pcb technology for high currents

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Components for 232Amp on your PCB, how do you do it? Georg Grunenberg

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Page 1: PCB technology for high currents

Components for 232Amp on your PCB, how do you do it?

Georg Grunenberg

Page 2: PCB technology for high currents

• Introduction of Phoenix Contact

• PCB technology for 232 Amp

• Customer benefit

• Questions

Topics

Page 3: PCB technology for high currents
Page 4: PCB technology for high currents

Corporate History

1923

1980s

1960s 1950s

Today

History

Page 5: PCB technology for high currents

Corporate Principles

Mission

We create progress

with innovative and inspiring solutions.

10 | VERMOGENS_ELEKTRONICA | Phoenix Contact

Page 6: PCB technology for high currents

PCB technology for high currents

Page 7: PCB technology for high currents

Copperfoils for PCB´s (layermaterial)

Which typs are available, and which are suitable

5 µm

9 µm

12 µm ( = 1/3 ounce/ ft²)

18 µm ( = ½ ounce / ft²)

35 µm ( = 1 ounce / ft²)

70 µm ( = 2 ounce / ft²)

105 µm ( = 3 ounce/ ft²)

140 µm ( = 4 ounce / ft²)

210 µm ( = 6 ounce / ft²)

400 µm

PCB technology for high currents

Suitable for inner

layers for high

currents

12 | VERMOGENS_ELEKTRONICA | Phoenix Contact

Page 8: PCB technology for high currents

Standard

PCB technology for high currents

Selective Heavy Copper

High Current

Thick Copper PCB

Inner Layers up to 400 µm

Outer Layers up to 210 µm

Iceberg technology

• Inner Layers

up to 400 µm

• Outer Layers

up to 400 µm

Wirelaid technology

13 | VERMOGENS_ELEKTRONICA | Phoenix Contact

Page 9: PCB technology for high currents

PCB technology for high currents

Example for a Multilayer PCB

Pad

Outer Layer

(up to 105 µm copper foils)

Inner Layers

(up to 400 µm copper foils)

Core Material (FR 4)

Prepeg

(e.g. FR 4)

Prepeg: flame retardant compound material, FR4

Core Material: pressed Prepeg between 2 copper foils…

14 | VERMOGENS_ELEKTRONICA | Phoenix Contact

Page 10: PCB technology for high currents

Microsection of a 6-layer Multilayer PCB

Source: Schweizer AG

PCB technology for high currents

Outer Layer

(up to 105 µm

copper foils)

Inner Layers

(up to 400 µm copper foils)

Core Material (FR 4)

15 | VERMOGENS_ELEKTRONICA | Phoenix Contact

Page 11: PCB technology for high currents

There are different kinds of thermal pads in the inner- and outerlayers.

Vias (drilled holes) are recommended due to a better thermal behaviour, they will

be filled during the soldering, but they reduce the cooling of the component / the

soldering pins.

PCB technology for high currents

direct link to the copper layers

Additional drilling holes (Vias)

with 0,8 mm diameter as

Heat trap (recommended)

4,8 mm

Note: The layout of the PCB has to be defined by the customer in

dependence of the application.

Ø 0,8 mm

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Page 12: PCB technology for high currents

PCB technology for high currents

+

Multilayer PCB

MKDSP 95

PCB thickness: max. 2,7 mm

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Page 13: PCB technology for high currents

PCB technology for high currents

PCB top side Temp.:

Wave Temp. :

Real example for a soldering process with Ersa Powerflow:

Note: The diagram is only an

example, it works also with

shorter preheating.

18 | VERMOGENS_ELEKTRONICA | Phoenix Contact

Page 14: PCB technology for high currents

PCB technology for high currents MKDSP 95 with Multilayer PCB

PCB Layout for 232 A permanent

(example PCB)

Number of layers thickness Width of track

Outer layer 2x 105 µm 14,5 mm

Inner Layer 4x 400 µm 27,5 mm

19 | VERMOGENS_ELEKTRONICA | Phoenix Contact

Page 15: PCB technology for high currents

PCB technology for high currents MKDSP 95 with Multilayer PCB

Results with permanent test current 232 A

The measured temperature of the PCB is 60°C, the ambient

Temperature was 22°C. This results a temperature rise of 38 K.

Temperature rise in Kelvin [K]

Test current

150 A 180 A 232 A

18 K 24 K 38 K

Note: Most customers don´t need 232 A permanently, but big conductor size for

their devices. The maximum conductor size for the MKDSP 95 is 95 mm² with

ferrule!

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Page 16: PCB technology for high currents

PCB technology for high currents MKDSP 95 with PCB

0

40

80

120

160

200

240

280

320

360

400

440

0 10 20 30 40 50 60 70 80 90 100 110

cu

rre

nt (A

)

Ambient temperature (°C)

MKDSP 95 with PCB

Current rating curve

Number of position: 4

Deratingfactor = 1

21 | VERMOGENS_ELEKTRONICA | Phoenix Contact

Page 17: PCB technology for high currents

Worldwide unique

Replacement for copper bars

35% cost reduction

80% less parts

New Design with High Current PCB for power electronics

Actual design New design with

MKDSP 95

22 | VERMOGENS_ELEKTRONICA | Phoenix Contact

Page 18: PCB technology for high currents

Frequency converter conventional

23 | VERMOGENS_ELEKTRONICA | Phoenix Contact

Page 19: PCB technology for high currents

PM 240 – 2 „FSE“

Line:

MKDSP 95 / 4 - 20 DC Bus:

MKDSP 95 / 2 - 20

Motor Connection:

MKDSP 95 / 4 - 20

Braking Resistor:

MKDSP 25 / 3 - 15

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Page 20: PCB technology for high currents

PCB technology for high currents MKDS(P) Series

MKDS 5N • 41 A

• 1000 V (IEC)

• 4 mm²

MKDSP 10 • 76 A

• 1000 V (IEC)

• 16 mm²

MKDSP 25 • 125 A

• 1000 V (IEC)

• 35 mm²

MKDSP 50 • 150 A

• 1000 V (IEC)

• 50 mm²

MKDSP 95 • 232 A

• 1000 V (IEC)

• 95 mm²

Complete Range up to 232 A

232 A through a PCB No Problem!

new

new

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Page 21: PCB technology for high currents

Questions ?

PCB technology for high currents

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Page 22: PCB technology for high currents

Thank You !

PCB technology for high currents

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Page 23: PCB technology for high currents

PCB technology for high currents

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