UP

(SECOND TIME=

120sec)

Visual Inspection

(Second time=

120sec)

$$$

Flextronics is loosing200k usd per yearbecause of the problemsgenerated in lasersoldering process.

Burn

Solder bridge

Solder Empty

MisalignedTombstone

Total of Defects 159

Total Units= 30

Oportunities per Unit= 300

DPU = 5.300

DPMO= 17667

Process Capability (Zst)= 2.10

Process Capability (CP)= 0.70

Total of Defects 9

Total Units= 30

Oportunities per Unit= 200

DPU = 0.300

DPMO= 1500

Process Capability (Zst)= 2.97

Process Capability (CP)= 0.99

In these images, there are only examples of solder empty and so lder bridge defects.

Burn

Solder bridge

Solder Empty

MisalignedTombstone

FAMILY “A”

J1J1

FAMILY “B”

We studied two familiesof connectors, each onehas 50 models, then in

total they are around 100models that have to beunder control in lasersoldering process.

How many connector families will be involved?, What are the projected businessbenefits of this project?, What happen if we dont do anything?






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Y= Solder empty, X’s = Connectors Assembly, Machine Parameters, Quality inspection. A planning

was established to attack the problem: 2 phases (Machine validation & Process Control).

Y= Solder empty, X’s = Connectors Assembly, Machine Parameters, Quality inspection. A planning

was established to attack the problem: 2 phases (Machine validation & Process Control).

More than 20variables wereidentified

Can the Problem Be Broken into Smaller Pieces? Multi-Generational Plan?

Basic Understanding LSP, Mode: “Continuos Pad”(Models: “A)

Softbeam

Laser Light

Pre-heat

1.-D12.- φ3.- Beam Power(watts)

(x1,y1,z1)

6.-(x,y,z) Beam Diam

4.-Beam Diam (mm)5.-Wait Time. (sec) Pre-heat

PARAMETERS TO

CONTROL:

Soldering

PCB

Origin

7.-Robot Speed CP (mm/sec)

.-Clamps.- PCB Color

.- PCB Thickness

.- Bent Pins or misaligment.- Residuos

S o l d e

r B a r

i s a t t a c h e

d t o t h e

p i n s

( C o n

n e c t o

r D e s i

g n )

PARAMETERS TO

CONTROL:

(x2,y2,z2)

R o

b o t S

p e e d

( C P )

Beam Power

off

Φ

D1

NOISE:B e a m

P o w e r

Connector Spec300

softbeam manual

Basic Understanding LSP, Mode: “Continuos Pad”(Models: “B”)

SoftbeamLaser Light

Suspipe

Pre-heat

1.-D12.- φ

φ

3.- Pwr0(watts) Pre-heat

S o l d e r W i r e

(x1,y1,z1)

D2

R e v F d

αw

7.-(x,y,z)

8.-D2

9.- α10.-w

11.-Feed (mm/sec)

Diam

12.-Solder Wire Diam

A r m S p e

e d

Beam Diam

4.-Beam Diam (mm)5.-Tpre (sec)

PARAMETERS TO

CONTROL:

Feed6.- Pwr1(watts) Feed

PCB

Origin

PARAMETERS TO

CONTROL:

PostHeat

PARAMETERS TO

CONTROL:

16.- Pwr2(watts) Postheat17.-Tpst(sec)

F e e d

RevLn

18.- RevFd (mm/sec)19.- RevLn(mm)

PARAMETERS TO

CONTROL:

15.-Arm Speed(mm/sec)

.-Clamps.-PCB Color

.- PCB Thickness

.- Bent Pins or misaligment.-Residuos

13.-Wire Adjust (mm)

Wire Adjust

D1

14.-Tmov (sec)

(x2,y2,z2)

20.- Tdly(sec)

NOISE:

connector specs200

How the machine works?






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Can we Understand better how the Laser Machine works? Lets see some videos…

Approximate beam diameter: 0.7mm a 3.0mm

Wavelength: 920nm a 960nm

Max Power or Energy: 4w to 60w

Laser characteristics….






