motorola atrix hd mb886

Motorola Atrix HD MB886Quad-Band GSM/EDGEW-CDMA/HSPA+ (850/900/1700/1900/2100 MHz)LTE (700 MHz - Band XVII / 1700 MHz - Band IV)#11000-120813-NTc

DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information.Copyright © 2012, UBM PLC. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.

© 2012, UBM PLC

The Motorola Atrix HD is a quad-band GSM / EDGE, multiband W-CDMA / HSPA+, dual-band LTE smartphone that runs the Android 4.0 “Ice Cream Sandwich” operating system on a dual-core 1 GHz Qualcomm Snapdragon 4 processor with 1 GB RAM. It also features a 4.5-in. TFT-LCD display with 720p (720 x 1280) resolution, 16M colors, and a scratch-resistant multi-touch capacitive touchscreen; 8 GB of internal storage; microSD slot for additional storage (max. 32 GB); and two cameras: an 8 MP CMOS BSI main camera with autofocus, LED flash, digital zoom, and HD (1080p) camcorder; and a 1.3 MP front-facing camera for video calls. Connectivity is provided by WiFi 802.11a/b/g/n, Bluetooth 4.0 + EDR, microUSB 2.0, Micro HDMI, 3.5 mm audio jack, and GPS. Sensors include an accelerometer, compass, temperature sensor, and ambient light / proximity sensor. The Atrix HD is powered by a 3.8 V, 1780 mAh Li-Polymer battery that supplies a listed 9 hours of talk time and 204 hours of standby.

Deep Dive Teardown

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Product Description

Deep Dive TeardownMotorola Atrix HD MB886 #11000-120813-NTc

IC Die Count**

IC Package Count**

Retail Price

Product Dimensions (mm) Total Manufacturing Cost*

Electronics Cost**

Integrated Circuits $49.98 38.1%

Modules, Discretes & Connectors $28.21 21.5%

Substrates $6.40 4.9%

Component Insertion $6.08 4.6%

Card Test $0.33 0.3%

Battery Subsystem $3.14 2.4%

Display Subsystem $18.62 14.2%

Camera Subsystem $8.88 6.8%

Non-Electronic Parts $7.25 5.5%

Final Assembly & Test $2.22 1.7%

Total $131.11 100.0%

Brand Motorola

Product Features

Official Release Date 8/1/2012

133.4 x 70.4 x 8.4

Weight (grams) 137.3

Product Name & Model #

Integrated Circuit Metrics

Secondary Camera 1.3 MP

40

30

Android 4.0 "Ice Cream Sandwich"

Product Description

Product Type

$449.99

Smartphone

4.5" TFT-LCD, 720 x 1280 Pixels, 16M Colors, Scratch-Resistant GlassDisplay

Communications GSM/EDGE, W-CDMA/HSPA+, LTE

ConnectivityWiFi 802.11a/b/g/n, Bluetooth 4.0 + EDR, microUSB 2.0, Micro HDMI, GPS

Battery LifeUse Time: 9 hours Standby Time: 204 hours

Cost Metrics

Manufacturing Cost Breakdown

$103.57

Interface Multi-Touch Capacitive Touchscreen

Processor

$131.11

Qualcomm 1.5 GHz Snapdragon 4 Krait (MSM8960) w/ 1 GB RAM

Operating System

Atrix HD MB886

StorageInternal: 8.0 GB External: microSD (max. 32 GB) *Excluding Supporting Materials' Cost

**Including Subsystems

Key Subsystems

Accelerometer, Compass, Temperature, Ambient/Proximity

Sensors

Main Camera 8.0 MP CMOS BSI, Autofocus, LED Flash, HD (1080p) Video Camcorder

Battery 3.8 V, 1780 mAh, Li-Polymer

Product Overview Block Diagram Major Components Antenna BatteryComponent Arrangement Main Board Other Flex & Board Component Statistics OverviewCostCameraDisplaySupporting Materials & Label BacklightsExterior Features Teardown SequenceProduct Overview


21 - Avago#ACPM-5004LTE / W-CDMA Band IV PA

22 - Avago#ACPM-5008W-CDMA Band VIII PA

19 - Avago#ACPM-7051Quad-Band GSM /W-CDMA Bands I & V PA

20 - Avago#ACPM-5002W-CDMA Band II PA

W-CDMA850 Tx

W-CDMA1900 Tx

W-CDMA900 Tx

W-CDMA /LTE 1700 Tx

DUPL DUPL DUPL

GSM 1800/1900 Rx

24 - Murata#XM0860SR-DL0801SPDT (DP4T) Switch

DUPL

DUPL

LTE 700 Tx

W-CDMA/LTERxD AntennaW-CDMA/LTERxD Antenna

DIPLEXER

5 - Qualcomm#RTR8600

GSM / CDMA / W-CDMA/ LTE RxD Transceiver + GPS

Main Antenna

23 - Sony#CXM3582UR

SP10T Antenna Switch

Main AntennaMain AntennaMain Antenna

23 - Sony#CXM3582UR

SP10T Antenna Switch

W-C

DM

A/G

SM

900 R

x

W-C

DM

A/G

SM

850 R

x

GSM Hi 1800/1900 & GSM Lo 850/900 Tx

W-C

DM

A /

LTE 1

700 T

x

W-CDMA / LTE1700 Tx/Rx

W-C

DM

A /

LTE 1

700 R

x

W-C

DM

A 1

900 T

x

W-C

DM

A 1

900 R

xW

-CD

MA

1900 T

x/Rx

W-C

DM

A 9

00 T

x

W-CDMA 900 Tx/Rx/ GSM 900 Rx

GPSGPSGPS

10 - Infineon#BGA915N7GPS LNA

W-CDMA 850 Tx/Rx/ GSM 850 Rx

W-CDMA2100 Tx

W-CDMA 2100 Tx/Rx

DUPL

W-CDMA/GSM 850 Rx orW-CDMA/GSM 900 Rx W

-CD

MA 2

100 R

x

LTE 700 Tx

LTE 7

00 R

x

W-CDMARxD Antenna

W-CDMARxD Antenna

25 - Sony#CXG1235XR

SP5T Antenna Switch


W-C

DM

A /

LTE 1

700 &

W-C

DM

A 2

100 R

xD

LTE 7

00 R

xD

W-C

DM

A 1

900 R

xD

W-C

DM

A 8

50 R

xD

W-C

DM

A 9

00 R

xD

W-C

DM

A 8

50 o

r 900 R

xD

LTE Band XVIIAntenna

LTE Band XVIIAntenna

14 - RF Micro Devices#RF7317LTE Band XVII PA

GSM

Hi 1800/1

900 T

x

GSM

Lo

850/9

00 T

x

W-C

DM

A 2

100 T

x

W-C

DM

A 8

50 T

x

To MSM8960

Product Overview Block Diagram Major Components Antenna BatteryComponent Arrangement Main Board Other Flex & Board Component Statistics OverviewCostCameraDisplaySupporting Materials & Label BacklightsExterior Features Teardown SequenceBlock Diagram

