program at a glance - mems conferences · 2006-01-12 · 4 mems 2006final program socialevents...

PROGRAM AT A GLANCE

77:30

8:30

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8

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7:00Registration

7:30Registration

7:30Registration

7:30Registration

8:30-8:50Welcome Address

8:10-8:50Invited Speaker

B.J. Feenstra

8:10-8:50Invited Speaker

K. Suzuki

10:30-11:00Exhibit Inspection & Break


12:20-13:40Lunch

12:30-13:40Lunch

12:20-13:40Lunch

12:00Conference Adjourns

8:50-9:30Invited Speaker - M. Meyyappan



16:00 - 19:00Registration

18:30 - 20:30Welcome Reception

Busses leave 18:00 from ICECLast Bus leaves at 21:00

9:30-10:30SESSION 1

Cells I

8:50-9:50SESSION 4

Particles I

8:50-9:50SESSION 6Power MEMS

8:10-8:50SESSION 9

Nano

10:20-12:00SESSION 12

Actuators

8:50-9:30SESSION 10 Wireless

9:30-9:50SESSION 11 Non Optical

10:20-12:20SESSION 5

Physical Sensors

16:10-17:10SESSION 8

Particles II

11:00-12:20SESSION 2

Cells II

16:10-17:30SESSION 3

Optical

17:30Adjourn for the Day



13:40-15:40POSTER/ORAL

Session I


Session II


Session IV

Thursday, 26 JANWednesday, 25 JANTuesday, 24 JANMonday, 23 JANSunday, 22 JAN


Session III


10:20-12:20SESSION 7

Fabrication & Packaging

18:30-22:00Gala Banquet

Busses leave 18:00 from Hilton IstanbulLast Bus leaves at 22:30


12:20MEMS 2007 Announcement

1MEMS 2006 FINAL Program

Table of Contents

From the Co-Chairs . . . . . . . . . . . . . . .2

General Information . . . . . . . . . . . . . . .3

Social Events . . . . . . . . . . . . . . .4

Organizing Committee . . . . . . . . . . . . . . .5

Industrial Support Group . . . . . . . . . . . . . . .6

Exhibits . . . . . . . . . . . . . . .7

Exhibit Floorplan . . . . . . . . . . . . . .15

Poster Floorplan . . . . . . . . . . . . . .16

Technical Program Information . . . . . . . . . . . . . .17

Technical Program:

Monday . . . . . . . . . . . . . .18

Tuesday . . . . . . . . . . . . . .19

Wednesday . . . . . . . . . . . . . .20

Thursday . . . . . . . . . . . . . .21

Poster/Oral . . . . . . . . . . . . . .23

Exhibit Floorplan . . . . . . . . . . . . . .36

2 MEMS 2006 FINAL Program

From The Co-Chairs

We would like to welcome you to Istanbul, TURKEY for the19th IEEE International Micro Electro Mechanical Systems (MEMS) Conference!

Since the beginning of this Conference series in 1987, the MEMS community has experienced sig-nificant growth in various areas such as environmental sensors, inertial sensors, optical MEMS,RF devices, microfluidics, bioanalytical microsystems, PowerMEMS, NEMS and many more

interesting fields. Great strides have been made in approaches to making MEMS, including self assem-bly, integration of nano-scale features and use of materials new to MEMS. The enthusiasm of this com-munity is evident from the creativity and speed shown in both research and product development.

It is our great pleasure to announce that this year we received a record high of 789 abstracts. A totalof 236 papers were judiciously selected by the 24 member Technical Program Committee (TPC). Thepresentations are arranged in a single-session format, which consists of 3 invited talks, 42 oral pre-sentations, and 194 posters. We are continuing the successful poster presentation format pioneeredin 2004. Poster presentations are divided into four sessions to facilitate interaction with authors, whowill have their posters on display throughout the Conference. During their designated poster session,authors will be asked to give a short presentation once every 30 minutes to those present next to theirposter. All Conference papers, oral and poster, will be available both in paper form and on a CD ROMand will be distributed at the Conference to all attendees.

We'd like to specially thank all the authors of the submitted abstracts. It is their highest quality workthat serves as the foundation for the success of this Conference. The best abstracts have been select-ed by the TPC, made up with equal representation from the three regional sub-divisions, whichinclude the American sub-continents, Europe and Africa, and Asia and Australia. To facilitate reviewof the large number of abstracts, four sub-committees were formed to examine abstracts in differentcategories. The committee recommendations on the acceptance and declination of papers were takenas binding and resulted in an overall acceptance ratio of thirty percent. We are greatly indebted to theTPC members, who volunteered their valuable time, including participation in a two-day on-sitemeeting, for paper selection. We are also indebted to the International Steering Committee and theAdvisory Co-Chairs, Victor M. Bright and Gary K. Fedder, for their guidance and advice. We gratefullyacknowledge the industrial support groups and exhibitors for their involvement in this Conferenceand are very thankful to the IEEE Robotics and Automation Society for their continued support ofthis meeting. Once again, welcome to Istanbul and we hope you enjoy the Conference!

Tayfun Akin, Ph.D. Roland Zengerle, Ph.D.General Co-Chair General Co-Chair


General Information

Conference LocationAll sessions will be held at the Istanbul Convention & Exhibition Centre (ICEC)

Harbiye 80230Istanbul, TURKEY

Dialing CodesTurkey's International Country code: +90 • Istanbul's Local Area Codes: 212 and 216

Registration & Information DeskThe Registration and Information desk will be open during the following times:Sunday, January 22nd . 16:00 - 19:00 Wednesday, January 25th 7:30 - 17:10Monday, January 23rd . . 7:00 - 17:30 Thursday, January 26th 7:30 - 12:00Tuesday, January 24th. . 7:30 - 17:40

LunchesTo reduce long lines, we suggest that you visit the posters and exhibits before visiting the buffet line.

Name BadgesAll attendees must wear their name badge at all times to gain addmission to all sessions, exhibits, lunches and receptions.

Technical Digest and CD-ROM SetsOne copy of the Technical Digest and CD-ROM set is included in your bag. Additional copies may be purchased at the RegistrationDesk. Purchase price of the Technical Digest set will increase after the conference. Be sure to order your additional copies in advance. IEEE Member..........€100 (each) Non-Member.........€125 (each)

Wireless Internet ServiceWireless Internet is available in the Exhibit Hall, Poster Area, Lunch Area, and General Session Room.There is no fee to connect tothis service.

Cloak AreaThe Cloak Area to hang your coat is located in the Exhibit Hall. The MEMS 2006 Conference and the ICEC are not responsible for anyitems left in the Cloak Area.

Cellular Phones, Pagers and Watch AlarmsOut of courtesy to our speakers and other attendees, please turn off any cellular phones, pagers and watch alarms during sessions.

Cameras and Video Tape RecordersCameras and video tape recorders are strictly prohibited in the sessions, poster presentations and the exhibit area. Film or videowill be confiscated.

SmokingAll meeting rooms and seated functions are smoke free. Please adhere to the smoking policy of the ICEC.

Message and Job Market BoardPlease visit the Message and Job Market Boards located near the Conference Registration Desk.

Currency ExchangeThe unit of currency in Turkey is the New Turkish Lira (TRY) and it is acceptable at regular stores and restaurants. Theexchange rate fluctuates daily. US dollars, Euro, Credit cards (MasterCard® and Visa®), and traveler's checks are accepted atmost hotels, restaurants, and stores.

Tipping Standards10% is standard for meals. For porters and bellman, 2% of the nightly room rate is standard and rounding off metered taxi rates is common.

ElectricityElectricity throughout Turkey is 220V, 50 cycles, as in Europe. Plugs are also of the European variety with two round prongs.

Shipping ServiceShipping Service for the Technical Digest is available by visiting the Business Center located at the Hilton Hotel.The Business Center hours are Monday-Thursday 8:00 to 22:00

Tel +90 (212) 296 3071 (Conference Registration Desk) Fax +90 (212) 224 08 78


SOCIAL EVENTS

Sunday Welcome ReceptionThe Welcome Reception will begin at 18:30 on Sunday evening in conjunction with Registration. The reception will be held at theEsma Sultan Palace. Buses will depart from the convention center starting at 18:00. The last return bus will leave at 21:00.

Istanbul still has many enigmatic ruins, rarely explained in guidebooks, and often almost impossible to date unless you are a realexpert: is it sixteenth century or eighteenth, or even basically Byzantine? Until recently, Esma Sultan Palace was one of these. Inthe old fishing village of Ortakoy on the Bosporus, the late eighteenth-century brick palace was a summer retreat for Esma Sultan,the daughter of a Sultan Abdulhamit. She was one of the most intellectual women of her time and was reputed to be a very activesocialite. It burned down about 100 years ago, and became a useless but picturesque shell.

Now, Ortakoy is almost under the shadow of the Bosporous suspension bridge, and is very much part of the great city. Yet it stillretains a good deal of its village atmosphere, with colorful houses that surround a gem of a seaside Baroque mosque. The area hasbecome popular as a focus of entertainment, artistic life and a slightly recherche tourist centre. The views over the Bosporus andthe beautiful mosque next door make this a truly spectacular venue for the Welcome Reception.

Gala BanquetNo conference is complete without a banquet! Join us at the Ciragan Palace Kempinski Istanbul for a night of food and entertain-ment that you will not forget. The entertainment program includes Golden Girls performing classical Turkish music, a WhirlingDervish Ceremony, a folk dancing show, and more!!!

About The PalaceIn the second half of the 16th century, High Admiral Kilic Ali Pasha had a waterfront house in the area where Ciragan Palace HotelKempinski Istanbul now stands, and in the 17th century (1648) Sultan Murat IV gave the imperial garden to his daughter, KayaSultan, and her husband, Grand Vizier Melek Ahmet Pasha. They had a small wooden mansion built here in which they wouldspend the summer months. At the beginning of the 18th century, Ahmet III presented the house and grounds to his son-in-law,Grand Vizier Ibrahim Pasha of Nevsehir, who organized torchlight festivities known as Ciragan Senlikleri (Ciragan Festivals) withhis wife, Fatma Sultan. It was then that the area became known as Ciragan.

Buses will depart from the Hilton Hotel starting at 18:00. The last return bus will leave at 22:30.

Registration includes 1 ticket. Additional Guest Ticket: €80

The Blue Mosque


Organizing CommitteeExecutive Organizing Committee

General Co-ChairsTayfun Akin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Middle East Technical University, TURKEYRoland Zengerle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IMTEK, University of Freiburg, GERMANY

Designate Co-Chairs 2007Jong-Uk Bu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LG Electronics Institute of Technology, KOREASatoshi Konishi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ritsumeikan, JAPAN

Advisory Co-ChairsVictor M. Bright . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of Colorado, USAGary K. Fedder. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Carnegie Mellon University, USA

Technical Program CommitteeTayfun Akin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Middle East Technical University, TURKEYOliver Brand. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Georgia Institute of Technology, USAVictor M. Bright . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of Colorado, USAJong-Uk Bu. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LG Electronics Institute of Technology, KOREALionel Buchaillot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IEMN/ISEN, FRANCELong-Shen Fan. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . National Tsing Hua University, TAIWANGary K. Fedder. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Carnegie Mellon University, USAAndreas Hierlemann . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ETH - Zurich, SWITZERLANDSatoshi Konishi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ritsumeikan, JAPANJörg Kutter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MIC, DENMARKAmit Lal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cornell University, USAWalter Lang . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IMSAS, GERMANYJong-Hyun Lee . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gwangju Institute of Science and Technology, KOREALinwei Lin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of California at Berkeley, USAGabriel Rebeiz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of California at San Diego, USALina Sarro . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Delft University of Technology, THE NETHERLANDSMitsuhiro Shikida. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Nagoya University, JAPANYuji Suzuki . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of Tokyo, JAPANHarrie A.C. Tilmans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IMEC, BELGIUMMan Wong. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hong Kong University of Science and Technology, HONG KONGEuisik Yoon . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of Minnesota, USARoland Zengerle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IMTEK, University of Freiburg, GERMANYBabak Ziaie . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purdue University, USAYitshak Zohar. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of Arizona, USA

International Steering CommitteeCo-ChairsVictor M. Bright . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of Colorado, USAGary K. Fedder. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Carnegie Mellon University, USA

MembersTayfun Akin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Middle East Technical University, TURKEYOliver Brand. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Georgia Institute of Technology, USAVictor M. Bright . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of Colorado, USAJong-Uk Bu. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LG Electronics Institute of Technology, KOREAGary K. Fedder. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Carnegie Mellon University, USAPaddy French . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Delft University of Technology, THE NETHERLANDSSatoshi Konishi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ritsumeikan University, JAPANOliver Paul . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IMTEK, University of Freiburg, GERMANYRoland Zengerle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IMTEK, University of Freiburg, GERMANYYitshak Zohar. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of Arizona, USA


Industrial Support GroupWe gratefully acknowledge, at the time of printing this brochure the financial support

of this Conference from the following:

Silver Level

Gold Level

Special Acknowledgment

Media Support


Exhibitors

Alcatel Vacuum Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3098 Avenue de BrognyAnnecy 74000 FRANCEPhone: 33-450-65-7777Fax: 33-450-65-7789Website: www.adixen.com

Adixen Micro Machining Systems (MMS) is a business unit within Alcatel Vacuum Technology located in Annecy, France. Adixen MMS is specialisedin designing, manufacturing, marketing and servicing deep plasma etching systems for the fabrication of Micro Electro Mechanical Systems andMicro Optical Electro Mechanical Systems. Its main application markets are the telecommunications, automotive, aerospace, computer peripher-als, biomedical industries, power devices and wafer level packaging.Adixen MMS is committed to support its customers through an international network of sales & service offices. Three applications laboratories inFrance, the USA and Japan provide our customers with process development & process demonstration. At the end of 2004, Adixen MMS had aworld-wide ICP etching tool installation base of more than 150 sites in the United States, Europe and Asia.