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Model: “A”

Laser Light

Pre-heat

1.- D12.- φ3.- Beam Power(watts)

(x1,y1,z1)

6.- (x,y,z) Beam Diam

4.-Beam Diam (mm)5.-Wait Time. (sec) Pre-heat

PARAMETERS TO

CONTROL:

Soldering

PCB

Origin

7.-Robot Speed CP (mm/sec)


.- PCB Thickness.- Bent Pins or misaligment.- Residuos

S o l d e

r B a r

i s a t t a c

h e d t

o t h e p i n

s

( C o n

n e c t o

r D e s i

g n )

PARAMETERS TO

CONTROL:

(x2,y2,z2)

R

o b o t

S p e

e d ( C P )

Beam Power off

Φ

D1

NOISE:B e a m

P o w e r

P D F C r e a t e d wi t h d e s k P D F P D F Wr i t e




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Laser Soldering Process Model: “B”

Laser Light

Suspipe

Pre-heat

1.- D12.- φ

φ

3.- Pwr0(watts) Pre-heat

S o l d e r W

i r e

(x1,y1,z1)

D2

R e v F d

α w

7.- (x,y,z)

8.- D2

9.- α10.- w

11.-Feed (mm/sec)

Diam

12.-Solder Wire Diam

A r m S

p e e d

Beam Diam

4.-Beam Diam (mm)5.-Tpre (sec)

PARAMETERS TO

CONTROL:

Feed6.- Pwr1(watts) Feed

PCB

Origin

PARAMETERS TO

CONTROL:

PostHeat

PARAMETERS TO

CONTROL:

16.- Pwr2(watts) Postheat17.- Tpst(sec)

F e e d

RevLn

18.- RevFd (mm/sec)

19.- RevLn(mm)

PARAMETERS TO

CONTROL:

15.-Arm Speed(mm/sec)


.- PCB Thickness

.- Bent Pins or misaligment.- Residuos

13.-Wire Adjust (mm)

Wire Adjust

D1

14.-Tmov (sec)

(x2,y2,z2)

20.- Tdly(sec)

NOISE:

P D F C r e a t e d wi t h d e s k P D F P D F Wr i t e




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X1 = Solder Wire

X2 = Parameters (pw0-watts, pw1-watts, pw2-watts, Tpre-sec, Tmov-sec,Tdly-sec,Tpst-sec, Arm Speed-mm/sec, Feed-mm/sec, Diameter, RevFn-mm/sec, RevLn-mm,beam power, cp).

X3 = Maintenance

X4 = Machine Programs

X5 = Connectors

X6 = PCBA

X7 = ProgrammingMethod

X8 =Visual Inspection Criterion

X9 = Training

Y=So

lder

Empty

Y = Discrete Data(Atributes)

Can we list all the variables involved in this problem?P D F C r e a t e d wi t h d e s k P D F P D F Wr i t er -T r i al : : h t t p: / / www. d o c u d e s k . c om


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1 3

e r i n g P

r o c e s s


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What is Important and How Can I Measure It? How Good Is the Measurement System?

T o o l s :

• G a g e R

& R.

• C a p a b i l i t y A

n a l i s y s

Z s t.

Gage R&R Study (This study was made only for operatorsbecause of LSP machine doesn’t have automatic inspection)

A preliminary Gage R&R study was done to identify quickly all theimprovements to guarantee the acceptable inspection criteria.

In this case 10 pieces were utilized of model A and only the topsides were inspected. Current microscope which is available inline was used.

3 differents oprs indifferents shifts weretaken for this study.

Y = Discrete Data(Atributes)

R&R Study. Results

Attribute Agreeme nt Work She et

Parameter

Performed By

Y/N Y/N

S ample # E xper t Trial 1 Trial 2 Trial 3 Trial 1 Trial 2 Trial 3 Trial 1 Trial 2 Trial 3 Agree Agree

