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Product Change Notification
Integration of Supertex Products into Microchip Technology
ADDENDUM TO SUPERTEX PCN-1403 (ISSUED APRIL 1, 2014)
Summary of Changes
Ordering Part NumberPart AgingLot TraceabilityStandardized LabelingStandardized BQM (Base Quantity Multiple)Combination RulesProduct Packing MethodsShipping Boxes
Updated
Updated
Updated
Ordering Part Number
What is Changing? Reason for ChangeWe will replace any spaces in theordering part number with a dash
Consistency and compatibility with Microchip’s existing ordering part number format
Pre:
HV9210NG-G M901
Post:
HV9210NG-G-M901
For a complete list of all affected ordering part numbers, please reference the attachment “PCN1403addendum_OrderingPartNumber.pdf”
Updated List Available
Part Aging
What is Changing? Reason for ChangeMicrochip can ship parts up to 4 years old without requiring a waiver from the customer. Parts older than 2 years old will be recertified prior to shipment.
Material sets used to manufacture integrated circuits have shown no degradation in solderability, moisture sensitivity or reliability of products after 4 years.
For more information related to Microchip’s part aging strategy, please visit the following link on our website:
http://ww1.microchip.com/downloads/en/Market_Communication/Microchip%20part%20age%20policy%20final_2_15_14.pdf
Lot Traceability
What is Changing? Reason for ChangeConvert Supertex lot number format to Microchip Lot Number format. Change the Topside Mark to replace Supertex Lot Number with Microchip Tracecode, Standardize to JEDEC marking for “Green” packages
Improves Microchip capability to provide traceability of products through manufacturing processes and to customers.
PRE CHANGE POST CHANGE
Updated List Available
Lot Traceability
Updated List Available
For a general guideline/matrix referencing pre- and post- part marking changes, please reference the attachment
“PCN1403addendum_PartMarkingGuideline.pdf”
Additional Info
For a complete list of all affected ordering part numbers, please reference the attachment
“PCN1403addendum_OrderingPartNumberReferenceforPartMarkingChart.pdf”
Example
Example
Standardize Labeling
What is Changing? Reason for ChangeConvert to the Microchip MSLCaution labels (MSL-1, MSL-2, MSL-3)Convert to Microchip labels for Reels, Bags, Inner boxes and Outer cartons
Improve operational efficiencies and cycle times by reducing process variation.
MSL Caution label(MSL-3)
PRE CHANGE POST CHANGE
24
168
3
MSL Caution label(MSL-6)
PRE CHANGE POST CHANGE
No ChangeWill keep existing MSL-6
Caution Label from Supertex
INNER BOX / REEL / BAG LABELS
PRE CHANGE POST CHANGE
Dimension: 100mm. x 60mm.
OUTER LABEL
PRE CHANGE POST CHANGEDimension: 152 mm. x 102 mm.
152 mm.
102
mm
.
No Attention label, preprint on Carton
Standardize BQM
What is Changing? Reason for ChangeStandardize the Base Quantity Multiple (BQM) to Microchip standards for tape and reel quantities (other packing media types are unaffected).
Improve operational efficiencies and cycle times by reducing process variation.
Package Lead count Body size PRE CHANGE POST CHANGEDFN 6 3x3x0.8mm 3000 3300DFN 8 3x3x0.8mm 3000 3300DFN 10 3x3x0.8mm 3000 3300QFN 16 3x3x0.9mm 3000 3300DFN 10 3x4x1.0mm 3000 3300QFN 16 4x4x0.9mm 3000 3300DFN 8 4x4x1.0mm 3000 3300DFN 10 4x4x0.8mm 3000 3300DFN 12 4x4x1.0mm 3000 3300QFN 12 4x4x0.9mm 3000 5000QFN 16 4x4x1.0mm 3000 3300QFN 24 4x4x0.9mm 3000 3300DFN 8 5x5x1.0mm 2500 3300DFN 18 5x5x1.0mm 2500 3300QFN 32 5x5x1.0mm 2500 3300QFN 32 5x5x0.8mm 2500 3300QFN 40 5x5x0.8mm 2500 3300QFN 33 6x6x1.0mm 2000 3000QFN 44 7x7x0.8mm 2000 3000QFN 48 7x7x1.0mm 2000 3000QFN 56 8x8x1.0mm 2000 3000
Tape and ReelBQM Changes
Updated Slide
Package Lead count Body size PRE CHANGE POST CHANGESOT-23 5 -- 2500 3000
SOT-223 3 -- 2500 4000SOIC 8 150mils 2500 3300SOIC 14 150mils 2500 2600SOIC 16 150mils 2500 2600SOIC 20 300mils 1000 1600SOIC 28 300mils 1000 1600SSOP 20 -- 1500 1600PLCC 28 11.5x11.5x4.3 500 750
Tape and ReelBQM Changes
Updated Slide
For a complete list of all affected ordering part numbers, please reference the attachment
“PCN1403addendum_BQMOrderingPartNumber.pdf”
Combination Rules
What is Changing? Reason for ChangeStandardize to Microchip methodsfor combining production lots, trace codes and date codes into tubes, trays, and reel media.
Microchip follows the combination rules defined by JEDEC for immediate packaging (tubes, trays, reels).
Change to Shipping Combination Rules
Packing Media Combination Pre Change Combination Post Change
Tube
1 Date Code 1 Date Code1 Lot Number No limit to the number of production lot
numbers – follow date code combination rule.
Bag
1 Date Code 3 Date codes 1 Lot Number No limit to the number of production lot
numbers – follow date code combination rule.
Tray
1 Date Code 3 Date codes 1 Lot Number No limit to the number of production lot
numbers – follow date code combination rule.
Tape and Reel
2 Date Codes 3 Date codes 2 Lot Numbers No limit to the number of production lot
numbers – follow date code combination rule.
1 Country of Origin – multiple assemblers if they located at the same country.
1 Assembly site
Multiple test site. 1 Test site
Product Packing
What is Changing? Reason for ChangeStandardize to Microchip systems and processes for packing materials.
Reduce the environmental footprint for Microchip and customers by removing unnecessary packing materials.