Applied Micro Structures, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154425 Fortran DriveSan Jose, CA 95134 USAPhone: 1-408-907-2822Fax: 1-408-719-9102Website: www.appliedmst.com

Aviza Technology Ltd. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47Ringland WayNewport, South Wales NP18 2TA UKPhone: 44-1633-414000Fax: 44-1633-414141Website: www.avizatechnology.com

Aviza Technology was formed through the merger of Aviza Technology Inc and Trikon Technologies Inc in December 2005. Aviza offers processapplications including Atomic Layer Deposition (ALD), diffusion and low pressure chemical vapor deposition (LPCVD) furnaces, atmospheric pressure CVD (APCVD), DCVD, etch and physical vapor deposition (PVD). At MEMS 2006, Aviza will be exhibiting its MEMS deep Silicon etchprocesses on the Omega dry etch system, and its thin film deposition solutions by PVD for Bulk Acoustic Wave resonators on the Sigma fxP clus-ter system.

BESTEC GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29Carl-Scheele-Str. 14Berlin, 12489 GERMANYPhone: 49-30-670992-11Fax: 49-30-677 5718Website: www.bestec.de

BESTEC is specialized in design and manufacturing of vacuum systems for applications in surface analysis & deposition techniques and is also asupplier of equipment to the high energy physics community. All systems are tailored according to the customer‚s needs. We satisfy high-endrequirements for vacuum physics, precision mechanics, optics/laserphysics and automation.BESTEC supplies:1. MBE- and OMBD-systems, Sputtering and e-Vap systems, Thermal evaporation systems2. PLD-Systems3. Systems for Surface analysis (XPS, UPS, AES, SIMS...-SPM)

EXHIBITOR BOOTH

Exhibit Hours:Monday, January 23 10:30 - 17:30

Tuesday, January 24 9:00 - 16:00

Wednesday, January 24 9:00 - 16:10

Please refer to the floorplans on page 15 and 36.


Brewer Science, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142401 Brewer ScienceRolla, MO 65401 USAPhone: 1-573-364-0300Fax: 1-573-458-4372Website: www.brewerscience.com

Brewer Science is an integrated, global company that manufactures chemicals and equipment for the optoelectronic, microelectronics, and MEMSindustries. Materials include lift-off layers, temporary etch protective coatings, optical coatings, electron beam resists, and anti-reflective coatings(ARC) for advanced lithography processes. Equipment includes spin coaters, bake and cure equipment, wafer processing systems and contactplanarization technology. Prototype coating services are also offered.

Coventer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114000 Centregreen WayCary, NC 27513 USAPhone: 919-854-7500Fax: 919-854-7501Website: www.coventor.com

Coventor is the industry-leader in MEMS design software tools. For more than nine years, Coventor has developed leading-edge expertise in theoptimization and analysis of micro-scale devices, such as micro-electro-mechanical systems (MEMS), integrated ICs and fluidic components andsubsystems. The company's device design software can be found in more than 200 commercial institutions, including the worlds leading microsystem Research and Developers. Coventor also hosts the most successful University program with more than 2000 seats installed worldwide forthe training and development of MEMS engineers. Serving RF, Optical, Sensor, Microfluidic and mixed applications, Coventor can help you designyour device, on demand.

Digital Matrix Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2492 Madison AvenueHempstead, NY 11550 USAPhone: 516-481-7990Fax: 516-481-7320Website: www.galvanics.com

Digital Matrix Corp. designs and manufactures galvanic equipment used in theelectroforming and plating of MEMS parts. We have developed nonorganic plating processes with Cu, Au, NiCo, Ni & NiP chemistries achieving high Vickers hardness and negligible stress. Plating sizes range from2" wafers to 1.5 meter shims with exact thickness and flatness as required and high-speed plating times. Equipment manufactured range from 1 to4 cell plating systems, Electroclean systems, Thickness profiler/gauge, silver spray system, Waste Treatment and DI Pure Water systems, spincoaters, spin dryers and many more. Two other specialties are: R&D projects and custom plating systems.

Digital Nanolocomation Center . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17CMS Building 905, 373-1 Guseong-dong, Yuseong-guDoejeon 305-701 KOREAPhone: 82-42-869-4314Fax: 82-42-869-8690Website: www.mems.kaist.ac.kr

Digital Nanolocomotion Center (DNC) is a National Creative Research Center funded by the Ministry of Science and Technology. Since its foun-dation in 2000, DNC has been devoted to the research on the bio-inspired digital nanolocomotion systems, whose major functions are the high-precision control and the cost-effective manipulation of a new class of information carriers, including mechanical, optical, biochemical and ther-mofluidic signals or nanosubstances. Total 21 people are currently working for DNC, either in research division or in service division. Major activ-ity and mission of DNC include research and development, advanced education and training, exchange and collaboration in the area of bio-inspiredNano/Micro ElectroMechanics Systems (N/MEMS) for non-electrical nano information carriers.

EV Group. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34DI Erich Thallner Strasse 1St. Florian/Inn, Schärding, 4782 AUSTRIAPhone: 43-7712-5311-0Fax: 43-7712-5311-4600Website: www.evgroup.com

EV Group provides leading-edge wafer processing equipment for MEMS and Microfluidics, Advanced Packaging, CompoundSemiconductor/MOEMS, SOI, Power Devices and Nanotechnology applications: Double side mask/bond aligners. Wafer bonders for anodic, siliconfusion, thermo compression and LowTemp plasma bonding. Wafer/mask cleaning systems. Temporary bonders and debonders. Resist processingsystems, photoresist spin/spray coaters and developers. Hot embossing and nanoimprinting systems. Optical test and inspection systems. EV Groupholds the dominant share of the market for wafer bonding equipment (especially SOI bonding) and is a leader in lithography for advanced packag-

EXHIBITOR BOOTH


Heildelberg Instruments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Tullastr. 2Heidelberg, 69126 GERMANYPhone: 49-6221-34300Fax: 49-6221-343030Website: www.himt.de

With an installation base in over 30 countries, Heidelberg Instruments is a world leader in production of high precision laser lithography systems.These systems are used for direct writing and photomask production in research and industry. Applications include: MEMS, BioMEMS, NanoTechnology, ASICS, TFT, Plasma Displays, Micro Optics, and many other exciting applications. Please visit us at: www.himt.de

Horiba Jobin Yvon . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32ZI de la Vigne aux loups-5 av. AragoChilly Mazarin, 91380 FRANCEPhone: 33-164-54-1300Fax: 33-169-74-8861Website: www.jobinyvon.fr

HSG-IMIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1Wilhelm-Schickard-Str. 10Villingen-Schwenningen, D-78052 GERMANYPhone: +49-7721-943-232Fax: +49-7721-943-210Website: www.hsg-imit.de

HSG-IMIT is a leading R&D provider in Baden-Württemberg for Microsystems Technology in the fields of microfluidics, sensors and informationtechnologies. Promoting awareness of and facilitating access to this new technologies are the main tasks of HSG-IMIT acting as a service centreproviding specific consulting, advanced training, technological services, feasibility studies, prototyping, small scale production as well as serial pro-duction in co-operation with industrial companies. About 80 employees are working on system solutions in the areas of microfluidics and physi-cal sensors. HSG-IMIT will be one of the first institutions dedicated to industrial research which will be certified after the new process orientedmanagement system ISO 9001:2000.

Innovative Micro Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 875 Robin Hill RoadSanta Barbara, CA 93117 USAPhone: 1-805-681-2800Fax: 1-805-967-2677Website: www.imtmems.com

IMT was formed in 2000, specifically to produce MEMS (micro-electromechanical systems) devices. IMT's 130,000 sq ft facility contains a 30,000sq ft clean room/fab, the largest and best-equipped independent MEMS fab in the world. The company was built for high-volume manufacturing,and provides complete foundry services from design through production. IMT currently has >100 employees and >20 customers in diverse appli-cations, including relays and relay arrays, drug discovery, drug delivery, biomedical implants and cell purifiers, microfluidics, displays, inertial nav-igation, optical telecommunications, printing, various sensors, night vision, IR emitters, telephone/DSL switching, RF devices, power management,and others. IMT's overriding goal is to partner with companies to develop and manufacturer products based on MEMS technology.

Institute of Physics Publishing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28Dirac House, Temple BackBristol, BS1 6BE UKPhone: 44-117-929-7481Fax: 44-117-929-4318Website: www.iop.org

Visit our stand to meet the publisher of Journal of Micromechanics and Microengineering, the journal that is making a big impression on the microscale with a 2004 impact factor of 2.048! Collect a free sample copy and find out how your work could benefit from the international exposureoffered by one of the leading journals in microelectromechanical systems, devices and structures. Further information, and the latest publishedpapers, can be found online at www.iop.org/journals/jmm.

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IntelliSense Software Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31600 West Cummings Park, Suite 2000Woburn, MA 01801 USAPhone: 1-781-933-8098Fax: 1-781-933-8099Website: www.intellisense.com

IntelliSense is the leading supplier of solutions for the MEMS industry. Its IntelliSuite family of CAD tools ignited the MEMS industry in the 90'sand is now used by universities and corporations worldwide. IntelliSense offers software tools and custom turnkey solutions ranging from conceptthrough finished production units world wide. With customers in over 25 countries, and partnerships with dozens of leading corporations,IntelliSense is recognized as the leading innovator in MEMS design, development and complete solutions. For further information please visithttp://www.intellisense.com

Lam Research Corporation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74650 Cushing ParkwayFremont, CA 94538 USAPhone: 1-510-572-1999Fax: 1-510-572-4924Website: www.lamrc.com

Building on the award-winning 2300 ExelanÆ Series, the 2300 Exelan Flex™ incorporates Dual Frequency Confined™ technology and theWaferless Auto Clean™ process. Additional technology addresses future production challenges via improve 193 nm photoresist compatibility, uni-formity and CD control, and process windows. Lam's 2300 VersysÆ Kiyo™ provides key manufacturing capabilities required for 65 nm and beyond:excellent within wafer, wafer to wafer, and chamber to chamber uniformity and defect control for 300 mm. Based on Lam's production provenTCPÆ 9400PTX, the TCPÆ 9400 DSiE™ for deep RIE silicon etch solutions offers wide process capability and flexibility for varying types of MEMS-based applications.

METU-MEMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45Inonu Bulvari, ODTUAnkara, TR-06531 TURKEYPhone: +90-312-210-2369Fax: +90-312-210-1261Website: www.microsystems.metu.edu.tr

METU-MEMS is an R&D and low volume production facility for Micro-Electro-Mechanical Systems. The facility allows 4" and 6" wafer processingand has 1000 sq. meters of class 100 and class 1000 clean room area for fabrication and 300 sq. meters of class 10000 clean room area for testing.The facility is supported by 25 technical personnel and 20 researchers and provides services for prototype development and low volume produc-tion of MEMS components. The current activities include development of MEMS components for commercial applications, including very low costuncooled infrared detector arrays, surface and bulk micromachined gyroscopes and accelerometers, RF MEMS components, piezoresistive pres-sure sensors, and humidity sensors.

MicroChem Corp.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 441254 Chestnut StreetNewton, MA 02464 USAPhone: 1-925-485-3205Fax: 1-925-846-8509Website: www.microchem.com

NanoAndMore GmbH. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43Steinbuehlstrasse 7Wetzlar, 35578 GERMANYPhone: 49-6441-870-6272Fax: 49-6441-870-6274Website: www.nanoandmore.com

Normtest Metrology Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Sedat Simaui Sokak No: 22/5 CankayaAnkara, 06680 TURKEYPhone: 90-312-441-8839Fax: 90-312-438-64-95Website: www.normtest.com.tr

Normtest Dis Ticaret Ltd Sti is the market leader Distributor Company in Turkey, that covers Nanotechnology, MEMS, Material Sciences, Physics,Electronics, Micro Mechanics, Bio-Technology and Surface Technologies Markets.Metrology Systems are one of the major area of interest for existing 10,000 + contacts of Normtest in the Turkish Market.Specialized and Highly Trained staff of Normtest is constantly in contact with the market with solutions in Photonics, Topology, Profiles, Propertiesof the surfaces and materials.

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Normtest Production Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40Sedat Simaui Sokak No: 22/5 CankayaAnkara, 06680 TURKEYPhone: 90-312-441-8839Fax: 90-312-438-64-95Website: www.normtest.com.tr

Normtest Dis Ticaret Ltd Sti is the market leader Distributor Company in Turkey, that covers Nanotechnology, MEMS, Material Sciences, Physics,Electronics, Micro Mechanics, Bio-Technology and Surface Technologies Markets.Production Systems Division particularly addresses to the Turkish Market that deals with Material and Surface Production by all sorts of technologies.Normtest has a Database with fully classified 10,000+ contacts that are continuously updated on the latest developments in the market, and is cer-tainly one of the first “Solution Providers” to the market.

NT-MDT Co. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33Arnhemseweg 34 dApeldoorn, 7331 BL THE NETHERLANDSPhone: 31-55-540-2565Fax: 31-55-540-2566Website: www.ntmdt.com

NTI sells a broad spectrum of Scanning Probe Microscopes and accessories. The SPM's are NT-MDT branded and cover a large number of applica-tions. There are models for biomedical applications, for the research of magnetic materials, for the semiconductor and CD industry, for chemistryand high throughput experimentation and many more.NTI sells the SPM's directly as well as through a network of distributors and agents to European and some Asian countries. For an overview of dis-tributors go to http://www.ntmdt.com/Distributors Consumables, such as cantilevers, silicon calibration gratings, DNA test monsters and HighlyOriented Pyrolytic Graphite, are sold worldwide from NTI. They are often delivered within 1 day. Visit our online consumables shop for an overviewof the products and prices. NTI is the EU representation of NT-MDT, which is established in Zelenograd, close to Moscow. NTI takes care of theafter-sales service to European customers. Training in the use of an SPM is generally given at the customer’s site, but it’s also possible to get an additional training at our facilities. NTI canbe contracted for conducting measurements on samples with the SPM’s at the facilities in Apeldoorn. Nano Technology Instruments – Europe B.V. was established in on June 6, 2002 as a Private Limited Liability Company. It is a Dutch company.Other legal names are: NTI and NTI – Europe B.V.

OAI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27685 River Oaks ParkwaySan Jose, CA 95134 USAPhone: 408-232-0600Fax: 408-433-9904Website: www.oainet.com

OAI manufactures precision lithography equipment for MEMS, Microfluidics, and Semiconductors industries. The equipment is engineered to thehighest specifications, is budget friendly and can take the customer from design, R&D through to production. Products include: mask aligners,bonders, light sources, and UV Ozone surface treatment. OAI maintains worldwide sales, service and engineering support.