10TR 1 1 1 1 1 1 1 1 0 0 N N

9TR 1 1 1 1 1 1 1 1 1 1 Y Y

8TR 1 1 1 1 1 1 1 1 1 1 Y Y

7TR 1 1 1 1 1 1 1 1 1 1 Y Y

3TR 1 1 1 1 0 0 1 0 0 1 N N

10TL 1 0 1 1 0 1 0 0 1 1 N N

9TL 1 1 1 1 0 1 1 0 0 0 N N

8TL 1 1 1 1 1 1 1 1 1 1 Y Y

7TL 1 1 1 1 1 1 1 1 1 1 Y Y

3TL 1 1 1 1 1 0 1 1 1 1 N N

90% 60% 70%

90% 60% 60%

50%

50%

Note:(1) If % Appraiser Score is low training needs to occur, focus on specific areas (within inspector error)(2) % Score vs. Expert is an error against known population as deemed by experts(3) >90% is the target for Screen % Effectiveness Score

The overall efficiency of all the included inspectors with respect to each other

(4) Screen % Effective vs. Expert is an error agai nst a known population as deemed by the expertsThe overall efficiency of all the included inspectors with respect to external standard

% APPRAISER SCORE(1)

->

% SCORE VS. EXPERT(2)

->

SCREEN % EFFECTIVE SCORE(3)

->

SCREEN % EFFECTIVE SCORE vs. EXPERT(4)

->

Known P opulation

SOLDER EMPTY

G Barajas & E Duarte

RAMON MAURA FELIPE

R e s u l t s w e r e v e r y l o w !

Operators need to be re-trained Operators need to be re-trained

P D F C r e a t e d wi t h d e s k P D F P D F Wr i t er -T r i al : : h t t p: / / www. d o c u d e s k . c om


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1 2 3 4 5 6

0.5

1.0

1.5

2.0

2.5

Zst (Thecnology)

Z s h

i f t (

C o

n t r

o l )

Poor Control

&Poor Technology

Good Control

&

Poor Technology

Category of

Worldwide Class!

Poor Control

&Good Technology

A BDPMO’s = 17667

CP = 0.70

DPMO’s = 1500

CP = 0.99

Where are we located in terms of Zst capability scale?P D F C r e a t e d wi t h d e s k P D F P D F Wr i t er -T r i al : : h t t p: / / www. d o c u d e s k . c om


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Connectorside view

Connector top side

Connector Bottom side

PCB

297°C274°C250°C

THIS PROFILE SHOWS THAT THEBEHAVIOR OF THE TEMPERATURE ISNOT THE SAME FOR EACH ZONEDURING SOLDERING PROCESS.

Profiling...P D F C r e a t e d wi t h d e s k P D F P D F Wr i t er -T r i al : : h t t p: / / www. d o c u d e s k . c om


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pcb

pad

pin

Thermocouple

Laser Light

Acceptable

pcb

pad

pin

Thermocouple

Laser Light

Not Acceptable

pcb

pad

pinThermocouple

Laser Light Acceptable

pcb

pad

pin

Thermocouple

Laser Light

Avoid the

shadow

Not Acceptable

Thermocouple Attachment...P D F C r e a t e d wi t h d e s k P D F P D F Wr i t er -T r i al : : h t t p: / / www. d o c u d e s k . c om


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Soldering By Hand...

Soldering By Laser...

A good recomendation to use the properequipment for profiling Laser soldering

process....



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e r i n g P

r o c e s s


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Shift A2 detect the major quantity of defects. Laser’s machines have better

performance than Xenon machine.

Shift A2 detect the major quantity of defects. Laser’s machines have better

performance than Xenon machine.

T o o l s :

• H y p o t h e

s i s t e s t

( C h i

S q u a r e )

.

• B o x p l

o t s.

• H i s t o g r a m s

Ho is rejected, while Ha isaccepted



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Pins dimensional study.

Top and Bottom have allpins with different length.

P D F C r e a t e d wi t h d

e s k P D F P D F Wr i t er -T r i al : : h t t p: / / www. d o c u d e s k . c om


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Every point means distance of each pin to the reference line.

0

10

20

30

40

50

60

70

80

90

100

1 1 6

3 1

4 6

6 1

7 6

9 1

1 0 6

1 2 1

1 3 6

1 5 1

1 6 6

1 8 1

1 9 6

2 1 1

2 2 6

2 4 1

2 5 6

2 7 1

2 8 6

Not all the pins are covered with the same temperature

by beam diameter.