Packing Methods
Change Packing MethodsRemove Inner Box for listed MSL-1 devicesChange Dry Pack for Tray Change Non-Dry Pack for 7” Tape and ReelChange Non-Dry Pack for 13” Tape and ReelChange Dry Pack for 13” Tape and Reel Change Dry Pack for Tape and Reel of QFP Packages
Updated Slide
Change Packing MethodDry Pack for Trays
PRE CHANGE POST CHANGE
Trays pack (5 full packs + 1 cover tray)
Desiccants (x2)
10% 20% 60%
Antistatic PP Straps (x3)HIC Card (x1)
Moisture barrier Bag 280 x 560
Moisture Barrier Bag (Sealed)
Production Label
Green/ESD Label
MSL Label
P2 Label
Antistatic PP Straps (x4)
PRE CHANGE POST CHANGE
Change Packing Method non-Dry Packfor 7” Tape and Reel for all packages
Green/ESD LabelUser Direction of Feed(
P2 Label
Production Label
P2 Label
Green/ESD Label
Pink Poly Bag
Blue color reel
Reel label on opposite sprocket holes side
Bag label
Static shielding bag
Protective band at outmost layer
PRE CHANGE POST CHANGE
Change Packing Method non-Dry Packfor 13” Tape and Reel for all packages
Green/ESD LabelUser Direction of Feed(
P2 Label
Production Label
P2 Label
Green/ESD Label
Pink Poly Bag
Blue color reel
Reel label on opposite sprocket holes side
Bag label
Protective band at outmost layer
Static shielding bag
PRE CHANGE POST CHANGE
Change Packing Method Dry Pack for 13” Tape and Reel for all packages
Moisture barrier bag 400 x 440 mm.
2 units of desiccant
Blue color reel
3-dot HIC centered
Green/ESD LabelUser Direction of Feed(
P2 Label
Production Label
Green/ESD Label
P2 Label
MSL Label
Moisture Barrier Bag
Production Label
Desiccants (x2)
HIC Card (x1)
Production Label
PRE CHANGE POST CHANGE
Change Packing Method Dry Pack for Tape and Reel of QFP
Add cushion to protect part in tape and reel dry pack
Add Bubble Sheet
Pizza Box
Green/ESD Label
P2 Label
Green/ESD Label
P2 Label
MSL Label
Moisture Barrier Bag
Production Label
Desiccants (x2)
HIC Card (x1)
Shipping Boxes
What is Changing? Reason for Change
Standardize to Microchip systems and processes for shipping boxes.
Reduce the environmental footprint for Microchip and customers by removing unnecessary packing materials. Improve operational efficiencies and cycle times by reducing process variation.
7 Inch Reel Inner Boxfor dry pack
PRE CHANGEDimension: 184.2 x 235 x 25.4 mm.
POST CHANGEDimension: 204 x 220 x 35 mm.
25.4
184.2235
PRE CHANGEDimension (W x L x H) mm
POST CHANGEDimension (W x L x H)
7 Inch Reel Outer Cartonfor dry pack
Length Width Height254 254 254412 412 110410 410 200406 406 305406 406 406597 406 406572 381 279
Length Width Height220 220 120205 460 228
PRE CHANGEDimension: 368.3 x 368.3 x 38.1 mm
POST CHANGEDimension: 342 x 365 x 50 mm
13 Inch Reel Inner Box-smallfor dry pack
PRE CHANGEDimension: 368.3 x 381 x 54 mm
POST CHANGEDimension: 353 x 370 x 78 mm
13 Inch Reel Inner Box-largefor dry pack
PRE CHANGE
Dimension: (W x L x H) mm
POST CHANGEDimension: (W x L x H)mm
13 Inch Reel Outer Cartonfor dry pack
Length Width Height412 412 110410 410 200406 406 305406 406 406597 406 406572 381 279
Length Width Height380 380 380286 375 362405 660 385360 390 385365 384 220380 380 160400 380 80400 380 50400 380 30
Tube Inner box for dry pack
PRE CHANGEDimension: 120.7x184.2x63.5mm
POST CHANGE
Dimension: 129 x 565 x 80 mm
Tubes Outer Cartonfor dry pack
PRE CHANGEDimension:(W x L x H) mm
POST CHANGEDimension:(W x L x H) mm
Length Width Height609 203 203609 254 203597 40.6 406572 381 279
Length Width Height430 657 187.5330 580 230330 580 160160 580 130160 580 90
Tray Inner box for dry pack
PRE CHANGE POST CHANGEDimension: 158.8 x 368.3 x 85.7 mm Dimension: 166 x 371.5 x 88 mm
PRE CHANGEDimension:(W x L x H) mm
POST CHANGEDimension:(W x L x H) mm
Tray Outer Cartonfor dry pack
Length Width Height609 203 203609 254 203410 410 200406 406 305406 406 406597 406 406572 381 279
Length Width Height380 380 380405 660 385360 390 385365 384 220345 392 195380 380 160210 390 100
Reel diameterPRE CHANGE
W x L x H (cm)POST CHANGE
W x L x H (cm)
7” N/A
21x21x5.5
21x21x8
16x21.5x21
21x31x21
32x63x15.5
13” N/A
36.5x38x39.5
35.5x35.5x4
35.5x35.5x6
35.5x35.5x16.5
Outer carton for non dry pack T/R (no inner)
Outer carton for non dry pack Tube (no inner)
PRE CHANGEW x L x H (cm)
POST CHANGEW x L x H (cm)
N/A
15x71.5x5
17x65x8
15.5x62x14
22.5x63x16.5
32x63x15.5
36x63x16.5
15x64x5.5
15x64x10
15x64x14
28x63x11
28x63x15.5
28x63x20
MEDIA PRE CHANGEW x L x H (cm)
POST CHANGEW x L x H (cm)
BAG N/A18x37.5x4.4
18x37.5x7
TRAY N/A
18x37.5x4.4
18x37.5x7
18x37x16
35.5x35.5x16.5
36.5x38x39.5
Outer carton for non dry pack Bag and Tray (no inner)
OrderiWhat isthe spac Reasonpart num
Su
CC
HHH
H
ng Part N changing
ce with a da
n for changmber format
P/N PRE‐CHAupertex Orde
2N6660 H2N6660 H2N6661 H2N7000‐G DAT9932TS‐GCL2N3‐G DCL2N3‐G DCL2N3‐G P
CL8800K63‐GCL8801K63‐GDN2535N3‐GDN2535N3‐GDN2540N3‐GDN3545N8‐GDN3545ND DN3545ND
HV20220FG‐GHV20220FG‐GHV20220PJ‐GHV20220PJ‐GHV20822FG‐GHV214FG‐G HV2201FG‐GHV2201PJ‐G HV2301FG‐GHV230GA‐G HV2601BD MHV2701BD MHV2701FG‐GHV2809K6‐G HV509K6‐G HV518P‐G SHV518PJ‐G M
Number C: Microchipash (-).
ge: consistet.