Page 2Page 1


16 - STMicroelectronics#LIS3DH

3-Axis MEMS Accelerometer

26 - AKM Semiconductor#AK8975

3-Axis Electronic Compass

28 - AMS#TSL277xx

Ambient Light & Proximity Sensor

18 - TI#BQ24314A

Li-ion Charger and Protection

WiFi/Bluetooth 2.4 GHzWiFi/Bluetooth 2.4 GHzWiFi/Bluetooth 2.4 GHz

31 - Orise Tech#A193

TFT-LCD Display Driver

1 - Samsung#K3PE7E700D-XGC2

Multichip Memory - 1 GB Mobile DDR2 SDRAM

2 - Qualcomm#MSM8960

Snapdragon S4 Baseband /

Applications Processor

3 - SanDisk#THGBM4G6D2HBAIR

Multichip Memory - 8 GB MLC NAND Flash, Controller

4 - Qualcomm#PM8921

Power Management

USBUSB

29 - OmniVision#OV8820

8 MP BSI CMOS Image Sensor

Camera

29 - OmniVision#OV8820

8 MP BSI CMOS Image Sensor

Camera

Micro-DVIMicro-DVI

microSDmicroSDSIM

SIM

MicrophoneMicrophone

EarpieceEarpiece

HeadsetHeadset

VibratorVibrator

1.3 MP

Camera

1.3 MP

Camera

17 - TI#TPA2025D1

2 W Class D Audio Amplifier

SpeakerSpeakerMicrophoneMicrophone

MicrophoneMicrophone

Bat

tery

Bat

tery

6 - Cypress Semi#CP7464AT

8-Bit MicrocontrollerWiFi 5 GHzWiFi 5 GHzWiFi 5 GHz

7 - Qualcomm#WCN3660

WiFi / Bluetooth / FM Radio

To RTR8600

15 - Qualcomm#WCD9310

Hardware CODEC

11 - TI#TMP105

Digital Temperature Sensor

Product Overview Block Diagram Major Components Antenna BatteryComponent Arrangement Main Board Other Flex & Board Component Statistics OverviewCostCameraDisplaySupporting Materials & Label BacklightsExterior Features Teardown SequenceBlock Diagram

Page 2Page 1


Total Estimated Cost of Supporting Materials: $2.00

AC Adapter - $1.10USB Cable - $0.35

Documentation - $0.10

Packaging - $0.45

Product Overview Block Diagram Major Components Antenna BatteryComponent Arrangement Main Board Other Flex & Board Component Statistics OverviewCostCameraDisplaySupporting Materials & Label BacklightsExterior Features Teardown SequenceSupporting Materials & Label

Product LabelSupporting Materials


Product Overview Block Diagram Major Components Antenna BatteryComponent Arrangement Main Board Other Flex & Board Component Statistics OverviewCostCameraDisplaySupporting Materials & Label BacklightsExterior Features Teardown SequenceSupporting Materials & Label

Product LabelSupporting Materials


Notification LED

Earpiece

Front Camera

Power / Sleep

Volume

3.5 mm Jack

microUSB Micro HDMI

Ambient Light / Proximity Sensor

Microphone

Product Overview Block Diagram Major Components Antenna BatteryComponent Arrangement Main Board Other Flex & Board Component Statistics OverviewCostCameraDisplaySupporting Materials & Label BacklightsExterior Features Teardown Sequence

Top Back

Exterior Features


Microphone

SIM / microSD

Rear Camera

Camera Flash

Speaker

Microphone


Top Back

Exterior Features



Page 2Page 1

Backlights



Side 1 Side 2

Major Components


Product Overview Block Diagram Major Components Antenna BatteryComponent Arrangement Main Board Other Flex & Board Component Statistics OverviewCostCameraDisplaySupporting Materials & Label BacklightsExterior Features Teardown SequenceComponent Arrangement



Step 1 Step 2 Step 4 Step 6Step 3 Step 5

Teardown Sequence


GPS/WiFi/Bluetooth Antenna

W-CDMA RxD Antenna

Main Antenna

LTE Band XVII Antenna

LTE/W-CDMA RxD Antenna

Supports RxD for W-CDMA Bands II (1900 MHz), V (850 MHz), & VIII (900 MHz) only.

Supports two separate antenna paths for GPS (1.5 GHz) and WiFi/Bluetooth (2.4 GHz) only. Additionally, a separate PCB trace stub antenna on the Main Board is used for WiFi 5 GHz.

Supports RxD for LTE Bands XVII (700 MHz) and LTE Band IV (1700 MHz) as well as W-CDMA Bands I (2100 MHz) and IV (1700 MHz) only.

Supports Tx/Rx for LTE/W-CDMA Band IV (1700 MHz), W-CDMA Bands I (2100 MHz), II (1900 MHz), V (850 MHz), VIII (900 MHz) and Quad-Band GSM (850/900/1800/1900 MHz).

Supports Tx/Rx for LTE Band XVII (700 MHz) only.

Product Overview Block Diagram Major Components Antenna BatteryComponent Arrangement Main Board Other Flex & Board Component Statistics OverviewCostCameraDisplaySupporting Materials & Label BacklightsExterior Features Teardown Sequence Antenna

Page 1 Page 2 Page 3 Page 4 Page 5 Page 6


30.0 mm 9.4 mm 3.0 mm

GPS/WiFi/BluetoothAntenna Element

Length Width Height

46.5 mm 3.3 mm 3.0 mm

W-CDMA RxDAntenna Element

Length Width Height




56.0 mm 6.3 mm 3.0 mmLength Width Height

MainAntenna Element




56.2 mm 3.3 mm 3.0 mm

W-CDMA/LTE RxDAntenna Element

Length Width Height




27.2 mm 26.3 mm 3.0 mm

LTE Band XVIIAntenna Element

Length Width Height




WiFi 5 GHz PCB Trace Stub Antenna



Antenna



Overall View Estimated Cost

Battery


MotorolaEB203.8

Lithium Polymer1750

96 x 56.5 x 2.5490.431.2213.1

LG ChemicalCell(s) $1.83Electronic Parts $0.60Non-electronic Parts $0.15Assembly $0.20Test $0.05Markup $0.31

$3.14

Vol. Energy Density (mWHrs/cc)

Wt. Energy Density (mWHrs/g)

Battery PackPack Brand

Cell Type

Pack Part NumberPack Voltage

Pack Rating (mAHrs)Pack Size (mm)

Estimated Costs

Pack Weight (grams)

Cell Brand

Estimated Pack Price


Overall View Estimated Cost

Battery


31 - Orise Tech#A193TFT-LCD Display Driver

UnknownMP1KY225009KA109.5 x 60.2 x 1.8

22.80View Size (mm) 99.62109 x 56.03686Type TFT w/Chip-in-GlassColors 16777216Rows / Columns 1280 / 720Backlighting Scheme 10 White LEDsPanel(s) $4.35Electronic Parts $5.50Circuit Assembly $0.27Non-Electronic Parts $1.61Final Assembly $0.13Test $0.25Markup $6.52

$18.62Estimated Module Price

Weight (grams)

Display ModuleBrandPart Number

Panel Metrics

Estimated Costs

Module Dimensions

Product Overview Block Diagram Major Components Antenna BatteryComponent Arrangement Main Board Other Flex & Board Component Statistics OverviewCostCameraDisplaySupporting Materials & Label BacklightsExterior Features Teardown Sequence Display