0.7mm Beam Diam

TOP BOTTOM


e s k P D F P D F Wr i t er -T r i al : : h t t p: / / www.

d o c u d e s k . c om


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2 3

e r i n g P

r o c e s s


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Two Variables are Critical X’s (Beam Power & CP). Temperatures peaks were reduced to avoid burnings.Two Variables are Critical X’s (Beam Power & CP). Temperatures peaks were reduced to avoid burnings.

DOE

Softbeam Parameters (X’s)

S o l d e r W i r e

p w 0 - w

a

t t s

R e v L

n - m m

p w 1

- w a t t

s

p w 2 - w

a t t s

T p r e - s e c

T m o v -

s e c,

T d l y - s e

c Tpst-sec

Ar m S p e e d - m m / s e c F eed -mm/ sec D i a m e t e r

R e v F

n - m m / s

e c

c p

b e a m

p o w e

r

Critical X’s: b

e a m p

o w e r

c p

According with the quantity ofvariables the study will be aFractional DOE for 2 levels & 8-4variables (Resolution IV). Thismeans to make 16 runs.

According with the quantity of

variables the study to be chose is aTAGUCHI DOE for 3 levels & 5variables.This means to make 27runs.

How Do I Close the Gap Between Current and Desired Performance? (Critical Xs)

$5000 usdwas theinvestmentfor theseDOE’s

– O p t i

m i z a t i o n

– D O E

T a g u c h

i

– D O E

F r a c t i o

n a t e d

– N o r m

a l l i t y T e s

t

– C r o s s S e c

t i o n

– I M C


e s k P D F P D F Wr i t er

-T r i al : : h t t p: / / www. d o c u d e s k . c om


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No Of Defects = 10.000 + 3.500 Y -2.625 Z -5.250 Arm Speep PTP -4.000 ArmSpeed CP + 3.500 Beam power + 1.375 PCB Solvent -2.375 Y*Z -4.000 Y*Arm SpeedPTP -6.000 Y*Arm Speed CP + 4.250 Y*Beam Power + 2.625 Y*PCB Solvent + ei

Tranfer Funtion:

Y Y11=148.15, Y12=228, Y21=249.70, Y22=239,30 mm

Z 64.5 mm

Arm Speed PTP 80 mm/sec

Arm Speed CP 4 mm/sec

Wait time 0.15 sec

Beam Power 18 watts

"NEW" PARAMETERSUnitsVariable VALUE

Y Y11=148, Y12=227, Y21=249.70, Y22=239,30 mm

Z 65.5 mm

Arm Speed PTP 75 mm/sec

Arm Speed CP 2.7 mm/sec

Wait time 0 sec

Beam Power 18 watts

"OLD" PARAMETERSUnitsVariable VALUE

Defects Before Vs After DOE

87

42

75

17

0

1020

30

40

50

60

7080

90

100

Solder Bridge

(Before Doe)

Solder Bridge

(After DOE)

Solder Empty

(Before DOE)

Solder Empty

(After DOE)

Type of Defect

Q u a n t i t y o f D e f e c t s

159

62

Defects

decreased

63%

Run Confirmation:

Can We Confirm the Solution on a Small Test?

Small test after improvements confirmed that for UN’s we have defects reduction

in 93% (Zst = 2.10 to 3.03. For TN’s we have defects reduction in 77%. (Zst =

2.97 to 3.40.

Small test after improvements confirmed that for UN’s we have defects reduction

in 93% (Zst = 2.10 to 3.03. For TN’s we have defects reduction in 77%. (Zst =

2.97 to 3.40.

Master Program

UN’s

TN’s

Reducing variation

Based on the new parameters we generated a Master Program on the Machine. Based on the new parameters we generated a Master Program on the Machine.





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Eliminating “burnings”Connectorside view

Connector top side

Connector Bottom side

PCB

297 °C274 °C250 °C

THIS PROFILE SHOWS THAT THEBEHAVIOR OF THE TEMPERATUREIS NOT THE SAME FOR EACH ZONEDURING SOLDERING PROCESS.

This is an example whensome plastic residuos areleft over the pins and thelaser burns them. Thereaction is very high, thenthe pcb catches a hightemperature (783°C) t o beburned.

