Next generation infrared sensors

a versatile thermopile with the smallest form factor available

on market

Company was registered in 2008

Spin off from SenseAir AB (a gas sensor manufacturer in Sweden)

Develops and produces thermopile infrared sensors

Today 3 employees

Production facility Uppsala

Today more than 50 customers has evaluated our sensors.

Company facts

JonDeTech ABManagement

PRODUCTIONComponents.

Systems & foil.

R & DDevelopment - Core technology.

Production processes & equipment.

LICENSED PARTNER, production partner or

Joint VentureMateria

ls

IP & Support

Production Equipment.

Joint VentureJonDeTech &

Certified Equipment Sub-contractors

Application Engineering.

Direct customeror distributor.

Components & subsystems

Project management.And support

Business model

“Provide customers with sensors that observe what is present and predict what is about to happen”.

JonDeTech will offer smart and low cost infrared sensors for measuring heat, temperature and presence, for the consumer- and industrial markets using our proprietary

technology.

We will mass produce these sensors.

JonDeTech mission

The sensor is extremely thin (<0.2 mm).

Robust and reliable (produced in a plastic foil material)

Surface mountable to most PCB carriers (e.g. flex-PCBs).

The thermopile is vertical configured (and can measure the true heat flux)

Can be glued to almost any geometrical (e.g. curved) surface

Position sensitive detectors and sensor arrays can easily be assembled on the PCB board by the customer. The sensor can be mounted side-by-side.

Low cost for large volumes.

Large field of view possible

Custom made geometry and sensor area can be provided.

Introduction

Key features of the JonDeTech thermopile* *IR-sensor, heat flow- and T sensor

IR-sensor comparison

Benchmark of different IR-sensors

Property JonDeTech’s thermopile

Si-based(metal container)

Si-based (SMT container)

Thin (<1 mm)

Surface mountable

Mountable to flex-PCB

Low impedance (<10 kΩ)

Robust

Large Field of View (FOV)

Side-by-side array

Large area sensors

Heat flux mode

?

The responsivity to irradiance are 3 Vmm2/W [JIRS3]9 Vmm2/W [JIRS5]

The total thermopower are: 3 mV/K [JIRS3]40 mV/(cm2×K) [per cm2]

Specific detectivity is:D* = 1.5×107 [all]

Sensitivity [JIRS3]S40 = 12 µV/K S100= 14 µV/K(obj.temp. 40C/100C, amb. 25C)

Electrical resistance:R <5 kΩ [JIRS3]R <15 kΩ [JIRS5]

/WHzcm

Technical specifications

Technical data JIRS sensors

Application examples

Input devices Wake up systems (proximity switch) for computers and mobile phone

applications. Wake-up circuits (proximity switch) for general stand-by devices. Input devices (general) Touchless gesture devices?

Preventive and predictive maintenance

Application examples

Overheat control units for bearings, transmission and gearboxes.

Overheat control units for motors.

Temperature control units for industrial rollers.

Overheat protection for compressor units.

Application examples

Fire detection systems

Intrusion detection (safety bags, cold chain)

Proximity sensors for entrance detection

Presence detection systems (WSNs)

Wake-up circuits for electronic door locks

Gas alarm systems

Security and surveillance

Application examples

Comfort sensors for HVAC technology to monitor indoor climate.

Contactless light switch units

Indoor air quality control (CO2 gas analysis units).

Residential control systems

Array Possibilities

Possibilities

The sensor can be mounted side-by-side on a PCB. The spacing between the sensors can be as small as 0.3 mm.

SMT asssembly

The sensors can be surface mounted on rigid PCBs (e.g. FR4) as well as flexible PCBs using standard pick and place machines. Standard RoHS compliant soldering techniques and capillary underfill processes can be used. Underfill will ensure good heat conduction to the PCB carrier as well as mechanical robustness of the system.

Surface mountable

Left. Thermopiles consist of several interconnected TC forming an electrical series of alternating material. Thermally however every TC is in parallel.

Right. A thermocouple (TC) is a circuit where two different (thermoelectric) materials, referred to as legs/leads, are joint together. When a temperature difference is applied between the solder junctions (joints), an electrical voltage (signal) is produced.

T1 T2

The produced voltage U equalsU = N (a- b) T

where N is the number of thermocouples, a and b is the Seebeck coefficient of the respective thermoelectric material and T is the temperature difference.

Sensor principle

U(Volt)

T

Thermoelectric material AThermoelectric material B

Measurement principle (thermopiles)

Sensor principle

Cross section of JonDeTech thermopile

JonDeTech’s vertical IR-sensor

The incoming infrared (IR) energy heats the absorption layer of the sensor producing a small temperature increase. This difference in temperature across the sensor layer is converted to an electrical signal.

This is in contrast to semiconductor based photovoltaic detectors which produce a direct signal from the absorbed photons.

* In the JonDeTech sensor the sensor thickness is just 0.2 mm

absorber layerT

signal

T0 (K)Thermal mass

thermal link

IR-heat

T1 (K)

sensor*

P (W)

sensorlayer

z

y

x

Sensor principle

Traditional IR-sensors Left. A traditional (horizontally configured) thermopile on a silicon membrane.

In these kind of IR-sensors, the hot and the cold junction are placed beside each other in the same horizontal plane. Hence they cannot be used as true heat flow sensors. In addition the thin and fragile membrane requires a protective encapsultation.

Traditional IR-sensors of today, typically have to be protected in a large size metal containers e.g. TO18 (~6x6 mm) or similar and attached to an even bulkier PCB

V

z

y

x

cold junction

hot junction

Traditional sensors

Size comparisonRight. JonDeTech sensors. Below, conventional IR-sensor, left surface mount package, to the right leg mounted TO-can package.

5 mm

2 mm

3-10 mm

2-7 mm

Size comparison

V

The green and blue pillars in the images correspond to the thermocouple legs/leads of the thermopile built from “nanowire clusters”.

Metal A Metal B Metal A

T1

T2Hot junction (top side of foil)

Cold junction (bottom side of foil)

Fig. Cross-section of the thermopile

The response is directly proportional to the surface area of the detector

The JonDeTech thermopile

Nanowire technology