Grid = 1 cm

30 - Dongwoon Anatech#DW9714Autofocus VCM Driver

29 - OmniVision#OV88208 MP BSI CMOS Image SensorGrid = 1 cm

UnknownW625DHA

9.3 x 9.3 x 6.39.3 x 9.3 x 6.3

1.21.2

CMOS8 MP1/3.2

51

Electronic Parts $5.50Non-Electronic Parts $1.20Assembly $0.26Test $0.15Markup $1.78

$8.88

Camera Weight (grams)

Camera Size (mm)Subsystem Weight (grams)

Optical Zoom

Estimated Costs

Estimated Module Price

TypeResolutionOptical Size

Brand

Subsystem Size (mm)

Lens Elements

Part Number

Camera Module

Product Overview Block Diagram Major Components Antenna BatteryComponent Arrangement Main Board Other Flex & Board Component Statistics OverviewCostCameraDisplaySupporting Materials & Label BacklightsExterior Features Teardown Sequence Camera


Grid = 1 cm

3.5mm

LTE Band XVII Antenna W-CDMA/LTE RxD Antenna

W-CDMA RxD AntennaGPS/WiFi/Bluetooth Antenna

Main AntennaSpeaker

Touchscreen

Display

Interconnect Flex

WiFi/BluetoothAntenna


Side 1 IC Identification Side 1 X-Ray Photos Side 1 Die Photos

Page 1

Side 1 Side 2

Page 2

Side 2 IC Identification Main Board Cross-Section

Main Board


HDMI

Camera Flash

USB Power / Sleep

Volume

SIMmicroSD

Dual-Shaft Vibrator

Battery

Top & Bottom Port MEMS MicrophonesGrid = 1 cm



Page 1

Side 1 Side 2

Page 2



2 - Qualcomm#MSM8960Snapdragon S4 Baseband / Applications Processor

1 - Samsung#K3PE7E700D-XGC2Multichip Memory - 1 GB Mobile DDR2 SDRAM (2-Die Pkg)

3 - SanDisk#THGBM4G6D2HBAIRMultichip Memory - 8 GB MLC NAND Flash, Controller (3-Die Pkg)

4 - Qualcomm#PM8921Power Management

5 - Qualcomm#RTR8600GSM / CDMA / W-CDMA / LTE RxD Transceiver + GPS

7 - Qualcomm#WCN3660WiFi / Bluetooth / FM Radio

14 - RF Micro Devices#RF7317LTE Band XVII PA

19 - Avago#ACPM-7051Quad-Band GSM / W-CDMA Bands I & V PA (3-Die Pkg)

20 - Avago#ACPM-5002W-CDMA Band II PA (2-Die Pkg)

21 - Avago#ACPM-5004LTE / W-CDMA Band IV PA (2-Die Pkg)

22 - Avago#ACPM-5008W-CDMA Band VIII PA (2-Die Pkg)

15 - Qualcomm#WCD9310Hardware CODEC

10 - Infineon#BGA915N7GPS LNA

23 - Sony#CXM3582URSP10T Antenna Switch (2-Die Pkg)

6 - Cypress Semiconductor#CP7464AT8-Bit Microcontroller

25 - Sony#CXG1235XRSP5T Antenna SwitchGrid = 1 cm

Product Overview Block Diagram Major Components Antenna BatteryComponent Arrangement Main Board Other Flex & Board Component Statistics OverviewCostCameraDisplaySupporting Materials & Label BacklightsExterior Features Teardown Sequence Main Board


Page 1

Side 1 Side 2

Page 2



13 - Fairchild Semiconductor#FSA806USB 2.0 High-Speed Switch

18 - TI#BQ24314ALi-ion Charger and Protection

17 - TI#TPA2025D12 W Class D Audio Amplifier

11 - TI#TMP105Digital Temperature Sensor

Grid = 1 cm

12 - Silego#SLG46400Programmable Mixed-Signal Array

26 - AKM Semiconductor#AK89753-Axis Electronic Compass

8 - Silego#SLG46400Programmable Mixed-Signal Array


16 - STMicroelectronics#LIS3DH3-Axis MEMS Accelerometer (2-Die Pkg)



Page 1

Side 1 Side 2

Page 2



1 - Samsung#K3PE7E700D-XGC2Multichip Memory - 1 GB Mobile DDR2 SDRAM(2-Die Pkg)

1 - Samsung#4G-B-MPMobile DDR2 SDRAM Memory - 512 MBDie Size: 9.5 x 8.3 mm


Side 1 IC Identification Side 1 X-Ray Photos Side 1 Die PhotosSide 1 Side 2 Side 2 IC Identification Main Board Cross-Section


3.1 - Samsung#GAS3Memory ControllerDie Size: 4.4 x 1.3 mm

3 - SanDisk#THGBM4G6D2HBAIRMultichip Memory - 8 GB MLC NAND Flash, Controller (3-Die Pkg)

3.2 - Samsung#EEU2 32GMLC NAND Flash Memory - 4 GBDie Size: 10.4 x 8.2 mm



Photo 4 Photo 6Photo 2Photo 1

Side 1 Side 2

Photo 5 Photo 7Photo 3



14 - RF Micro Devices#RF7317LTE Band XVII Power AmplifierPkg Size: 3 x 3 mm

14.1 - RF Micro Devices#M1D7313271RF Power AmplifierDie Size: 0.7 x 0.55 mm




Side 1 Side 2




19.2 - Avago#UEXXRF Power AmplifierDie Size: 1.8 x 1.0 mm

19.1 - Avago#GEH1RF Power AmplifierDie Size: 1.7 x 1.0 mm

19 - Avago#ACPM-7051Quad-Band GSM / W-CDMA Bands I & V Power Amplifier (3-Die Pkg)Pkg Size: 7.5 x 5.0 mm

19.3 - Avago#L20BBias ControlDie Size: 0.8 x 0.5 mm




Side 1 Side 2




20 - Avago#ACPM-5002W-CDMA Band II Power Amplifier (2-Die Pkg)Pkg Size: 3 x 3 mm

20.2 - Avago#HJ5Bias ControlDie Size: 0.6 x 0.4 mm

20.1 - Avago#2YHNRF Power AmplifierDie Size: 1.0 x 1.0 mm




Side 1 Side 2




21 - Avago#ACPM-5004LTE / W-CDMA Band IV Power Amplifier (2-Die Pkg)Pkg Size: 3 x 3 mm

21.2 - Avago#HJ5Bias ControlDie Size: 0.6 x 0.42 mm

21.1 - Avago#HRAERF Power AmplifierDie Size: 1.09 x 1.06 mm




Side 1 Side 2




22 - Avago#ACPM-5008W-CDMA Band VIII Power Amplifier (2-Die Pkg)Pkg Size: 3 x 3 mm

22.2 - Avago#LJ5Bias ControlDie Size: 0.6 x 0.4 mm

22.1 - Avago#FLC61RF Power AmplifierDie Size: 1.0 x 1.0 mm




Side 1 Side 2




23 - Sony#CXM3582URSP10T Antenna Switch (2-Die Pkg)Pkg Size: 3.37 x 2.6 mm

23.2 - Sony#A2942CMOS DecoderDie Size: 1.7 x 0.55 mm

23.1 - Sony#G1342SP10T GaAs SwitchDie Size: 1.7 x 0.9 mm Dual Low Pass Filter

23.123.2

Dual LowPass Filter




Side 1 Side 2




Grid = 1 cm

8 MP Camera




28 - AMS#TSL277xxAmbient Light & Proximity SensorGrid = 1 cm




Grid = 1 cm

1.3 MP Camera

Earpiece

Main Board

MEMS Microphone


Interconnect Flex Camera Flash Board

Other Flex & Board


Grid = 1 cm

Contacts to Main Board

Camera Flash


Interconnect Flex Camera Flash Board

Other Flex & Board


AssemblyName Manufacturer Core Material Mfg. Technology Layers Area

(cm²)

