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PMEG3002ESF30 V, 0.2 A low VF MEGA Schottky barrier rectifier17 February 2015 Product data sheet

1. General descriptionPlanar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier withan integrated guard ring for stress protection in a DSN0603-2 (SOD962-2) leadless ultrasmall Chip-Scale Package (CSP).

2. Features and benefits• Average forward current IF(AV) ≤ 0.2 A• Reverse voltage VR ≤ 30 V• Low forward voltage typ. VF = 310 mV• Low reverse current typ. IR = 0.33 µA• Package height typ. 0.3mm

3. Applications• Low voltage rectification• High efficiency DC-to-DC conversion• Switch mode power supply• Ultra high speed switching• LED backlight for mobile application

4. Quick reference dataTable 1. Quick reference dataSymbol Parameter Conditions Min Typ Max Unit

δ = 0.5; f = 20 kHz; Tamb ≤ 140 °C;square wave

[1] - - 0.2 AIF(AV) average forwardcurrent

δ = 0.5; f = 20 kHz; Tsp ≤ 148 °C;square wave

- - 0.2 A

VR reverse voltage Tj = 25 °C - - 30 V

VF forward voltage IF = 10 mA; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 310 390 mV

IR reverse current VR = 10 V; Tj = 25 °C; pulsed - 0.33 2 µA

trr reverse recovery time IF = 500 mA; IR = 500 mA;IR(meas) = 100 mA; Tj = 25 °C

- 1.42 - ns

[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.

© Nexperia B.V. 2017. All rights reserved

Nexperia PMEG3002ESF30 V, 0.2 A low VF MEGA Schottky barrier rectifier

PMEG3002ESF All information provided in this document is subject to legal disclaimers.

Product data sheet 17 February 2015 2 / 14

5. Pinning informationTable 2. Pinning informationPin Symbol Description Simplified outline Graphic symbol

1 K cathode[1]

2 A anode

Transparenttop view

21

DSN0603-2 (SOD962-2)

sym001

1 2

[1] The marking bar indicates the cathode.

6. Ordering informationTable 3. Ordering information

PackageType number

Name Description Version

PMEG3002ESF DSN0603-2 Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3mm

SOD962-2

7. MarkingTable 4. Marking codesType number Marking code

PMEG3002ESF K





8. Limiting valuesTable 5. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit

VR reverse voltage Tj = 25 °C - 30 V

IF forward current Tsp ≤ 145 °C; δ = 1 - 0.28 A

δ = 0.5; f = 20 kHz; Tamb ≤ 140 °C;square wave

[1] - 0.2 AIF(AV) average forward current

δ = 0.5; f = 20 kHz; Tsp ≤ 148 °C;square wave

- 0.2 A

IFRM repetitive peak forward current tp = 1 ms; δ ≤ 0.25 - 1.5 A

IFSM non-repetitive peak forwardcurrent

tp = 8 ms; Tj(init) = 25 °C; square wave - 3.5 A

[2] - 405 mW

[3] - 660 mW

Ptot total power dissipation Tamb ≤ 25 °C

[1] - 1200 mW

Tj junction temperature - 150 °C

Tamb ambient temperature -55 150 °C

Tstg storage temperature -65 150 °C

[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for anode and cathode

1 cm2 each.

9. Thermal characteristicsTable 6. Thermal characteristicsSymbol Parameter Conditions Min Typ Max Unit

[1][2] - - 310 K/W

[1][3] - - 190 K/W

Rth(j-a) thermal resistancefrom junction toambient

in free air

[1][4] - - 105 K/W

Rth(j-sp) thermal resistancefrom junction to solderpoint

[5] - - 40 K/W

[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reversepower losses PR are a significant part of the total power losses.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for anode and cathode

1 cm2 each.[4] Device mounted on a ceramic PCB, Al2O3, standard footprint.[5] Soldering point of anode tab.





