mission profile aware ic design - a case study -
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Mission Profile Aware IC Design - A Case Study -. Goeran Jerke, Robert Bosch GmbH, Automotive Electronics Andrew B. Kahng, University of California , San Diego. - PowerPoint PPT PresentationTRANSCRIPT
Mission Profile Aware IC Design- A Case Study -
Goeran Jerke, Robert Bosch GmbH, Automotive ElectronicsAndrew B. Kahng, University of California, San Diego
This research project is supported by the German Government, Federal Ministry of Education and Research under the grant number 16M3195C
• Introduction
• Design Challenges
• Mission Profile Aware Design
• Case Study – Electromigration Aware IC Design
• Summary and Conclusion
Overview
Apr 19, 2023 2Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego
Introduction
Apr 19, 2023Apr 19, 2023
ECUs, mechatronicssensors
MEMS sensors
Semiconductors
OEM
Tier 1
Tier 2
OEM – Original Equipment
Manufacturer
Introduction
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 5
Electronic Control Unit for ESP
Introduction
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 6
Tier 2 +
Tier 1
ECU for Driver Assistance Acceleration Sensor Module
Introduction
Apr 19, 2023 7Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego
EnvironmentOEM
Tier 1, OEM
Tier 1
Tiers 1 and 2Foundry
Tier 2Foundry
System DesignPackaging
Constraints
Functional LoadConstraints
Temperatures Responsibility Parameters
Ambient Temperature (Car)
Installation Location (Car)
ECU Housing
ECU (internal)
Component Pin
Device Junction
• IC Technology Node Evolution
Introduction
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 8
Smart-Power
HV-CMOS
CMOS automotive
CMOS leading edge (ITRS)
• Aggressive technology scaling• Time to market co-design• System partitioning and integration• Robustness• Application requirements:– Origin and cause of requirements replicability, quality– Impact on application design and technologies– Application use operating conditions, environmental load– Functional loads thermal, current, voltage, ...– Reliability dominant failure mechanisms
• Complex, heterogeneous and fragmented design flows
Design Challenges
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 9
• Aggressive technology scaling• Time to market co-design• System partitioning and integration• Robustness• Application requirements:– Origin and cause of requirements replicability, quality– Impact on application design and technologies– Application use operating conditions, environmental load– Functional loads thermal, current, voltage, ...– Reliability dominant failure mechanisms
• Complex, heterogeneous and fragmented design flows
Design Challenges
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 10
• Introduction
• Design Challenges
• Mission Profile Aware Design
• Case Study – Electromigration Aware IC Design
• Summary and Conclusion
Overview
Apr 19, 2023 11Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego
Mission Profile Aware Design
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 12
...
OEM
Tier 1
Tier 2
...Tier n
Supply Chain
Mission Profile Aware Design
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 13
...
OEM
Tier 1
Tier 2
...Tier n
Design Chain
MP
MP
MP
MP
MP
MPMP MP
Requirements, Constraints, Functional Loads, Environmental Loads
Mission Profile Aware Design
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 14
...
OEM
Tier 1
Tier 2
...Tier n
Design Chain
MP
MP
MP
MP
MP
MPMP MP
NEW: Achieved Robustness, Dominant Failure Mechanisms RIF
• Design Flow Overview
Mission Profile Aware Design
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 15
1 2
3 3
5
4 4
• Consistent consideration of mission profiles (MP)in supply chain • Reduction of design uncertainty
o More precise requirements and stress factorso Better understanding of system (failure mechanisms)
• Formalized and improved communication o OEM Tier n and Tier n OEM
• Standardization of structure and content of MPs• Electronic format MP documents • RMP Framework
(Tool-independent platform for mission profile aware design)
Mission Profile Aware Design
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 16
• Mission Profile Document– Document header– Operating states definition– Component definition– Property definition– Back-annotation data
Mission Profile Aware Design
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 17
• Mission Profile Document– Document header
• Author• Timestamp• Document history• Mounting location
– Operating states definition– Component definition– Property definition– Back-annotation data
Mission Profile Aware Design
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 18
• Mission Profile Document– Document header– Operating states definition
• Generic data container for operating states Manufacturing, assembly, storage, ... Car: start, acceleration, breaking, stop&go, freeway cruising, ... IC: power-up, idling, power-down, mode_1, mode_2, ...