Min.TracePitch(mm)

Min.TraceWidth(mm)

ThruViaLand Dia

(mm)

ThruViaHole Dia

(mm)

BlindViaLand Dia

(mm)

BlindViaHole Dia

(mm)

Thickness(mm)

RoutingDensity

EstimatedCosts

Main Board Unimicron Technologies FR4 8 Layer buildup FR4 / HF 8 81.1 0.20 0.10 0.30 0.15 0.7 46.4 5.60$ Interconnect Flex Unknown Polyimide 2 Layer flex w/vias 2 4.5 0.20 0.10 0.40 0.20 0.1 32.9 0.77$ Camera Flash Board Unimicron Technologies FR4 4 Layer conventional FR4 / HF 4 1.7 0.20 0.10 0.20 0.10 0.4 4.6 0.03$

Substrates


Integrated CircuitsSubstrates Subsystem ICs Modules Active Discretes Passive Discretes Connectors

Component Statistics


Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.

Pkg Ref. # PkgQty Brand Name Part Number Pkg Description Form Pin Count Length

(mm)Width(mm)

Height(mm) Die Ref # Die Qty Brand Name Part Number Description Length

(mm)Width(mm) Each Total

1 1 Samsung K3PE7E700D-XGC2 Multichip Memory - 1 GB Mobile DDR2 SDRAM BGA-POP-2 220 14.00 14.00 0.48 1.1 2 Samsung 4G-B-MP Mobile DDR2 SDRAM Memory - 512 MB 9.57 8.32 $ 2.030 $ 4.060 2 1 Qualcomm MSM8960 Snapdragon S4 Baseband / Applications Processor BGA-POP 759 14.00 14.00 0.74 2.1 1 Qualcomm HG11-VR150-32011 Snapdragon S4 Baseband / Applications Processor 9.88 9.86 $ 22.680 $ 22.680

3.1 1 Toshiba GAS3 Memory Controller 4.40 1.30 $ 0.630 $ 0.630 3.2 2 SanDisk EEU2 32G MLC NAND Flash Memory - 4 GB 10.40 8.25 $ 1.840 $ 3.680

4 1 Qualcomm PM8921 Power Management BGA 254 7.70 7.70 1.00 4.1 1 Qualcomm HG11-N1039-300 Power Management 6.55 6.34 $ 3.610 $ 3.610 5 1 Qualcomm RTR8600 GSM / CDMA / W-CDMA / LTE RxD Transceiver + GPS BGA 196 7.78 6.20 1.03 5.1 1 Qualcomm HG11-VF535-220 GSM / CDMA / W-CDMA / LTE RxD Transceiver + GPS 6.61 4.01 $ 4.000 $ 4.000 6 1 Cypress Semiconductor CP7464AT 8-Bit Microcontroller QFN 48 5.94 5.94 0.45 6.1 1 Cypress Semiconductor CP7464AT 8-Bit Microcontroller 3.20 3.20 $ 0.870 $ 0.870 7 1 Qualcomm WCN3660 WiFi / Bluetooth / FM Radio Flip Chip, Solder 79 3.83 3.83 0.80 7.1 1 Qualcomm HG11-VU832-200 WiFi / Bluetooth / FM Radio 3.83 3.83 $ 3.080 $ 3.080 8 1 Silego SLG46400 Programmable Mixed-Signal Array DFN 12 2.51 2.46 0.81 8.1 1 Silego SLG46400 Programmable Mixed-Signal Array 1.93 1.23 $ 0.190 $ 0.190

10 1 Infineon BGA915N7 GPS LNA DFN 6 1.37 1.37 0.70 10.1 1 Infineon BGA915N7 GPS LNA 1.02 0.52 $ 0.090 $ 0.090 11 1 TI TMP105 Digital Temperature Sensor Flip Chip, Solder 6 1.57 1.07 0.70 11.1 1 TI TMP105 Digital Temperature Sensor 1.57 1.07 $ 0.130 $ 0.130 12 1 Silego SLG46400 Programmable Mixed-Signal Array DFN 12 2.46 2.46 0.80 12.1 1 Silego SLG46400 Programmable Mixed-Signal Array 1.93 1.24 $ 0.190 $ 0.190 13 1 Fairchild Semiconductor FSA806 USB 2.0 High-Speed Switch DFN 12 1.80 1.80 0.80 13.1 1 Fairchild Semiconductor FSA806 USB 2.0 High-Speed Switch 1.20 0.91 $ 0.120 $ 0.120 14 1 RF Micro Devices RF7317 LTE Band XVII Power Amplifier BGA 10 3.00 3.00 0.80 14.1 1 RF Micro Devices M1D7313271 RF Power Amplifier 0.70 0.55 $ 0.200 $ 0.200 15 1 Qualcomm WCD9310 Hardware CODEC Flip Chip, Solder 71 3.77 3.21 0.80 15.1 1 Qualcomm HG11-VP942-200 Hardware CODEC 3.77 3.21 $ 0.850 $ 0.850

16.1 1 STMicroelectronics V656A Accelerometer Processor 1.67 1.17 $ 0.150 $ 0.150 16.2 1 STMicroelectronics CSL23A MEMS Sensor 1.87 1.87 $ 0.960 $ 0.960

17 1 TI TPA2025D1 2 W Class D Audio Amplifier Flip Chip, Solder 12 2.00 1.55 0.70 17.1 1 TI TPA2025D1 2 W Class D Audio Amplifier 2.00 1.55 $ 0.220 $ 0.220 18 1 TI BQ24314A Li-ion Charger and Protection DFN 8 2.00 2.00 1.00 18.1 1 TI BQ24314A Li-ion Charger and Protection 1.57 0.84 $ 0.110 $ 0.110

19.1 1 Avago GEH1 RF Power Amplifier 1.70 1.00 $ 0.540 $ 0.540 19.2 1 Avago UEXX RF Power Amplifier 1.80 1.00 $ 0.570 $ 0.570 19.3 1 Avago L20B Bias Control 0.80 0.55 $ 0.080 $ 0.080 20.1 1 Avago 2YHN RF Power Amplifier 1.07 1.03 $ 0.330 $ 0.330 20.2 1 Avago HJ5 Bias Control 0.60 0.43 $ 0.040 $ 0.040 21.1 1 Avago HRAE RF Power Amplifier 1.09 1.06 $ 0.340 $ 0.340 21.2 1 Avago HJ5 Bias Control 0.60 0.42 $ 0.040 $ 0.040 22.1 1 Avago FLC61 RF Power Amplifier 1.07 1.04 $ 0.320 $ 0.320 22.2 1 Avago LJ5 Bias Control 0.59 0.42 $ 0.040 $ 0.040 23.1 1 Sony G1342 SP10T GaAs Switch 1.70 0.90 $ 0.590 $ 0.590 23.2 1 Sony A2942 CMOS Decoder 1.70 0.55 $ 0.200 $ 0.200

