nanoscale plasmonic lithography on silicon
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Soft Lithography
Soft lithography is a technique for fabricating or replicating structures usingelastomeric stamps (most notably PDMS), molds, and conformable photomasks.
Elastomer is a polymer with viscoelasticity and very weak intermolecular forces,
generally having low Youngs modulus and high failure strain.
The advantages of soft lithography are:
Lower cost in mass production;
Well-suited for applications in biotechnology and plastic electronics;
Well-suited for applications involving large or non-planar surfaces;
More pattern transferring methods (more ink options);
Does not need a photo reactive surface to create nanostructures;
Smaller details than photolithography in laboratory settings. The resolution
depends on the mask used.
Soft Lithography Process
1. Inking a stamp.
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2. ODT has attached to the stamp.
3.
The PDMS stamp with the ODT is placed on the gold substrate. When the
stamp is removed, the ODT in contact with the gold stays stuck to the gold.
PDMS (Polydimethylsiloxane)
PDMS or polydimethylsiloxane belongs to a group of polymeric
organosilicon compounds.
It is the most-widely used silicon-based organic polymer and particularly
known for its unusual rheological properties.
It is optically clear, and in general, inert, non-toxic, and non-flammable.
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Its chemical formula is CH3[Si(CH3)2O]nSi(CH3)3.
PDMS Mechanical Properties
PDMS is viscoelastic, meaning that at long flow times (or high
temperatures), it acts like a viscous liquid, similar to honey. However, at
short flow times (or low temperatures), it acts like an elastic solid, similar to
rubber.
In other words, if some PDMS is left on a surface overnight (long flow time),
it will flow to cover the surface and mold to any surface imperfections.
However, if the same PDMS is rolled into a sphere and thrown onto the
same surface (short flow time), it will bounce like a rubber ball.
The shear modulus of PDMS varies with preparation conditions, but is
typically in the range of 100 kPa to 3 MPa. The loss tangent is very low
(tan 0.001).
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PDMS Chemical Compatibilites
After polymerization and cross-linking, solid PDMS samples will present an
external hydrophobic surface. This surface chemistry makes it difficult for
polar solvents (such as water) to wet the PDMS surface, and may lead to
adsorption of hydrophobic contaminants.
Plasma oxidation can be used to alter the surface chemistry,
adding silanol (SiOH) groups to the surface. Atmospheric air plasma &
argon plasma will work for this application.
This treatment renders the PDMS surface hydrophilic, allowing water to wet
it. This is frequently required for water-based microfluidics. The oxidized
surface resists adsorption of hydrophobic and negatively charged species.
PDMS Applications
Applications:
Surfactant and antifoaming agents
Hydraulic fluids and related applications
Medicine and cosmetics
Foods (cooking oils, processed foods)
Domestic and niche uses
PDMS Stamp Process Scheme
1. PDMS master is created by patterning silicon, pouring and curing the
PDMS, and peeling away from the substrate.
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2. Thiol is poured over the stamp and let dry. Conformal contact is made with
the substrate and pattern is left behind.
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PDMS Stamp Process
1.
Preparing the master
a) The master is typically created on silicon, but can be done on any solid
patterned surface.
b) Photoresist is applied to the surface and patterned by a photomask and
UV light.
c) The master is then baked, developed and cleaned before use.
In typical processes the photoresist is usually kept on the wafer to be used as a
topographic template for the stamp. However, the unprotected silicon regions can
be etched, and the photoresist stripped, which would leave behind a patterned
wafer for creating the stamp. This method is more complex but creates a more
stable template.
2. Creating and Inking the PDMS stamp
Creating the PDMS stamp:
After fabrication the master is placed in a walled container, typically a petri dish
and the stamp is poured over the master.
Inking the stamp:
Inking of the stamp occurs through the application of a thiol solution either by
immersion or coating the stamp with a Q-tip. The highly hydrophobic PDMS
material allows the ink to be diffused into the bulk of the stamp, which means the
thiols reside not only on the surface, but also in the bulk of the stamp material. This
diffusion into the bulk creates an ink reservoir for multiple prints. The stamp is let
dry until no liquid is visible and an ink reservoir is created.
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3. Applying the stamp to the substrate
Direct contact
The stamp is brought to physical contact with the substrate and the thiol solution is
transferred to the substrate.
Other techniques
Printing of the stamp onto the substrate can also take place with a rolling stamp
onto a planar substrate or a curved substrate with a planar stamp.
PDMS Stamp Technical Problems
Stamp deformation
Deformation of the stamp can occur during removal from the master and during the
substrate contacting process. When the aspect ratio of the stamp is high buckling of
the stamp can occur. When the aspect ratio is low roof collapse can occur.
