pe2017 forum programs - mesago · 18.05.2017 · ausstellerforum, halle 7, stand 507 exhibitor...

ForenprogrammForum programs

Ausstellerforum, Halle 7, Stand 507 Exhibitor Forum, hall 7, booth 507

Fachforum, Halle 6, Stand 143 Industry Forum, hall 6, booth 143

E-Mobility-Forum, Halle 6, Stand 326 E-Mobility Forum, hall 6, booth 326

Dienstag, 16.05.2017 Seite 12 Tuesday, 16 May 2017 Page 12

Mittwoch, 17.05.2017 Seite 13 Wednesday, 17 May 2017 Page 13

Donnerstag, 18.05.2017 Seite 14 Thursday, 18 May 2017 Page 14

Ausstellerforum, Fachforum und E-Mobility Forum 2017Exhibitor Forum, Industry Forum 2017and E-Mobility Forum

Mittwoch, 17.05.2017 Seite 5 - 6 Wednesday, 17 May 2017 Page 5 - 6

Dienstag, 16.05.2017 Seite 3 - 4 Tuesday, 16 May 2017 Page 3 - 4

Mittwoch, 17.05.2017 Seite 10 Wednesday, 17 May 2017 Page 10

Dienstag, 16.05.2017 Seite 9 Tuesday, 16 May 2017 Page 9

Donnerstag, 18.05.2017 Seite 7 - 8 Thursday, 18 May 2017 Page 7 - 8

Donnerstag, 18.05.2017 Seite 11 Thursday, 18 May 2017 Page 11

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Ausstellerforum Halle 7, Stand 507Exhibitor Forum hall 7, booth 507

Dienstag, 16.05.2017 Tuesday, 16 May 2017

Uhrzeit Time Firma Company Referent Speaker Thema Topic

10:00 - 10:20 MES Manz Electronic Systeme OHG

Jun Chao SUN Characterize power material under pulse excitation

10:20 - 10:40 Alpha Assembly Solutions Gustavo Greca Double sided sintering and reliability confirmed by power cycling

10:40 - 11:00 Mentor Graphics David Sulyok Power electronics for automotive / transportation / EHV

11:00 - 11:20 Rohde & Schwarz GmbH & Co KG.

Thomas Rottach Solutions for accurate and safe power measurements

11:20 - 11:40 Sekels GmbH Stefan Becker Hochstromdrossel

11:40 - 12:00 Panasonic Automotive & Industrial Systems Europe GmbH

Tetsuzo Ueda GaN and SiC power device technologies

12:00 - 12:20 Siebel Elektronik GmbH Henrik Siebel High insulating power supplies: Strategic components in power electronics

12:20 - 12:40 RECOM Power GmbH Thomas Rechlin David schützt Goliat – DC/DC-Wandler für IGBT, SiC und andere Gate Treiber

12:40 - 13:00 Monolith Semiconductor, Inc.

Xuning Zhang Unleash SiC MOSFETs - Extract the best performance

13:00 - 13:20 A.L.M.T. Corp. Shinichi Yamagata ALMT's High Performance Heatspreader Materials for Power Devices and our NEW Products, Magnesium Silicon Carbide Composite and Metal Diamond Composite

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13:20 - 13:40 Advanced Cooling Technologies Inc.

Pete Ritt Thermal management solutions for challenging power electronic applications

13:40 - 14:00 ON Semiconductor James Victory Physical SPICE Modeling for Wide Bandgap Devices

14:00 - 14:20 KEMET Electronics Corporation

Axel Schmidt Ceramic DC Link Capacitors in Wide Band Gap Applications

14:20 - 14:40 Littelfuse Corey Deyalsingh Fabricating rugged 1.2 KV SiC MOSFETs in a high-volume 150mm CMOS fab

14:40 - 15:00 AMS Technologies AG Konrad Laufs Reliable and compact water cooling pump stations utilize all integrated manifolds

15:00 - 15:20 ROGERS Corporation Dominik Pawlik Performance optimization of DC link systems

15:20 - 15:40 Indium Corporation of Europe

Andreas Karch Solder InForms for improved bondline control and enhanced reliability for substrate attach in IGBT power modules

15:40 - 16:00 Proton-Electrotex Alexey Cherkasov Proton-Electrotex production overniew and business perspectives

