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2014The 64th Electronic Components and Technology Conference (ECTC 2014)

Panasonic's advanced packaging technologies for thin substrates

Mitsuru HiroshimaMicro Electronics Division

Panasonic Factory Solutions Co., Ltd.

May 27th, 2014

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2014The 64th Electronic Components and Technology Conference (ECTC 2014)

Panasonic's 4 Business Groups and Our Company

Appliances Eco Solutions

AVC NetworksAutomotive &

Industrial Systems

Figures as of April 2013

Automotive

Industrial

Manufacturing

15 billion yen

Osaka, JAPAN

January 1, 2003

100% from Panasonic Corp.

2,870 （World wide）

Head Office

Establishment

Funding

Paid-in capital

Employees

Business AreaElectric Component MountingMicroelectronics Systems etc..

Panasonic Factory Solutions Co., Ltd.

Panasonic Welding Systems Co., Ltd.

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2014The 64th Electronic Components and Technology Conference (ECTC 2014)

Bare Die

Frontend &

Pre-assembly

Module

Assembly

PCB

Assembly

SAW filter

ImageSensor

RF Module

GPS Module

FPC

Mother Board

Package

Assembly

IC fabrication

LCD Panel

Pre-assembly

Final Product

Product Portfolio -Electronic Circuit Manufacturing Solution-

Plasma Dry Etcher

APX300

LCD Driver IC Bonder

FPX Series 

Plasma Dicer

APX300

Flip Chip Bonder

FCB3

Plasma cleaner

PSX307

MDP Series

Die Bonder

SMD System

NPM Series 

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2014The 64th Electronic Components and Technology Conference (ECTC 2014)

Mounting “thin-Si die/component” on “thin-substrate” is essential !

Source) zxhgroup.com

Requirements for thin-substrate Manufacturing

Source) LG Source) SAFE KEEPER CARD Source) Fitbit Flex

Bendable Smart Phone Secured Plastic Card Wearable for Healthcare

Strength of thin-die

Reliabilityof Interconnect

Supportthin-substrate

Key requirements

Flexibility + “more Functions in Small Volume”

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2014The 64th Electronic Components and Technology Conference (ECTC 2014)

Panasonic’s PKG Solutions for thin substrate

Strength of thin-die

Reliability of Interconnect

Supportthin-substrate

Plasma Dicing Plasma Cleaning

Electrode

Die

Die Wire

Substrate

e-Carrier(Electrostatic Force)

Electrostatic carrier

SMDProcess

Cover

Flexible Substrate

Source)Win Industry

DC

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2014The 64th Electronic Components and Technology Conference (ECTC 2014)

What is “Plasma Dicing” ?

SOLID based Dry Etching based

Blade Dicing Plasma Dicing

SiF4

SF6 + O2

SixOyF

z

SFx+

F*,O* SiF4 etc..

Si

Resist

Sidewallprotection

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2014The 64th Electronic Components and Technology Conference (ECTC 2014)

Dicing chip

Blade Dicing Plasma Dicing

damaged layer(500nm thick)

Plasma Dicing - Die Strength -

60μm

3 points bending test result

0%

1%

10%

100%

100 1000 10000

Chip Strength (MPa)

Cum

ulat

ive

Freq

uenc

y(-)

Blade DicingPlasma Dicing

Top V

iew

TEM

Im

age

Strong thin-die by Plasma Dicing !

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2014The 64th Electronic Components and Technology Conference (ECTC 2014)

“R” edge

Plasma Dicing - Makes dies stronger -

HexagonalCircular

Highest Strength Dies

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2014The 64th Electronic Components and Technology Conference (ECTC 2014)

After plasma

Plasma Cleaning - PoP interconnection -

Sn

Before plasma

Carbon

CarbonAto

mic

Concentration(%)

Ato

mic

Concentration(%)

■ TMV(Through Mold Via) process ■ XPS depth profile on solder ball surface

Plasma Cleaning

Solder BallLaser

Smears（Residues）

Mold-resin

Top PKG

TMV

Reliable Solder Joint after cleaning !

Bottom PKG Sn

XPS : X-ray Photoelectron Spectroscopy

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2014The 64th Electronic Components and Technology Conference (ECTC 2014)

Chip Bonding

Plasma Cleaning

Plasma Dicing

Handling

Panasonic’sPKG techniques

Contribute to your thin-sub. manufacturing !

Source)Win Industry

APX300 MD-P200US

PSX307

e-carrier

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2014The 64th Electronic Components and Technology Conference (ECTC 2014)