moc3061

6-PIN DIP ZERO-CROSS PHOTOTRIAC DRIVER OPTOCOUPLER (600V PEAK)MOC3061-M MOC3062-MPACKAGE

MOC3063-M

MOC3162-M

MOC3163-M

SCHEMATIC

ANODE 1

6 MAIN TERM.

6 6 1N/C 3 CATHODE 2 5 NC*

1

ZERO CROSSING CIRCUIT

4 MAIN TERM.

*DO NOT CONNECT (TRIAC SUBSTRATE)

6

1

DESCRIPTIONThe MOC306X-M and MOC316X-M devices consist of a GaAs infrared emitting diode optically coupled to a monolithic silicon detector performing the function of a zero voltage crossing bilateral triac driver. They are designed for use with a triac in the interface of logic systems to equipment powered from 115/240 VAC lines, such as solid-state relays, industrial controls, motors, solenoids and consumer appliances, etc.

FEATURES Simplies logic control of 115/240 VAC power Zero voltage crossing dv/dt of 1000 V/s guaranteed (MOC316X-M), 600 V/ms guaranteed (MOC306X-M) VDE recognized (File # 94766) ordering option V (e.g., MOC3063V-M) Underwriters Laboratories (UL) recognized (File #E90700, volume 2)

APPLICATIONS Solenoid/valve controls Static power switches Temperature controls AC motor starters Lighting controls AC motor drives E.M. contactors Solid state relays

2003 Fairchild Semiconductor Corporation

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6-PIN DIP ZERO-CROSS PHOTOTRIAC DRIVER OPTOCOUPLER (600V PEAK)MOC3061-M MOC3062-M MOC3063-M MOC3162-M MOC3163-M

ABSOLUTE MAXIMUM RATINGS (TA = 25C unless otherwise noted)Parameters TOTAL DEVICE Storage Temperature Operating Temperature Lead Solder Temperature Junction Temperature Range Isolation Surge Voltage(4) (peak AC voltage, 60Hz, 1 sec duration) Total Device Power Dissipation @ 25C Derate above 25C EMITTER Continuous Forward Current Reverse Voltage Total Power Dissipation 25C Ambient Derate above 25C DETECTOR Off-State Output Terminal Voltage Peak Repetitive Surge Current (PW = 100 s, 120 pps) Total Power Dissipation @ 25C Ambient Derate above 25C VDRM ITSM PD All All All 600 1 150 1.76 V A mW mW/C IF VR PD All All All 60 6 120 1.41 mA V mW mW/C TSTG TOPR TSOL TJ VISO PD All All All All All All -40 to +150 -40 to +85 260 for 10 sec -40 to +100 7500 250 2.94 C C C C Vac(pk) mW mW/C Symbol Device Value Units


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ELECTRICAL CHARACTERISTICS (TA = 25C Unless otherwise specied) INDIVIDUAL COMPONENT CHARACTERISTICSParameters EMITTER Input Forward Voltage Reverse Leakage Current DETECTOR Peak Blocking Current, Either Direction Critical Rate of Rise of Off-State Voltage Test Conditions IF = 30 mA VR = 6 V VDRM = 600V, IF = 0 (note 1) IF = 0 (gure 9, note 3) Symbol VF IR IDRM1 dv/dt Device All All MOC316X-M MOC306X-M MOC306X-M MOC316X-M Min Typ* 1.3 0.005 10 10 1500 Max 1.5 100 100 500 Units V A

nA V/s

600 1000

TRANSFER CHARACTERISTICS (TA = 25C Unless otherwise specied.)DC Characteristics Test Conditions Symbol Device MOC3061-M MOC3062-M/ MOC3162-M MOC3063-M/ MOC3163-M All All 1.8 500 Min Typ* Max 15 10 5 3 V A mA Units

LED Trigger Current (rated IFT)

main terminal Voltage = 3V (note 2)

IFT

Peak On-State Voltage, Either Direction Holding Current, Either Direction

ITM = 100 mA peak, IF = rated IFT

VTM IH

ZERO CROSSING CHARACTERISTICSCharacteristics Inhibit Voltage (MT1-MT2 voltage above which device will not trigger) Leakage in Inhibited State Test Conditions IF = Rated IFT IF = Rated IFT, VDRM = 600V, off state Symbol VINH IDRM2 Device MOC3061-M/2M/3M MOC3062-M/3M All Min Typ* 12 12 150 Max 20 15 500 V A Units

