mipi low latency interface (lli) for mobile phone bom … asia expo - arteris... · ericsson, texas...

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Copyright © 2012 MIPI Alliance. All rights reserved.

Scott Yang Greater China Country Manger

Arteris Inc


MIPI Low Latency Interface (LLI) for Mobile Phone BoM

Cost Savings

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Legal Disclaimer

The material contained herein is not a license, either expressly or impliedly, to any IPR owned or controlled by any of the authors or developers of this

material or MIPI. The material contained herein is provided on an “AS IS” basis and to the maximum extent permitted by applicable law, this material is

provided AS IS AND WITH ALL FAULTS, and the authors and developers of this material and MIPI hereby disclaim all other warranties and conditions,

either express, implied or statutory, including, but not limited to, any (if any) implied warranties, duties or conditions of merchantability, of fitness for a

particular purpose, of accuracy or completeness of responses, of results, of workmanlike effort, of lack of viruses, and of lack of negligence. ALSO,

THERE IS NO WARRANTY OR CONDITION OF TITLE, QUIET ENJOYMENT, QUIET POSSESSION, CORRESPONDENCE TO DESCRIPTION OR

NON-INFRINGEMENT WITH REGARD TO THIS MATERIAL.

All materials contained herein are protected by copyright laws, and may not be reproduced, republished, distributed, transmitted, displayed, broadcast or

otherwise exploited in any manner without the express prior written permission of MIPI Alliance. MIPI, MIPI Alliance and the dotted rainbow arch and all

related trademarks, tradenames, and other intellectual property are the exclusive property of MIPI Alliance and cannot be used without its express prior

written permission.

IN NO EVENT WILL ANY AUTHOR OR DEVELOPER OF THIS MATERIAL OR MIPI BE LIABLE TO ANY OTHER PARTY FOR THE COST OF

PROCURING SUBSTITUTE GOODS OR SERVICES, LOST PROFITS, LOSS OF USE, LOSS OF DATA, OR ANY INCIDENTAL, CONSEQUENTIAL,

DIRECT, INDIRECT, OR SPECIAL DAMAGES WHETHER UNDER CONTRACT, TORT, WARRANTY, OR OTHERWISE, ARISING IN ANY WAY OUT

OF THIS OR ANY OTHER AGREEMENT RELATING TO THIS MATERIAL, WHETHER OR NOT SUCH PARTY HAD ADVANCE NOTICE OF THE

POSSIBILITY OF SUCH DAMAGES.

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• Arteris NoC Milestones • Technical Founders from Tsquared in 2003 • Founded Network-on-Chip Interconnect in 2003 (250 man years of

development) • NoC Solution = first released implementation of a Arteris NoC in 2005 • First Customer in early 2006. • FlexNoC® = second generation of Arteris NoC in 2009.

• Investors: Qualcomm, ARM, DoCoMo, Synopsys, Ventech, TVM & Crescendo

• Awards: EE Times ACE Finalist 2012, Red Herring “Global 100” 2010, MIT Technology Review “10 Private Companies to Watch” 2010, EE Times “60 Emerging Start-ups” 2009, World Economic Forum “Technology Pioneer 2008”, Red Herring “Europe 100” 2007

Arteris: The NoC Interconnect IP Leader

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What is MIPI LLI?

LLI = Low Latency Interface

• Enables companion chip use models

• Fast enough for cache refills & DRAM sharing

• No software drivers or stack

• Minimal Pins

• Uses low power MIPI M-PHY

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MIPI LLI enables Shared Memory and Companion Chip use cases

Application Processor Baseband Modem

Memory Memory

LLI

M-PHY

LL

I C

on

tro

ller

M-RX

Din

D

out

C

RM

MI

C

M-TX

M-PHY LL

I Co

ntro

ller M-RX

Din

D

out

C

RM

MI

C

M-TX

Removing an LPDDR2 saves $1-2

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MIPI LLI is less expensive than PoP

Low Latency Interface

Removing modem baseband’s dedicated memory:

• Saves $1-2 in BoM cost

• Eliminates DRAM area from PCB floorplan

• Maintains vertical height clearance

Modem BB + DRAM PoP

Using a modem baseband + RAM in a PoP:

• Maintains $1-2 RAM BoM cost

• Adds $0.50 to $1+ for PoP packaging cost

• Increases chip vertical height

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Arteris participation in MIPI LLI WG

• Joined MIPI at creation of LLI Investigation Group

• Attended LLI IG and WG conference calls and F2F meetings since creation

• Mostly by Philippe Martin

• Deeply involved in Transaction Layer (L5) definition • Protocol interoperability experience • Spec writing owned by TI, Arteris review

• Main driver of Data Link Layer (L2) • Interchip-Link experience • Spec writing owned by Arteris

• Significant contribution to PHY Adaptation layer (L1.5) • ARQ retry scheme

• Major contributor to the upcoming LLI specification versions

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How Did We Get Here?

