Module Metrology

Peter Sutcliffe

Peter Sutcliffe – Module Metrology

Wenzel CMM Module Metrology

carried out on Wenzel CMM with module jig aligned along the X axis

Peter Sutcliffe – Module Metrology

Touch Probe Each touch probe

measurement starts with measuring the base and pin to establish datums.

There are 3 touch probe measurements:

Pedestal before grinding cooling face

Pedestal after grinding cooling face

Module measurement of hybrid and cooling face

Peter Sutcliffe – Module Metrology

Optical Measurement of Silicon planes

Optical Measurement carried out using Renishaw VPN 625 and X250 lens.

First measure horizontal base and vertical post to establish datums.

10 point R and Phi planes to measure 5 fiducial points and 5 other points on silicon

9 point measurement of gold + and o to establish planarity of hybrid.

Peter Sutcliffe – Module Metrology

Optical Measurement of Silicon Edges.

First measure 2 holes to establish module CL

Take 6 point line to measure Phi and R edge.

Peter Sutcliffe – Module Metrology

Data Added to Database

Data outputted to a txt file and updated onto database.

Pedestal:Before Grinding:Add base paddle metrology summary file.After Grinding:Add base paddle metrology summary file.

Module:First Full Metrology:Phi SummaryPhi Silicon PlanePhi Hybrid PlaneR SummaryR Silicon PlaneR Hybrid PlaneTop SummaryTop Phi EdgeTop R edgeSecond Metrology after Cable Attachment:Top SummaryTop Phi EdgeTop R edgeFinal Metrology after Burn in:Top SummaryTop Phi EdgeTop R edge