24 2 Murata XM0860SR-DL0801 SPDT (DP4T) Switch MLP 8 1.50 1.50 0.70 24.1 1 Murata XM0860SR-DL0801 SPDT (DP4T) Switch 0.43 0.39 $ 0.070 $ 0.140 25 1 Sony CXG1235XR SP5T Antenna Switch QFN 16 2.20 2.20 0.70 25.1 1 Sony CXG1235XR SP5T Antenna Switch 1.12 1.07 $ 0.350 $ 0.350 26 1 AKM Semiconductor AK8975 3-Axis Electronic Compass Flip Chip, Solder 14 1.96 1.96 0.80 26.1 1 AKM Semiconductor AK8975 3-Axis Electronic Compass 1.96 1.96 $ 0.460 $ 0.460

Main Board, Side 2 28 1 AMS TSL277xx Ambient Light & Proximity Sensor DFN 6 2.00 2.00 0.80 28.1 1 AMS TSL277xx Ambient Light & Proximity Sensor 1.50 1.00 $ 0.120 $ 0.120 27 2021 37 $49.98

(UF) = Underfilled

Totals

Location

Estimated CostsDie InfoPackage Info

3 1 SanDisk THGBM4G6D2HBAIR Multichip Memory - 8 GB MLC NAND Flash, Controller BGA Stacked 2+1 168 13.00 11.48 0.98

16 1 STMicroelectronics LIS3DH 3-Axis MEMS Accelerometer MCP - 2 Chips 16 3.00 3.00 1.10

19 1 Avago ACPM-7051 Quad-Band GSM / W-CDMA Bands I & V Power Amplifier MCP - 3 Chips 24 7.50

20 1 Avago ACPM-5002 W-CDMA Band II Power Amplifier MCP - 2 Chips 3.00 3.00 0.85

5.00 1.00

21 1 Avago ACPM-5004

W-CDMA Band VIII Power Amplifier MCP - 2 Chips

LTE / W-CDMA Band IV Power Amplifier MCP - 2 Chips 10 3.00

10

22 1 Avago ACPM-5008 0.85

3.00 0.85

3.37

10 3.00 3.00

SP10T Antenna Switch MCP - 2 Chips 26 2.60 0.62

Main Board, Side 1

23 1 Sony CXM3582UR





Note: The ICs listed below are for reference only.Their costs are integrated into the cost of the individual subsystems.

Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.

Pkg Ref. # PkgQty Brand Name Part Number Pkg Description Form Pin Count Length

(mm)Width(mm)

Height(mm) Die Ref # Die Qty Brand Name Part Number Description Length

(mm)Width(mm) Each Total

29 1 OmniVision OV8820 8 MP BSI CMOS Image Sensor COB 55 6.80 6.30 0.30 29.1 1 OmniVision OV8820 8 MP BSI CMOS Image Sensor 6.80 6.30 $ 4.150 $ 4.150 30 1 Dongwoon Anatech DW9714 Autofocus VCM Driver Flip Chip, Solder 6 1.20 0.80 0.70 30.1 1 Dongwoon Anatech DW9714 Autofocus VCM Driver 1.20 0.80 $ 0.090 $ 0.090

Display Module: 31 1 Orise Tech A193 TFT-LCD Display Driver Flip Chip, Adhesive 1350 27.50 1.90 0.20 31.1 1 Orise Tech A193 TFT-LCD Display Driver 27.50 1.90 $ 2.710 $ 2.710 3 1411 3 $6.95Totals

Package Info

Camera Module: Camera Board

Die Info

Location

Estimated Costs





Pin Count

Length(mm)

Width(mm) Each Total

4 Unknown Unknown Shielding: Small 1 12.00 7.00 $ 0.020 $ 0.080 1 Sawtek Unknown Crystal: Ceramic 4 2.54 2.00 $ 0.200 $ 0.200 1 Unknown 1059385 Touchscreen: Capacitive, Plastic 34 126.00 66.50 $ 8.190 $ 8.190 1 Wolfson Micro WM7130A Microphone: MEMS - Bottom Port 6 3.73 2.97 $ 0.270 $ 0.270 1 Wolfson Micro WM7120A Microphone: MEMS - Top Port 4 3.77 2.92 $ 0.270 $ 0.270 1 Unknown Unknown Antenna: Film - LTE Band XVII 2 27.20 26.30 $ 0.150 $ 0.150 1 Unknown Unknown Antenna: Film - W-CDMA/LTE RxD 2 56.20 3.30 $ 0.150 $ 0.150 1 Unknown Unknown Antenna: Film - Main 1 56.00 6.30 $ 0.150 $ 0.150 1 Unknown Unknown Antenna: Film - W-CDMA RxD 2 46.50 3.30 $ 0.150 $ 0.150 1 Unknown Unknown Vibrator: Dual-Shaft Vibrator 2 15.50 4.40 $ 0.450 $ 0.450 1 AAC Acoustic Ltd AAC120601U18B Speaker: Speaker 2 16.60 10.00 $ 0.360 $ 0.360 1 Murata Unknown Filter: SAW - LTE Band XVII Tx 5 1.35 1.00 $ 0.070 $ 0.070 1 Unknown Unknown Shielding: Large 1 20.00 10.00 $ 0.030 $ 0.030 1 Unknown Unknown Shielding: Large 1 16.00 17.00 $ 0.030 $ 0.030 1 Unknown Unknown Shielding: Large 1 20.00 18.00 $ 0.040 $ 0.040 1 Unknown Unknown Shielding: Large 1 28.70 16.50 $ 0.040 $ 0.040 1 Unknown Unknown Shielding: Large 1 25.00 20.00 $ 0.040 $ 0.040 1 Unknown Unknown Shielding: Large 1 30.00 23.40 $ 0.040 $ 0.040 1 Unknown Unknown Shielding: Large 1 24.00 17.80 $ 0.040 $ 0.040 1 Unknown Unknown Shielding: Large 1 24.40 17.00 $ 0.040 $ 0.040 3 Unknown Unknown Switch: SMT 4 5.30 3.60 $ 0.070 $ 0.210 1 Unknown Unknow Antenna: Film - GPS/WiFi/Bluetooth 2 30.00 9.40 $ 0.150 $ 0.150 1 TDK-EPC B9459 Filter: SAW - WCDMA Band II Tx 5 1.35 1.00 $ 0.070 $ 0.070 1 Taiyo Yuden FAR-D5NE-740M00-P1C9 Filter: SAW - Duplexer - LTE Band XVII 9 2.46 2.00 $ 0.290 $ 0.290 1 Avago ACMD-4102 Filter: FBAR - Duplexer - W-CDMA Band II 12 2.50 2.00 $ 0.400 $ 0.400 1 Murata SAYRF1G95CA0B0A Filter: SAW - Duplexer - W-CDMA Band I 9 1.96 1.60 $ 0.290 $ 0.290 1 Taiyo Yuden FAR-D5NE-881M50-P1A6Q Filter: SAW - Duplexer - W-CDMA Band V 9 2.50 1.90 $ 0.290 $ 0.290 1 Taiyo Yuden FAR-D5NF-942M50-P1GWQ Filter: SAW - Duplexer - W-CDMA Band VIII 9 2.50 1.90 $ 0.290 $ 0.290 1 TDK-EPC B7959 Filter: SAW - Duplexer - W-CDMA/LTE Band IV 9 2.20 2.00 $ 0.290 $ 0.290 1 Unknown Unknown Crystal: Ceramic 4 2.50 2.00 $ 0.200 $ 0.200 1 Murata SAFEB836MAL0F00 Filter: SAW - W-CDMA Band V Tx 5 1.35 1.00 $ 0.070 $ 0.070 1 Unknown Unknown Crystal: Ceramic 4 2.00 1.60 $ 0.200 $ 0.200 1 Murata SAFEA1G96FR0F00 Filter: SAW - W-CDMA Band II Rx 5 1.35 1.00 $ 0.070 $ 0.070 1 Murata SAFEA2G14FF0F00 Filter: SAW - LTE/W-CDMA Band I/IV Rx 5 1.35 1.00 $ 0.070 $ 0.070 1 Murata SAFEA942MFR0F00 Filter: SAW - W-CDMA Band VIII Rx 5 1.35 1.00 $ 0.070 $ 0.070 1 Murata SAFEB881MFM0F00 Filter: SAW - W-CDMA Band V Rx 5 1.35 1.00 $ 0.070 $ 0.070 1 Murata SAFEA740MCL0F00 Filter: SAW - LTE Band XVII Rx 5 1.35 1.00 $ 0.070 $ 0.070 1 Murata SAFEA1G73AA0F00 Filter: SAW - LTE/W-CDMA Band IV Tx 5 1.35 1.00 $ 0.070 $ 0.070 1 Murata SAFEA1G58FB0F00 Filter: SAW - GPS/GLONASS 5 1.35 1.00 $ 0.070 $ 0.070 1 Murata SAFEA1G58KA0F00 Filter: SAW - GPS/GLONASS 5 1.35 1.00 $ 0.070 $ 0.070 1 STMicroelectronics DCPL-WB-02D3 RF Coupler: Dual RF Coupler 7 1.70 1.40 $ 0.080 $ 0.080 1 Murata SAWEN1G84BH0F00 Filter: Dual SAW - GSM 1800/1900 Rx 10 1.80 1.35 $ 0.110 $ 0.110