• MIPI Low Latency Interface (LLI) Investigation group formed in December 2009

• LLI confirmed as Working Group in 18 March 2010

• MIPI LLI 1.0 spec approved 4 April 2012

• LLI WG Member Companies: • Analog Devices, ARM, Arteris, Broadcom, Cadence,

Infineon, MCCI, Micron, Motorola, Nokia, Qualcomm, RIM, Samsung, SMSC, STMicroelectronics, ST-Ericsson, Texas Instruments

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LLI is a Layered Model LLI C

ontro

ller

M-P

HY

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LLI is Implemented in 2 IP components

Chip #1

M-PHY

LLI Controller

Chip #2

M-RX

Din

D

out

C

RM

MI

C

M-TX

1or more Tx/Rx Lanes

NIU

DataLink

Controller PA

NIU

N

IU

NIU

N

IU

µN

oC

BE

BE

LL

LL

SVC

Sideband

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Interconnect Adaptation Layer

• IAL is implementation from Arteris • Required, but not defined in MIPI LLI spec

because each SoC interconnect is different

• Connects to SoC interconnect • Typically AXI, OCP for Low Latency (LL) and

Best Effort (BE) Traffic Classes • APB or OCP for config

• Supports any data width • Typically 32 bits to 128 bits

• Mapping between interconnect Traffic Classes (BE, LL, SVC)

• Power management, Connection/ Disconnection, QoS, Clock Management, Rate Matching, etc…

NIU

N

IU

NIU

N

IU

NIU

µN

oC

BE

BE

LL

LL

SVC

*FlexLLI Implementation

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Transaction & Data Link Layers

• Arteris FlexLLI embeds Transaction and Data Link Layers in DataLink Controller

• Usually same clock as interconnect

• Optional Master/Slave LL and BE TC ports

• Optional 40-bit LLI addressing

• Handles LLI clock conversions

• Performance parameters

DataLink

Controller

Sideband


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System Address translation

• Typically configured by “system master” • Number of regions configurable at design time, per port • Offset configurable at runtime • Same mechanism for ingoing/outgoing transactions

Local Interconnect

mapping

Remote chip mapping

Segment 0

Ex : 64 MB to DRAM

Segment 2

Ex : 32 MB to PER1

Address _ in

+ Offset 0

Address _ in

+ Offset 2

Base 1

PER space

DRAM space

Base 2

Base 3

Segment 1

Ex : 64 MB to DRAM Address _ in

+ Offset 1

Segment 3

Ex : 64 MB to PER2

Address _ in

+ Offset 3

Local

mapping

Remote chip

mapping

Address _ in

+ Offset 0

Segment 0

( LLI : 64 MB )

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Physical Adapter Layer

• Interface to MIPI M-PHY

• Configurable number of Rx and Tx lanes

• Configurable RMMI data

• Optional PHY test mode

Din

D

out

C

RM

MI

C PA


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MIPI M-PHY

• Industry standard

• Optimized for mobile applications • High performance and scalability • Low power operation and modes

• LLI M-PHY features • Type 1 • HS-Mode Gears G1, G2 or G3 • Up to 5.8 Gbps per lane

M-PHY

M-RX

Din

D

out

C

RM

MI

C

M-TX

1or more Tx/Rx Lanes

PA


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Why MIPI LLI?

• Link a chip and a companion chip together

• Remove a memory chip from a mobile phone

• No software complexity

• Fewer pins than other standards

• Scalable – Future-proof designs for high-throughput requirements

• Low Power – Leverage M-PHY (< pwr than PCIe)

Increase Flexibility, Reduce BoM cost

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Why Arteris FlexLLI?

• First and only Silicon-proven LLI controller

• Lowest risk, automated environment for fast configuration and verification setup

• Industry-leading M-PHY / LLI joint solution with Synopsys

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MIPI LLI is implemented in TI OMAP5 Platform and other SoCs

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FlexLLI automated delivery environment

µNoC

DL+PA

controller

Clock management

AXI

APB

AXI

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FlexLLI delivery environment

• Provides same capabilities as FlexNoC environment • Parameterization of µNoC and LLI controller • RTL, synthesis scripts and SystemC exports

• FlexVerifier VMM automated test bench export • Allows simulations of µNoC + LLI controller

• Reverse LLI BFM automatically instantiated • Standard diagnostics provided • Open environment for user-defined diagnostics

• Will incorporate M-PHY models • Will be tuned to Synopsys M-PHY specifics

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Flexibility: FlexLLI has Many Configuration Options

• Configuration registers • Sideband and IRQ management, transaction user bit

remapping, address translation, Req/Rsp Arbitration priority, credit frame arbitration

• Clock gating and power management • Double-level clock gating (Units and reg levels) • Integrates into SoC power management

• QoS, debug observability, buffering, clock management, traffic class mapping, custom protocols, etc.