16:00 - 16:20 dSPACE GmbH Frank Puschmann Hardware-in-the-loop simulation of power electronics and electrical drives systems

16:20 - 16:40 EPCOS AG, A TDK Group Company

Natalia Iriondo EPCOS DC link capacitors for upcoming trends

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Mittwoch, 17.05.2017 Wednesday, 17 May 2017


13:20 - 13:40 Diotec Semiconductor AG Udo Steinebrunner Next Generation Schottky Rectifiers - Taylor Made Solutions for Special Application Requirements

13:40 - 14:00 Tamura-Europe Ltd. Wolfgang Rath Gate driver module for SiC-MOSFET / IGBT SEMICONDUCTORS

14:00 - 14:20 Yole Developpement SA Pierric Gueguen Status of power packaging

14:20 - 14:40 VACUUMSCHMELZE GmbH & Co. KG

Frank Schnelle Magnetic components for EV charging

14:40 - 15:00 EPCOS AG, A TDK Group Company

Ayse Kartal AC filtering capacitor solutions with film technology from EPCOS

15:00 - 15:20 Jianghai Europe Electronic Components GmbH

Arne Albertsen Jianghai Power Film Capacitors

15:20 - 15:40 Sumitomo Electric Industries, Ltd.

Yasuki Mikamura SiC V-Groove Trench MOSFETs (VMOSFETs) and power modules with low on-state resistance

15:40 - 16:00 Schweizer Electronic AG Christian Rössle Hochtemperatur-Leiterplatten für Leistungselektronische Anwendungen

16:00 - 16:20 Hollmén & Co Ltd Simon Wright Laser welded cooling solutions for next generation heat sinks and liquid coolers

16:20 - 16:40 FuG Elektronik GmbH Sven Seifert Applications of high voltage power supplies for tests of power electronics

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09:40 - 10:00 Traftor Europe Guillaume Pasquet Toroidal inductors from 20kVA to 500kVA: How to achieve higher performance and cost reduction combining optimized design and manufacturing capability

10:00 - 10:20 Hitachi Metals Europe GmbH

Tohru Umeno Innovative power application – Energy management –

From the battery to the final product by raw materials

and components

10:20 - 10:40 Mitsubishi Electric Europe B.V.

Eugen Wiesner MITSUBISHI ELECTRIC high voltage power semiconductors: What are the upcoming technologies and trends?

10:40 - 11:00 Vincotech GmbH Guillem Gargallo New VINcoNPC X12 - three-level Modules for 1+ MW 1500 V Solar PV InvertersDC

11:00 - 11:20 Kapteos S.A.S. Lionel Duvillaret A breakthrough in electromagnetism diagnostics using innovative optical sensors

11:20 - 11:40 ABB Switzerland Ltd. - Semiconductors

Raffael Schnell Drive the future with LinPak, the new low inductive power IGBT module

11:40 - 12:00 SEMIKRON International GmbH

Bernhard Eichler 1500VDC in Solar? Whatever you need, SEMIKRON is ready!

12:00 - 12:20 Allegro MicroSystems, LLC

Roland Heene Dan Jacques

Automotive and industrial gate driver ICs for battery operated equipment

12:20 - 12:40 POCO Holding Co., Ltd. yunfan zhang New magnetic powder cores for high frequency power conversion with negative temperature characteristics

12:40 - 13:00 HEIDEN power GmbH Ralph WoidichRonald A. Sommerer

Leistungsmessung ein- und mehrphasiger Systeme

13:00 - 13:20 ROHM Semiconductor GmbH

Aly Mashaly Potential of SiC for automotive applications

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Donnerstag, 18.05.2017 Thursday, 18 May 2017


09:40 - 10:00 MacMic Science & Technology Co., Ltd.

Kent Feng Cost Effective and High Performance Power Semiconductor for Inverter Welder and Power Source

10:00 - 10:20 POWERSYS Adrien Michel PSIM: Dynamic simulation platform for power electronics and motor drives

10:20 - 10:40 Analog Devices GmbH Tom Weingartner Connected Motion: ADI Deterministic Ethernet Solutions

10:40 - 11:00 Aperam Alloys Amilly Bashar Gony kµ magnetic core : An effective solution for the most demanding applications

11:00 - 11:20 EpiGaN nv Markus Behet From hype to reality: GaN/Si - where are we today?

