opening address photomask technology + euv...
TRANSCRIPT
Welcome to the 2018
Photomask Technology + EUV Lithography Conference
in Monterey, CA
Chairs
SPIE Photomask Technology EUV Lithography
Abstracts by region
Europe(25)
Asia(24)
USA(27)
EUVPhotomask
Europe(17)
Asia(19)
USA(20)
AgendaSunday Monday Tuesday Wednesday Thursday
Imec workshop on EUV mask
blanks
EUVL + PM 1 Keynotes EUVL + PM 4EUV mask blanks
EUVL 6 + PM 8EUV mask and imaging
EUV High-NA and Imaging
EUV Scanner Source
Deep learning advanced data
analytics
EUVMaterials
I
Nanoimprint Lithography
EUVL 7 + PM 9EUV inspection, repair,
and verification
EUV Patterning
EUV Process control
Mask inspection,
control, repair
EUVL afternoon
off
Mask write and MPC
EUVL 8 + PM 10EUV pellicle and
metrology
EUVL + PMPoster speed talks
Mask process and
resist
EUVMaterials
II
Panel: Optical and EUV masks
Poster Dinner (Marriott)Entertainment
Joint sessionsPM breakout sessions
EUV breakout sessions
Venue
Exhibition
Reminder to speakers
• Please load your presentation on the conference room computer during a break prior to your session
• Steinbeck2 for joint and Photomask• Steinbeck3 for EUVL
• Arrive at your session early and introduce yourself to the Session chairs• Sit near the session chair table at the front of the room
• Speed poster participants –load your presentations by 12:30pm today • Additional option of using computer in the back
Monday posters
Poster session preceded by a new session with 10-minute invited talks followed by 2-minute speed talks
NOTE: All speed poster presenters must load their slide on the SPIE computer by 12:30pm
Wednesday evening
Student Scholarships
• Goal: Encourage student engagement in EUVL• Selection: Through abstract review• Award: Registration and travel support• This year: 14 scholarships awarded across AP, EU, and US
Note: applies to photomask submissions related to EUV
Thank you to the conferenceand award sponsors
Thank you to the following sponsors for their generous support
Plenary
9:00 to 9:40amCurrent challenges and opportunities for EUV lithography
Harry J. LevinsonHJL Lithography (USA)
Photomask Technology Kick-off38th annual conference 2nd year joint with EUVL
Thank you to theBACUS Steering and Program Committees
Frank E. Abboud, Intel Corp. Michael D. Archuletta, RAVE LLC Ki-ho Baik, HOYA Corp. USA Artur Balasinski, Cypress Semiconductor Corp. Uwe F. W. Behringer, UBC Microelectronics Peter D. Buck, Mentor Graphics Corp. Brian Cha, Samsung Electronics Co., Ltd. Derren Dunn, IBM Corp. Thomas B. Faure, GLOBALFOUNDRIES Inc. Aki Fujimura, DS2, Inc. Emily Gallagher, imec Brian J. Grenon, RAVE LLC Jon Haines, Micron Technology Inc. Naoya Hayashi, Dai Nippon Printing Co., Ltd. Bryan S. Kasprowicz, Photronics, Inc. Patrick M. Martin, Applied Materials, Inc. Kent Nakagawa, Toppan Photomasks, Inc. Jan Hendrik Peters, bmbg consult Moshe Preil, KLA-Tencor Corp. Jed Rankin, GLOBALFOUNDRIES Inc. Stephen P. Renwick, Nikon Research Corp. of America Douglas J. Resnick, Canon Nanotechnologies, Inc. Thomas Scheruebl, Carl Zeiss SMT GmbH Thomas Struck, Infineon Technologies AG Bala Thumma, Synopsys, Inc. Anthony Vacca, Automated Visual Inspection Michael Watt, Shin-Etsu MicroSi Inc. Jim N. Wiley, ASML US, Inc. Larry S. Zurbrick, Keysight Technologies, Inc.
Frank E. Abboud, Intel Corp. (United States)Uwe F.W. Behringer, UBC Microelectronics (Germany)Byungcheol (Brian) Cha, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)Lucien Bouchard, Photronics, Inc.Thomas B. Faure, GLOBALFOUNDRIES Inc. (United States)Aki Fujimura, D2S, Inc. (United States)Brian J. Grenon, RAVE LLC (United States)Naoya Hayashi, Dai Nippon Printing Co., Ltd (Japan)Izak Kapilevich, Applied Materials, Inc. (United States)Bryan S. Kasprowicz, Photronics, Inc. (United States)Byung Gook Kim, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)Lloyd C. Litt, GLOBALFOUNDRIES Inc. (United States)Paul A. Morgan, Micron Technology, Inc. (United States)Kent H. Nakagawa, Toppan Photomasks, Inc. (United States)Takahiro Onoue, HOYA Corp. (Japan)Jan Hendrik Peters, BMBG Consult (Germany)Moshe E. Preil, KLA-Tencor Corp. (United States)Douglas J. Resnick, Canon Nanotechnologies, Inc. (United States)Thomas Scherübl, Carl Zeiss SMT GmbH (Germany)Yuyang Sun, Mentor Graphics Corp. (United States)Bala Thumma, Synopsys, Inc. (United States)Banqiu Wu, Applied Materials, Inc. (United States)Shusuke Yoshitake, NuFlare Technology, Inc. (Japan)
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Panel session
Optical and EUV Masks: Analyzing the HVM requirements and Capability Differences• Wednesday 4:10 to 5:50 PM• Steinbeck 2• Panelists:
• Takahiro Onoue: Hoya Corp.• Paul Morgan: Micron Technology Inc.• Thomas Scherubl: Carl Zeiss SMT• Peter Buck: Mentor, A Siemens Business• Byung Gook Kim: Samsung