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Why Arteris FlexLLI?

• First: Silicon-proven with lowest risk

• Easiest: Automated environment for fast configuration and verification setup. Joint solution with Synopsys M-PHY.

• Most Flexible: Extensive configuration options for fastest time to market

Reduce risk and development time

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C2C

Remote ChipLocal Chip

o7266v3

REQ

or

RSP

REQ

or

RSP

REQ

or

RSP

REQ

or

RSP

Tx data width8 64 bits…

NT

TP

NT

TP

TxClkEn

TxClkEn

RxActive

RxActive

RxClk

TxClk

Modem Application Processor

memory memory

C2C was developed to enable a modem to use

the DRAM that is connected to an applications

processor

It allows for significant BOM cost savings of up

to $2.00 to the handset manufacturers of

smartphones

Other I/F PCI Express, HSI, Unipro do not

provide a low latency solution to allow modem

cache refill through shared memory - C2C latency = 100ns roundtrip

- Other I/F (pcie) >300 ns roundtrip

- HIS cannot support read throughput for cache refill

Major modem & app processor vendors already

implementing C2C

C2C

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Arteris FlexNoC

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Reduced Wire Routing Congestion with Arteris FlexNoC

Crossbar Architecture versus NoC Architecture

FlexNoC Datapath and Wire Density View in action

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Arteris Network-on-Chip(NoC) Press Release Arteris携手TSMC合作矽中介层Test Chip

飞思卡尔i.MX应用处理器取得Arteris FlexNoC授权

Arteris FlexNoc Interconnect IP Selected by Toshiba for SoC Deployment

Cavium licenses Arteris NoC Interconnect IP

Samsung adopts Arteris for mobile chips

Arteris FlexNoC(TM) Network-on-Chip (NoC) Solution Selected by LG Electronics

Arteris Network-On-Chip (NoC) Selected by Texas Instruments to Provide SoC Interconnect

北京新岸线公司手机SoC采用Arteris FlexNoC Interconnect与C2C技术

Pixelworks Again Chooses Arteris for Network-on-Chip (NOC) Interconnect Fabric IP

Arteris Network on Chip (NoC) Selected by NEC Electronics Europe for Advanced Development of Complex SoC Applications (Renesas)

NTT Electronics Completes a Graphic SoC Design Using Arteris NoC Technology

Arteris FlexNoC Interconnect IP助力Core Logic移动多媒体处理器设计

MtekVision Licenses Arteris FlexLLI MIPI Low Latency Interface (LLI) IP

http://www.ed-china.com/ART_8800044462_400012_500016_HN_51f0ed34.HTM







http://www.eeworld.com.cn/xfdz/2011/1105/article_8397.html










http://finance.yahoo.com/news/Arteris-FlexNoc-Interconnect-iw-521279998.html





http://www.eetindia.co.in/ART_8800647060_1800006_NT_9354af98.HTM

http://www.eetimes.com/electronics-news/4210507/Samsung-adopts-Arteris-for-mobile-chips




http://finance.yahoo.com/news/Arteris-FlexNoCTM-iw-3036190947.html







http://www.arteris.com/pr_18_aug_08








http://www.esmchina.com/ART_8800119390_1400_2201_3800_4300_8bbeab9c.HTM?jumpto=view_welcomead_1332369317057










http://finance.yahoo.com/news/Pixelworks-Again-Chooses-iw-1766819722.html







http://www.finanznachrichten.de/nachrichten-2009-01/12873264-arteris-network-on-chip-noc-selected-by-nec-electronics-europe-for-advanced-development-of-complex-soc-applications-004.htm






http://www.prnewswire.com/news-releases/ntt-electronics-completes-a-graphic-soc-design-using-arteris-noc-technology-90608159.html



http://www.eet-china.com/articleLogin.do?artId=8800665724&fromWhere=/ART_8800665724_621496_NT_681d3b62.HTM&catId=621496&newsType=NT&pageNo=null&encode=681d3b62







http://www.arteris.com/MtekVision_Arteris_MIPI_LLI_FlexLLI_pr_2012_april_11.php







mipi low latency interface (lli) for mobile phone bom … asia expo - arteris... · ericsson, texas...

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