ISOLATION CHARACTERISTICSCharacteristics Isolation Voltage *Typical values at TA = 25C Notes 1. Test voltage must be applied within dv/dt rating. 2. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between max IFT (15 mA for MOC3061-M, 10 mA for MOC3062-M & MOC3162-M, 5 mA for MOC3063-M & MOC3163-M) and absolute max IF (60 mA). 3. This is static dv/dt. See Figure 9 for test circuit. Commutating dv/dt is a function of the load-driving thyristor(s) only. 4. Isolation surge voltage, VISO, is an internal device dielectric breakdown rating. For this test, Pins 1 and 2 are common, and Pins 4, 5 and 6 are common. 2003 Fairchild Semiconductor Corporation

Test Conditions f = 60 Hz, t = 1 sec

Symbol VISO

Device All

Min 7500

Typ*

Max

Units V

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Figure 1. LED Forward Voltage vs. Forward Current1.7 1.6 VF, FORWARD VOLTAGE (V) 1.5 1.4 1.4 IFT, NORMALIZED 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.1 TA = -40C TA = 25C 1.3 1.2 1.1 1.0 0.9 0.8 -40 1.6 1.5

Figure 2. Trigger Current Vs. Temperature

VTM = 3V NORMALIZED TO TA = 25C

TA = 85C

1

10

100

-20

0

20

40

60

80

100

IF, LED FORWARD CURRENT (mA)

TA, AMBIENT TEMPERATURE (C)

Figure 3. LED Current Required to Trigger vs. LED Pulse Width16 IFT, LED TRIGGER CURRENT (NORMALIZED) 14 12 10 8 6 4 2 0 1 10 PWIN, LED TRIGGER PULSE WIDTH (s) 100 TA = 25C NORMALIZED TO PWIN >> 100s 10000

Figure 4. Leakage Current, IDRM vs. Temperature

IDRM, LEAKAGE CURRENT (nA)

1000

100

10

1

0.1 -40

-20

0

20

40

60

80

100



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Figure 5. IDRM2, Leakage in Inhibit State vs. Temperature2.4 2.2 ITM, ON-STATE CURRENT (mA) 2.0 1.8 IDRM2, NORMALIZED 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 IF = RATED IFT NORMALIZED TO TA = 25C 800 600 400 200 0 -200 -400 -600 -800 -4 -3

Figure 6. On-State Characteristics

TA = 25C

-20

0

20

40

60

80

100

-2

-1

0

1

2

3

4


VTM, ON-STATE VOLTAGE (VOLTS)

Figure 7. IH, Holding Current vs. Temperature3.2 IH, HOLDING CURRENT (NORMALIZED) 2.8 2.4 VINH, NORMALIZED 2.0 1.6 1.2 0.8 0.85 0.4 0.0 -40 0.80 -40 -20 0 20 40 60 80 100 TA, AMBIENT TEMPERATURE (C) 1.20 1.15

Figure 8. Inhibit Voltage vs. Temperature

NORMALIZED TO TA = 25C 1.10 1.05 1.00 0.95 0.90

-20

0

20

40

60

80

100



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1. 100x scope probes are used, to allow high speeds and voltages. 2. The worst-case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then removing the current. The variable vernier resistor combined with various capacitor combinations allows the dv/dt to be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. RC is measured at this point and recorded.27 VDRM/VRRM SELECT X100 PROBE 1 2 X100 PROBE 6 DUT 4 470pF MOUNT DUT ON TEMPERATURE CONTROLLED C PLATE dV dt VERNIER 0.001 0.005 1 MEG 82 2W 0.01 2W POWER 0.047 1N914 20V 56 2W 1000 1/4W RFP4N100 0.47 1N967A 18V 0-1000V 10mA 0.1 TEST 2W EACH 1.2 MEG 20k 2W 0.33 2W 1000 10 WATT WIREWOUND 1000V

