packaging trends surface mount packagingjevans/elec6740/packagingreview.pdf · 2002. 9. 9. ·...
TRANSCRIPT
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ELECTRONICS PACKAGING REVIEW
John L. Evans, Ph.D.INSY 4700
PACKAGING TECHNOLOGY&
DEFECTS
PACKAGING TRENDS SURFACE MOUNT PACKAGING
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IC PACKAGE & WIRE BONDING WIRE BONDING FANOUT
WIRE BONDING – LARGE FINE PITCH PROCESS
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PACKAGING VARIETY BGA PACKAGING VARIETY
BGA PACKAGING BALL GRID ARRAY - BGA
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HIGH I/O BGA PACKAGE MULTICHIP BGA
MULTI-CHIP PACKAGE - PGA LOW PASTE - PASSIVES
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COMPONENT FAILURE GOOD COMPONENT PLACEMENT
PLACEMENT OFFSET SO16 SKEWED
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GOOD QFP PLACEMENT SKEWED QFP PLACEMENT
GULL WING DEFECT J-LEAD DEFECT
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BGA OFFSET BGA – ROBUST PROCESS
FLIP-CHIP WITH UNDERFILL LAMINENT SUBSTRATE
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FLEX SUBSTRATE CERAMIC SUBSTRATE