11:20 - 11:40 Honeywell Europe N.V. Wilhelm Bloedorn High reliability thermal interface materials (TIMs) for advanced power applications

11:40 - 12:00 Exagan S.A. Eric Moreau Driving the GaN power device roadmap for large scale adoption

12:00 - 12:20 MB Electronic AG Helko Meuche New generation of magnetic materials, an optimum selection for power electronics

12:20 - 12:40 Amulaire Thermal Technology

Chihwei Wei Innovative design in IGBT cold plate

12:40 - 13:00 Wolverine Tube Inc. MicroCool Division

Matt Reeves High performance, cost effective, next generation liquid cooling

13:00 - 13:20 AC Power Corp. Daniel Tseng High power programmable AC and DC power source

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13:20 - 13:40 Magnetics Inc. Donna Kepcia Smaller-faster-lower cost: Magnetic materials meet rigorous demands in today’s high power, fast-paced design landscape

13:40 - 14:00 Hangzhou Firstack Technology Co., Ltd.

Jun Li 1500V NPC PV drive solution

14:00 - 14:20 Yole Developpement SA Jonathan Liao Status of the Gate Driver industry

14:20 - 14:40 tesema Leistungselektronik

Mezmur Asressahegn smart and compact high voltage power supply for air cleaning

14:40 - 15:00 GT elektronik GmbH & Co. KG

Matthias Hecht Scalable real power metering for industry 4.0

15:00 - 15:20 DEWETRON GmbH Christoph Wiedner Analysis of Poly-phase Power Systems with DEWETRON’s Mixed Signal Power Analyzer


Satoshi Endo Soft-PGS, new TIM for power module

15:40 - 16:00 Vincotech GmbH Michele Portico Embedded designs drive tomorrow’s solutions

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Fachforum Halle 6, Stand 143Industry Forum hall 6, booth 143



10:30 - 11:00 Universität Rostock Jan Fuhrmann Research activities of the University of Rostock for future off-shore wind grids

11:00 - 11:30 Fuji Electric Europe GmbH Daniel Hofmann 3.3kV SiC hybrid technology combined with HPnC package

11:30 - 12:00 RWTH Aachen University Hannes Nordmann Added Value For Batterymanagementsystems – Same Hardware, More Informationen, More Safety, More Reliablity

12:15 - 13:15 Power Systems Design Kevin Parmenter Developing the next generation of power supplies

13:30 - 14:00 Fraunhofer IAF Richard Reiner Monolithicallyintegrated GaN circuits

14:00 - 14:30 Technische Universität Wien

Manfred Schrödl Der PLANETENMOTOR – Eine neue, unkonventionelle Kombination von Elektromotor und Planetengetriebe für kompakte elektrische Antriebe

14:30 - 15:30 ROHM Co., Ltd. Kazuhide Ino Benefits and reliability of SiC devices for industrial and automotive applications

15:30 - 16:30 Award Gewinner Leo Lorenz Presentations of the Conference Award Winners 2017

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10:00 - 11:30 Yole Développement Pierric Gueguen and invited speakers

Status and perspectives in power semiconductor (Si, SiC, GaN) business

11:30 - 12:30 Roland Berger Michael AlexanderWolfgang BernhartJonas Zinn

Automotive electronics battleground: Semiconductor vs.Tier-1 business model

12:30 - 13:30 Infineon Technologies AG Peter Friedrichs Next steps in the industrialization of SiC power switches

13:30 - 14:30 A Media, Bodo's Power Systems

Bodo Arlt SIC – Design, EMC and measurement

14:30 - 15:30 A Media, Bodo's Power Systems

Bodo Arlt GaN – Design, EMC and measurement

15:30 - 16:30 Plexim GmbH Felix Prauße Software and hardware solutions for HIL and RCP applications in power electronics

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10:00 - 10:30 On Semiconductor Dominic Li Optimized high current IGBT gate driver improves system efficiency

10:30 - 11:30 Rohde & Schwarz GmbH & Co KG.

Josef Köppl Abwärme - eine Wärme, die keiner haben will. Neue Trends aus der Kühltechnologie

11:30 - 12:30 ECPE Lena Somschor Einführung in den students day

12:30 - 13:00 Monolith Semiconductor, Inc.