ANGE ring P/N 043 365 029 D596 G S372 D591 D602 P002 G M935 G M935 G P003 G P013 G P003 G D561 D560 D561 G M931 SM270
G M904 G S323 G M931 S337 M931 M904 M931 M918 M936 M936 M931 M937 M932 S313 M903
Change p will remov
ency and co
PNEW
CC
HHH
H
H
H
HH
ve any spac
ompatibility
P/N POST‐CHMicrochip Or2N6660‐H02N6660‐H32N6661‐H02N7000‐G‐DAT9932TS‐GCL2N3‐G‐DCL2N3‐G‐DCL2N3‐G‐P
CL8800K63‐GCL8801K63‐GDN2535N3‐GDN2535N3‐GDN2540N3‐GDN3545N8‐GDN3545ND‐DN3545ND‐
HV20220FG‐GV20220FG‐G‐HV20220PJ‐GHV20220PJ‐GHV20822FG‐GHV214FG‐G‐HV2201FG‐G‐HV2201PJ‐G‐HV2301FG‐G‐HV230GA‐G‐HV2601BD‐MHV2701BD‐MHV2701FG‐G‐HV2809K6‐G‐HV509K6‐G‐HV518P‐G‐SHV518PJ‐G‐M
ces with the
with Micro
HANGE rdering P/N043 365 029 D596 ‐S372 D591 D602 P002 ‐M935 ‐M935 G‐P003 G‐P013 G‐P003 G‐D561 D560 D561 G‐M931 ‐SM270 ‐M904 G‐S323 G‐M931 ‐S337 ‐M931 ‐M904 ‐M931 ‐M918 M936 M936 ‐M931 ‐M937 M932 S313 M903
PC
e part numb
chip’s exist
CN1403_addendum_J
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June2014
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Su
HH
HHHH
H
HHHHHHH
HHHHH
H
P/N PRE‐CHAupertex OrdeHV5308DJ‐B
HV5308PG‐B‐GHV5308PJ‐B‐GHV5522K7‐GHV5523K7‐G HV5622K7‐GHV5623K7‐G HV57009PG‐GHV5812PJ‐G HV7350K6‐G HV850MG‐GHV850X S3
HV9110NG‐G HV9120NG‐GHV9123NG‐GHV9123NG‐GHV9803BLG‐GHV9803LG‐GHV9901NG‐GHV9910BLG‐GHV9910BLG‐GHV9910BNG‐GHV9910BNG‐GHV9910CNG‐GHV9911NG‐GHV9911NG‐GHV9912NG‐GHV9912NG‐GHV9931LG‐GHV9961NG‐GHV9961NG‐GHV9963NG‐GHV9963NG‐GHV9963NG‐G HV9980WG‐GHV9982K6‐G HV9982K6‐G HV9989K6‐G LND150N3‐G
ANGE ring P/N M903 G M919 G M903 G S344 M933
G S343 M933 G S236 M904 M937
G S329 329 SM267
G M901 G M901 G M934 G S376 G S374 G M901 G S363 G S373 G M901 G M934 G M934 G M901 G M934 G M901 G M934 G S350 G M901 G M934 G M901 G M934 SM359 G S345 M935 SM370 M935
G P002
PNEW
HH
H
HH
H
HHHHH
HHHHHHHHHH
HHHHHHHHH
P/N POST‐CHMicrochip OrHV5308DJ‐B‐V5308PG‐B‐GHV5308PJ‐B‐GHV5522K7‐GHV5523K7‐G‐HV5622K7‐GHV5623K7‐G‐HV57009PG‐GHV5812PJ‐G‐HV7350K6‐G‐HV850MG‐GHV850X‐S3
HV9110NG‐G‐HV9120NG‐GHV9123NG‐GHV9123NG‐GHV9803BLG‐GHV9803LG‐GHV9901NG‐GHV9910BLG‐GHV9910BLG‐GHV9910BNG‐GHV9910BNG‐GHV9910CNG‐GHV9911NG‐GHV9911NG‐GHV9912NG‐GHV9912NG‐GHV9931LG‐GHV9961NG‐GHV9961NG‐GHV9963NG‐GHV9963NG‐GHV9963NG‐G‐HV9980WG‐GHV9982K6‐G‐HV9982K6‐G‐SHV9989K6‐G‐LND150N3‐G
HANGE rdering P/N‐M903 G‐M919 G‐M903 G‐S344 ‐M933 G‐S343 ‐M933 G‐S236 ‐M904 ‐M937 G‐S329 329 ‐SM267 ‐M901 ‐M901 ‐M934 G‐S376 G‐S374 ‐M901 G‐S363 G‐S373 G‐M901 G‐M934 G‐M934 ‐M901 ‐M934 ‐M901 ‐M934
G‐S350 ‐M901 ‐M934 ‐M901 ‐M934 ‐SM359 G‐S345 ‐M935 SM370 ‐M935 G‐P002
PCCN1403_addendum_J
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Su
MMMM
P/N PRE‐CHAupertex OrdeLND150N3‐GLND150N3‐GLND150N3‐GLR645N3‐G LR645N3‐G LR745N3‐G LR745N3‐G LR8N3‐G P
MD0105K6‐GMD1711FG‐GMD1711K6‐GMD1715K6‐GPS10NG‐G MTC6320K6‐GTC6320TG‐GTC6320TG‐GTC8020K6‐G TD9944TG‐GTN0104N3‐GTN0104N3‐GTN0106N3‐GTN0106N3‐GTN0110N3‐GTN0604N3‐GTN0604N3‐GTN0610N3‐GTN0610N3‐GTN0620N3‐GTN0620N3‐GTN0620N3‐GTN1504ND TN2124K1‐GTN2510N8‐GTN2540N3‐GTN5325N3‐GTN5335K1‐GTP0606N3‐GTP0606N3‐GTP2104N3‐G
ANGE ring P/N G P003 G P013 G P014 P003 P013 P003 P013
P003 G M932 G M931 G M933 G M935 M905 D626
G D607 G D626 M937
G D590 G P003 G P014 G P003 G P013 G P002 G P005 G P013 G P003 G P013 G D163 G P002 G P014 D562 G D545 G D592 G P002 G P002 G D589 G P002 G P003 G P003
PNEW
MMMM
T
T
T
P/N POST‐CHMicrochip OrLND150N3‐GLND150N3‐GLND150N3‐GLR645N3‐G‐LR645N3‐G‐LR745N3‐G‐LR745N3‐G‐LR8N3‐G‐P
