6

INARI AMERTRON

Key Sharing :

• Inari Insight• Business Segments• Key Technologies

• Business Advancement and Future Potentials• New Business Segments• Plans and Programs

• Summary of Core Service and Capabilities by Subsidiary

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

Business Model and Management Alignment

Be the Valued & Strategic

Partner to Niche Customers

Our Vision

• Need all levels to walk the talk at all times.

• Focus on the success Formula.

• To delight stakeholders, customers and employees.

Integrity

No Excuse

Result Oriented

Aligned Partnership• Customers – Our Team – Suppliers.

• Positive and Can-Do attitudes.Initiative

Our Key Beliefs

• Deliver TOP Quality Service &

Products To Our Customers

• Treat Staffs, Customers, Our

Business Partners Fairly

• Deliver Good Returns For Our

Shareholders

Our Mission

7

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

▪ Established in 2006, Inari is a leadingOSAT provider of semiconductorpackaging and testing services for crucialcomponents used in Radio Frequency (RF)wireless devices (e.g. smartphones, mediatablets, etc.).

▪ Inari Berhad successfully listed at BursaMalaysia ACE Market (Stock Code : 0166)on 19th July 2011.

▪ Completed acquisition of Amertron Inc.(Global) Limited for US$32.0 mil (RM102.9mil) on 25 June 2013, with corebusinesses of optoelectronicsmanufacturing and fibre-optics assembly– both fast growing segments of thesemiconductor industry.

▪ Enlarged Group has skilled workforce ofabout 6,000 across 12 manufacturingplants in Malaysia, China, and Philippines.

A Growing OSAT Player in the Semiconductor Industry with International Clientele…

8

1.18

-

200

400

600

800

1,000

1,200

1,400

FY07 FY08 FY09 FY10 FY11 FY12 FY13 FY14 FY15 FY16 FY17

Revenue (RM'million)

Highest Record since FY 2007

228

-

50

100

150

200

250

FY07 FY08 FY09 FY10 FY11 FY12 FY13 FY14 FY15 FY16 FY17

PAT (RM'million)

Highest PAT Record since FY 2007

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

Management Team

Connie ChanPA -CEO Office

KC LauGroup CEO

Corporate Malaysia Philippines

PL ChongGroup CFO

OL ChengBiz Dev/QMR

OL ChengISL/ IOT – Fiber Chip

LS ChoongCeedtec- ODM Test

Measurement Equip

Eugene KhooIIS – Test Solutions

BS OoiGM – Site Services

Sabran SamsuriITSB –RF SiP

KE CheeAmertron Philippines-Fiber Engine, Sensors, ICs

KE CheeISK –Fiber Engine

China

SH QiuAmertron Kunshan

-IR Sensors

9

Corporate Social Responsibility Policy

We Committed To Practice, Provide and

Continual Improve:

• Human Right and Integrity

• Safe and Conducive Working Environment

• Eco and Environmental Friendly Practices

• Good Corporate Governance and Ethics

• Meeting The Legal and Other Requirements

10

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

11

Current Focused Business Segments

s

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

OSAT

- Photonic Chip Fabrication (Facet coating)

- Fully integrated back-end wafer processing

- Integrated circuit package assembly

- Final packaging and testing

Key Products

- RF System-In-Package Flip Chip package, IC/Sensors, LED / Smart Display

- Photonic Laser, VCSEL and Detector Chips

- IRIS Scan for Korean Smartphones

ODM

- Complete test system development capability

- Design, develop and manufacturing of electronic test and measurement equipment

- Hardware development

- Test development

Key Products

- Automated Test Equipment (e.g. for automotive application)

- Precision Bench-top Power Sources for laboratories and manufacturing testing

- PCBA / Box build

Test Development

- Test Board and Demo Board design and layout

- Platform conversion for wafer and package level testing

- Scripting to coding test programs for Teradyne, Adventest and specific testers

Key Products

- RF test

- Fiber Optics test

- IR/ Sensors test

- Digital Test (define test methodology)

- LED / Smart Display

Our Values and Core Competencies

Process & Package

Development

- Package design

- PCB substrate design and leadframe design

- Automated manufacturing process

- Prototype samples

Key Products

- System-In-Package Multi-Chip Modules

- Integrated Flip Chip Modules

- Photonic Laser and IR Modules

12

Company ConfidentialCompany ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