1 AAC Acoustic Ltd AAC120612Z2 Speaker: Earpiece 2 15.50 5.00 $ 0.330 $ 0.330 1 Unknown Unknown Camera: 1.3MP 22 6.90 6.90 $ 2.500 $ 2.500 1 Wolfson Micro WM7120A Microphone: MEMS - Top Port 4 3.76 2.98 $ 0.270 $ 0.270

TOTALS 50 250 $17.39

Interconnect Flex, Side 1

Qty Brand Name Part NumberPackage

Estimated Costs

Description

Main Board, Side 1

Location





Form Top Marking Pin Count Length(mm)


1 Small Active IC, Simple QK 6 1.40 1.40 $0.090 $0.0901 Small Active MOSFET 507A 6 1.95 1.95 $0.090 $0.0901 Small Active IC, Simple CBG 23 8 1.95 1.95 $0.090 $0.0901 Small Active IC, Simple JK120 12 2.50 1.30 $0.090 $0.09012 Small Active Diode, SMT 2 0.60 0.30 $0.015 $0.1793 Small Active Diode, SMT 2 0.80 0.50 $0.015 $0.0454 Small Active Transistor, Small BX 3 1.00 0.65 $0.030 $0.1201 Small Active Transistor, Small A4K 3 2.00 1.10 $0.030 $0.0302 Small Active MOSFET 8401 2GB 4 1.50 1.50 $0.090 $0.1801 Small Active Transistor, Small L2J 3 1.10 0.60 $0.030 $0.0301 Small Active IC, Simple 221 RAV AVHL 6 1.20 1.20 $0.090 $0.0902 Small Active IC, Simple S6AH CCP 6 1.51 0.96 $0.090 $0.1801 Small Active MOSFET 114 6 1.40 1.00 $0.090 $0.0901 Small Active IC, Simple P92 8 1.60 1.30 $0.090 $0.0903 Small Active Transistor, Small Pga 6 1.57 1.13 $0.030 $0.0902 Small Active IC, Simple 242UDN 5 1.30 0.85 $0.090 $0.1801 Small Active IC, Simple FH <> SN 9 1.45 1.35 $0.090 $0.0901 Small Active IC, Simple 4791 0124 219 12 2.50 2.00 $0.090 $0.0901 Small Active IC, Simple 22AF D33 16 1.80 1.80 $0.090 $0.090

11 Small Active Diode, SMT 2 0.60 0.30 $0.015 $0.1641 Small Active Diode, SMT 2 1.00 0.60 $0.015 $0.0151 Small Active LED, IR Emitter 2 3.00 1.60 $0.080 $0.0801 Small Active LED, Multi-Color 6 1.40 0.90 $0.090 $0.0902 Small Active IC, Simple GU 6 1.50 1.50 $0.090 $0.180

Camera Flash Board, Side 1 1 Small Active LED, Flash 2 2.00 1.63 $0.250 $0.250TOTALS 57 231 $2.71

Main Board, Side 2

Location Functional DescriptionQty

Package Estimated Costs

Main Board, Side 1





Form Pin Count Each Total

1 Capacitor Tantalum / Niobium, Small 2 $0.050 $0.0501 Filter Ceramic, Small 6 $0.065 $0.065

666 Small Passive Cap, Res, Ferrite 2 $0.004 $2.66493 Small Passive Coil, Inductor 2 $0.008 $0.7447 Small Passive Cap, Res, Ferrite Array 4 $0.007 $0.0522 Capacitor Tantalum / Niobium, Small 2 $0.050 $0.1001 Capacitor Tantalum / Niobium, Small 2 $0.050 $0.0502 Filter Ceramic, Small 4 $0.065 $0.1301 Coil SMT, Small 2 $0.050 $0.0501 Coil SMT, Small 2 $0.050 $0.0501 Capacitor Tantalum / Niobium, Small 2 $0.050 $0.050

42 Small Passive Cap, Res, Ferrite 2 $0.004 $0.1686 Small Passive Cap, Res, Ferrite Array 4 $0.007 $0.0442 Small Passive Cap, Res, Ferrite Array 10 $0.007 $0.0157 Small Passive Coil, Inductor 2 $0.008 $0.056

5 Small Passive Coil, Inductor 2 $0.008 $0.0402 Small Passive Cap, Res, Ferrite 2 $0.004 $0.008

TOTALS 840 1730 $4.34

Qty Functional DescriptionPackage

Main Board, Side 1

Main Board, Side 2


Location

Estimated Costs





Pin Count

Length(mm)


1 Bd to Bd: Main Board 24 5.90 1.45 $0.140 $0.1401 Connector: ZIF - 1.3 MP Camera 21 6.86 2.60 $0.197 $0.1971 Connector: Spring - Formed 1 4.50 1.70 $0.030 $0.0302 Connector: Spring - Formed 1 4.66 1.30 $0.030 $0.060