aaa-006823

tp (s)10-3 102 10310110-2 10-1

102

103

Zth(j-a)(K/W)

10

duty cycle =

10.75

0.5

0.33 0.25

0.2 0.1

0.05

0

0.020.01

FR4 PCB, standard footprint

Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical valuesaaa-006824

tp (s)10-3 102 10310110-2 10-1

102

103

Zth(j-a)(K/W)

10

duty cycle =1

0.750.5

0.33 0.25

0.2 0.1

0.050.020.010

FR4 PCB, mounting pad for anode and cathode 1 cm2 each

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values





aaa-006825

tp (s)10-3 102 10310110-2 10-1

102

Zth(j-a)(K/W)

10

duty cycle = 1

0.75

0.5

0.330.25

0.20.1 0.05

0.020.010

Ceramic PCB, Al2O3, standard footprint

Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values





10. CharacteristicsTable 7. CharacteristicsSymbol Parameter Conditions Min Typ Max Unit

V(BR)R reverse breakdownvoltage

IR = 100 µA; tp = 300 µs; δ = 0.02;Tj = 25 °C

30 - - V

IF = 0.1 mA; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 185 255 mV

IF = 1 mA; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 245 320 mV

IF = 10 mA; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 310 390 mV

IF = 100 mA; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 405 480 mV

VF forward voltage

IF = 200 mA; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 460 535 mV

VR = 10 V; Tj = 25 °C; pulsed - 0.33 2 µAIR reverse current

VR = 30 V; Tj = 25 °C; pulsed - 1.8 9 µA

VR = 1 V; f = 1 MHz; Tj = 25 °C - 21 - pFCd diode capacitance

VR = 10 V; f = 1 MHz; Tj = 25 °C - 8 - pF

trr reverse recovery time IF = 500 mA; IR = 500 mA;IR(meas) = 100 mA; Tj = 25 °C

- 1.42 - ns





aaa-011861

VF (V)0 0.60.40.2

10-3

10-2

10-1

1

IF(A)

10-4

(1)

(2)

(3) (4) (5)

pulsed condition(1) Tj = 150 °C(2) Tj = 125 °C(3) Tj = 85 °C(4) Tj = 25 °C(5) Tj = −40 °C

Fig. 4. Forward current as a function of forwardvoltage; typical values

aaa-011862

VR (V)0 302010

10-2

10-3

10-4

10-5

10-6

10-7

10-8

10-9

10-10

IR(A)

10-11

(1)

(2)

(3)

(4)

(5)

pulsed condition(1) Tj = 150 °C(2) Tj = 125 °C(3) Tj = 85 °C(4) Tj = 25 °C(5) Tj = −40 °C

Fig. 5. Reverse current as a function of reversevoltage; typical values

VR (V)0 403010 20

aaa-011863

20

10

30

40

CD(PF)

0

f = 1 MHz; Tamb = 25 °C

Fig. 6. Diode capacitance as a function of reversevoltage; typical values

IF(AV) (A)0 0.30.20.1

aaa-012791

0.04

0.08

0.12

PF(AV)(W)

0

(1)

(2)

(3)(4)

Tj = 150 °C(1) δ = 0.1(2) δ = 0.2(3) δ = 0.5(4) δ = 1

Fig. 7. Average forward power dissipation as afunction of average forward current; typicalvalues





aaa-012792

VR (V)0 302010

0.010

0.015

0.005

0.020

0.025PR(AV)

(W)

0

(1)

(2)

(3)

(4)

Tj = 125 °C(1) δ = 1(2) δ = 0.9(3) δ = 0.8(4) δ = 0.5

Fig. 8. Average reverse power dissipation as afunction of reverse voltage; typical values

Tamb (°C)0 50 100 150 1751257525

aaa-012793

0.1

0.2

0.3

IF(AV)(A)

0

(1)

(2)

(3)

(4)