Olympus Partnership Development Group . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6180 Baytech DriveSan Jose, CA 95134 USAPhone: 1-408-514-3900Fax: 1-408-946-3836Website: www.olympus-pdg.com

Olympus Partnership Development Group (PDG) is part of the R&D division of Olympus Corporation. Our mission is to establish partnerships withcompanies by leveraging our MEMS and Optical foundry services, and extensive experience with MEMS chips, micro-optics, and optical subsys-tems. Olympus offers complete module solutions for combining MEMS, optics and electronics to accelerate design, development, production, andtime-to-market of new products and technologies. Olympus has innovative technology, a global brand, world-class precision manufacturing, world-wide distribution, a marketing and sales infrastructure, and investment capability.

PhoeniX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48P.O. Box 545Enschede, 7500 AM THE NETHERLANDSPhone: 31-53-483-6460Fax: 31-53-433-7415Website: www.phoenixbv.com

The PhoeniX provides customers integrated software solutions for Micro and Nano technologies. PhoeniX bridges the gap between design team andthe real cleanroom environment, facilitating communication from design to production and back. Re-usability, validation, and quality improvementof information, from research to volume production, are the key factors for efficient MNT product development. With solutions for Mask Design(CleWin3, MaskEngineer), Process Flow Design (FlowDesigner, FlowDB) and Integrated Optics Simulation (FieldDesigner, OptoDesigner) PhoeniXsets new standards in MEMSLand.

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Polytec GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Polytec - Platz 1 - 7Waldbronn, 76337 GERMANYPhone: 49-7243-6040Fax: 49-7243-69944Website: www.polytec.com

Polytec measure and visualize motion with laser light. Polytec develops and manufactures high-quality measurement systems for the analysis ofvibration, length, velocity and surface topography. The applications range from microsystem technology to large scale mechanical engineering,from the automotive sector and aerospace industry to medical technology and biomedical sciences, etc.

SoftMEMS LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1314109 Capri DriveLos Gatos, CA 95032 USAtel: 1-510-847-4170fax: 1-408-379-2306Website: www.softmems.com

SoftMEMS is the creator of the popular, powerful, easy-to-use CAD tool suites MEMS Pro, MEMS Master and MEMS Xplorer for the design and analy-sis of MEMS. Software functionalities encompass mixed MEMS/IC schematic capture, simulation, design optimization, statistical analysis, and fullcustom mask layout supporting popular mask formats. Also included are manufacturing and design rule verification, 3D model generation and visu-alization from manufacturing process descriptions, behavioral model creation and links to 3D analysis packages. A variety of foundry-specific mod-ules are fully integrated with SoftMEMS' tool suites to ensure process compatibility and manufacturability with the world's leading MEMS foundries.We will be showing our MEMS Pro and MemsMaster tools at MEMS 2006. Please visit us at our booth for a live demonstration.

Springer-Volag GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Tiergarteustr. 17Heidelberg, 619121 GERMANYPhone: 49-6221-487-8149Fax: 49-6221-487-8995Website: www.springer.com

The world’s second-largest specialist publishing group in the STM (Science, Technology, Medicine) sector and the top specialist informationprovider in the German-speaking countries.- 70 publishing houses in 19 countries in Europe, Asia and the US- Consolidated sales 2004: approx. 783 million euro- Around 5,000 employees around the world- Product range across all media for high-quality content (books, journals, newsletters, CD-ROMs, databases, online services, seminars and conferences)- 1,450 journals and more than 5,000 new book titles every year- Backlist with more than 40,000 titles- 7 main publishing fields: science, medicine, economics, engineering, architecture, construction and transport

Surface Technology Systems PLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Imperial Park Imperial WayNewport, GWENT NP 8UJ UKPhone: 44-1633-6524-00Fax: 44-1633-6524-05Website: www.stsystems.com

Established in 1984, STS is a leading supplier of cassette-to-cassette cluster and single/batch loadlocked plasma etch and deposition systems thatcan be configured with ICP, RIE, XeF2 and CV D sources. Products include the market-leading ASE® deep silicon etch process for MEMS micro-machining. The company also offers a complete suite of other enabling process technologies for MEMS device fabrication and packaging applica-tions, including dielectric etch and deposition, metal etch and dry isotropic silicon etch. Serving both R&D and high volume manufacturers, STSis committed to facilitating the transfer of MEMS technology from R&D to full scale production and successful commercialization.

SUSS MicroTec. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Schleissheimer Strasse 90Garching Bei Munchen, 85748 GERMANYPhone: 49-89-320-070Fax: 49-89-320-07162Website: www.suss.com

SUSS MicroTec is a world-leading supplier of lithography tools, coaters, wafer and device bonders and test systems for a range of markets includ-ing MEMS and Nanotechnology. No other company provides such a range of equipment for MEMS production and test process' - a reason why wehave been the proven market leader since the mid-90's. Yield is maximized due to SUSS' unbeatable equipment accuracy and reliability. We see itas our responsibility to support companies in their quest for commercially viable products – either in the R&D or production stage. SUSS is a com-pany which has made innovation, quality and customer service a priority - not just packaged into a motto but in everything we do.

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TecHarmonic, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 419 Great Oaks Blvd., Suite 30San Jose, CA 95119 USAPhone: 1-408-360-8780Fax: 1-408-360-8787Website: www.techarmonic.com

TecHarmonic manufactures Point-of-Use dry resin, wet, thermal/wet and thermal catalytic systems to abate the toxic, corrosive, explosive,pyrophoric and GWG emissions from process tools used in the production of MEMs, Solar Cells, IC's, FPD and other devices.

Tousimis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102211 Lewis AvenueRockville, MD 20851 USAPhone: 1-301-881-2450Fax: 1-301-881-5374Website: www.tousimis.com

Tousimis designs and manufactures compact advanced Supercritical Point CO2 Drying Systems. These highly reliable designs feature auto-processcapability with worldwide sales and service support. We now offer 6 different CPD models that can process up to 8” wafers. Applications include elimination of MEMS stiction problems, Gel Drying,Nano-Particle Drying, and Bio-MEMS sample Drying.Visit us at Booth #10 and learn more about our CPD technology benefits.

Unaxis Wafer Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210050 16th Street NorthSt. Petersburg, FL 33716 USAPhone: 1-727-577-4999Fax: 1-727-577-7035Website: www.waferprocessing.unaxis.com

Unaxis Wafer Processing provides innovative solutions for deposition and etch that enables production of leading edge devices and ICs used in com-puters, telecommunication, and automotive industries. Close cooperation with key customers and suppliers allows Unaxis to stay at the forefrontsof packaging, lighting, MEMS, and telecommunication technologies.Unaxis has developed strong market positions in its served markets: Advanced Packaging, Advanced Silicon, Photomask Etching and CompoundSemi & Microtechnology. Over 40 sales, service and spare parts centers in addition to two technology centers for process development, customersupport and training comprise a worldwide, customer focused infrastructure.

VEECO Instruments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Nanotech House, Buckingway Business Park, Anderson Rd.Swavesey, Cambridge, CB4 5VQ UKPhone: 44-1954-233-900Fax: 44-1954-2131-300Website: www.veeco-europe.com

Veeco is the leading supplier of 3D metrology instrumentation for research and production. Veeco's Optical Profilers, Stylus Profilers and AtomicForce Microscopes are critical enabling tools for characterizing MEMS devices. Wyko® NT Series non-contact Optical Profilers provide ultra-fastmeasurement of static and dynamic devices. Dektak® Stylus Profilers accurately calculate step heights, trench depths, stress and surface rough-ness.

Wiley-VCH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46Boschstr.12Weinheim, 69469 GERMANYPhone: 49-6201-606-197Fax: 49-6201-606-100Website: www.wiley-vch.de

Wiley-VCH publishes for the scientific community, scientific societies and students worldwide. Our products, whether they be monographs, text-books or major references work, are developed to fulfill - and anticipate - the needs of these users. And whether print or online: We find the mosteffective medium and market authoritative and cutting-edge content to specialized and interdisciplinary communities on a worldwide scale.

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Xactix, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262403 Sidney Street, Suite 300Pittsburgh, PA 15203 USAPhone: 1-412-381-3195Fax: 1-412-381-1136Website: www.xactix.com

XACTIX is the leading supplier of xenon difluoride silicon etch equipment. Isotropic etching using xenon difluoride is being widely adopted as anessential process for releasing MEMS. XeF2 shows nearly infinite selectivity to silicon over almost all standard semiconductor materials includingphotoresist, silicon dioxide, silicon nitride and aluminum. Being a vapor phase etchant, XeF2 avoids many of the problems typically associated withwet or plasma etch processes.

Yole Développement and Micronews . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2345 rue Sainte GeneviéveLyon, 69006 FRANCEPhone: 33) 472 83 01 90Fax: 33-47-283-0183Website: www.yole.fr

Founded in 1998, Yole Developpement is now the world leader in the analysis of the microtechnologies and compound semiconductors markets.Yole Developpement is a market research and strategy consulting company, specialized in:- MEMS & Nanotechnologies- Compound semiconductors & optoelectronics- Equipment and materials for the production of semiconductor devices- Life sciences instrumentation

zygoLOT GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25Lin Tiefen See 58Darmstadt, DE 64293 GERMANYPhone: 49-6151-88-0627Fax: 49-6151-88-0688Website: www.zygolot.de

Zygos NewView 6000 Series optical profilers are powerful tools for characterizing and quantifying surface roughness, step heights, critical dimen-sions, film thickness and other topographical features with excellent precision and accuracy on micro-devices. All measurements are nondestruc-tive, fast, and require no sample preparation. From cost-effective bench-top research tools, to high-speed, automated production-ready metrologysystems, Zygos NewView 6000 optical profiler offers a complete line of metrology solutions for today's leading-edge research and production appli-cations.

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8

WP1

8

WP1

9

TPa1

9

TPb1

9

MP1

9

MP2

4

TPb2

4

TPa2

4

WP2

4

WP2

5

TPa2

5

TPb2

5

MP2

5

MP3

0

TPb3

0

TPa3

0

WP3

0

WP3

1

TPa3

1

TPb3

1

MP3

1

MP3

6

TPb3

6

TPa3

6

WP3

6

WP3

9

TPa3

9

TPb3

9

MP3

9

MP4

0

TPb4

0

TPa4

0

WP4

0

WP4

5

TPa4

5

TPb4

5

MP4

5

MP4

6

TPb4

6

TPa4

6

MP4

7

WP3

8

TPa3

8

TPb3

8

MP3

8

MP4

1

TPb4

1

TPa4

1

WP4

1

WP4

4

TPa4

4

TPb4

4

MP4

4

TPb4

7

TPa4

7

MP4

8

TPa4

8

WP3

7

TPa3

7

TPb3

7

MP3

7

MP4

2

TPb4

2

TPa4

2

WP4

2

WP4

3

TPa4

3

TPb4

3

MP4

3

MP4

9

TPa4

9

MP5

0

TPa5

0

MP5

1

MP5

2

Monday (MP)Poster/Oral Session I

Tuesday A (TPa)Poster/Oral Session II

Tuesday B (TPb)Poster/Oral Session III

Wednesday (WP)Poster/Oral Session IV

Poster COLOR Legend

TO EXHIBITS

TOGENERALSESSIONROOM


TECHNICAL PROGRAM INFORMATION

The Technical Program consists of a three invited speaker presentations, a general session of contributed papers and 4 poster/oral sessions.

Oral SessionsAll oral sessions will be held in the Ballroom A.

Poster/Oral SessionsThe poster/oral format will consist of three (3) scheduled 10 minute, oral presentations which will be presented in each session ontheir assigned day in front of each poster. Posters will be on display from Monday at 7:00 through Wednesday at 15:40. All posterpapers are listed in this program by topic catagory with their assigned number starting on page 23. Authors will be available for ques-tions throughout the entire assigned session.

Session I - MPMonday, January 23rd13:40 – 15:40 Poster/Oral Presentation 1 – 14:10Poster/Oral Presentation 2 – 14:40Poster/Oral Presentation 3 – 15:10

Session II - TPaTuesday, January 24th13:40 – 15:40 Poster/Oral Presentation 1 – 14:10Poster/Oral Presentation 2 – 14:40Poster/Oral Presentation 3 – 15:10

Guide to Understanding Poster NumberingEach poster is assigned a unique number which clearly indicates when and where the poster is presented. The number of eachposter is shown on the left-hand side before the title. A typical poster number is shown here: TPb34

The first character (i.e. T) indicates the day of the conference: M = Monday, T = Tuesday, W = Wednesday

The second character “P” indicates that it is a PosterTuesday posters have a third character. This character indicate the session time:

a = 13:40 - 15:40b = 15:40 - 17:40

The number at the end is the assigned poster board position on the floorplan, as shown on page 16.

Page NumberingTo assist you with finding the paper in the Technical Digest, we have provided the page number for you following each paper title.