Substrate contamination
During the curing process some fragments can potentially be left uncured and
contaminate the process. When this occurs the quality of the printed SAM is
decreased. When the ink molecules contain certain polar groups the transfer of
these impurities is increased.
Shrinking/swelling of the stamp
During the curing process the stamp can potentially shrink in size leaving a
difference in desired dimensions of the substrate patterning. Swelling of the stamp
may also occur. Most organic solvents induce swelling of the PDMS stamp.
Ink mobility
Ink diffusion from the PDMS bulk to the surface occurs during the formation of the
patterned SAM on the substrate. This mobility of the ink can cause lateral
spreading to unwanted regions. Upon the transfer this spreading can influence the
desired pattern.
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PDMS Stamp Advantages
Advantages:
The simplicity and ease of creating patterns with micro-scale features;
Can be done in a traditional laboratory without the constant use of a
cleanroom (cleanroom is needed only to create the master);
Multiple stamps can be created from a single master;
Individual stamps can be used several times with minimal degradation of
performance;
A cheaper technique for fabrication that uses less energy than conventional
techniques.
Plasmonic Nanoparticles
Plasmonic nanoparticles are particles whose electron density
can couple with electromagnetic radiation of wavelengths that are far larger than
the particle due to the nature of the dielectric-metal interface between the medium
and the particles: unlike in a pure metal where there is a maximum limit on what
size wavelength can be effectively coupled based on the material size.
The nanoparticles can form clusters to form plasmonic molecules and interact with
each other to form cluster states. The symmetry of the nanoparticles and the
distribution of the electrons within them can affect a type of bonding or
antibonding character between the nanoparticles similarly to molecular orbitals.
Since light couples with the electrons, polarized light can be used to control thedistribution of the electrons and alter the mulliken term symbol for the irreducible
representation. Changing the geometry of the nanoparticles can be used to
manipulate the optical activity and properties of the system, but so can the
polarized light by lowering the symmetry of the conductive electrons inside the
particles and changing the dipole moment of the cluster. These clusters can be used
to manipulate light on the nano scale.
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Applications of Plasmonic Nanoparticles
Plasmonic solar cells
Due to their ability to scatter light back into the photovoltaic structure and
low absorption, plasmonic nanoparticles are under investigation as a method for
increasing solar cell efficiency. Forcing more light to be absorbed by the dielectric
increase efficiency.
Spectroscopy
Plasmonic nanoparticles have been explored as a method for high
resolution spectroscopy. One group utilized 40 nm gold nanoparticles that had
been functionalized such that they would bind specifically to epidermal growth
factor receptors to determine the density of those receptors on a cell.
Cancer treatment
Preliminary research indicates that the absorption of
gold nanorods functionalized with epidermal growth factor is enough to amplify
the effects of low power laser light such that it can be used for targeted radiation
treatments.
Surface Plasmon Resonance (SPR)
Surface plasmon resonance(SPR) is the resonant oscillation of conduction
electrons at the interface between a negative and
positive permittivity material stimulated by incident light.
The resonance condition is established when the frequency ofincident photonsmatches the natural frequency of surface electrons
oscillating against the restoring force of positive nuclei. SPR in
subwavelength scale nanostructures can be polaritonic or plasmonic in
nature.
SPR is the basis of many standard tools for measuring adsorption of
material onto planar metal (typically gold or silver) surfaces or onto the
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surface of metal nanoparticles. It is the fundamental principle behind many
color-based biosensor applications and different lab-on-a-chip sensors.
Localized Surface Plasmon
A Localized Surface Plasmon (LSP) is the result of the confinement of a surface
plasmon in a nanoparticle of size comparable to or smaller than the wavelength of
light used to excite the plasmon. The LSP has two important effects:
(1) Electric fields near the particles surface are greatly enhanced. This
enhancement falls off quickly with distance from the surface;
(2) The particles optical excitation has a maximum at theplasmon resonant
frequency. For noble metal nanoparticles, this occurs at visible wavelengths.
Hydrosilylation
Hydrosilylation, also called catalytic hydrosilation, describes the addition
of Si-H bonds across unsaturated bonds. Ordinarily the reaction isconducted catalytically and usually the substrates are unsaturated organic
compounds. Alkenes and alkynes give alkyl and vinyl
silanes; aldehydes and ketones give silyl ethers. The process was first
reported in academic literature in 1947.