– Theorically reflow process (tin-lead) window for SMT assembly describes: 60 secsmust be sufficient over 183°C to get peaks of temper ature between 217°C – 230°C.

– Wave Soldering Process has a work window of: 1.5 – 3 secs with peaks of 255°C.

Then we can conclude that PCB is designed to resist at least thesame work window than Wave Soldering Process andtemperatures above this process window could damage the pcb(FR4) generating “burnings”.

In the previous slide we obtained temperatures peaks like 274°C(1 sec) and 297°C (1.5 sec) This means that there is a high risk toburn the PCB.

Making small changes in the master program obtained of lastDOE study, we have reduced these temperature peaks in order towork with values less 255°C (0.8sec). See the next slides to notethe differences with the results.

225°C (0.8 sec)

246°C (0.8 sec)

PROCESSWINDOW

IMC study

Intermetalic joint study andcross section were performed toasure that acceptables rangesare achieved.





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Preheat...... It is better to avoid thermal choke.P D F C r e a t e d wi t h d




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2 8

e r i n g P

r o c e s s


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T o o l s :

• S P C

• G r a p h s “

P ”

• H i s t o g r a m s

Old programs insoftbeammachines weredeleted. Only the

master programwill be available.Critical X’s havespecified lowand high limitsto work.

How Will Critical Xs be Controlled?Defects Reported from China (J1 Connector)

0

5

10

15

20

25

0 8 / 0

1 / 2 0 0

7

1 5 / 0

1 / 2 0 0

7

2 2 / 0

1 / 2 0 0

7

2 9 / 0

1 / 2 0 0

7

0 5 / 0

2 / 2 0 0

7

1 2 / 0

2 / 2 0 0

7

1 9 / 0

2 / 2 0 0

7

2 6 / 0

2 / 2 0 0 7

0 5 / 0

3 / 2 0 0

7

1 2 / 0

3 / 2 0 0

7

1 9 / 0

3 / 2 0 0

7

2 6 / 0

3 / 2 0 0

7

0 2 / 0

4 / 2 0 0

7

0 9 / 0

4 / 2 0 0

7

1 6 / 0

4 / 2 0 0

7

2 3 / 0

4 / 2 0 0

7

3 0 / 0

4 / 2 0 0

7

0 7 / 0

5 / 2 0 0

7

1 4 / 0

5 / 2 0 0

7

2 1 / 0

5 / 2 0 0

7

2 8 / 0

5 / 2 0 0

7

0 4 / 0

6 / 2 0 0

7

1 1 / 0

6 / 2 0 0

7

1 8 / 0

6 / 2 0 0

7

2 5 / 0

6 / 2 0 0

7

Date

Q t y o f D e f e c t s R e p o r t e d

Defects Reported from China (J1 Connector)

0.0%

0.5%

1.0%

1.5%

2.0%

2.5%

0 8 / 0 1 / 2 0

0 7

1 5 / 0 1 / 2 0

0 7

2 2 / 0 1 / 2 0

0 7

2 9 / 0 1 / 2 0

0 7

0 5 / 0 2 / 2 0

0 7

1 2 / 0 2 / 2 0

0 7

1 9 / 0 2 / 2 0

0 7

2 6 / 0 2 / 2 0

0 7

0 5 / 0 3 / 2 0

0 7

1 2 / 0 3 / 2 0

0 7

1 9 / 0 3 / 2 0

0 7

2 6 / 0 3 / 2 0

0 7

0 2 / 0 4 / 2 0

0 7

0 9 / 0 4 / 2 0

0 7

1 6 / 0 4 / 2 0

0 7

2 3 / 0 4 / 2 0

0 7

3 0 / 0 4 / 2 0

0 7

0 7 / 0 5 / 2 0

0 7

1 4 / 0 5 / 2 0

0 7

2 1 / 0 5 / 2 0

0 7

2 8 / 0 5 / 2 0

0 7

0 4 / 0 6 / 2 0

0 7

1 1 / 0 6 / 2 0

0 7

1 8 / 0 6 / 2 0

0 7

2 5 / 0 6 / 2 0

0 7

Date

% o f P i e c e s w i t h D e f e c t s

Pointsout ofcontrol!!!

Improvements.

Improvements.