P11,625 m

2

P36,406 m

2

P52,646 m

2

P83,623 m

2

P2118,580 m

2

P1315,422 m

2

▪ DC & RF wafer probing

▪ Wafer back-grinding

▪ Wafer laser marking

▪ Wafer sawing

▪ Wafer inspection

(automated Visual

inspection)

▪ Tape & Reel

Back-end

Wafer Processing

▪ Testing: RF, NF,

Harmonic, LNA

▪ Tape & Reel

▪ Failure analysis

▪ ATE

Final Test

▪ Surface mount technology

▪ Flip chip mounting

▪ Die attach

▪ Wire bonding

▪ Molding

▪ Laser marking

▪ Package sawing

Integrated Circuit

Package Assembly

End Market

▪ Smart Mobile Device

▪ Multi Bands phone

▪ Long Term Evolution (LTE)

Deployment

Inari Technology Key Product Portfolio Overview(RF Flip-Chip SiP (shipped more than 5b units) & IRIS Optoelectronic)

Optoelectronic

Iris

Camera

IR

LED

1mm

1m

m

6mm

4.5

mmFlip Chip SiP

Platform Sample

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

Wafer Probing & Processing

Wafer Foundry

Assembly

Final Test

CMOS/GaA/InP/CMOS

SOI

RF Modulation

Testing

LIV/Dynamic Testing

Logic Testing

SiP (IC Packaging)

SoC (WLP)

Integrated System Module

(ISM)

Inari

Technology

Inari South

Keytech

Inari

Semiconductor

Lab

Amertron

(Philippines)

Inari Integrated

Systems

EMS

MEMS/ Si Wafer

Box Build

Integrated System Module

(ISM)

Inari

Technology

Inari

Semiconductor

Labs

Technical Competency, Capability & Services

External / Customer Foundry

Amertron

(Philippines)

Ceedtec

Cu Pillar Bumping Eye Diagram

Testing

CoC (WLP)

Inari

Technology

Inari Amertron Penang and Philippines

Products Portfolio

Fiber Optics

Transceiver

RF SiP Modules

Applications

Main Packages

IC / Hermetic

Smart Display

Products

15

Inari Amertron Kunshan China

Products Portfolio Other Packages

16

17

INARI AMERTRON

Key Sharing :

• Inari Today• Business Segments• Key Technologies

• Business Advancement and Future Potentials• New Business Segments• Plans and Programs

• Summary of Core Service and Capabilities by Subsidiary

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

New Business Potential and Our FocusIoT (Internet of Things) – Connectivity

Semiconductor IoT: $X Trillions (Source: PWC May 2015)

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

New Business Potential and Our FocusWired Connectivity (Photonic Fiber Optics)

Current Business

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

New Business Potential and Our FocusWireless Connectivity (RF Photonics) Using Existing RF SiP platform

Photonics Sensing

Source Yole

RF Signal Transceiver

RF Photonics

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

IoT Areas of Future ApplicationsBe Part of The Supply Chains

Source: Keysight

-Smart Phone-IRIS

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

INDUSTRY 4.0

CREATE VALUE

FC-SiP + CoC + PEP

Inari’s Value Creations & New Paradigm

PLATFORM:

BACKBONE:

PARADIGM:

INDUSTRY 3.0

VALUE ADD

FC-SiP + CoC

• WIRELESS RF

• PHOTONICS (FO)

• OPTO (IRIS SENSORS)

COMBINING SoC & SiP – Higher

Value System• RF in SiP of MEDICAL WEARABLE

• SiP of CMOS/Emitter /Lasers/Sensors

• WIRED CONNECTIVITY

NEXT GENERATION• WIRELESS RF

• PHOTONICS (FO)

• OPTO (IRIS SENSORS)

“Manufacturing Excellence with I4.0”

End Market

▪ Smart Mobile Device

▪ Multi Bands phone

▪ Long Term Evolution (LTE)

Deployment

Optoelectronic

Iris

Camer

a

IR

LED

“Current….”