Session III - TPbTuesday, January 24th15:40 – 17:40Poster/Oral Presentation 1 – 16:10Poster/Oral Presentation 2 – 16:40Poster/Oral Presentation 3 – 17:10

Session IV- WPWednesday, January 25th13:40 – 15:40Poster/Oral Presentation 1 – 14:10Poster/Oral Presentation 2 – 14:40Poster/Oral Presentation 3 – 15:10


Sunday, 22 January 2006

16:00 - 19:00 REGISTRATION

18:30 - 20:30 WELCOME RECEPTION

Monday, 23 January 2006

8:30 WELCOME ADDRESS

8:50 INVITED SPEAKERNANOTECHNOLOGY: AN OVERVIEW AND INTEGRATION WITH MEMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1Meyya Meyyappan, J. Ji, J. Li, and A. CassellNASA Ames Research Center, USA

SESSION 1 Cells ISession Chairs:E. Yoon, University of Minnesota, USAY. Zohar, University of Arizona, USA

9:30 CMOS BIDIRECTIONAL ELECTRODE ARRAY FOR ELECTROGENIC CELLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4S. Hafizovic1, F. Heer1, W. Franks1, F. Greve1, A. Blau2, C. Ziegler2, and A. Hierlemann1

1ETH Zurich, SWITZERLAND and 2University of Kaiserslautern, GERMANY

9:50 ORIENTED AND VECTORIAL PATTERNING OF CARDIAC MYOCYTE USING A MICROFLUIDICDIELECTROPHORESIS CHIP - TOWARDS ENGINEERED CARDIAC TISSUE WITHCONTROLLED MACROSCOPIC ANISOTROPY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8M. Yang1, C.C. Lim1, R. Liao2, and X. Zhang1

1Boston University, USA and 2Harvard University, USA

10:10 A BULK PZT MICROSENSOR FOR IN-SITU TISSUE CONTRAST DETECTION DURINGFINE NEEDLE ASPIRATION BIOPSY OF THYROID NODULES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12T. Li, R.Y. Gianchandani, and Y.B. GianchandaniUniversity of Michigan, USA

10:30 EXHIBIT INSPECTION AND BREAK

SESSION 2 CELLS IISession Chairs:Y.B. Gianchandani, University of Michigan, USAA. Hierlemann, ETH Zurich, SWITZERLAND

11:00 CELL DEFORMABILITY MONITORING CHIPS BASED ONORIFICE-LENGTH-DEPENDENT DIGITAL LYSIS RATES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16S. Youn, D.W. Lee, and Y.-H. ChoKorea Advanced Institute of Science and Technology, REPUBLIC OF KOREA

11:20 MEMS BASED SENSORS FOR THE STUDY OF INDENTATION RESPONSE OF SINGLE CELLS . . . . . . . . . . . . . . . . . . . 20S. Yang and T. SaifUniversity of Illinois at Urbana-Champaign, USA

11:40 STUDY OF THE FLIGHT OF SMALL LIQUID DROPLETS THROUGH A THIN LIQUID FILM FORPICOLITRE LIQUID TRANSFER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24L. Geyl, G. Amberg, W. van der Wijngaart, and G. StemmeRoyal Institute of Technology, SWEDEN

12:00 DISCRETE CHEMICAL RELEASE FROM A MICROFLUIDIC CHIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28M. Hu1, T. Lindemann1, T. Göttsche2, J. Kohnle2, R. Zengerle1,2, and P. Koltay1

1University of Freiburg, GERMANY and 2HSG-IMIT, GERMANY

12:20 LUNCH

13:40 - 15:40 POSTER/ORAL SESSION I


Program

Technical DigestPage Number


SESSION 3 OpticalSession Chairs:O. Brand, Georgia Institute of Technology, USAJ.-U. Bu, LG Electronics Institute of Technology, KOREA

16:10 DUAL-AXIS ELECTROMAGNETIC SCANNING MICROMIRROR USING RADIAL MAGNETIC FIELD . . . . . . . . . . . . . . . 32C.-H. Ji, S.-H. Ahn, K.-C. Song, H.-K. Yoon, M. Choi, S.-C. Kim, and J.-U. BuLG Electronics Institute of Technology, KOREA

16:30 ANGLE TUNABLE LIQUID WEDGE PRISM DRIVEN BY ELECTRO-WETTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36A. Takei, E. Iwase, K. Hoshino, K. Matsumoto, and I. Shimoyama University of Tokyo, JAPAN

16:50 TRANSMISSIVE SCANNING MICROMIRRORS FOR AUTOSTEREOSCOPIC DISPLAY. . . . . . . . . . . . . . . . . . . . . . . . . . . 40A. Nakai, K. Hoshino, K. Matsumoto, and I. ShimoyamaUniversity of Tokyo, JAPAN

17:10 MANUALLY RE-WRITABLE PANEL FOR LARGE AREA MEMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44R. Shigematsu1, A. Higo1,2, H. Toshiyoshi1,2, and H. Fujita1

1University of Tokyo, JAPAN and 2Kanagawa Academy of Science and Technology, JAPAN

17:30 ADJOURN FOR THE DAY

Tuesday, 24 January 2006

8:10 INVITED SPEAKERELECTROWETTING-BASED DISPLAYS: BRINGING MICROFLUIDICS ALIVE ON-SCREEN . . . . . . . . . . . . . . . . . . . . . . 48B. Johan Feenstra, R.A. Hayes, R. van Dijk, R.G.H. Boom, M.M.H. Wagemans, I.G.J. Camps, A. Giraldo, and B. v.d. HeijdenPhilips Research Laboratories, THE NETHERLANDS

SESSION 4 Particles ISession Chairs:Y. Suzuki, University of Tokyo, JAPANB. Ziaie, Purdue University, USA

8:50 BIO-PARTICLE SORTING EMPLOYING HYDRODYNAMIC RECTIFICATION IN A MICROFLUIDIC CIRCUIT. . . . . . . . . 54M. Yamada1 and M. Seki21University of Tokyo, JAPAN and 2Osaka Prefecture University, JAPAN

9:10 HIGH SPEED PARTICLES AND BIOMOLECULES SORTING MICROSYSTEMUSING THERMOSENSITIVE HYDROGEL AND WATER TWO-PHASE FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58T. Arakawa1, T. Izumi1, W. Teragauchi1, T. Aoki1, Y. Shirasaki2, H. Sugino2, T. Funatsu2, and S. Shoji21Waseda University, JAPAN and 2University of Tokyo, JAPAN

9:30 MEMS BASED INTEGRATED PARTICLE DETECTION CHIP FOR REAL TIME ENVIRONMENTAL MONITORING . . . . . 62H.H. Lim, D. Park, J.Y. Maeng, J. Hwang, and Y.J. KimYonsei University, KOREA


SESSION 5 Physical SensorsSession Chairs:V.M. Bright, University of Colorado, USAG.K. Fedder, Carnegie Mellon University, USA

10:20 HIGH PERFORMANCE MATCHED-MODE TUNING FORK GYROSCOPE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66M.F. Zaman, A. Sharma, and F. AyaziGeorgia Institute of Technology, USA

10:40 HIGH-PERFORMANCE SOI-MEMS GYROSCOPE WITH DECOUPLED OSCILLATION MODES. . . . . . . . . . . . . . . . . . . . 70S.E. Alper, K. Azgin, and T. AkinMiddle East Technical University, TURKEY

11:00 SELF-MAGNETIC EXCITATION FOR IN-PLANE MODE RESONANT MICROSENSOR . . . . . . . . . . . . . . . . . . . . . . . . . . . 74J.H. Seo and O. BrandGeorgia Institute of Technology, USA

11:20 ULTRASENSITIVE MASS SENSOR BASED ON LATERAL EXTENSIONALMODE (LEM) PIEZOELECTRIC RESONATOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78W. Pang1, L. Yan2, H. Zhang1, H. Yu1, E.S. Kim1, and W.C. Tang2

1University of Southern California, USA and 2University of California at Irvine, USA


11:40 MICROMACHINED SU-8 PROBE INTEGRATED WITHFILM-BULK-ACOUSTIC RESONANT MASS SENSOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .82H. Zhang, W. Pang, and E.S. KimUniversity of Southern California, USA

12:00 A MEMS CONDENSER MICROPHONE FOR CONSUMER APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86J.W. Weigold1, T.J. Brosnihan2, J. Bergeron1, and X. Zhang1

1Analog Devices, USA and 2Pixtronix, Inc., USA

12:20 MEMS 2007 ANNOUNCEMENT

12:30 LUNCH

13:40 - 15:40 POSTER/ORAL SESSION II

15:40 - 17:40 POSTER/ORAL SESSION III

17:40 ADJOURN FOR THE DAY

Wednesday, 25 January 2006

8:10 INVITED SPEAKERKEY TECHNOLOGIES FOR HEALTHCARE SENSOR-NET SERVICES -THE NEXT TECHNOLOGY FRONTIER TOWARDS REAL WORLD IT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .90Kei Suzuki, S. Yamashita, K. Aiki, H. Kuriyama, and K. ShimadaHitachi Ltd., JAPAN

SESSION 6 Power MEMSSession Chairs:W. Lang, IMSAS, GERMANYM. Wong, Hong Kong University of Science and Technology, HONG KONG

8:50 MEMS RADIOISOTOPE-POWERED PIEZEOELECTRIC µ–POWER GENERATOR (RPG) . . . . . . . . . . . . . . . . . . . . . . . . .94R. Duggirala1, R. Polcawich2, E. Zakar2, M. Dubey2, H. Li1, and A. Lal11Cornell University, USA and 2US Army Research Laboratory, USA

9:10 SEISMIC POWER GENERATOR USING HIGH-PERFORMANCE POLYMER ELECTRET . . . . . . . . . . . . . . . . . . . . . . . . . .98T. Tsutsumino1, Y. Suzuki1, N. Kasagi1, and Y. Sakane2

1University of Tokyo, JAPAN and 2Asahi Glass Corporation, Ltd., JAPAN

9:30 NOVEL STRUCTURE FOR PASSIVE CO2 DEGASSING IN µDMFC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .102

C. Litterst1, S. Eccarius2, C. Hebling2, R. Zengerle1, and P. Koltay1

1University of Freiburg, GERMANY and 2Franhofer Institute for Solar Energy Systems, GERMANY


SESSION 7 Fabrication and PackagingSession Chairs:S. Konishi, Ritsumeikan University, JAPANL. Sarro, Delft University of Technology, THE NETHERLANDS

10:20 A 32*32 PARYLENE-PYROLYZED CARBON BOLOMETER IMAGER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .106M. Liger and Y.-C. TaiCalifornia Institute of Technology, USA

10:40 A NEW THREE-DIMENSIONAL LITHOGRAPHY USING POLYMER DISPERSED LIQUID CRYSTAL (PDLC) FILMS . . .110J.-W. Jeon, J.-Y. Choi, J.-B. Yoon, and K.S. LimKorea Advanced Institute of Science and Technology, REPUBLIC OF KOREA

11:00 ASPECT RATIO DEPENDENT SCALLOPING ATTENUATION IN DRIE AND AN APPLICATION TOLOW-LOSS FIBER-OPTICAL SWITCHES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .114Y. Mita1, M. Sugiyama1, M. Kubota1, F. Marty2, T. Bourouina2, and T. Shibata1

1University of Tokyo, JAPAN and 2Ecole Supérieur des Ingénieurs en Electronique et Electrotechnique, FRANCE

11:20 3D NANOHELIX FABRICATION AND 3D NANOMETER ASSEMBLY BY FOCUSED ION BEAMSTRESS-INTRODUCING TECHNIQUE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .118L. Xia, W. Wu, J. Xu, Y. Hao, and Y. WangPeking University, CHINA

11:40 FABRICATION OF THE FLEXIBLE SENSOR USING SOI WAFER BY REMOVING THE THICK SILICON LAYER . . . . .122K. Noda, K. Hoshino, K. Matsumoto, and I. ShimoyamaUniversity of Tokyo, JAPAN


12:00 A LOW TEMPERATURE VACUUM PACKAGE UTILIZING POROUS ALUMINA THIN FILM ENCAPSULATION. . . . . . . . 126R. He and C.-J. KimUniversity of California at Los Angeles, USA

12:20 LUNCH

13:40 - 15:40 POSTER/ORAL SESSION IV


SESSION 8 Particles IISession Chairs:L. Lin, University of California at Berkeley, USAM. Shikida, Nagoya University, JAPAN

16:10 INTEGRATING OPTOELECTRONIC TWEEZERS FOR INDIVIDUAL PARTICLE MANIPULATION WITHDIGITAL MICROFLUIDICS USING ELECTROWETTING-ON-DIELECTRIC (EWOD). . . . . . . . . . . . . . . . . . . . . . . . . . . . 130G.J. Shah1, P.-Y. Chiou2, J. Gong1, A.T. Ohta2, J.B. Chou2, M.C. Wu2, and C.-J. Kim1

1University of California at Los Angeles, USA and 2University of California at Berkeley, USA

16:30 MUSCLE PROTEINS AS HIGH SPEED NANO TRANSPORTERS ON MICRO PATTERNS . . . . . . . . . . . . . . . . . . . . . . . . 134Y. Yoshida1, T. Shimozawa2, T. Nishizaka3,4, S. Ishiwata2, and S. Takeuchi1,4

1University of Tokyo, JAPAN, 2Waseda University, JAPAN, 3Gakushuin University, JAPAN, and 4PRESTO, JAPAN

16:50 A NEW BIO-MOLECULES DECRYPTION PROTOCOL USING SHAPE ENCODED PARTICLES (SEP) . . . . . . . . . . . . . . 138J.G.F. Tsai, Z. Chen, B. Merriman, J. Chen, S. Nelson, and C.-J. KimUniversity of California at Los Angeles, USA

17:10 Session Adjourns

18:30 - 22:00 GALA BANQUET

Thursday, 26 January 2006

SESSION 9 NanoSession Chairs:J.-H. Lee, Gwangju Institute of Science and Technology, KOREAH.A.C. Tilmans, IMEC, BELGIUM

8:10 3-D MAGNETIC TWEEZERS FOR INVESTIGATION OFMECHANICAL PROPERTIES OF SINGLE DNA MOLECULES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142C.-H. Chiou, Y.-Y. Huang, M.-H. Chiang, H.-H. Lee, and G.-B. LeeNational Cheng Kung University, TAIWAN

8:30 MODULAR MEMS EXPERIMENTAL PLATFORM FOR TRANSMISSION ELECTRON MICROSCOPY . . . . . . . . . . . . . . . 146N. Sarkar1, C. Baur1, E. Stach2, Z. Jandric1, R. Stallcup1, M. Ellis1, G. Skidmore1, J. Liu3, and G.K. Fedder3

1Zyvex Corporation, USA, 2Purdue University, USA, and 3Carnegie Mellon University, USA

SESSION 10 WirelessSession Chairs:J.-H. Lee, Gwangju Institute of Science and Technology, KOREAH.A.C. Tilmans, IMEC, BELGIUM

8:50 SIMULTANEOUS AND INDEPENDENT MEASUREMENT OF STRESS ANDTEMPERATURE USING A SINGLE FIELD EFFECT TRANSISITOR BASED SENSOR . . . . . . . . . . . . . . . . . . . . . . . . . . . 150M. Doelle, J. Held, P. Ruther, and O. PaulUniversity of Freiburg, GERMANY