MD0105K6‐GMD1711FG‐GMD1711K6‐GMD1715K6‐GPS10NG‐G‐MTC6320K6‐G‐TC6320TG‐G‐TC6320TG‐G‐TC8020K6‐G‐TD9944TG‐GTN0104N3‐GTN0104N3‐GTN0106N3‐GTN0106N3‐GTN0110N3‐GTN0604N3‐GTN0604N3‐GTN0610N3‐GTN0610N3‐GTN0620N3‐GTN0620N3‐GTN0620N3‐GTN1504ND‐TN2124K1‐G‐TN2510N8‐GTN2540N3‐GTN5325N3‐GTN5335K1‐G‐TP0606N3‐GTP0606N3‐GTP2104N3‐G
HANGE rdering P/NG‐P003 G‐P013 G‐P014 ‐P003 ‐P013 ‐P003 ‐P013 P003 ‐M932
G‐M931 ‐M933 ‐M935 M905 ‐D626 ‐D607 ‐D626 ‐M937 ‐D590
G‐P003 G‐P014 G‐P003 G‐P013 G‐P002 G‐P005 G‐P013 G‐P003 G‐P013 ‐D163
G‐P002 G‐P014 D562 ‐D545 ‐D592
G‐P002 G‐P002 ‐D589 ‐P002 ‐P003 ‐P003
PCCN1403_addendum_J
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Su
P/N PRE‐CHAupertex OrdeTP2540N3‐GTP5335K1‐GVN0104N3‐GVN0106N3‐GVN0300L‐G VN0335NW VN0550N3‐GVN0606L‐G VN10KN3‐G VN10KN3‐G VN10KN3‐G VN10KN3‐G VN1206L‐G VN1210N2 VN1210ND VN2106ND VN2106NW VN2110ND VN2110NW VN2222LL‐GVN2222LL‐GVN2410L‐G VN2410L‐G VN2450ND VN2460N3‐GVN2460N3‐GVN3205N3‐GVN3205N8‐GVP0335NW VP0550N3‐GVP0550N3‐GVP1210ND VP2110K1‐GVP2206N3‐GVP2206ND VP2450ND
ANGE ring P/N G P002 D588 G P013 G P003 P002 D301
G P013 P003 P002 P003 P013 P014 P002 H212 D623 D595 D619 D491 D614
G P003 G P013 P013 P014 D621 G P003 G P014 G P002 G D576 D300
G D559 G P013 D624 D537
G P003 D613 D622
PNEW
V
P/N POST‐CHMicrochip OrTP2540N3‐GTP5335K1‐G‐VN0104N3‐GVN0106N3‐GVN0300L‐G‐VN0335NW‐VN0550N3‐GVN0606L‐G‐VN10KN3‐G‐VN10KN3‐G‐VN10KN3‐G‐VN10KN3‐G‐VN1206L‐G‐VN1210N2‐HVN1210ND‐VN2106ND‐VN2106NW‐VN2110ND‐VN2110NW‐VN2222LL‐G‐VN2222LL‐G‐VN2410L‐G‐VN2410L‐G‐VN2450ND‐VN2460N3‐GVN2460N3‐GVN3205N3‐GVN3205N8‐GVP0335NW‐VP0550N3‐GVP0550N3‐GVP1210ND‐DVP2110K1‐G‐VP2206N3‐GVP2206ND‐DVP2450ND‐D
HANGE rdering P/N‐P002 ‐D588 G‐P013 G‐P003 ‐P002 ‐D301 G‐P013 ‐P003 ‐P002 ‐P003 ‐P013 ‐P014 ‐P002 H212 D623 D595 ‐D619 D491 ‐D614 ‐P003 ‐P013 ‐P013 ‐P014 D621 G‐P003 G‐P014 G‐P002 G‐D576 ‐D300 ‐D559
G‐P013 D624 ‐D537
G‐P003 D613 D622
PCCN1403_addendum_J
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PART MARKING GUIDELINE [Suppliment to PCN-1403 ADDENDUM]This chart is to be used as a general guideline only and does not include custom marking. It does not contain actual part marking on any specific product.
Supertex Package Code
(P/N Suffix)
Lead/Pin/Bump Count Package Description Pre-Change_Marking Diagram [Supertex] Pre-Change_Marking Guidelines
[Supertex] Post-Change_Marking Diagram [Microchip] Pre-Change_Marking Guidelines [Microchip]
B1 26 BCC (6x6)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week Sealed___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
BD 42 Bumped DieL = Lot NumberYYWW = Date CodeP = Product Code● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
DJ 44 Quad Cerpac Chip Carrier
YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number*C = Country of Origin**A = Assembler ID* May be part of ejector pin or included as part of Top Marking* May be part of Top marketing (i.e. adjacent to the 1st row - YYWW)
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec SymbolNote: Marking is rotated 90° CCW from original Supertex specification.Note: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
PART MARKING GUIDELINE [Suppliment to PCN-1403 ADDENDUM]This chart is to be used as a general guideline only and does not include custom marking. It does not contain actual part marking on any specific product.