Hydrosilylation involves the insertion of an unsaturated bond, in this case
alkene, into a silicon-hydride group on the surface, which results in
attachment of the alkyl to the silicon via a SiC bond. This reaction is of
broad interest because of its utility for covalent interfacing of a broad
range of organic molecules to silicon surfaces. The reaction pathways
proposed for low energy light-induced hydrosilylation reactions on the
silicon surface typically involve electronhole pairs, since visible light is
incapable of homolytic SiH bond cleavage or electron photoemission.
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Proposed Mechanism for the Plasmonic Stamp-Assisted Hydrosilylation
Scheme of Hydrosilylation Reaction on Silicon Surface
a. Hydrosilylation of an alkene on Si(111)H, resulting in SiC bond formation and
covalent attachment of the molecule to the surface.
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b. Plasmonic stamp-assisted photohydrosilylation on a Si(111)H surface. A
continuous wave bandpass filter, where it shines upon the optically transparent,
PDMS-based plasmonic stamp with embedded gold nanoparticle patterns.
Hydrosilylation occurs in a spatially defined fashion on the Si(111)H surface to
produce a hydrosilylated surface pattern that mirrors that of the parent gold
nanoparticle pattern in the plasmonic stamp.
Fabrication of Plasmonic Stamps
a.
Conversion of a gold nanopattern on silicon, prepared via block copolymerself-assembly, into a plasmonic stamp. A gold nanopattern is produced using a
self-assembled block copolymer (BCP) template and then lifted off the Si/SiOx
surface embedded within the cured PDMS to yield the plasmonic stamp.
b. Atomic force microscopy (AFM) height map and section analysis of a gold
nanopattern on silicon surface, produced via self-assembly of the BCP PS-b-
P2VP (molecular weight of 125 k-b-58.5 k). The scale bar is 100 nm. (c) AFM
height map and section analysis of the plasmonic stamp surface. The scale bar
is 100 nm. (d) Schematic image and optical photograph of a plasmonic stamp
(on a reflective surface). The scale bar is 2 mm. (e) UV_vis spectrum of a PDMS
plasmonic stamp showing the absorption at 530 nm due to the embedded gold
nanoparticles.
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Block-copolymer Self Assembly
Self-assembly is a process in which a disordered system of pre-existing
components forms an organized structure or pattern as a consequence of
specific, local interactions among the components themselves, without
external direction. When the constitutive components are molecules, the
process is termed molecular self-assembly.
Block copolymers comprise two or more homopolymer subunits linked by
covalent bonds. The union of the homopolymer subunits may require an
intermediate non-repeating subunit, known as a junction block. Block
copolymers with two or three distinct blocks are called diblock
copolymers and triblock copolymers, respectively.
BCP-based films are compatible with existing silicon-based lithography due
to the central role played by organic photoresists that are handled in much
the same manner.
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Pattern Modification/Visualization using 10 nm Gold Nanoparticles
(a-c) Schematic outline of pattern visualization via multiple surface modification
reactions. The BCP used for generating the gold nanoparticle pattern within the
plasmonic stamp was PS-b-P2VP. Hydrosilylation with 1,7-octadiene resulted in
alkene-terminated patterns; a UV-mediated thiolene addition of 1,6-hexanedithiol
resulted in thiolterminated patches. Exposure of this patterned surface to gold
nanoparticles resulted in binding only to the thiolterminated areas on the silicon
surface. (d) Scanning electron microscopy (SEM) micrograph of the patterned
silicon surface before exposure to gold nanoparticles. (e) SEM micrograph of
patterned silicon surface after exposure to 10 nm Au nanoparticles. (SEM scale
bar: 100 nm)
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AFM height maps of silicon surfaces with 1-dodecene and plasmonic stamps
(a-c) Effect of time on illumination of a Si(111)H surface with 1-dodecene, through
a plasmonic stamp, from 0 (a), 30 (b), and 60 min (c).
(d-f) Control over pattern spacing using plasmonic stamps prepared with BCPs of 3
different molecular weights: center-to-center spacings of PS-b-P2VP and
illumination time of 60 min was 70 nm (d), PS-b-P2VP (91.5 k-b-105 k) was 120
nm (e), and PS-b-P2VP was 160 nm (f). All scale bars correspond to 200 nm.