9:10 EFFECTS OF MECHANICAL VIBRATIONS AND BIAS VOLTAGE NOISEON PHASE NOISE OF MEMS RESONATOR BASED OSCILLATORS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154M. Agarwal1, K.K. Park1, M. Hopcroft1, S. Chandorkar1, R.N. Candler1, B. Kim1, R. Melamud1,G. Yama2, B. Murmann1, and T.W. Kenny1

1Stanford University, USA and 2Robert Bosch Corporation, USA


SESSION 11 Wireless Communication Micro Devices and Systems (Non-Optical)Session Chairs:J.-H. Lee, Gwangju Institute of Science and Technology, KOREAH.A.C. Tilmans, IMEC, BELGIUM

9:30 DIGITALLY FREQUENCY-CONTROLLABLE DUAL-BAND WLANFILTERS USING MICROMACHINED FREQUENCY-TUNING ELEMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158J.-M. Kim1, S. Lee1, J.-H. Park2, J.-M. Kim1, C.-W. Baek3, Y. Kwon1, and Y.-K. Kim1

1Seoul National University, KOREA, 2LG Electronics Institute of Technology, KOREA, and3Chung-Ang University, KOREA


SESSION 12 ActuatorsSession Chairs:L. Buchaillot, IEMN/ISEN, FRANCEL.-S. Fan, National Tsing Hua University, TAIWAN

10:20 PASSIVE CONTACT FORCE AND ACTIVE OPENING FORCE ELECTROSTATICSWITCHES FOR SOFT METAL CONTACT MATERIALS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162J. Oberhammer and G. StemmeRoyal Institute of Technology, SWEDEN

10:40 A CENTRIFUGO-MAGNETICALLY ACTUATED GAS MICROPUMP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166S. Haeberle1, N. Schmitt1, R. Zengerle1,2, and J. Ducrée2


11:00 ACOUSTIC EJECTOR WITH NOVEL LENS EMPLOYING AIR-REFLECTORS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170C.-Y. Lee, H. Yu, and E.S. KimUniversity of Southern California, USA

11:20 DROPLETS OSCILLATION AND CONTINUOUS PUMPING BY ASYMMETRIC ELECTROWETTING. . . . . . . . . . . . . . . . 174T.-T. Wang, P.-W. Huang, and S.-K. FanNational Chiao Tung University, TAIWAN

11:40 A WETTABILITY SWITCHABLE SURFACE DRIVEN BY ELECTROSTATIC INDUCED SURFACEMORPHOLOGY CHANGE WITHOUT ENERGY INTERFERENCE ON REAGENTS IN DROPLETS . . . . . . . . . . . . . . . . . 178T.-H. Chen, Y.-J. Chuang, and F.-G. TsengNational Tsing Hua University, TAIWAN

12:00 CONFERENCE ADJOURNS


POSTER/ORAL PRESENTATIONS

MP Monday, Session I, 13:40 to 15:40 TPb Tuesday, Session III, 15:40 to 17:40TPa Tuesday, Session II, 13:40 to 15:40 WP Wednesday, Session IV, 13:40 to 15:40

Please refer to the poster floorplan on page 16.

DESIGN, ANALYSIS AND THEORETICAL CONCEPTS

MP1 DYNAMICS OF SILICON MICRO-HEATERS: MODELLING AND EXPERIMENTAL IDENTIFICATION............................182D. Wiesmann and A. SebastianIBM Zurich Laboratory, SWITZERLAND

MP2 PREDICTION METHOD OF 3-D SHAPE FABRICATED BY DOUBLEEXPOSURE TECHNIQUE IN DEEP X-RAY LITHOGRAPHY (D2XRL) ..............................................................................186N. Matsuzuka, Y. Hirai, and O. TabataKyoto University, JAPAN

TPa1 UNIFORM NANOLITER SOLUTE DEPOSITION BY THE CONTROLOF DROPLET PROFILE DURING EVAPORATION WITH MICRO WELL.......................................................................................190C.-T. Chen, F.-G. Tseng, and C.-C. ChiengNational Tsing Hua University, TAIWAN

TPa2 MODELING OF FLUIDIC SELF-ASSEMBLY FOR INTEGRATION OF SILICON COMPONENTS ON PLASTIC................194S.A. Stauth and B.A. ParvizUniversity of Washington, USA

TPb1 A LOW-TEMPERATURE THERMOPNEUMATIC GAS BUBBLE VALVE ...........................................................................198W. van der Wijngaart, D. Chugh, E. Man, J. Melin, and G. StemmeRoyal Institute of Technology, SWEDEN

TPb2 SPRING-ON-TIP NANOLITHOGRAPHY PROBES.............................................................................................................202X. Wang, L. Vincent, and C. LiuUniversity of Illinois at Urbana-Champaign, USA

WP1 CONTINUOUS PARTICLE SORTING UTILIZING CASCADE SQUEEZE-JUMPINGEFFECT UNDER MICROFLUIDIC CONFIGURATION ......................................................................................................206C.-H. Lin1, C.-Y. Lee1, and L.M. Fu2

1National Sun Yat-Sen University, TAIWAN and 2National Pingtung University of Science and Technology, TAIWAN

WP2 NOVEL MEASUREMENT SYSTEM OF THE FRICTION COEFFICIENTS FOR THE DRIE SIDEWALLS...........................210I.-H. Hwang and J.-H. LeeGwangju Institute of Science and Technology, KOREA

MATERIALS AND DEVICE CHARACTERIZATION

MP3 HIGH-RATE SPUTTERING OF THICK PZT LAYERS FOR MEMS ACTUATORS...............................................................214H. Jacobsen1, H.-J. Quenzer1, B. Wagner1, K. Ortner2, and Th. Jung2

1Fraunhofer ISIT, GERMANY and 2Fraunhofer IST, GERMANY

MP4 MULTI-FUNCTIONING AFM CANTILEVER FOR MECHANICAL TESTS: INDENTATION, STRIP BENDING AND ADHESION TESTS..............................................................................................218H.-J. Lee1, K. Cho1, J.-H. Kim1, J.-M. Kim2, Y.-K. Kim2, and C.-W. Baek3

1Korea Institute of Machinery and Materials, REPUBLIC OF KOREA, 2Seoul National University, REPUBLIC OF KOREA, and 3Chung-Ang University, REPUBLIC OF KOREA

MP5 TEMPERATURE COMPENSATION OF A MEMS RESONATOR USING QUALITY FACTOR AS A THERMOMETER ........222M.A. Hopcroft1, M. Agarwal1, K.K. Park1, B. Kim1, C.M. Jha1, R.N. Candler1, G. Yama2, B. Murmann1, and T.W. Kenny1

1Stanford University, USA and 2Robert Bosch Corporation North American Research and Technology Center, USA

TPa3 SPIDER SILK AS A NEW BIOMATERIAL FOR MEMS .....................................................................................................226J. Bai1, R. Saheb-Djawaher1, T. Ma1, W. Chu1, R. Wang1, L. Silva1, C. Michal1, J.-C. Chiao2, and M. Chiao1

1University of British Columbia, CANADA and 2University of Texas at Arlington, USA

TPa4 MECHANICAL, THERMAL, AND MATERIAL INFLUENCES ONOHMIC-CONTACT-TYPE MEMS SWITCH OPERATION ...................................................................................................230N.E. McGruer, G.G. Adams, L. Chen, Z.J. Guo, and Y. DuNortheastern University, USA

TPb3 BACK-END-OF-LINE POLY-SIGE DISK RESONATORS ....................................................................................................234E.P. Quévy1, A. San Paulo1, E. Basol1, R.T. Howe2, T.-J. King1, and J. Bokor1

1University of California at Berkeley, USA and 2Stanford University, USA


TPb4 POLYCRYSTALLINE DIAMOND RF MEMS RESONATORS WITH THE HIGHEST QUALITY FACTORS . . . . . . . . . . . . .238N. Sepúlveda1, D.M. Aslam1, and J.P. Sullivan2

1Michigan State University, USA and 2Sandia National Laboratories, USA

WP3 IMAGING OF ACOUSTIC EMISSION FROM VIBRATING MICRO/NANO STRUCTURES . . . . . . . . . . . . . . . . . . . . . . . . .242T. Ono, S.-J. Kim, and M. EsashiTohoku University, JAPAN

WP4 MULTI-WALLED CARBON NANOTUBE FILLED CONDUCTIVE ELASTOMERS:MATERIALS AND APPLICATION TO MICRO TRANSDUCERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .246J. Engel, J. Chen, N. Chen, S. Pandya, and C. LiuUniversity of Illinois at Urbana-Champaign, USA

FABRICATION AND PACKAGING TECHNOLOGIES

MP6 VERTICAL AND HORIZONTAL PARALLEL MOUNTING OF MICRO COMPONENTSON A SUBSTRATE WITH HIGH SURFACE COVERAGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .250J. Fang and K.F. BöhringerUniversity of Washington, USA

MP7 NEW RESIST-COATING TECHNIQUE USING FINE MIST FOR THREE-DIMENSIONAL NANOTECHNOLOGY . . . . . . .254K. Yamazaki and H. NamatsuNTT Corporation, JAPAN

MP8 FABRICATION OF MICROSPRING PROBES USING CONDUCTIVE PASTE DISPENSING . . . . . . . . . . . . . . . . . . . . . . .258T. Itoh1, K. Kataoka2, and T. Suga1

1University of Tokyo, JAPAN and 2Tokyo Electron AT Ltd., JAPAN

MP9 IN-PLANE, HOLLOW MICRONEEDLES VIA POLYMER INVESTMENT MOLDING . . . . . . . . . . . . . . . . . . . . . . . . . . . . .262J.M. Lippmann and A.P. PisanoUniversity of California at Berkeley, USA

MP10 ON-CHIP 2-AXIS OPTICAL FIBER ACTUATOR USING GRAY-SCALE TECHNOLOGY . . . . . . . . . . . . . . . . . . . . . . . . . .266B. Morgan and R. GhodssiUniversity of Maryland, USA

MP11 INTERCONNECTION AND PACKAGING FOR 2D CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER ARRAYS BASED ON THROUGH-WAFER TRENCH ISOLATION . . . . . . . . . . . . . . . . . . . .270X. Zhuang, A. Sanli Ergun, O. Oralkan, I.O. Wygant, and B.T. Khuri-YakubStanford University, USA

TPa5 3D LITHOGRAPHY AND DEPOSITION ON HIGHLY STRUCTURED SURFACES USINGPLASMA SURFACE MODIFICATION, SAM COATING, AND CONTACT DISPLACEMENTELECTROLESS PLATING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .274W.-S. Su1, S.-T. Lee1, M.-S. Tsai2, and W. Fang1

1National Tsing Hua University, TAIWAN and 2National Nano Device Laboratory, TAIWAN

TPa6 LOCAL HEATING OF PYROLYZED POLYMER HEATERS FOR FURTHERCARBONIZATION AT HIGHER TEMPERATURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .278K. Naka and S. KonishiRitsumeikan University, JAPAN

TPa7 STUDY AND APPLICATIONS OF A PARYLENE SELF-SEALING STRUCTURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .282H. Zhang, S. Wang, and Y. XuWayne State University, USA

TPa8 SELF-PROPAGATING EXPLOSIVE REACTIONS IN NANOSTRUCTURED AL/NI MULTILAYER FILMS AS A LOCALIZED HEAT PROCESS TECHNIQUE FOR MEMS . . . . . . . . . . . . . . . . . . . . . . . . . . .286T. Namazu, H. Takemoto, H. Fujita, Y. Nagai, and S. InoueUniversity of Hyogo, JAPAN

TPa9 SELECTIVE AND DIRECT GOLD ELECTROPLATING ON SILICON SURFACE FOR MEMS APPLICATIONS . . . . . . . . .290T. Fujita, S. Nakamichi, S. Ioku, K. Maenaka, and Y. TakayamaUniversity of Hyogo, JAPAN

TPa10 THE PATTERNING OF ELECTRIC CIRCUITS FOR MASK-DEPOSITION TECHNOLOGY . . . . . . . . . . . . . . . . . . . . . . . .294S. Yotsuya and T. Makigaki Seiko Epson Corporation, JAPAN

TPa11 SUPERPLASTIC FORMING OF BULK METALLIC GLASS – A TECHNOLOGY FOR MEMSAND MICROSTRUCTURE FABRICATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .298J. Schroers1,2, T. Nguyen1, and A. Desai31Liquidmetal Technologies, USA, 2California Institute of Technology, USA, and 3Tanner Research, USA

TPb5 RECONSTITUTED WAFER TECHNOLOGY FOR HETEROGENEOUS INTEGRATION . . . . . . . . . . . . . . . . . . . . . . . . . . .302E.P. Quévy1, R.T. Howe2, and T.-J. King1

1University of California at Berkeley, USA and 2Stanford University, USA


TPb6 A NEW FABRICATION METHOD OF NANO-FLUIDIC FILTERS USING SELF-ASSEMBLYOF NANO-SPHERE AND SURFACE TENSION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .306Y.H. Seo, D.-S. Choi, and K.-H. WhangKorea Institute of Machinery and Materials, KOREA

TPb7 FABRICATION OF 3D THIN POLYMER STRUCTURES FOR HYBRID SENSORS AND ACTUATORS . . . . . . . . . . . . . . . .310J. Park1, J. Kim1,3, D. Roh1, S. Park1, B. Kim2, and K. Chun3

1Korea Institute of Science and Technology, KOREA , 2Hankuk Aviation University, KOREA, and3Seoul National University, KOREA

TPb8 A PARAMETRIC STUDY OF DIMENSIONAL TOLERANCE AND HYDRODYNAMIC DEBRIS REMOVAL IN MICRO-ELECTRO-DISCHARGE MACHINING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .314M.T. Richardson1, Y.B. Gianchandani1, and D.S. Skala2

1University of Michigan, USA and 2Sandia National Laboratories, USA

TPb9 A UNIVERSAL PARAMETER FOR SILICON ANISOTROPIC ETCHING IN ALKALINE SOLUTIONS . . . . . . . . . . . . . . . .318D. Cheng, M.A. Gosálvez, M. Shikida, and K. SatoNagoya University, JAPAN