1 Bd to Bd: Unused 16 6.60 2.30 $0.100 $0.10013 Connector: Spring - Formed 1 4.30 2.10 $0.030 $0.3897 Connector: External Test Antenna 6 2.40 2.30 $0.070 $0.4901 Socket: Micro SD Memory 8 13.20 13.30 $0.250 $0.2501 Socket: SIM 8 16.70 15.40 $0.230 $0.2301 Connector: Micro/Mini HDMI 14 7.53 6.50 $0.130 $0.1301 Connector: Micro/Mini USB 9 7.50 5.00 $0.100 $0.1002 Bd to Bd: Display / Touchscreen 34 9.00 3.30 $0.190 $0.3801 Bd to Bd: Interconnect Flex 24 6.90 2.30 $0.140 $0.14014 Connector: Spring - Formed 1 2.80 1.20 $0.030 $0.4194 Connector: Standoff 1 4.00 4.00 $0.020 $0.0805 Contact: Pad - 3.5mm Jack 1 2.55 2.00 $0.020 $0.1001 Jack: Headphone 5 13.00 7.60 $0.150 $0.1501 Connector: Pogo Pin 2 4.90 2.40 $0.040 $0.040

2 Connector: Standoff 1 2.70 2.70 $0.020 $0.0401 Bd to Bd: 8 MP Camera 34 9.10 2.30 $0.190 $0.1904 Connector: Spring - Formed 1 4.50 1.00 $0.030 $0.120

TOTALS 65 320 $3.77

Main Board, Side 2

Location

Estimated Costs

Qty FormPackage


Main Board, Side 1





NOTE: Occasional inconsistencies in totals may be present due to rounding error.

General Area Assembly Name

Subs

trat

e A

rea

(sq.

cm)

Met

al L

ayer

s

Circ

uit A

rea

(sq.

cm)

Rou

ting

Den

sity

(cm

of r

outin

g pe

r sq.

cm o

f su

bstr

ate)

Num

ber o

fC

ompo

nent

s

Num

ber o

fC

onne

ctio

ns

Com

pone

nt D

ensi

ty(C

ompo

nent

s/sq

.cm

)

Con

nect

ion

Den

sity

(Con

nect

ions

/sq.

cm)

Avg

. Pin

Cou

nt

Ass

embl

y W

eigh

t(g

ram

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Main Electronics Camera Flash Board 1.7 4 6.8 4.6 1 2 0.6 1.2 2.0 0.20Main Electronics Interconnect Flex 4.5 2 9.0 32.9 15 90 3.3 20.0 6.0 1.00Main Electronics Main Board 81.1 8 648.8 46.4 1023 4460 12.6 55.0 4.4 31.20Main Electronics Totals 87.3 14 664.6 1039 4552 11.9 52.1 4.4 32.40Subsystem Electronics Battery Pack: Battery Board 2.2 4 8.8 19.6 18 41 8.2 18.6 2.3 0.40Subsystem Electronics Camera Module: Camera Board 0.9 4 3.7 99.8 13 115 14.1 125.0 8.9 0.20Subsystem Electronics Display Module: Display Flex 11.5 2 23.0 16.0 44 120 3.8 10.4 2.7 0.40Subsystem Electronics Totals 14.6 10 35.5 75 276 5.1 18.9 3.7 1.00

System Totals 101.9 24 700.08 1114 4828 10.9 47.4 4.3 33.40

Electronic Assembly Metrics by Assembly


Electronic Costs BreakdownElectronic Assembly Metrics Vendor IC Cost Distribution Non-Electronic Cost Estimate Cost SummaryFinal Ass’y Labor & Test Cost

Page 2Page 1 Page 3 Page 4

Cost




Tota

l

Inte

grat

ed C

ircui

ts

Mod

ular

& O

dd F

orm

C

ompo

nent

s

Smal

l Act

ive

Com

pone

nts

Pass

ive

Com

pone

nts

Con

nect

or C

ompo

nent

s

Subs

trat

es

Inse

rtio

n

Car

d Te

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Main Electronics Camera Flash Board 0.29$ -$ -$ 0.25$ -$ -$ 0.03$ 0.00$ 0.01$ Main Electronics Interconnect Flex 4.52$ -$ 3.10$ -$ 0.05$ 0.43$ 0.77$ 0.16$ 0.02$ Main Electronics Main Board 86.18$ 49.98$ 14.29$ 2.46$ 4.29$ 3.35$ 5.60$ 5.92$ 0.30$ Main Electronics Totals 91.00$ 49.98$ 17.39$ 2.71$ 4.34$ 3.77$ 6.40$ 6.08$ 0.33$ Subsystem Electronics Battery Pack 0.79$ -$ -$ 0.21$ 0.04$ 0.09$ 0.26$ 0.14$ 0.05$ Subsystem Electronics Camera Module 5.76$ 4.24$ 0.65$ -$ 0.04$ 0.53$ 0.04$ 0.11$ 0.15$ Subsystem Electronics Display Module 6.02$ 2.71$ -$ 0.52$ 0.13$ 0.19$ 1.96$ 0.27$ 0.25$ Subsystem Electronics Totals 12.56$ 6.95$ 0.65$ 0.73$ 0.21$ 0.81$ 2.26$ 0.51$ 0.45$

System Totals 103.57$ 56.93$ 18.04$ 3.44$ 4.54$ 4.58$ 8.66$ 6.59$ 0.78$

Electronics Costs by Assembly




Cost




IC P

acka

ge C

ount

IC C

onne

ctio

ns

Mod

ular

/Odd

For

m

Com

pone

nts

Mod

ular

/Odd

For

m

Com

pone

nt C

onne

ctio

ns

Smal

l Act

ive

Com

pone

nts

Smal

l Act

ive

Com

pone

nt

Con

nect

ions

Pass

ive

Com

pone

nts

Pass

ive

Com

pone

nt

Con

nect

ions

Con

nect

ors

Con

nect

or C

onne

ctio

ns

Subs

yste

m IO

s

Opp

ortu

nitie

s

Main Electronics Camera Flash Board 0 0 0 0 1 2 0 0 0 0 0 3Main Electronics Interconnect Flex 0 0 3 28 0 0 7 14 5 48 0 105Main Electronics Main Board 27 2021 47 222 56 229 833 1716 60 272 0 5483Main Electronics Totals 27 2021 50 250 57 231 840 1730 65 320 0 5591Subsystem Electronics Battery Pack 0 0 0 0 3 15 11 22 4 4 4 63Subsystem Electronics Camera Module 2 61 1 2 0 0 9 18 1 34 34 162Subsystem Electronics Display Module 1 1350 0 0 11 22 32 64 1 34 34 1549Subsystem Electronics Totals 3 1411 1 2 14 37 52 104 6 72 72 1774

System Totals 30 3432 51 252 71 268 892 1834 71 392 72 7365

Counts by Assembly




Cost




IC D

ie C

ount

IC P

acka

ge C

ount

Num

ber o

f Pac

kage

Con

nect

ions

Die

Are

a(s

q.m

m)

Subs

trat

e Ti

ling

Den

sity

(die

are

a / s

ubst

rate

are

a)

Pack

age

Are

a(s

q.m

m)

Die

Are

a/Pa

ckag

e A

rea

Rat

io

Pack

age

Con

nect

ions

per s

q.cm

of P

acka

ge A

rea

Vola

tile

Mem

ory

(KB

ytes

)

Non

-Vol

atile

Mem

ory

(KB

ytes

)

Main Electronics Main Board 37 27 2021 574.8 0.07 845.4 0.68 239.1 1048576 8388608Main Electronics Totals 37 27 2021 574.8 845.4 0.68 239.1 1048576 8388608Subsystems Camera Module 2 2 61 43.8 43.8 1.00 1.4 0 0Subsystems Display Module 1 1 1350 52.3 52.3 1.00 25.8 0 0Subsystem Electronics Totals 3 3 1411 96.1 96.1 1.00 1469.0 0 0