Discussion
From the above results, it appears that the local hydrosilylation reaction is driven
by the plasmon resonance of the Au nanoparticles. As such, energy is being
transferred from the Au nanoparticles/plasmons to the 1-dodoecene/Si(111)-H
interface. Upon excitation, the plasmon can decay radiatively through resonant
photon scattering or nonradiatively via the generation of an electron_hole pair
(EHP), typically referred to as hot carriers. These hot carriers can be directly
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injected into the surrounding medium, or they can recombine, which results in local
heating of the nanoparticle. Lastly, EHPs can be directly generated in the Si as a
result of the high intensity electromagnetic field of the LSPR, which is localized to
the neighborhood of the gold nanoparticle. Given that all four of these mechanisms
(resonant photon scattering, nanoparticle plasmonic heating, hot carrier injection
and near-field electromagnetic EHP generation) could be driving the local
hydrosilylation reaction, their relative contributions are discussed below. Efficiency
enhancement due to the resonant photon scattering or forward light scattering of
metal nanoparticles has been suggested in the field of light scattering-enhanced
solar cells. When metal nanoparticles are located on a solar cell surface, thesecondary radiation of incident electromagnetic energy scattered into the active
layers of solar cells, referred to as the forward light scattering, can increase the
effective optical length by light trapping in the active layers which could lead to
an increased rate of EHP generation at the silicon surfaces. However, the size of
the Au nanoparticles in the plasmonic stamp is 1015 nm, which is in the range in
which LSPR absorption would be dominant; the forward scattering intensity would
be less than 0.1% of incident light, according to previously reported simulations.
The next mechanism to be considered is in situ plasmonic heating, which could result
in a local increase of temperature of the gold nanoparticles due to the strong light
absorption at the plasmon resonance, which is dissipated as heat. For thermal
heating to play a role in hydrosilylation, the silicon surface would need to reach
temperatures in excess of 100C, within the time scale of experiments performed
in this work. The temperature increase, T, of a single isolated gold nanoparticle
can be estimated using the conventional model:
where is the particle absorption cross section, I is the incident light intensity, k is
the thermal conductivity of the surrounding medium, and D is the nanoparticle
diameter. Assuming a scattering cross section of 500 nm2, a thermal conductivity of
0.15 W/m.K (corresponding to PDMS), a nanoparticle diameter of 15 nm, and an
intensity of 50 mW/cm2, the predicted temperature increase would be 1.8x10-5
C. It is worth noting that steam generation has been observed for dilute solutions
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of light absorbing nanoparticle using moderate light intensities of 10 mW/cm2but
this phenomenon has been shown to be a result of enhanced light absorption due
to efficient volume scattering between nanoparticles in solution. A similar light
trapping effect is unlikely to play a role here since the nanoparticles are isolated
on a single plane. Moreover, in order for patterned surface hydrosilylation to
occur, it would be necessary for the temperature increase to be localized directly
underneath the nanoparticles such that the surrounding silicon does not react.
The third mechanism to consider is hot carrier injection from the gold nanoparticles
into the surrounding medium. In the event of nonradiative decay of the plasmon
(which is the dominant plasmon decay mode for nanoparticles much smaller than
the plasmon wavelength), an energetic EHP is formed, typically referred to as hot
carrier generation. These hot carriers have been extensively studied in catalytic
water-splitting, where it has been shown that the hot carriers are directly injected
into the semiconductor surface, facilitating the water-splitting reaction. In the case
of hydrosilylation, if a hole is injected into the silicon surface from the gold
nanoparticle, the hydrosilylation reaction can proceed via nucleophilic attack by an
alkene on a positively charged surface silicon site, as has been repeatedly
postulated.
Lastly, the effect of the highly concentrated electromagnetic field produced by the
LSPR is considered. It has been shown that the rate of EHP generation in a
semiconductor is proportional to the local intensity of the electric field. Given that
the electric field enhancement is on the order of ~103 at the edges of the
nanoparticle, the relative concentration of EHPs at the silicon surface (within the
neighborhood of the gold nanoparticle) would also be expected to ~103 times
higher. As such, the kinetic rate of the hydrosilylation reaction would proceed much
faster in these areas of increased EHP concentration.
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CONCLUSION
Soft lithography is a technique for fabricating or replicating structures using
elastomeric stamps (most notably PDMS), molds, and conformable photomasks.
The gold nanopatterns which produced via block copolymer self-assembly can be
incorporated into an optically transparent flexible PDMS stamp, termed a
plasmonic stamp, and used to directly functionalize silicon surfaces on a sub-100
nm scale.
Localized surface plasmons in a gold nanopattern, embedded within an optically
transparent plasmonic stamp, can be used to drive hydrosilylation of alkenes on
silicon surfaces, upon illumination with low intensity light with wavelengths that
corresponded to the absorption profile of the gold nanoparticles. The gold
nanopatterns were created via block copolymer self-assembly, but could
presumably be produced through other lithographic nanopatterning approaches.
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SOURCE
ACS Nano, 2015, 9(2), pp 21842193
Chem. Mater., 2014, 26(1), pp 763772
Micromachines2012, 3, 21-27
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