Supertex Package Code
(P/N Suffix)
Lead/Pin/Bump Count Package Description Pre-Change_Marking Diagram [Supertex] Pre-Change_Marking Guidelines
[Supertex] Post-Change_Marking Diagram [Microchip] Pre-Change_Marking Guidelines [Microchip]
48 LQFP (7x7, 1.4mm)
YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number*C = Country of Origin**A = Assembler ID______ = RoHS Compliant* May be part of ejector pin or included as part of Top Marking* May be part of Top marketing (i.e. adjacent to the 1st row - YYWW)
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
100 MQFP (14x20)
YY = Year SealedWW = Week SealedP = Product CodeL = Lot NumberC = Country of OriginA = Assembler ID______ = RoHS Compliant
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
G1 26 LLGA (6x6)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week Sealed___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
GA 25 / 26 FPBGA
P = Product CodeL = Lot NumberYY = Year SealedWW = Week Sealed___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
FG
PART MARKING GUIDELINE [Suppliment to PCN-1403 ADDENDUM]This chart is to be used as a general guideline only and does not include custom marking. It does not contain actual part marking on any specific product.
Supertex Package Code
(P/N Suffix)
Lead/Pin/Bump Count Package Description Pre-Change_Marking Diagram [Supertex] Pre-Change_Marking Guidelines
[Supertex] Post-Change_Marking Diagram [Microchip] Pre-Change_Marking Guidelines [Microchip]
HF 128 TQFP (w/Heat Slug)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedC = Country of OriginA = Assembler ID___________ = RoHS Compliant
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
3X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Code
5X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Code
K4 3 DPAK (TO-252)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week Sealed___________ = RoHS Compliant
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec SymbolNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K5 3 SOT-23
P = Product CodeL = Lot NumberY = Last Digit of Year SealedWW = Week Sealed___________ = RoHS CompliantNote: SPACING in between "YWW" and "LLLL" could be omitted due to space constraint
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec SymbolNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
P = Product CodeY = Last Digit of Year SealedW = Code for Week Sealed___________ = RoHS Compliant
K1 / T SOT-23 (TO-236AB)
PART MARKING GUIDELINE [Suppliment to PCN-1403 ADDENDUM]This chart is to be used as a general guideline only and does not include custom marking. It does not contain actual part marking on any specific product.
Supertex Package Code
(P/N Suffix)
Lead/Pin/Bump Count Package Description Pre-Change_Marking Diagram [Supertex] Pre-Change_Marking Guidelines
[Supertex] Post-Change_Marking Diagram [Microchip] Pre-Change_Marking Guidelines [Microchip]
K6 8 VDFN (4x4)
P = Product CodeY = Last Digit of Year SealedW = Code for Week SealedL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K6 8 VDFN (5x5)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K6 10 VDFN (3x4)
P = Product CodeY = Last Digit of Year SealedW = Code for Week SealedL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K6 12 VDFN (4x4)
P = Product CodeY = Last Digit of Year SealedW = Code for Week SealedL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K6 18 VDFN (5x5)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K6 12 VQFN (4x4)
P = Product CodeY = Last Digit of Year SealedW = Code for Week SealedL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
PART MARKING GUIDELINE [Suppliment to PCN-1403 ADDENDUM]This chart is to be used as a general guideline only and does not include custom marking. It does not contain actual part marking on any specific product.
Supertex Package Code
(P/N Suffix)
Lead/Pin/Bump Count Package Description Pre-Change_Marking Diagram [Supertex] Pre-Change_Marking Guidelines
[Supertex] Post-Change_Marking Diagram [Microchip] Pre-Change_Marking Guidelines [Microchip]
K6 16 VQFN (3x3)
P = Product CodeY = Last Digit of Year SealedW = Code for Week SealedL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K6 16 VQFN (4x4)
P = Product CodeY = Last Digit of Year SealedW = Code for Week SealedL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K6 24 VQFN (4x5)
P = Product CodeL = Lot NumberY = Code for Year SealedW = Code for Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K6 32 VQFN (5x5)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K6 33 VQFN (6x6)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K6 40 VQFN (6x6)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
PART MARKING GUIDELINE [Suppliment to PCN-1403 ADDENDUM]This chart is to be used as a general guideline only and does not include custom marking. It does not contain actual part marking on any specific product.
Supertex Package Code
(P/N Suffix)
Lead/Pin/Bump Count Package Description Pre-Change_Marking Diagram [Supertex] Pre-Change_Marking Guidelines
[Supertex] Post-Change_Marking Diagram [Microchip] Pre-Change_Marking Guidelines [Microchip]
K6 48 VQFN (7x7)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K6 56 VQFN (8x8)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K6 64 VQFN (9x9)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K6 80 VQFN (11x11)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K7 8 WDFN (3x3)
P = Product CodeY = Last Digit of Year SealedW = Code for Week SealedL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Code● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K7 10 WDFN (3x3)
P = Product CodeY = Last Digit of Year SealedW = Code for Week SealedL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Code● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
PART MARKING GUIDELINE [Suppliment to PCN-1403 ADDENDUM]This chart is to be used as a general guideline only and does not include custom marking. It does not contain actual part marking on any specific product.
Supertex Package Code
(P/N Suffix)
Lead/Pin/Bump Count Package Description Pre-Change_Marking Diagram [Supertex] Pre-Change_Marking Guidelines
[Supertex] Post-Change_Marking Diagram [Microchip] Pre-Change_Marking Guidelines [Microchip]
K7 10 WDFN (4x4)
P = Product CodeY = Last Digit of Year SealedW = Code for Week SealedL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K7 19 WDFN (7x5)
P = Product CodeY = Last Digit of Year SealedW = Code for Week SealedL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K7 12 WQFN (3x3)
P = Product CodeY = Last Digit of Year SealedW = Code for Week SealedL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Code● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K7 16 WQFN (3X3)
P = Product CodeY = Last Digit of Year SealedW = Code for Week SealedL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Code● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K7 32 WQFN (5x5)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K7 32 WQFN (6x6)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
PART MARKING GUIDELINE [Suppliment to PCN-1403 ADDENDUM]This chart is to be used as a general guideline only and does not include custom marking. It does not contain actual part marking on any specific product.