TPb10 MICRO/NANO PATTERN FABRICATION USING ULTRAFAST LASER SURFACE MODIFICATION AND SELF-ASSEMBLED MONOLAYERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .322W.S. Chang, K.S. Huh, S.H. Cho, J.G. Kim, and K.H. WhangKorea Institute of Machinery and Material, KOREA

TPb11 DIRECT ETCH METHOD FOR MICROFLUIDIC CHANNEL AND NANO-HEIGHTPOST FABRICATION BY PICOLITER DROPLETS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .326U. Demirci and M. TonerHarvard Medical School, Massachusetts General Hospital, Shriners Hospital for Children, USA

WP5 FLEXIBLE SKIN WITH TWO-AXIS BENDING CAPABILITY MADE USINGWEAVING-BY-LITHOGRAPHY FABRICATION METHOD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .330N. Chen, J. Engle, S. Pandya, and C. LiuUniversity of Illinois at Urbana-Champaign, USA

WP6 FABRICATION OF POLYMERIC 3-D MICRO-STRUCTURES USING FERROFLUID MOLDS . . . . . . . . . . . . . . . . . . . . . .334W.-B. Song, H. Kim, C. Son, and B. ZiaiePurdue University, USA

WP7 NON-DESTRUCTIVE STRENGTH CHARACTERIZATION OF FULL-WAFER BONDS USING A MODIFIED BLISTER TEST METHOD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .338M. Rabold, A. Doll, F. Goldschmidtböing, and P. WoiasUniversity of Freiburg, GERMANY

WP8 MICRO-BRUSH PRESS-ON CONTACT: A NEW TECHNIQUE FOR ROOM TEMPERATUREELECTRICAL AND MECHANICAL ATTACHMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .342S.-H. Lee, J. Chae, N. Yazdi, and K. NajafiUniversity of Michigan, USA

WP9 RAPID FABRICATION PROCESS FOR HIGH ASPECT-RATIO EMBEDDED MICROCHANNELS WITH ORIFICES USING A SINGLE SU-8 LAYER ON A MASK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .346T. Suzuki1, T. Tokuda1, H. Yamamoto1, M. Ohoka2, I. Kanno1, M. Washizu3, and H. Kotera1

1Kyoto University, JAPAN, 2ASTEM Research Institute of Kyoto, JAPAN, and 3University of Tokyo, JAPAN

WP10 NOVEL PHOTOLITHOGRAPHY TO PERFORM THE OBLIQUE MICROSTRUCTURE . . . . . . . . . . . . . . . . . . . . . . . . . . .350H.-C. Tsai, Y.-R. Chang, H.-K. Chen, and T.-K. ShingDelta Electronics Inc., TAIWAN

BIOMEDICAL AND CHEMICAL DEVICES AND SYSTEMS

MP12 BRILLIANT DUST: NANOPARTICLE DOPED ON-CHIP MICROPLASMAS FOR FLUORESCENTDETECTION OF BIOMOLECULES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .354K. Peri, M. McShane, and C.G. WilsonLouisiana Technical University, USA

MP13 ELECTRONIC CONTROL OF BINDING OF GENETICALLY ENGINEERED POLYPEPTIDES TO MICROFABRICATED STRUCTURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .358X. Xiong1, M. Gungormus2,3, C. Tamerler2,3, M. Sarikaya2, and B. Parviz2

1Intel Corporation, USA, 2University of Washington, USA, and 3Istanbul Technical University, TURKEY

MP14 S-MAYHEM: A SPECTROASCOPIC MICROANALYTICAL HOLLOW ENHANCED MAGNETRON FOR EXPLOSIVE GAS DETENTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .362R. Yalavarthy and C.G. WilsonLouisiana Technical University, USA


MP15 MICROFABRICATION OF HELMHOLTZ COILS WITH INTEGRATEDCHANNELS FOR NMR SPECTROSCOPY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .366K. Ehrmann, N. Saillen, F. Vincent, C. Massin, P.-A. Besse, and R.S. PopovicEcole Polytechnique Fédérale de Lausanne, SWITZERLAND

MP16 AUTONOMOUS METAL ION SENSORS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .370R.N. Supino and J.J. TalghaderUniversity of Minnesota, USA

MP17 MICROMACHINED FLOW-THROUGH POLYMERASE CHAIN REACTION CHIP UTILIZING MULTIPLEMEMBRANE-ACTIVATED MICROPUMPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .374C.-H. Wang, Y.-Y. Chen, C.-S. Liao, H.-H. Lee, and G.-B. LeeNational Cheng Kung University, TAIWAN

MP18 ATMOSPHERIC PRESSURE AIR MICROPLASMA IONIZATION SOURCEFOR CHEMICAL ANALYSIS APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .378J.A. Wright, R.A. Miller, and E.G. NazarovSionex Corporation, USA

MP19 DIRECT ELECTROSTATIC TRANSPORTATION OF FROZEN DROPLETS IN LIQUID NITROGEN . . . . . . . . . . . . . . . . .382FOR SINGLE CRYOPRESERVED CELL PROCESSINGA. Yamamoto, T. Nakajima, K.-i. Kudoh, and T. HiguchiUniversity of Tokyo, JAPAN

MP20 PASSIVE MAGNETIC SEPERATOR INTEGRATED WITH MICROFLUIDIC MIXER:DEMONSTRATION OF ENHANCED CAPTURE EFFICIENCY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .386T. Lund-Olesen, H. Bruus, and M.F. HansenTechnical University of Denmark, DENMARK

MP21 OPTICAL TEMPERATURE CONTROL OF MULTIPLE MICROHEATERS USING DIGITAL MICROMIRROR DEVICE . . .390A. Ichikawa, F. Arai, and T. FukudaNagoya University, JAPAN

MP22 PNEUMATIC PARTICLE MANIPULATOR WITH VIBRATOR MATRIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .294O.C. Jeong and S. KonishiRitsumeikan University, JAPAN

MP23 OPTIMAL DESIGN OF MICRO RAYLEIGH-BÉNARD CONVECTION POLYMERASE CHAIN REACTION SYSTEM . . . . . . . . .398D.-J. Yao and J.-R. ChenNational Tsing Hua University, TAIWAN

MP24 CELL ADHESIONS ON NANOTURF SURFACES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .402C.-H. Choi, S.H. Hagvall, J.C.Y. Dunn, B.M. Wu, and C.-J. KimUniversity of California at Los Angeles, USA

MP25 ELECTRO-OSMOTIC FLOW THROUGH CLOSED-OPEN-CLOSED MICROCHANNELS: AN APPROACH TO HYPHENATION OF CAPILLARY ELECTROPHORESIS AND MALDI . . . . . . . . . . . . . . . . . . . . . . . .406V. Parmar, T. Redeby, W. van der Wijngaart, A. Emmer, and G. StemmeRoyal Institute of Technology, SWEDEN

TPa12 NEEDLE MICRO-COILS FOR MRS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .410R.R.A. Syms1, M.M. Ahmad1, I.R. Young1, D. Gilderdale1, and D.J. Collins2

1Imperial College London, UK and 2Royal Marsden NHS Trust, UK

TPa13 COMPACT, SEAMLESS INTEGRATION OF ACTIVE DOSING AND ACTUATION WITH MICRONEEDLES FOR TRANSDERMAL DRUG DELIVERY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .414N. Roxhed1, B. Samel1, L. Nordquist2, P. Griss1, and G. Stemme1

1Royal Institute of Technology, SWEDEN and 2Uppsala University, SWEDEN

TPa14 DESIGN AND FABRICATION OF A CENTRIFUGALLY DRIVEN MICROFLUIDIC DISK FOR FULLY INTEGRATED METOBOLIC ASSAYS ON WHOLE BLOOD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .418J. Steigert1, T. Brenner1, M. Grumann1, L. Riegger1, R. Zengerle1,2, and J. Ducrée2


TPa15 IMPLANTABLE ULTRASOUND EMITTER ARRAY FOR MEDICAL APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . .422J. Chen1, X. Cheng1, P. Lin2, and S. Zhou3

1University of New Mexico, USA, 2Infotonics Technology Center Inc., USA, and 3Rohm and Haas Electronic Materials LLC, USA

TPa16 A CONTINUOUS CELL LYSIS DEVICE USING FOCUSED HIGH ELECTRIC FIELD ANDSELF-GENERATED ELECTROOSMOTIC FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .426D.W. Lee and Y.-H. ChoKorea Advanced Institute of Science and Technology, KOREA


TPa17 2-DIMENSIONAL SPR DETECTION SYSTEM INTEGRATED WITH MOLECULAR IMPRINTING POLYMERMICROARRAYS USING MICROFLUIDIC TECHNOLOGY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .430K.-H. Lee, Y.-D. Su, S.-J. Chen, and G.-B. LeeNational Cheng Kung University, TAIWAN

TPa18 DETACHABLE SILICON MICRONEEDLE STAMPS FOR ALLERGY SKIN PRICK TESTING . . . . . . . . . . . . . . . . . . . . . .434A. Trautmann, F. Heuck, R. Denfeld, P. Ruther, and O. PaulUniversity of Freiburg, GERMANY

TPa19 NONLINEAR ELECTROPHORETIC MOBILITY OF LARGE DNA MOLECULES IN MICROSYSTEMS WITH SUB-MICRON PILLAR ARRAYS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .438Y.C. Chan1, Y. Zohar2, and Y.-K. Lee1

1Hong Kong University of Science and Technology, HONG KONG and 2University of Arizona, USA

TPa20 DNA SELF-FOCUSING CHIPS USING NONUNIFORMLY DISTRIBUTED ASYMMETRIC ELECTRIC FIELDS . . . . . . . . .442S. Yi and Y.-H. ChoKorea Advanced Institute of Science and Technology, KOREA

TPa21 A 3-D MICROFLUIDIC/ELECTRONIC SCAFFOLD FOR INCREASED VIABILITYAND ANALYSIS OF THICK IN VITRO BRAIN SLICES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .446L. Rowe, M.A. McClain, M. Almasri, K. Lee, and A.B. FrazierGeorgia Institute of Technology, USA

TPa22 BIODEGRADABLE POLYMER NEEDLE HAVING A TRENCH FOR COLLECTING BLOOD BY CAPILLARY FORCE . . .450S. Aoyagi1, H. Izumi1, Y. Isono1, K. Makihira1, and M. Fukuda2

1Kansai University, JAPAN and 2Lightnix Inc., JAPAN

TPa23 BIO-SENSING WITH COMPACT DISCS AND NANOFIBERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .454M. Tabuchi1, K. Kobayashi2, and Y. Baba3,1

1University of Tokushima, JAPAN, 2Taiyo Yuden Co, Ltd., JAPAN, and 3Nagoya University, JAPAN

TPa24 A NOVEL MICRO-TISSUE REACTOR FOR MAINTAINING HEPATOCYTES IN VITRO . . . . . . . . . . . . . . . . . . . . . . . . . .458M.-C. Shih1,2, Y.-S. Weng2, T.-C. Shih1, R.-J. Gau2, and C.-H. Liu1

1National Tsing Hua University, TAIWAN and 2Industrial Technology Research Institute, TAIWAN

TPa25 A WIRELESS POTENTIOMETRIC CHEMICAL SENSOR BASED ONA LOW RESISITANCE ENOS CAPACITIVE STRUCTURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .462J. Garcia-Canton, A. Merlos, and A. BaldiCentro Nacional de Microelectrónica-IMB (CSIC), SPAIN

TPb12 THREE DIMENSIONAL ELECTRODE STRUCTURE CONTROLLED BY DIELECTROPHORESISFOR FLOW-THROUGH MICRO ELECTRPORTION SYSTEM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .466Y.-S. Choi1,2, Y.-J. Kim1, M. Im1, B.-G. Kim1, K.-S. Yun3, and E. Yoon4

1Korea Advanced Institute of Science and Technology, KOREA, 2Kyungwoon Tech, KOREA, 3University of California at Los Angeles, USA, and 4University of Minnesota, USA

TPb13 MONODISPERSE ANISOTROPIC POLYMERIC PARTICLES GENERATED FROM A MICRO CO-FLOW SYSTEM . . . . .470T. Nisisako, T. Torii, and T. HiguchiUniversity of Tokyo, JAPAN

TPb14 ELECTRONIC DETECTION OF DNA WITH AMORPHOUS SILICON NANOSTRUCTURES . . . . . . . . . . . . . . . . . . . . . . .474J. Lund, C.-J. Wang, and B. ParvizUniversity of Washington, USA

TPb15 CHIP-BASED HIGH-SENSITIVITY DETECTION OF MULTIPLE DISEASE BIOMARKERS . . . . . . . . . . . . . . . . . . . . . . .478E.D. Goluch1, S.I. Savka2, D.G. Georganopoulou2, J.M. Nam2, K.A. Shaikh1, K.S. Ryu1, T.N. Chiesl2, A.E. Barron2, C.A. Mirkin2, and C. Liu1

1University of Illinois at Urbana-Champaign, USA and 2Northwestern University, USA

TPb16 LIPID BILAYER MICRCHAMBERS: AN OPTICAL DETECTION SYSTEM FOR MEMBRANE TRANSPORT . . . . . . . . . . .482H. Suzuki1, K.V. Tabata2, H. Noji2, and S. Takeuchi11University of Tokyo, JAPAN and 2Osaka University, JAPAN

TPb17 CELL-BASED PROTEIN SENSOR ARRAY USING GENETICALLY ENGINEERED MICROBES . . . . . . . . . . . . . . . . . . . .486S.-H. Oh, S.-H. Lee, S.A. Kenrick, P.S. Daugherty, and H.T. SohUniversity of California at Santa Barbara, USA

TPb18 A HIGHLY-SENSITIVE DIFFERENTIAL-MODE MICROCHEMICAL SENSOR USING TFBARS WITHON-CHIP MICROHEATER FOR VOLATILE ORGANIC COMPOUND (VOC) DETECTION . . . . . . . . . . . . . . . . . . . . . . .490H.-M. Lee1,2, H.-T. Kim2, H.-K. Choi1, H.-C. Lee1, H.-K. Hong1, D.-H. Lee1, J.-U. Bu1, and E. Yoon2