– Component definition– Property definition– Back-annotation data
Mission Profile Aware Design
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 19
• Mission Profile Document– Document header– Operating states definition– Component definition
• Type e.g. ECU, passive component, IC, sensor, ...• Device I/O port definition (*)
– Operating state dependent environmental and functional loads» Heat flow» Transient/effective voltages and currents» ...
• Profiles– Property definition– Back-annotation data
Mission Profile Aware Design
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 20
(*) A port is a generic object: thermal port or electrical port
Mission Profile Aware Design
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 21
Source: ZVEI Handbook RV EE Modules 2012
• Mission Profile Document– Document header– Operating states definition– Component definition
• Type • Device I/O port definition• Profiles:
– Temperature histogram, gradient and cycling– Humidity vs. temperature histogram– Vibration– ...
– Property definition– Back-annotation data
Mission Profile Aware Design
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 22
Mission Profile Aware Design
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 23
Source: ZVEI Handbook RV EE Modules 2012
• Mission Profile Document– Document header– Operating states definition– Component definition– Property definition– Back-annotation data
• Reliability: Robustness Indication Figures (RIF) of dominant failure mechanisms
• Robustness: Enhanced Worst-Case Distance (WCD)
Mission Profile Aware Design
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 24
Mission Profile Aware Design
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 25
Component Parameter ECU TEEM_Package, TVMLA, TEEM_internal , TComp.Package , ... Board TBoard , ... Package TComp.Package, TComp.Pins, Rth, ... Chip TJunction, ... Sensor Discrete device, ...
Source: ZVEI Handbook RV EE Modules 2012
Component Properties
• Introduction
• Mission Profile Aware Design
• Case Study – Electromigration Aware IC Design
• Summary and Conclusion
Overview
Apr 19, 2023 26Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego
• Quality of Functional Load Data
EM Aware Design – Case Study
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 27
Classic Design Flow
Current Aware Design Flow
EM Aware Design – Case Study
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 28
Current Aware Design Flow
Cell-Level
EM Aware Design – Case Study
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 29
Current Aware Design Flow
Block-Level
EM Aware Design – Case Study
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 30
I = 1A DC
AE/QMM
Electrical Overstress (EOS)
VoidsVoids HillockHillock
Electromigration (EM)
AE/QMM
Imax = 1A + Duty cycle
I
I
t
t
Abnormal peak event
EMEOS RPP
EM EOS RPP
AE/QMM
Repetitive Power Pulsing (RPP)
• Quality of Functional Load Data
Current (Density) Aware Routing to prevent EM and EOS
EM Aware Design – Case Study
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 31
• Effective Design Parameters
EM Aware Design – Case Study
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 33
• Electromigration Aware Design Flow
EM Aware Design – Case Study
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 34
1
2
5
3
4
4,5
• Current Density Critical Nets – Automotive IC A
EM Aware Design – Case Study
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 35
Different Mission Profile Next technology node
Base node
• Current Density Critical Nets – Automotive IC B
EM Aware Design – Case Study
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 36
Different Mission Profile
Next technology node
Base node
• Introduction
• Design Challenges
• Mission Profile Aware Design
• Case Study – Electromigration Aware IC Design
• Summary and Conclusion
Overview
Apr 19, 2023 37Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego
• Consideration of robustness as design target is essential for automotive electronic designs
• Consistent consideration of mission profiles within the design chain is required (bi-directional flow)
• Current aware design is driven by mission profiles
• Mission profile aware design:– Vendor- and EDA tool-independent focus on design flow – Reduction of design uncertainty– Formalized and improved communication
Summary and Conclusion
Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 38
Apr 19, 2023 39Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego
Thank You!