Supertex Package Code
(P/N Suffix)
Lead/Pin/Bump Count Package Description Pre-Change_Marking Diagram [Supertex] Pre-Change_Marking Guidelines
[Supertex] Post-Change_Marking Diagram [Microchip] Pre-Change_Marking Guidelines [Microchip]
K7 40 WQFN (5x5)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
K7 44 WQFN (7x7)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
L / LL 3 TO-92P = Product CodeYY = Year SealedWW = Week Sealed___________ = RoHS Compliant
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec SymbolNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code
6 LFGA (3x3)
P = Product CodeY = Last Digit of Year SealedW = Code for Week SealedL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
22 LFGA (5x7)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
64 LFGA (7x7)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
LA
PART MARKING GUIDELINE [Suppliment to PCN-1403 ADDENDUM]This chart is to be used as a general guideline only and does not include custom marking. It does not contain actual part marking on any specific product.
Supertex Package Code
(P/N Suffix)
Lead/Pin/Bump Count Package Description Pre-Change_Marking Diagram [Supertex] Pre-Change_Marking Guidelines
[Supertex] Post-Change_Marking Diagram [Microchip] Pre-Change_Marking Guidelines [Microchip]
64 LFGA (7x7)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
78 LFGA (9x9)
P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
LG 8 SOIC (Narrow Body)
Y = Code for Year Sealed orYY = Year SealedWW = Week SealedP = Product CodeL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator
Y = Code for Year SealedWW = Week SealedP = Product CodeL = Lot Number___________ = RoHS Compliant
X = Product CodeY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
8
X = Product CodeY = Year SealedWW = Week SealedNNN = Traceability Code● = Pin 1 Indicator
10
X = Product CodeY = Year SealedWW = Week SealedNNN = Traceability Code● = Pin 1 Indicator
MG MSOP
YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator
LB
OR
PART MARKING GUIDELINE [Suppliment to PCN-1403 ADDENDUM]This chart is to be used as a general guideline only and does not include custom marking. It does not contain actual part marking on any specific product.
Supertex Package Code
(P/N Suffix)
Lead/Pin/Bump Count Package Description Pre-Change_Marking Diagram [Supertex] Pre-Change_Marking Guidelines
[Supertex] Post-Change_Marking Diagram [Microchip] Pre-Change_Marking Guidelines [Microchip]
N2 3 TO-39 (Metal Can)P = Product CodeYY = Year SealedWW = Week Sealed
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec SymbolNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
N3 3 TO-92
P = Product CodeYY = Year SealedWW = Week Sealed___________ = RoHS Compliant
For LR SeriesP = Product CodeY = Last Digit of Year SealedW = Code for Week SealedL = Lot Number___________ = RoHS Compliant
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec SymbolNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
N5 3 TO-220P = Product CodeYY = Year SealedWW = Week Sealed___________ = RoHS Compliant
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec SymbolNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
N8 3 SOT 89 (TO-243AA)P = Product CodeY = Last Digit of Year SealedW = Code for Week Sealed___________ = RoHS Compliant
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Code
OR
For LR Series
Or
PART MARKING GUIDELINE [Suppliment to PCN-1403 ADDENDUM]This chart is to be used as a general guideline only and does not include custom marking. It does not contain actual part marking on any specific product.
Supertex Package Code
(P/N Suffix)
Lead/Pin/Bump Count Package Description Pre-Change_Marking Diagram [Supertex] Pre-Change_Marking Guidelines
[Supertex] Post-Change_Marking Diagram [Microchip] Pre-Change_Marking Guidelines [Microchip]
14
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
16
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
16
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec SymbolNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
28
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec SymbolNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
40
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec SymbolNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
NG SOIC (Narrow Body)
P = Product CodeY = Last Digit of Year SealedWW = Week SealedL = Lot NumberA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator
P PDIP
YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number*C = Country of Origin**A = Assembler ID______ = RoHS Compliant* May be part of ejector pin or included as part of Top Marking
PART MARKING GUIDELINE [Suppliment to PCN-1403 ADDENDUM]This chart is to be used as a general guideline only and does not include custom marking. It does not contain actual part marking on any specific product.
Supertex Package Code
(P/N Suffix)
Lead/Pin/Bump Count Package Description Pre-Change_Marking Diagram [Supertex] Pre-Change_Marking Guidelines
[Supertex] Post-Change_Marking Diagram [Microchip] Pre-Change_Marking Guidelines [Microchip]
44
YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number*C = Country of Origin**A = Assembler ID______ = RoHS Compliant* May be part of ejector pin or included as part of Top Marking* May be part of Top Marking
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.Note: Marking is rotated 90° CW from original Supertex specification
64
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
80
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
100
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
YY = Year SealedWW = Week SealedP = Product CodeL = Lot NumberC = Country of OriginA = Assembler ID______ = RoHS Compliant
PG PQFP
PART MARKING GUIDELINE [Suppliment to PCN-1403 ADDENDUM]This chart is to be used as a general guideline only and does not include custom marking. It does not contain actual part marking on any specific product.
Supertex Package Code
(P/N Suffix)
Lead/Pin/Bump Count Package Description Pre-Change_Marking Diagram [Supertex] Pre-Change_Marking Guidelines
[Supertex] Post-Change_Marking Diagram [Microchip] Pre-Change_Marking Guidelines [Microchip]
28
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec SymbolNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.Note: Marking is rotated 90° CCW from original Supertex specification
44
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec SymbolNote: Marking is rotated 90° CCW from original Supertex specificationNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
QP 44 QSOP
YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number*C = Country of OriginA = Assembler ID______ = RoHS Compliant* May be part of ejector pin or included as part of Top Marking
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec SymbolNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
SG 8 SOIC (Narrow Body) with Heat Slug
Y = Code for Year Sealed orYY = Year SealedWW = Week SealedP = Product CodeL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator
Y = Code for Year SealedWW = Week SealedP = Product CodeL = Lot Number___________ = RoHS Compliant
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
PJ PLCC
YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number*C = Country of Origin**A = Assembler ID______ = RoHS Compliant* May be part of ejector pin or included as part of Top Marking** "Space" in between Date Code & Assembler ID can be dropped in case of space limitation.Note: Bottom marking may be presented in either a horizonal or circular direction.
OR
PART MARKING GUIDELINE [Suppliment to PCN-1403 ADDENDUM]This chart is to be used as a general guideline only and does not include custom marking. It does not contain actual part marking on any specific product.