1LG Electronics Institute of Technology, KOREA and 2Korea Advanced Institute of Science and Technology, KOREA


TPb19 A NEW MICROFLUIDIC CHIP FOR FORMATION OF MICRO-DROPLETSIN LIQUIDS UTILIZING ACTIVE PNEUMATIC CHOPPERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .494C.-T. Chen and G.-B. LeeNational Cheng Kung University, TAIWAN

TPb20 BULK TITANIUM MICRONEEDLES WITH EMBEDDED MICROFLUIDICNETWORKS FOR TRANSDERMAL DRUG DELIVERY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .498E.R. Parker, M.P. Rao, K.L. Turner, and N.C. MacDonaldUniversity of California at Santa Barbara, USA

TPb21 MICROFABRICATION AND SELF-ASSEMBLY OF 3D MICROBOXES FOR BIOMEDICAL APPLICATIONS . . . . . . . . . .502T. Leong1, H. Ye1, E. Call2, B. Gimi1, Z. Bhugwalla1, and D.H Gracias1

1John Hopkins University, USA and 2Baltimore Polytechnic Institute, USA

TPb22 A 3D BIOLOGICAL FILTRATION MATRIX USING SELF-ASSEMBLED MICROSPHERES INSIDEMICROCHANNELS AND GELATIN SACRIFICIAL LAYER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .506T.-S. Chen1, C.-P. Chen1, Y.-C. Tsai1, W.-P. Shin1, and W.-C. Lin2

1National Taiwan University, TAIWAN and 2Industrial Technology Research Institute, TAIWAN

TPb23 FIELD-EFFECT CONTROL OF ELECTRO-OSMOTIC FLOW WITH SYNCRONIZED AC-SWITCHINGOF CHANNEL AND GATE POTENTIALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .510E.J. van der Wouden, D. Liang, D.C. Hermes, J.G.E. Gardeniers, and A. van den BergUniversity of Twente, THE NETHERLANDS

TPb24 SELF-REGULATED BIO-NANOSTRUCTURED MEMBRANES FOR MEMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .514M. Tabuchi1, F. Tomita2, K. Kobayashi2, S. Miki2, T. Saijo1, A. Shibata1, and Y. Baba3,1

1University of Tokushima, JAPAN, 2Taiyo Yuden Co., Ltd., JAPAN, and 3Nagoya University, JAPAN

WP11 PYROLYZED POLYMER AS ABSORBENT OF NITROGEN DIOXIDE SENSOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .518K. Naka, T. Hashishin, J. Tamaki, and S. KonishiRitsumeikan University, JAPAN

WP12 A SURFACE PLASMON RESONANCE SENSOR WITH A V-SHAPED SILICON PRISM ARRAY . . . . . . . . . . . . . . . . . . . .522N. Tsujiuchi, E. Iwase, K. Hoshino, K. Matsumoto, and I. ShimoyamaUniversity of Tokyo, JAPAN

WP13 CARRYING TARGET MOLECULES ON BEADS BY BIO MOLECULAR MOTORS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .526M.C. Tarhan1, R. Yokokawa2, F. Morin1, S. Takeuchi1, T. Kon1, and H. Fujita1

1University of Tokyo, JAPAN and 2Ritsumeikan University, JAPAN

WP14 INFARED LIGHT INDUCED PATTERNING OF PROTEINS ON PPNIPAMTHERMORESPONSIVE THIN FILMS: A “PROTEIN LASER PRINTER” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .530K.F. Böhringer1,2, H. Bilge1, X. Cheng3, B. Ratner4, S. Takeuchi2, and H. Fujita2

1University of Washington, USA, 2University of Tokyo, JAPAN, 3Massachusetts General Hospital, USA, and4University of Washington Engineered Biomaterials, USA

WP15 ARRAYED MONODISPERSE MICRO-ALGINATE BEADS IN Ì-FLUIDIC TRAPS FOR CELL ASSAY . . . . . . . . . . . . . . . .534W.-H. Tan and S. TakeuchiUniversity of Tokyo, JAPAN

WP16 DIRECT HANDWRITTING MANIPULATION OF DROPLETS BY SELF-ALIGNED MIRROR-EWODACROSS A DIELECTRIC SHEET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .538K.-C. Chuang and S.-K. FanNational Chiao Tung University, TAIWAN

WP17 REAL-TIME PCR USING A PCR MICROCHIP WITH INTEGRATED THERMAL SYSTEM ANDPOLYMER WAVEGUIDES FOR THE DETECTION OF CAMPYLOBACTER JEJUNI . . . . . . . . . . . . . . . . . . . . . . . . . . . . .542Z. Wang1, A. Sekulovic1,2, J.P. Kutter1, D.D. Bang3, and A. Wolff11Technical University of Denmark, DENMARK, 2Technical University of Delft, THE NETHERLANDS, and 3Danish Institute for Food and Veterinary Research, DENMARK

WP18 FABRICATION OF GOLD NANOPARTICLE USING PULSED MIXING METHOD WITH VALVELESS MICROPUMPS . . .546K. Sugano, H. Yamada, O. Ichihashi, T. Tsuchiya, and O. TabataKyoto University, JAPAN

WP19 HIGH RESOLUTION AND S/N RATIO NANO PROBING SYSTEM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .550M. Shuzo, K. Okada, H. Arai, R. Kanzaki, and I. ShimoyamaUniversity of Tokyo, JAPAN

WP20 A HANDHELD MICRODISCHARGE SPECTROSCOPY SYSTEM FOR HIGH-SPEED CHEMICAL ANALYSIS OFGASEOUS AND LIQUID SAMPLES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .554B. Mitra, B. Levy, T.-C. Fung, and Y.B. GianchandaniUniversity of Michigan, USA


WP21 SELF ASSEMBLED MONOLAYER PATTERNING USING CAPILLARY FORCE LITHOGRAPHY . . . . . . . . . . . . . . . . . . .558I. Wong and C.-M. HoUniversity of California at Los Angeles, USA

WP22 A MICRO “FLEA CIRCUS”: SELF ASSEMBLY OF BACTERIA THROUGHSPATIO-TEMPORAL CONTROL OF AEROTAXIS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .562M.I. Pinelis, J.H. Park, and M.M. MaharbizUniversity of Michigan, USA

WP23 HIGH SENSITIVITY PARTICLE DETECTION BY BIASED AC ELECTROOSMOTIC TRAPPING ON CANTILEVER . . . .566J. Wu, N. Islam, and M. LianUniversity of Tennessee, USA

MECHANICAL AND PHYSICAL MICRO SENSORS AND SYSTEMS

MP26 CONTROLLING ULTRA WIDE BAND TRANSMISSIONS FROMA WIRELESS MICROMACHINED GEIGER COUNTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .570C.K. Eun1, R. Gharpurey2, and Y.B. Gianchandani11University of Michigan, USA and 2University of Texas, USA

MP27 A CANTILEVER MICROPHONE USING RESONANCE OF CLOSED-END AIR COLUMNS . . . . . . . . . . . . . . . . . . . . . . .574S. Yoshimi, K. Hoshino, K. Matsumoto, and I. ShimoyamaUniversity of Tokyo

MP28 MICRO PRESSURE SENSORS OF 50µm SIZE FABRICATED BY A STANDARD CMOS FOUNDRYAND A NOVEL POST PROCESS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .578H.-H. Wang1, C.-W. Hsu1, W.-H. Liao1, L.-J. Yang1, and C.-L. Dai21Tamkang University, TAIWAN and 2National Chung Hsing University, TAIWAN

MP29 MINIATURISED THERMAL FLOW SENSORS FOR ROUGH ENVIRONMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .582R. Buchner, M. Maiwald, C. Sosna, T. Schary, W. Benecke, and W. LangUniversity of Bremen, GERMANY

MP30 PIEZORESISTIVE CANTILEVER FOR NANO-NEWTON SENSING IN TWO DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . .586T. Chu Duc, J.F. Creemer, and P.M. SarroDelft University of Technology, THE NETHERLANDS

MP31 TEMPERATURE DEPENDENCE OF QUALITY FACTOR IN MEMS RESONATORS . . . . . . . . . . . . . . . . . . . . . . . . . . . . .590B. Kim1, C.M. Jha1, T. White2, R.N. Candler1, M. Hopcroft1, M. Agarwal1, K.K. Park1, R. Melamud1, S.A. Chandorkar1, and T.W. Kenny1

1Stanford University, USA and 2California Polytechnic State University, USA

MP32 A DUAL AXIS GAS GYROSCOPE BASED ON CONVECTIVE AND THERMO-RESISTIVE EFFECTS IN SILICONWITH LOW THERMAL-INDUCED STRESS SENSING ELEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .594D.V. Dao1, V.T. Dau1, T. Shiozawa2, H. Kumaga2, and S. Sugiyama1

1Ritsumeikan University, JAPAN and 2Tamagawa Seki Co., Ltd., JAPAN

MP33 A HIGH-Q LENGTH-EXTENSIONAL BULK-MODE MASS SENSOR WITH ANNEXED SENSING PLATFORMS . . . . . . . .598Z. Hao, R. Abdolvand, and F. AyaziGeorgia Institute of Technology, USA

MP34 TWO-DIMENSIONAL SILICON SMART TACTILE IMAGE-SENSOR WITH SINGLE SENSINGDIAPHRAM ACTUATED BY VIBRATING PRESSURE FOR SIMULTANEOUS DETECTION OFFORCE AND OBJECT HARDNESS DISTRIBUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .602H. Takao, M. Yawata, K. Sawada, and M. IshidaToyohashi University of Technology, JAPAN

MP35 A CAPACITIVE PROXIMITY SENSOR IN DUAL IMPLEMENTATION WITH TACTILE IMAGINGCAPABILITY ON A SINGLE FLEXIBLE PLATFORM FOR ROBOT ASSISTANT APPLICATIONS . . . . . . . . . . . . . . . . . . .606H.-K. Lee, S.-I. Chang, and E. YoonUniversity of Minnesota, USA

TPa26 ELECTRET BASED WIRELESS MICRO IONIZING RADIATION DOSIMETER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .610C. Son and B. ZiaiePurdue University, USA

TPa27 OPTICAL SENSING IN A DIRECTIONAL MEMS MICROPHONE INSPIRED BY THE EARSOF THE PARASITOID FLY, ORMIA OCHRACEA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .614W. Cui1, B. Bicen2, N. Hall3, S.A. Jones1, F.L. Degertekin2, and R.N. Miles1

1State University of New York, USA, 2Georgia Institute of Technology, USA, and 3Sandia National Laboratories, USA


TPa28 CAPACITIVE ABSOLUTE PRESSURE SENSOR WITH VACUUM CAVITY FORMED BYBONDING SILICON TO SOI WAFER FOR UPPER AIR OBSERVATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .618K.R. Lee1, K. Kim1,2, Y.K. Kim2, H.D. Park1, S.W. Chio3, W.B. Chio3, and B.K. Ju2

1Korea Electronics Technology Institute, KOREA, 2Korea University, KOREA, and 3BNP Science Co., Ltd., KOREA

TPa29 CHARACTERISTICS OF ON-WALL IN-TUBE THERMAL FLEXIBLE MASS-FLOW SENSORS . . . . . . . . . . . . . . . . . . . .622Z.Y. Tan, M. Shikida, M. Hirota, and K. SatoNagoya University, JAPAN

TPa30 PIEZORESISTIVE MEMS UNDERWATER SHEAR STRESS SENSORS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .626A.A. Barlian, R. Narain, J.T. Li, C.E. Quance, A.C. Ho, V. Mukundan, and B.L. PruittStanford University, USA

TPa31 PARYLENE ACCELEROMETER UTILIZING SPIRAL BEAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .630S. Aoyagi1, K. Makihira1, D. Yoshikawa1, and Y.C. Tai21Kansai University, JAPAN and 2California Institute of Technology, USA

TPa32 NOVEL SOLID MICRO-GYROSCOPE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .634K. Maenaka, H. Kohara, M. Nishimura, T. Fujita, and Y. TamayamaUniversity of Hyogo, JAPAN

TPa33 RESONANT METAL CANTILEVER WITH ATTOGRAM/HZ MASS SENSITIVITY FULLY INTEGRATED . . . . . . . . . . . . .638IN A STANDARD 0.35µm CMOS PROCESSJ. Verd1, G. Abadal1, J. Teva1, A. Uranga1, F. Pérez-Murano2, J. Estevez2, and N. Barniol11Universitat Autónoma de Barcelona, SPAIN and 2Institut de Microelectrónica de Barcelona, SPAIN

TPa34 A HIGHLY SENSITIVE CMOS-MEMS CAPACITIVE TACTILE SENSOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .642C.-T. Ko1, J.-P. Wu2, W.-C. Wang2, C.-H. Huang2, S.-H. Tseng3, Y.-L. Chen3, and M.S.-C. Lu1

1National Tsing Hua University, TAIWAN, 2Touch Micro-System Technology, TAIWAN, and3National Applied Research Laboratories, TAIWAN

TPb25 AN ORTHOGONAL FLUXGATE-TYPE MAGNETIC MICROSENSOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .646O. Zorlu, P. Kejik, F. Vincent, and R.S. PopovicEcole Polytechnique Fédérale de Lausanne, SWITZERLAND

TPb26 FABRICATION OF RIGID BACKPLATE CONDENSER MICROPHONEUSING DRIE AND WAFER BONDING TECHNOLOGY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .650K.-C. Lee and H.-S. KwonKorea Research Institute of Standards and Science, KOREA

TPb27 A THREE DIMENSIONAL MICROFLOWN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .654D.R. Yntema, J.W. van Honschoten, H.-E. de Bree, R.J. Wiegerink, and M. ElwenspoekUniversity of Twente, THE NETHERLANDS

TPb28 DRAG FORCE ACTUATED BISTABLE MICROSWITCHES FOR FLOW SENSING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .658W.J. Kuipers, J.J. van Baar, M. Dijkstra, R.J. Wiegerink, T.S.J. Lammerink, J.H. de Boer, and G.J.M. KrijnenUniversity of Twente, THE NETHERLANDS