We registered

overtime data

using SPC theprocess

performance.





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30


Softbeam process must be measured daily to identify significantvariations and take actions. It will be better if types of defects areseparated.

LASER 1

LASER 2XENON

LASER 1

LASER 2

XENONLASER 1

LASER 2

XENONLASER 1

LASER 2

XENON

YIELD

A2

B2

QUANTITY OF DEFECTS DETECTEDTotal ofPieces

Produced

MACHINESHIFT

A1

B1

Date Connector Inspection Final Inspection QA

Yield =(Connector Inspection + Final inpection + QA)

Total of pieces produced=1 -( ) X 100 _____%

Daily Report

Softbeam process must be measured daily to identify significantvariations and take actions. It will be better if types of defects are

separated.Formatode llenadode parámetros de laSoftbeam

X1 Y1 Y2 Z W X2 Y3 Y4HORA

T d l y

T U R N O

MA Q U I N A

Modelo

B e am ó P W1

F e e d

T m ov

FECHA

Ing

Proc.

Softbeamrameter collection d

Set-up procedure

We implemented some formats in

order to collect as may information

as needed.

.- Daily Yields

.- Daily Machine Parameters

.- Set-up Procedure.- Validation Machine Procedure.





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125Solectron Confidential

SoftbeamLaser Light

Beam On

Beam Poweroff

Wait Time (0.15): Es el tiempoen seg que el robotespera en el primer pinantes de moverse a lolargo de todo el conector.

Z + ( 6 4 . 5 0 )

W

(60.26)

Beam Power (14-16):Es la potencia enwatts aplicada alo largo de todoslos pines.

CP(2.6 – 3.0): Es la velocidad enmm/seg con la que elrobot se desplaza a lolargo de todos los pines.

PTP: Point to Point, es la velocidad con laque se desplaza el robot entredos puntos. Se mide en % dela velocodad máxima del

mismo. 75% -80% sonvalores típicos.

Modelos con más variación:UN398, UN395, UN395B,UN595B, UN553

Softbeam 1

Softbeam

Laser Light

Suspipe

Pwr 0

S o l d e r

W i r e

R e v F d

w

Pwr 2

RevLn

Pwr1 (140-170)/10: Es lapotencia en wattsaplicada a lo largo detodos los pines.

Speed (26-30)/10: Es la velocidad enmm/seg con la que el robot sedesplaza a lo largo de todoslos pines.

P w r 1

, S p e

e d , F e e

d

Pwr2 (100)/10: Es la potenciaen watts aplicada alúltimo pin para poderretirar la soldadura.

RevFd (300)/10: Es lavelocidad theretracción enmm/seg con laque lasoldadura esretirada delúltimo pin.

RevLn (20)/10: Es ladistancia en mmcon la que lasoldadura esretirada del últimopin.

Tdly (10-30)/100:Es el tiempo en seg que elsuspipe permanece dispensandosoldadura una vez que el robot se hadetenido en el último pin.

Tpst (20)/100: Es el tiempo en seg que elrobot permanece con el beam abiertoen último pin.

Pwr0 (140)/10: Es la potencia enwatts aplicada al primer pin(precalentamiento).

Tpst (20)/100: Es el tiempo en seg que elrobot permanece con el beam abiertoen el primer pin.

Tmov(10-30)/100: Es el tiempo en seg queel suspipe permanece dispensando

soldadura en el primer pin antes deque el robot se mueva.

Feed (80-100)/10: Es la velocidad enmm/seg con la que lasoldadura es dispensada porel suspipe.

PTP: (Point to Point), es la velocidad conla que se desplaza el robotentre dos puntos. Se mide en

% de l a velocodad máxima delmismo. 75% - 80% sonvalores típicos.

Modelos con más variación: TN13, TN113, TN1987,TN395, TN1893, TN1873, TN1371C, TN220B.

Z

+

(

6 8 . 2 5 )

(75.00)

Based on

three months

of data

collected, we

calculate

confidence

intervals for

each machine

parameter inorder to

specify the

maximum

and

minimum

values of

tolerance.





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Thank you !

We spent 10 months to close this project....However continuos improvement neverends, then always there will be something more to improve.




mexi tronic a

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