Supertex Package Code
(P/N Suffix)
Lead/Pin/Bump Count Package Description Pre-Change_Marking Diagram [Supertex] Pre-Change_Marking Guidelines
[Supertex] Post-Change_Marking Diagram [Microchip] Pre-Change_Marking Guidelines [Microchip]
TG 8 SOIC (Narrow Body) with Dual Die
YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
TS 24 TSSOP
YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number*C = Country of OriginA = Assembler ID______ = RoHS Compliant* May be part of ejector pin
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
16
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
20
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
24
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
28
X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.
Wide Body SOIC (SOW) WG
YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number*C = Country of OriginA = Assembler ID______ = RoHS Compliant* May be part of ejector pin or included as part of Top Marking
Orderi[Supplim What isstandard Reasonprocess
Ordering
AT9919KAT9933LCL320SGCL325SGCL330SGCL7SG‐GCL8800KCL8801KDN1509KHT0440KHT0440LHT0740LHT18LG‐HT19LG‐HV100K5HV101K5HV20220HV2201PHV2809KHV300LGHV310LGHV311LGHV430WHV508LGHV509K6HV5523KHV5623KHV5812PHV5812WHV6810WHV7350K
ng Part Nment to PC
changingds for tape
n for changvariation.
g Part Numbe
K7‐G LG‐G G‐G G‐G G‐G K63‐G‐M935 K63‐G‐M935 K1‐G K6‐G LG‐G LG‐G ‐G ‐G 5‐G 5‐G 0PJ‐G‐M904 PJ‐G‐M904 K6‐G‐M937 G‐G G‐G G‐G WG‐G G‐G 6‐G‐M932 K7‐G‐M933 K7‐G‐M933 PJ‐G‐M904 WG‐G WG‐G K6‐G‐M937
Number DCN-1403 AD
: Standardiand reel qu
ge: Improve
er PKG SUFFIX K7‐G LG‐G SG‐G SG‐G SG‐G SG‐G K6‐G K6‐G K1‐G K6‐G LG‐G LG‐G LG‐G LG‐G K5‐G K5‐G PJ‐G PJ‐G K6‐G LG‐G LG‐G LG‐G WG‐G LG‐G K6‐G K7‐G K7‐G PJ‐G WG‐G WG‐G K6‐G
Detail for DDENDUM
ize the Basuantitys (oth
e operationa
PKG DESCR
8L (3x3) DF8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N33L (6x6) Q33L (6x6) Q5L SOT‐2310L (3x4) D8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N3L SOT‐2233L SOT‐22328L PLCC 28L PLCC 56L (8x8) Q8L SOIC (N8L SOIC (N8L SOIC (N20L SOIC (W8L SOIC (N32L (5x5) Q44L (7x7) Q44L (7x7) Q28L PLCC 28L SOIC (W20L SOIC (W56L (8x8) Q
Tape & RM]
se Quantity her packing
al efficienci
RIPTION
FN arrow Body)arrow Body) arrow Body) arrow Body) arrow Body) QFN QFN
DFN arrow Body)arrow Body)arrow Body)arrow Body)3 3
QFN arrow Body)arrow Body)arrow Body)Wide Body) arrow Body)QFN QFN QFN
Wide Body) Wide Body) QFN
Reel BQM
Multiple (Bg media typ
es and cyc
w/Heat Slugw/Heat Slugw/Heat Slugw/Heat Slug
PC
M Change
BQM) to Micpes are una
cle times by
BQM PRCHANG3000 2500 2500 2500 2500 2500 2000 2000 2500 3000 2500 2500 2500 2500 2500 2500 500 500 2000 2500 2500 2500 1000 2500 2500 2000 2000 500 1000 1000 2000
CN1403_addendum_J
es
crochip affected).
y reducing
RE E
BQM PCHAN330330330330330330300300300330330330330330400400750750300330330330160330330300300750160160300
June2014
POST NGE 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 0 0 00 00 00 00 00 00 00 00 00 0 00 00 00
Ordering
HV7800KHV7801KHV809LGHV809SGHV816K6HV823LGHV825LGHV830LGHV852K7HV853K7HV857K7HV857LKHV859K7HV892K7HV9110NHV9120NHV9123NHV9123NHV9150KHV9801AHV9803BHV9803BHV9803LHV9803LHV9861AHV9901NHV9910BHV9910BHV9910BHV9910BHV9910BHV9910CHV9910CHV9910CHV9911NHV9911NHV9912NHV9912NHV9918KHV9919B
g Part Numbe
K1‐G K1‐G G‐G G‐G 6‐G G‐G G‐G G‐G 7‐G 7‐G 7‐G K7‐G 7‐G 7‐G NG‐G‐SM267 NG‐G‐M901 NG‐G‐M901 NG‐G‐M934 K6‐G ALG‐G BLG‐G BLG‐G‐S376 LG‐G LG‐G‐S374 ALG‐G NG‐G‐M901 BLG‐G BLG‐G‐S363 BLG‐G‐S373 BNG‐G‐M901BNG‐G‐M934CLG‐G CNG‐G‐M934CSG‐G NG‐G‐M901 NG‐G‐M934 NG‐G‐M901 NG‐G‐M934 K7‐G BK7‐G
er PKG SUFFIX K1‐G K1‐G LG‐G SG‐G K6‐G LG‐G LG‐G LG‐G K7‐G K7‐G K7‐G K7‐G K7‐G K7‐G NG‐G NG‐G NG‐G NG‐G K6‐G LG‐G LG‐G LG‐G LG‐G LG‐G LG‐G NG‐G LG‐G LG‐G LG‐G
NG‐G NG‐G
LG‐G NG‐G
SG‐G NG‐G NG‐G NG‐G NG‐G K7‐G K7‐G
PKG DESCR
5L SOT‐235L SOT‐238L SOIC (N8L SOIC (N16L (4x4) Q8L SOIC (N8L SOIC (N8L SOIC (N10L (3x3) D10L (3x3) D8L (3x3) DF8L (3x3) DF8L (3x3) DF10L (4x4) D14L SOIC (N16L SOIC (N16L SOIC (N16L SOIC (N16L (3x3) Q8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N16L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N16L SOIC (N16L SOIC (N8L SOIC (N16L SOIC (N8L SOIC (N16L SOIC (N16L SOIC (N16L SOIC (N16L SOIC (N8L (3x3) DF8L (3x3) DF