System Totals 40 30 3432 670.8 941.4 0.71 364.5 1048576 8388608

IC Metrics




Cost



Estimated Cost of Electronics

(Includes Subsystem Electronics)

$103.57

Estimated Cost of Electronics

(Includes Subsystem Electronics)

$103.57 Card Test1%

Insertion6%

Small Active Components3%

Modular & Odd Components18%

Substrates8%

Passive Components4%

Connector Components4%

Integrated Circuits56%



Cost



* Includes Subsystem Vendors & Associated Costs

OmniVision7.3%

Avago4.0%

Samsung7.1%

Other9.1%

Qualcomm60.1%

SanDisk7.6%

Orise Tech4.8%

Brand CostQualcomm $34.22SanDisk $4.31OmniVision $4.15Samsung $4.06Orise Tech $2.71Avago $2.30

Sony $1.14STMicroelectronics $1.11Cypress Semiconductor $0.87TI $0.46AKM Semiconductor $0.46Silego $0.38RF Micro Devices $0.20Murata $0.14Fairchild Semiconductor $0.12AMS $0.12Infineon $0.09Dongwoon Anatech $0.09Total $56.93

Other



Cost


SubsystemPart ID

No.Qty Description Fabrication Process Material Dimensions (mm)

Weight (grams)

Est'd Cost Each

Est'dExtended Cost

1 1 Rear Enclosure Molded + Pulls Plastic 133.2 x 69.8 x 8.8 7.50 0.540 0.5402 1 Rear Cover Molded + Die Cut Carbon Fiber 109.4 x 61.5 x 0.32 2.70 0.280 0.2803 1 Battery Cover Molded + Painted Plastic 133 x 70 x 7.1 3.50 0.260 0.2604 1 Front Enclosure Molded + Painted Plastic 132.4 x 69.2 x 7.8 4.30 0.320 0.3205 1 Display Window Molded + Transfer Print + Painted Gorilla Glass 126.3 x 66.5 x 0.68 13.70 3.850 3.8506 1 Frame Cast + Painted + Plated Aluminum + Plating 100.9 x 66.5 x 3.2 6.80 0.430 0.430

7 11 Grommets Molded Silicon Rubber x 1.10 0.020 0.2208 26 Screw Molded Metal x 1.30 0.015 0.3909 2 Bezel Molded + Painted Plastic 48.3 x 2 x 0.8 0.10 0.030 0.06010 1 Camera Bezel Molded + Transfer Print + Painted Plastic 50 x 10 x 0.5 0.20 0.120 0.12011 1 Product Badge Co-Molded + Painted Plastic 15.5 x 15.5 x 0.5 0.10 0.060 0.06012 1 Flash Diffuser Molded + Painted Plastic 10 x 7 x 2.2 0.05 0.090 0.09013 1 Camera Window Molded + Painted Plastic + Adhesive 8.8 x 8.8 x 0.5 0.05 0.070 0.07014 1 Speaker Screen Die-Cut Metal 7.4 x 4 x 0.2 0.05 0.010 0.01015 1 Port Cover Molded + Painted Plastic 28.8 x 4.7 x 2 0.20 0.060 0.06016 1 Bracket Molded Plastic 27.8 x 17 x 4.6 0.60 0.080 0.08017 2 Side Keys Molded + Painted Plastic x 0.10 0.060 0.12018 1 Adhesive Die-Cut Plastic + Adhesive 73 x 46 x 0.08 0.10 0.005 0.00519 8 Gasket Die-Cut Foam + Adhesive x 0.40 0.005 0.04020 1 Moisture Sensor Die-Cut Paper + Adhesive 4 x 1.6 x 0.1 0.05 0.010 0.01021 1 Grommet Molded Silicon Rubber 54 x 6.3 x 0.7 0.20 0.010 0.01022 5 Label Die-Cut + Printed Plastic + Adhesive x 0.25 0.020 0.10023 2 Ground Tape Die Cut Conductive Mesh + Adhesive x 0.10 0.010 0.02024 5 Audio Screen Die-Cut Plastic + Adhesive x 0.25 0.005 0.02525 1 Tape Die-Cut Plastic + Adhesive 28.6 x 13.3 x 0.15 0.10 0.010 0.01026 1 Camera Window Ring Stamped Metal + Adhesive 8.9 x 8.9 x 0.26 0.01 0.030 0.03027 1 Display Gasket Die-Cut Plastic + Adhesive 103 x 59.5 x 0.2 2.00 0.040 0.040

80 $7.25Estimated CostTotal

Enclosures

Miscellaneous



Cost


0.92$ 1.30$ Est'd final test cost

China983331200

Made in

Est'd final assembly cost

Number of partsEst'd number of stepsEst'd time (seconds)

Final Assembly & Test



Cost


Camera 7%

Non-Electronic Parts 6%

Main Electronic Assemblies69%

Final Assembly & Test2%

Battery Pack2%

Display14%

Main Electronic Assemblies 91.00$ Battery Pack 3.14$ Display 18.62$ Camera 8.88$ Non-Electronic Parts 7.25$ Final Assembly & Test 2.22$

Total 131.11$

Estimated Cost Totals Note: An additional $2.00 estimated for accessories and supporting materials

Cost Total Notes:Estimated final assembly cost includes labor only.

Total cost does not include Non-recurring, R&D, G&A, IP licensing fees/royalties, software, sales & marketing, distribution.

Assumes fully scaled production.



Cost


Cost Estimation Process (Overview & Discussion)

Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the output of the model across product families and over time.

TechInsights’ philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insider’s knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the “right” answer for your firm’s environment. However, TechInsights does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge.

Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources.

Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their estimated cost. Other system items such as optics, antennae, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost.

The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate.

We believe our cost estimates generally fall within 15 percent of the “right answer,” which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce.

Please feel free to contact us at [email protected] with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input.


Cost Estimation Process Metrics

Overview


In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system semiconductor storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count, and silicon tiling density. Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products are described below along with their definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking purposes or for quantifying differences in levels of complexity between dissimilar product types. Data fall into two categories; either “raw” measured data or ratios of these measured data sets.

Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the major cost driver for most systems we examine.Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board “projected” area (i.e. the simple board area and not the cumulative surface area of both sides of the board). This metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% - 20% has been seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-factor IC packaging technologies. High density circuit boards are also often a supporting technology.Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting.Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical connection observed (solder joints, adhesive interconnect, or connector terminal interfaces).Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an opportunity for failure. A high opportunity count means more complex and riskier electronics assembly. Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the ‘average’ terminal complexity of the components and often provide a signature of integration level and/or “digital-ness” of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often characteristic of analog circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits.Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data related to the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount memory chips is more readily achieved than comparable silicon tiling of high pincount logic.Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the Silicon Tiling Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density of high-pincount devices can pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount assembly in terms of (typically) precision of placement, number of placements, and engineering of part clearances.Routing Density (heuristic estimate) = 3*(Average Pin Count)*√Part Density. The Routing Density metric is a empirically derived relationship that characterizes the wiring density of the interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the regularity of wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity.

Metrics (Overview & Discussion)


Cost Estimation Process Metrics

Overview

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