ECOSYSTEM:Technology & Innovation/

Talents/Automation/ IT

Total Supply

ChainIndustry 4.0+

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

23

FRONT END

TECHNOLOGY

COLLABORATION

Enlarging Higher-Value Local Eco System Cluster

NICHE SPECTRUM

PARTNERSHIP WITH

BROADCOM and OSRAM

+CURRENT INARI DRIVEN

LOCAL ECO SYSTEMGovernment Collaboration• MIDA• MITI

• NCIA

• MDeC

• Local Authorities

Value

Creation

Ecosystem

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

Appendix

Key Factories and Facilities

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

P5Flip Chip Tape and Reel ( ~ 120 Systems )

• 100% Locally Designed and Fabricated

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

P8• In Avago Factory (RF Testing)

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

P13• RF Testing

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

P13• Chip Fab and Wafer

Certification

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

P21• Mixed Signal Testing

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

P21• IRIS Scanner

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

AMERTRON CLARK

CK2• Optocoupler product

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

P13 B Phase 1

3 Storey Front L Block

Additional Floor Space ~60K Sqft

Expansion Plan

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

P13 Extension (Phase 1)For RF expansion

Status update:

• Phase 1 construction completed within 3 months

- Production on Aug’17.

Before After

Plan

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

P13 B Phase 2

(Under Construction)

4 Storey Building

Target Mid May’18

Additional Floor Space ~120K Sqft

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

P13 Extension (Phase 2) For RF and Chip Fab Expansion

Before After

Total 340,000 Sqft

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

INARI Batu Kawan

(Under Planning)

PHASE 1: 6 STOREY BLOCK A

PHASE 2: 5 STOREY EXTENSION BLOCK B, 6 STOREY BLOCK C & 6 STOREY BLOCK D

Additional Floor Space ~600K Sqft

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

Private & Confidential

KEY FINANCIAL HIGHLIGHTS

FINANCIAL PERIOD ENDED 31 DECEMBER 2017

Q2 FY 2018

28 February 2018

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

Q2 FY 2018 Performance –At Glance

5 Locations, 12 Plants, Over 6,000 Employees

Revenue

Net Earnings

EBITDA

Net Assets

Debt-to-Equity

RM375.9 mil

RM69.1 mil

RM99.8 mil

RM987.5 mil

0.03x

Highest since listing

Highest since listing

Highest since listing

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

(RM’ mil) Q2 18 Q2 17

Revenue +37%

yoy375.9 275.1

PAT +11%

yoy69.1 62.4

EBITDA +25%

yoy99.8 79.6

EPS – basic

(sen)

+3%

yoy3.37 3.26*

FY 2018 2nd Quarter Ended 31 December 2017

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

P & L Analysis

Q2 18 Q2 17 Q1 18

RM’mil RM’mil RM’mil

Revenue 375.9 275.1 373.1

PAT 69.1 62.4 68.7

Margin (%) 18.4% 22.7% 18.4%

Less: Grant income - (5.6) -

PAT (Excl. Grant Income) 69.1 56.8 68.7

Add/(Less): Net Forex Loss/(Gain) 10.8 (23.1) 3.4

PAT (Excl. Grant Income & Forex) 79.9 33.7 72.1

Margin (%) 21.2% 12.2% 19.3%

Add: Depn and amort. 21.5 14.9 23.2

PAT (Excl. Forex & Depn.) 101.4 48.5 95.3

Margin (%) 27.0% 17.6% 25.5%

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

Revenue Analysis

Revenue (Q2 18)

RM375.9 mil (+37% yoy)

Highest revenue by quarter since listing

222 228 228

255

275 294

217

257

282 275

346 346

373 376

-

100

200

300

400

Q1 15 Q2 15 Q3 15 Q4 15 Q1 16 Q2 16 Q3 16 Q4 16 Q1 17 Q2 17 Q3 17 Q4 17 Q1 18 Q2 18

RM

'mil

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

PAT, Net Margin and EBITDA Trends

PAT

Q2 18 : RM69.1 mil (YTD 18: RM137.8 mil)

Q2 17 : RM62.4 mil (YTD 17: RM110.5 mil)

EBITDA

Q2 18 : RM99.8 mil (YTD 18: RM197.1 mil)

Q2 17 : RM79.6 mil (YTD 17: RM143.7 mil)