RIPTION
arrow Body)arrow Body) QFN arrow Body)arrow Body)arrow Body)DFN DFN FN FN FN DFN Narrow BodyNarrow BodyNarrow BodyNarrow BodyQFN arrow Body)arrow Body)arrow Body)arrow Body)arrow Body)arrow Body)Narrow Bodyarrow Body)arrow Body)arrow Body)Narrow BodyNarrow Bodyarrow Body)Narrow Bodyarrow Body) Narrow BodyNarrow BodyNarrow BodyNarrow BodyFN FN
w/Heat Slug
y) y) y) y)
y)
y) y)
y) w/Heat Slugy) y) y) y)
PC
BQM PRCHANG2500 2500 2500 2500 3000 2500 2500 2500 3000 3000 3000 3000 3000 3000 2500 1000 1000 2500 3000 2500 2500 2500 2500 2500 2500 1000 2500 2500 2500 1000 2500 2500 2500 2500 1000 2500 1000 2500 3000 3000
CN1403_addendum_J
RE E
BQM PCHAN300300330330330330330330330330330330330330260260260260330330330330330330330260330330330260260330260330260260260260330330
June2014
POST NGE 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
Ordering
HV9925SHV9930LHV9931LHV9931LHV9961LHV9961NHV9961NHV9963NHV9963NHV9963NHV9967BHV9971LHV9972LHV9973LLND01K1LP0701LLP1030DLR12LG‐GLR645LGMD0100MD0105MD0107MD1210MD1211MD1213MD1711MD1810MD1811MD1812MD1813MD1820MD1821MD1822MD1823PS10NG‐SR036SGSR037SGSR086SGSR087SGSR10LG‐G
g Part Numbe
SG‐G LG‐G LG‐G LG‐G‐S350 LG‐G NG‐G‐M901 NG‐G‐M934 NG‐G‐M901 NG‐G‐M934 NG‐G‐SM359 BK7‐G LG‐G LG‐G LG‐G 1‐G G‐G DK1‐G G G‐G 0DK6‐G 5K6‐G‐M932 7K6‐G 0K6‐G 1LG‐G 3K6‐G 1K6‐G‐M933 0K6‐G 1K6‐G 2K6‐G 3K6‐G 0K6‐G 1K6‐G 2K6‐G 3K6‐G ‐G‐M905 G‐G G‐G G‐G G‐G G
er PKG SUFFIX SG‐G LG‐G LG‐G LG‐G LG‐G NG‐G NG‐G NG‐G NG‐G NG‐G K7‐G LG‐G LG‐G LG‐G K1‐G LG‐G K1‐G LG‐G LG‐G K6‐G K6‐G K6‐G K6‐G LG‐G K6‐G K6‐G K6‐G K6‐G K6‐G K6‐G K6‐G K6‐G K6‐G K6‐G NG‐G SG‐G SG‐G SG‐G SG‐G LG‐G
PKG DESCR
8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N16L SOIC (N16L SOIC (N16L SOIC (N16L SOIC (N16L SOIC (N8L (3x3) DF8L SOIC (N8L SOIC (N8L SOIC (N5L SOT‐238L SOIC (N5L SOT‐238L SOIC (N8L SOIC (N8L (4x4) DF18L (5x5) D12L (4x4) D12L (4x4) Q8L SOIC (N12L (4x4) Q48L (7x7) Q16L (4x4) Q16L (4x4) Q16L (4x4) Q16L (4x4) Q16L (3x3) Q16L (3x3) Q16L (3x3) Q16L (3x3) Q14L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N
RIPTION
arrow Body) arrow Body)arrow Body)arrow Body)arrow Body)Narrow BodyNarrow BodyNarrow BodyNarrow BodyNarrow BodyFN arrow Body)arrow Body)arrow Body)
arrow Body)
arrow Body)arrow Body)FN (Dual Pad)DFN DFN QFN arrow Body)QFN QFN QFN QFN QFN QFN QFN QFN QFN QFN Narrow Bodyarrow Body) arrow Body) arrow Body) arrow Body) arrow Body)
w/Heat Slug
y) y) y) y) y)
)
y) w/Heat Slugw/Heat Slugw/Heat Slugw/Heat Slug
PC
BQM PRCHANG2500 2500 2500 2500 2500 1000 2500 1000 2500 2500 3000 2500 2500 2500 2500 2500 2500 2500 2500 3000 2500 3000 3000 2500 3000 2000 3000 3000 3000 3000 3000 3000 3000 3000 2500 2500 2500 2500 2500 2500
CN1403_addendum_J
RE E
BQM PCHAN330330330330330260260260260260330330330330300330300330330330330330330330330300330330330330330330330330260330330330330330
June2014
POST NGE 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
Ordering
TC1550TTC2320TTC6215TTC6320KTC6320KTC6320TTC6320TTC6320TTC7920KTC8020KTC8220KTD9944TTD9944TTN2640LTP2640L
g Part Numbe
TG‐G TG‐G TG‐G K6‐G K6‐G‐D626 TG‐G TG‐G‐D607 TG‐G‐D626 K6‐G K6‐G‐M937 K6‐G TG‐G TG‐G‐D590 LG‐G LG‐G
er PKG SUFFIX TG‐G TG‐G TG‐G K6‐G K6‐G TG‐G TG‐G TG‐G K6‐G K6‐G K6‐G TG‐G TG‐G LG‐G LG‐G
PKG DESCR
8L SOIC (N8L SOIC (N8L SOIC (N8L (4x4) DF8L (4x4) DF8L SOIC (N8L SOIC (N8L SOIC (N12L (4x4) D56L (8x8) Q12L (4x4) D8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N
RIPTION
arrow Body) arrow Body) arrow Body) FN (Dual Pad)FN (Dual Pad)arrow Body) arrow Body) arrow Body) DFN QFN DFN arrow Body) arrow Body) arrow Body)arrow Body)
(Dual) (Dual) (Dual) ) ) (Dual) (Dual) (Dual)
(Dual) (Dual)
PC
BQM PRCHANG2000 2000 2000 3000 3000 2000 2000 2000 3000 2000 3000 2000 2000 2500 2500
CN1403_addendum_J
RE E
BQM PCHAN330330330330330330330330330300330330330330330
June2014
POST NGE 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00