FR4 PCB, standard footprintTj = 150 °C(1) δ = 1; DC(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz

Fig. 9. Average forward current as a function ofambient temperature; typical values

Tamb (°C)0 50 100 150 1751257525

aaa-012794

0.1

0.2

0.3

IF(AV)(A)

0

(1)

(2)

(3)

(4)

FR4 PCB, mounting pad for anode and cathode 1

cm2 eachTj = 150 °C(1) δ = 1; DC(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz


Tamb (°C)0 50 100 150 1751257525

aaa-012795

0.1

0.2

0.3

IF(AV)(A)

0

(1)

(2)

(3)

(4)

Ceramic PCB, Al2O3, standard footprintTj = 150 °C(1) δ = 1; DC(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz






Tsp (°C)0 50 100 150 1751257525

aaa-012796

0.1

0.2

0.3

IF(AV)(A)

0

(1)

(2)

(3)

(4)

Tj = 150 °C(1) δ = 1; DC(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz

Fig. 12. Average forward current as a function of solder point temperature; typical values

11. Test information

time

IF

IR

trr

IR(meas)

006aad022

Fig. 13. Reverse recovery definition

tptcy

P

t006aac658

duty cycle δ =

tp

tcy

Fig. 14. Duty cycle definition





The current ratings for the typical waveforms are calculated according to the equations:IF(AV) = IM × δ with IM defined as peak current, IRMS = IF(AV) at DC, and IRMS = IM × √δ withIRMS defined as RMS current.

12. Package outline

14-12-03Dimensions in mm

0.6250.575

0.3250.275

0.4

0.150.13

0.320.28

0.250.23

0.03max1

2

Fig. 15. Package outline DSN0603-2 (SOD962-2)

13. Soldering

Footprint information for reflow soldering of leadless ultra small package; 2 terminals SOD962-2

sod962-2_fr

solder land

solder resist

solder land plus solder paste

solder paste deposit

Dimensions in mm

R0.025 (8×)

0.14(2×)

0.2(2×)

0.24(2×)0.4

0.85

0.4

Fig. 16. Reflow soldering footprint for DSN0603-2 (SOD962-2)





14. Revision historyTable 8. Revision historyData sheet ID Release date Data sheet status Change notice Supersedes

PMEG3002ESF v.2 20150217 Product data sheet - PMEG3002ESF v.1

Modifications: • Product status changed

PMEG3002ESF v.1 20140415 Preliminary data sheet - -





15. Legal information

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Productstatus [3]

Definition

Objective[short] datasheet

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Product[short] datasheet

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[2] The term 'short data sheet' is explained in section "Definitions".[3] The product status of device(s) described in this document may have

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Customers are responsible for the design and operation of theirapplications and products using Nexperia products, and Nexperiaaccepts no liability for any assistance with applications orcustomer product design. It is customer’s sole responsibility to determinewhether the Nexperia product is suitable and fit for thecustomer’s applications and products planned, as well as for the plannedapplication and use of customer’s third party customer(s). Customers shouldprovide appropriate design and operating safeguards to minimize the risksassociated with their applications and products.

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16. Contents1 General description ............................................... 12 Features and benefits ............................................13 Applications ........................................................... 14 Quick reference data ............................................. 15 Pinning information ...............................................26 Ordering information .............................................27 Marking ................................................................... 28 Limiting values .......................................................39 Thermal characteristics .........................................310 Characteristics .......................................................611 Test information ..................................................... 912 Package outline ................................................... 1013 Soldering .............................................................. 1014 Revision history ...................................................1115 Legal information .................................................1215.1 Data sheet status ............................................... 1215.2 Definitions ...........................................................1215.3 Disclaimers .........................................................1215.4 Trademarks ........................................................ 13

© Nexperia B.V. 2017. All rights reservedFor more information, please visit: http://www.nexperia.comFor sales office addresses, please send an email to: [email protected] Date of release: 17 February 2015