Sujit Banerjee SiC MOSFETs – How can we match the success of SiC diodes?

13:30 - 14:00 Brightek (Europe) Limited Joseph Hung NPI--A balancing act for engineers--Global component sourcing--

14:00 - 15:00 Danfoss Silicon Power GmbH

Alexander Streibel Boosting battery energy storage systems: Three-level power modules using SiC MOSFET

15:30- 16:00 ECPE Lena Somschor Verlosung Students Day

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E-Mobility-Forum Halle 6, Stand 326E-Mobility Forum hall 6, booth 326

Dienstag 16.05.2017 Tuesday 16 May 2017


10:00 - 10:30 Fraunhofer IIS-B Bernd Eckardt Power Electronics for next Generation Electric Vehicles

10:30 - 11:00 Littelfuse Carlos Castro Solutions for a safer E-Mobility

11:00 - 11:30 Infineon Technologies Laurent Beaurenaut Silicon Carbide Inverters: The Future of Electromobility

11:30 - 12:00 Rohm Semiconductors Akifumi Enomoto Jochen Hüskens

SiC solutions for eMobility

12:00 - 14:00 Pause/ Break

14:00 - 14:30 Phoenix Contact Jens Eickelmann High Power Charging - Das Laden von Elektrofahrzeugen mit bis zu 350 kW

14:30 - 15:00 Rutronik

TU Chemnitz

Andreas Mangler

Thomas Günther

Erweiterte Analyse-Funktionen im Batterie Management System – Impedanzspektroskopie das Schlüsselelement in der Reichweitenprognose

15:00 - 15:30 Mitsubishi Electric Khalid Hussein High-power Semiconductors for E-Mobility: Rising prospects and performance expectations

15:30 - 16:00 Keysight Thomas Leifert Design challenges developing the Connected and Electrical Car of the future

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Mittwoch 17.05.2017 Wednesday 17 May 2017


10:00 - 10:30 Fraunhofer IIS-B Bernd Eckardt Power Electronics for next Generation Electric Vehicles

10:30 - 11:00 Littelfuse Carlos Castro Solutions for a safer E-Mobility

11:00 - 11:30 Infineon Technologies Laurent Beaurenaut Silicon Carbide Inverters: The Future of Electromobility

11:30 - 12:00 Rohm Semiconductors Akifumi Enomoto Jochen Hüskens

SiC solutions for eMobility

12:00 - 14:00 Pause/ Break

14:00 - 14:30 Phoenix Contact Jens Eickelmann High Power Charging - Das Laden von Elektrofahrzeugen mit bis zu 350 kW

14:30 - 15:00 Rutronik

TU Chemnitz

Andreas Mangler

Thomas Günther

Erweiterte Analyse-Funktionen im Batterie Management System – Impedanzspektroskopie das Schlüsselelement in der Reichweitenprognose

15:00 - 15:30 Mitsubishi Electric Khalid Hussein High-power Semiconductors for E-Mobility: Rising prospects and performance expectations

15:30 - 16:00 Keysight Thomas Leifert Design challenges developing the Connected and Electrical Car of the future

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Donnerstag 18.05.2017 Thursday 18 May 2017


10:00 - 10:20 Dewesoft GmbHTU Leoben

Helmut Weiß Lithium-Ion-Batteries on Fire: Impressive Action + Demanding Measurement Task

10:20 - 10:40 ALPHA-Numerics GmbH Tobias Best 3D-CFD-Temperatursimulation von Automobilelektronik

10:40 - 11:00 WEVO-CHEMIE GmbH Artur Drachenberg Automobile Leistungselektronik – Innovative Verguss- und Klebelösungen

11:00 - 11:20 Schweizer Electronic AG Christian Rössle Sensor and Power PCBs for E-Mobility

11:20 - 11:40 SET Power Systems GmbH

Sebastian Liebig E-motor emulator: Testing power electronics without an E-motor


Dieter Volm Ultrafast disconnection of high voltage DC systems with powerfuse

12:00 - 12:20 Facta Sam Mudge How fuse design can support OEMs and T1 OEMs achieve ISO26262

12:40 - 13:00 ON-Semiconductor Fabio Necco Power MOSFETs in Automotive Applications

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pe2017 forum programs - mesago · 18.05.2017 · ausstellerforum, halle 7, stand 507 exhibitor...

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