DIFFERENTIAL PREAMP

0.047 1000V

100 2W

f = 10 Hz PW = 100 s 50 PULSE GENERATOR

ALL COMPONENTS ARE NON-INDUCTIVE UNLESS SHOWN

Figure 9. Circuit for Static

dV Measurement of Power Thyristors dt

BASIC APPLICATIONSRin 1 2 MOC3061-M MOC3062-M MOC3063-M 6 5

360 HOT FKPF12N60 39

Typical circuit for use when hot line switching is required. In this circuit the "hot" side of the line is switched and the load connected to the cold or neutral side. The load may be connected to either the neutral or hot line. Rin is calculated so that IF is equal to the rated IFT of the part, 15 mA for the MOC3061-M, 10 mA for the MOC3062-M, or 5 mA for the MOC3063-M. The 39 ohm resistor and 0.01 F capacitor are for snubbing of the triac and is often, but not always, necessary depending upon the particular triac and load used. Suggested method of ring two, back-to-back SCRs with a Fairchild triac driver. Diodes can be 1N4001; resistors, R1 and R2, are optional 330 ohm. Note: This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only.VCC

VCC

3

4 360 0.01F

240 VAC

LOAD

NEUTRAL

Figure 10. Hot-Line Switching Application Circuit

115 VAC R1 1 Rin 2 MOC3061-M MOC3062-M MOC3063-M 3 6 5 360 SCR SCR D1

4

R2

D2 LOAD

Figure 11. Inverse-Parallel SCR Driver Circuit


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Package Dimensions (Through Hole)0.350 (8.89) 0.320 (8.13)

Package Dimensions (Surface Mount)0.350 (8.89) 0.320 (8.13)

0.260 (6.60) 0.240 (6.10)

0.260 (6.60) 0.240 (6.10)

0.390 (9.90) 0.332 (8.43)

0.070 (1.77) 0.040 (1.02)

0.070 (1.77) 0.040 (1.02)0.014 (0.36) 0.010 (0.25) 0.320 (8.13)

0.320 (8.13) 0.014 (0.36) 0.010 (0.25)

0.200 (5.08) 0.115 (2.93)

0.200 (5.08) 0.115 (2.93)

0.012 (0.30) 0.008 (0.20)

0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 (2.54) 15 0.012 (0.30)

0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41)

0.100 [2.54] 0.035 (0.88) 0.006 (0.16)

Package Dimensions (0.4 Lead Spacing)0.350 (8.89) 0.320 (8.13)

Recommended Pad Layout for Surface Mount Leadform

0.260 (6.60) 0.240 (6.10)

0.070 (1.78)

0.060 (1.52)0.070 (1.77) 0.040 (1.02)

0.014 (0.36) 0.010 (0.25)

0.425 (10.79)

0.100 (2.54) 0.305 (7.75) 0.030 (0.76)

0.200 (5.08) 0.115 (2.93)

0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.012 (0.30) 0.008 (0.21) 0.425 (10.80) 0.400 (10.16)

NOTE All dimensions are in inches (millimeters)


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ORDERING INFORMATIONOption S SR2 T V TV SV SR2V Order Entry Identier S SR2 T V TV SV SR2V Description Surface Mount Lead Bend Surface Mount; Tape and reel 0.4" Lead Spacing VDE 0884 VDE 0884, 0.4" Lead Spacing VDE 0884, Surface Mount VDE 0884, Surface Mount, Tape & Reel

MARKING INFORMATION

1

MOC3061 V3 4

2 6

X YY Q5

Denitions1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option See order entry table) One digit year code, e.g., 3 Two digit work week ranging from 01 to 53 Assembly package code

*Note Parts that do not have the V option (see denition 3 above) that are marked with date code 325 or earlier are marked in portrait format.


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Carrier Tape Specifications12.0 0.1 4.5 0.20 2.0 0.05 0.30 0.05 4.0 0.1 1.5 MIN 1.75 0.10

11.5 1.0 21.0 0.1 9.1 0.20 24.0 0.3

0.1 MAX

10.1 0.20

1.5 0.1/-0

User Direction of Feed

NOTE All dimensions are in inches (millimeters)

Reow Prole (White Package, -M Sufx)

300 Temperature (C) 250 200 150 100 50 0 0 0.5 1 1.5 2 2.5 245C peak

230C, 1030 s

Time above 183C, 120180 sec Ramp up = 210C/sec Peak reflow temperature: 245C (package surface temperature) Time of temperature higher than 183C for 120180 seconds One time soldering reflow is recommended 3.5 4 4.5

3

Time (Minute)


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DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.


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moc3061

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