34

39 37 40

43 43

23

39

48

62

52

66 69 69

-

20

40

60

80

100

Q1 15Q2 15Q3 15Q4 15Q1 16Q2 16Q3 16Q4 16Q1 17Q2 17Q3 17Q4 17Q1 18Q2 18

PATRM'm

42

50 48 52

57 58

36

58 64

80

71

95 97 100

-

20

40

60

80

100

120

Q1 15Q2 15Q3 15Q4 15Q1 16Q2 16Q3 16Q4 16Q1 17Q2 17Q3 17Q4 17Q1 18Q2 18

EBITDA

Highest since listing

in 2011Highest since listing

in 2011

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

Healthy Financial Position – As At Q2 FY2018

Cash and cash

equivalent

RM486.3 mil

Net cash from

operations (YTD)

RM176.1 mil

Property, plant and

equipment (NBV)

RM383.3 mil

Capacity Investment

RM100.4 mil

+90% yoy(from RM52.8mil)

Borrowings

RM32.3 mil

Debt/Equity Ratio

0.03x

Strong Liquidity Capacity InvestmentBorrowings

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

Share CapitalQ2 18

2.1 bil shares

Q2 17

970.7 mil shares

Enlarged Shareholders’ Equity

Net AssetsQ2 18

RM987.5 mil

Q2 17

RM800.1 mil

Market CapitalisationRM7.1 bil @ RM3.45/share (@ 27.2.18)

RM6.9 bil @ RM3.40/share (Q2 18)

RM3.2 bil @ RM3.32 per share (Q2 17)

45 83

158

258

537

684

876 915

988

-

200

400

600

800

1,000

1,200

FY11 FY12 FY13 FY14 FY15 FY16 FY17 Q1 18 Q2 18

Shar

eho

lder

s' E

qu

ity

(RM

'mil)

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

EPSYTD Q2 18 : 6.78 sen

YTD Q2 17 : 5.75 sen*

NA per share and EPS Analysis

*adjusted for bonus issue for comparison purpose

NA per shareAs at Q2 18 : RM0.48

As at Q2 17 : RM0.27*

0.03 0.06

0.10

0.15

0.28

0.35

0.44 0.48

1.41 1.34

2.73

6.07

8.47 7.76

11.68

-

2.00

4.00

6.00

8.00

10.00

12.00

-

0.10

0.20

0.30

0.40

0.50

0.60

FY 11 FY 12 FY 13 FY 14 FY 15 FY 16 FY 17 Q2 18 (6 mths)

EPS

(sen

)

NA

per

sh

are

(RM

)

NA per share & EPS

NA per share (RM) EPS (Sen)

Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative Company ConfidentialI – Integrity N – No Excuse A – Aligned Partnership R – Result Oriented I – Initiative

Growing Shareholder Value

Dividend Payout Ratio Total Cash Payout Dividend Yield

YTD Q2 18 (6 mths)

72.0%

FY 2017 (12 mths)

72.2%

YTD Q2 18 (6 mths)

RM99.2 mil

FY 2017 (12 mths)

RM165.0 mil

Q2 18

3.3% (Annualised) Q1 18 @ 0.9% (2.3 sen/RM2.54)

Q2 18 @ 0.7% (2.5 sen/RM3.40)

FY 2017 (12 mths)

4.6% (9.8 sen / RM2.11)

6.0 9.3 16.3

35.4

60.3 74.4

165.0

52.1

32%

48%

40%35%

40%

51%

72% 72%

0%

10%

20%

30%

40%

50%

60%

70%

80%

FY 11 FY 12 FY 13 FY 14 FY 15 FY 16 FY 17 Q2 18 (6mths)

-

50.0

100.0

150.0

200.0

250.0

Dividend Payout Ratio & Cash Payout

Cash Payout (RM'mil) Payout Ratio (%)

1.8

2.8

4.5

6.8

8.9 8.4

9.8

4.8

-

2.0

4.0

6.0

8.0

10.0

12.0

FY 11 FY 12 FY 13 FY 14 FY 15 FY 16 FY 17 Q2 18 (6mths)

Sen

Dividend Payout (Per Share)

Actualising Through

Technology & Innovation

THANK YOU