TPb29 INSERTION FORCE SENSOR BY SIDEWALL-DOPING WITH RAPID THERMAL DIFFUSION . . . . . . . . . . . . . . . . . . . .662B.K. Nguyen, K. Hoshino, K. Matsumoto, and I. ShimoyamaUniversity of Tokyo, JAPAN

TPb30 HIGH TUNING RANGE PARALLEL PLATE MEMS VARIABLECAPACITOR WITH ARRAYS OF SUPPORTING BEAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .666M. Bakri-Kassem and R.R. MansourUniversity of Waterloo, CANADA

TPb31 ULTRA-THICK AND HIGH-ASPECT-RATIO NICKEL MICROGYROSCOPE USING EFAB™MULTI-LAYER ADDITIVE ELECTROFORMING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .670S.E. Alper, I.E. Ocak, and T. AkinMiddle East Technical University, TURKEY

TPb32 DESIGN AND FABRICATION OF AN AUTOMATIC MODE CONTROLLED VIBRATORY GYROSCOPE . . . . . . . . . . . . .674W.T. Sung1, J.Y. Lee1, J.G. Lee1, and T. Kang2

1Seoul National University, SOUTH KOREA and 2Konkuk University, SOUTH KOREA

TPb33 3-AXES FLEXIBLE TACTILE SENSOR FABRICATED BYSI MICROMACHINING AND PACKAGING TECHNOLOGY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .678K. Kim1,2, K.R. Lee1, Y.K. Kim2, D.S. Lee1, N.K. Cho1, W.H. Kim1, K.B. Park1, H.D. Park1, Y.K. Park3,J.H. Kim3, and J.J. Pak2

1Korea Electronics Technology Institute, KOREA, 2Korea University, KOREA, and 3Korea Research Institute of Standard and Science, KOREA


WP24 A MULTICHANNEL NANOPARTICLE SCINTILLATION MICRODEVICE WITH INTEGRATED WAVEGUIDES . . . . . . . .682FOR ALPHA, BETA, GAMMA, X-RAY, AND NEUTRON DETECTIONS. Pellegrin, C. Whitney, and C.G. WilsonLouisiana Technical University, USA

WP25 DESIGN AND FABRICATION OF 2D PHONONIC CRYSTALS IN SURFACE ACOUSTIC WAVE MICRO DEVICES . . . . .686K.-B. Gu1, C.-L. Chang2, J.-C. Shieh1, and W.-P. Shih1

1National Taiwan University, TAIWAN and 2Canon, Inc., JAPAN

WP26 INTEGRATED SIX-DEGREE-OF-FREEDOM SENSING FOR ORTHODONTIC SMART BRACKETS . . . . . . . . . . . . . . . . .690J. Bartholomeyczik, J. Haefner, B. Lapatki, P. Ruther, T. Schelb, and O. PaulUniversity of Freiburg, GERMANY

WP27 ARTIFICIAL LATERAL LINE AND HYDRODYNAMIC OBJECT TRACKING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .694J. Chen1, J. Engel1, N. Chen1, S. Pandya1, S. Coombs2, and C. Liu1

1University of Illinois at Urbana-Champaign, USA and 2Bowling Green State University, USA

WP28 A NOVEL HIGH PERFORMANCE MICROMECHANICAL RESONANT ELECTROSTATIC FIELD SENSORUSED IN ATMOSPHERIC ELECTRIC FIELD DETECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .698C. Peng1, X. Chen1, Q. Bau, L. Luo2, and S. Xia1

1Chinese Academy of Sciences, CHINA and 2University of California at Berkeley, USA

WP29 SHOCK PROTECTION USING INTEGRATED NONLINEAR SPRING SHOCK STOPS . . . . . . . . . . . . . . . . . . . . . . . . . . .702S.W. Yoon, N. Yazdi, J. Chae, N.C. Perkins, and K. NajafiUniversity of Michigan, USA

WP30 MICRO CAPACITIVE INCLINATION SENSOR UTILIZING DIELECTRIC NANO-PARTICLES . . . . . . . . . . . . . . . . . . . . .706H. Ueda1, H. Ueno1, K. Itoigawa1, and T. Hattori21TOKAI RIKA Co., Ltd., JAPAN and 2University of Hyogo, JAPAN

WP31 A DIGITALLY CONTROLLED MEMS GYROSCOPE WITH UNCONSTRAINED SIGMA-DELTAFORCE-FEEDBACK ARCHITECTURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .710J. Raman1, E. Cretu2, P. Rombouts1, and L. Weyten1

1Ghent University, BELGIUM and 2Melexis N.V., BELGIUM

WP32 A POLYMER-BASED FLEXIBLE TACTILE SENSOR FOR BOTH NORMAL AND SHEAR LOAD DETECTION . . . . . . . .714E.-S. Hwang, J.-H. Seo, and Y.-J. KimYonsei University, KOREA

ACTUATORS

MP36 PARALLEL PLATE ELECTROSTATIC ACTUATORS IN LIQUIDS: DISPLACEMENT-VOLTAGE OPTIMISATION FOR MICROFLUIDIC APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . .718B. Legrand1, A.-S. Rollier1, L. Buchaillot1, and D. Collard2

1Institut d’Electronique, de Microélectronique et de Nanotechnologie, FRANCE and 2University of Tokyo, JAPAN

MP37 NORMALLY-CLOSED ELECTROSTATIC MICRO VALVE WITH PRESSURE BALANCE MECHANISMFOR PORTABLE FUEL CELL APPLICATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .722K. Yoshida1, Y. Hagihara1, S. Tanaka2, and M. Esashi21Matsushita Electric Works, Ltd., JAPAN and 2Tohoku University, JAPAN

MP38 ZERO-POWER LATCHING, LARGE-STROKE, HIGH-PRECISON LINEAR MICROACTUATORFOR LIGHTWEIGHT STRUCTURES IN SPACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .726R. Toda and E.-H. YangJet Propulsion Laboratory, USA

MP39 PRACTICAL HIGH-SPEED METAL-BASED OPTICAL MICROSCANNINGDEVICES WITH LOW PRODUCTION COST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .730J.-H. Park, J. Akedo, H. Sato, and M. LebedevNational Institute of Advanced Industrial Science and Technology, JAPAN

MP40 VERTICLE DRIVE MICRO ACTUATOR USING SMA THIN FILM FOR A SMART BUTTON . . . . . . . . . . . . . . . . . . . . . .734W. Yoshikawa1, A. Sasabe2, K. Sugano1, T. Tsuchiya1, O. Tabata1, and A. Ishida3

1Kyoto University, JAPAN, 2Ritsumeikan University, JAPAN, and 3National Institute for Materials Science, JAPAN

MP41 COMPLIANCE-BASED LATCHABLE MICROFLUIDIC ACTUATORS USING A PARAFFIN WAX . . . . . . . . . . . . . . . . . . .738B. Yang1 and Q. Lin2

1Carnegie Mellon University, USA and 2Columbia University, USA

MP42 EWOD (ELECTROWETTING-ON-DIELECTRIC) ACTUATED OPTICAL MICROMIRROR . . . . . . . . . . . . . . . . . . . . . . . .742H. Kang and J. KimPohang University of Science and Technology, KOREA


TPa35 ELECTROSTATICALLY-CONTROLLED, SELF-PNEUMATICALLY-ACTUATED MICROVALVE WITHHIGH PRESSURE TOLERANCE AND LOW PRESSURE LOSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .746D. Satoh, S. Tanaka, and M. EsashiTohoku University, JAPAN

TPa36 A PLANAR 3 DOF SAMPLE MANIPULATOR FOR NANO-SCALE CHARACTERIZATION . . . . . . . . . . . . . . . . . . . . . . . .750B.R. de Jong, D.M. Brouwer, H.V. Jansen, M.J. de Boer, T.G. Lammertink, S. Stramigioli, and G.J.M. KrijnenUniversity of Twente, THE NETHERLANDS

TPa37 A MICROMACHINED TITANIUM SPUTTER ION PUMP FOR CAVITY PRESSURE CONTROL . . . . . . . . . . . . . . . . . . . .754S.A. Wright and Y.B. GianchandaniUniversity of Michigan, USA

TPa38 COMPACT AND STRESS-RELEASED PISTON TIP-TILT MIRROR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .758T. Overstolz1, W. Noell1, R. Stanley2, and N.F. de Rooij11University of Neuchâtel, SWITZERLAND and 2Swiss Center for Electronics and Microtechnology, Inc., SWITZERLAND

TPa39 ANALYSIS AND EXPERIMENT OF DIAPHRAGM DEFLECTION BY A SHEAR MODE PZT ACTUATORIN MICROFLUIDIC APPLICATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .762S.-C. Chen1, C.-H. Cheng2, and Y.-C. Lin1

1National Changhua University of Education, TAIWAN and 2DA-YEH University, TAIWAN

TPa40 A TOUCH-MODE CAPACITANCE MICROVALVE EQUIPPED WITH HIGH SPEED AND PRESSUREMICROSECOND SWITCHING PERFORMANCE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .766B. Bae, R.I. Masel, and M.A. ShannonUniversity of Illinois at Urbana-Champaign, USA

TPa41 A NOVEL ELASTOMER MEMBRANE MICROPUMP WITH EMBEDDED COILS FOR OFF-CHIP PUMPING APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .770H.-L. Yin, J. Hsieh, and H.-H. HsuInstrument Technology Research Center, TAIWAN

TPb34 A NOVEL COIL-LESS LORENTZ FORCE 2D SCANNING MIRROR USING EDDY CURRENT . . . . . . . . . . . . . . . . . . . . .774H.-A. Yang and W. FangNational Tsing Hua University, TAIWAN

TPb35 PIEZOELECTRIC ACTUATOR INTEGRATED CANTILEVERWITH TUNABLE SPRING CONSTANT FOR ATOM PROBE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .778Y. Kawai1, T. Ono1, E. Meyer2, C. Gerber2, and M. Esashi11Tohoku University, JAPAN and 2University of Basel, SWITZERLAND

TPb36 PERISTALTIC PDMS PUMP WITH PERFECT DYNAMIC VALVES FOR BOTH GAS AND LIQUID . . . . . . . . . . . . . . . . .782O.C. Jeong, T. Morimoto, Y. Watanabe, and S. KonishiRitsumeikan University, JAPAN

TPb37 PRESSURE-INDEPENDENT MICROPUMP WITH PIEZOELECTRIC VALVESFOR LOW FLOW DRUG DELIVERY SYSTEMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .786A. Geipel1, A. Doll1, F. Goldschmidtböing1, P. Jantscheff2, N. Esser2, U. Massing2, and P. Woias1

1University of Freiburg, GERMANY and 2Tumor Biology Center, GERMANY

TPb38 A NOVEL TYPE OF MECHANICAL POWER TRANSMISSION ARRAY FOR SWITCHINGDENSEKY-ARRAYED ACTUATOR SYSTEMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .790H. Sasaki, M. Shikida, and K. SatoNagoya University, JAPAN

TPb39 FERROMAGNETIC SHAPE MEMORY ACTUATOR FOR LARGE 2D OPTICAL SCANNING . . . . . . . . . . . . . . . . . . . . . .794M. Kohl1, D. Brugger1,2, and B. Krevet1

1Forschungszentrum Karslruhe GmbH, IMT, GERMANY and 2Robert Bosch GmbH, GERMANY

WP33 PICOLITER CONTROLLABLE SYRINGES DRIVEN BY PARALLEL MOTIONS OF ELECTROSTATICCONTROLLED LINEAR INCHWORM ACTUATOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .798R. Yokokawa1, T. Saika1, T. Nakayama1, H. Fujita2, and S. Konishi11Ritsumeikan University, JAPAN and 2University of Tokyo, JAPAN

WP34 FREQUENCY CONTROLLED BIDIRECTIONAL RATCHETING BIOMIMETIC MOTION . . . . . . . . . . . . . . . . . . . . . . . . .802Z. Ding and B. ZiaiePurdue University, USA

WP35 GAS GENERATOR ACTUATOR ARRAYS FOR FLIGHT CONTROL OF SPINNING BODY PROJECTILES . . . . . . . . . . . .806B.A. English, P. Gadiraju, C.S. Rinehart, A. Glezer, and M.G. AllenGeorgia Institute of Technology, USA


WP36 SERIALLY-CONNECTED WEIGHT-BALANCED DIGITAL ACTUATORS FOR WIDE-RANGE,HIGH-PRECISION, LOW-VOLTAGE DISPLACEMENT CONTROL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .810Korea Advanced Institute of Science and Technology, KOREA

WP37 FABRICATION AND CHARACTERIZATION OF AN ELECTROSTATIC CONTRACTION BEAMS MICROMOTOR . . . . . .814E. Sarajlic1, E. Berenschot1, N. Tas1, H. Fujita2, G. Krijnen1, and M. Elwenspoek1

1University of Twente, THE NETHERLANDS and 2University of Tokyo, JAPAN

WP38 NANOMETER SCALE ACTUATION OF MAGNETIC HEAD ELEMENTS IN HARD DISK DRIVESWITH BUILT-IN MICROHEATER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .818M. Kurita1, T. Shiramatsu1, K. Miyake2, A. Kato2, M. Soga2, H. Tanaka2, M. Suk3, and S. Saegusa4

1Hitachi, Ltd., JAPAN, 2Hitachi Global Storage Technologies, JAPAN,3Hitachi Global Storage Technologies, USA, and 4Hiroshima University, JAPAN

MICRO-OPTICAL DEVICES AND SYSTEMS

MP43 MEASUREMENT OF LIGHT INTENSITY FIELD WITH A FLUORESCENT BEAD CANTILEVER . . . . . . . . . . . . . . . . . . .822T. Kan, K. Hoshino, K. Matsumoto, and I. ShimoyamaUniversity of Tokyo, JAPAN

MP44 SELF-ASSEMBLED HIGH NA MICROBALL LENS ARRAYS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .826J.-Y. Huang, Y.-S. Lu, and J.A. YehNational Tsing Hua University, TAIWAN

MP45 DESIGN AND EXPERIMENT OF 3-DIMENSIONAL MICRO-OPTICAL SYSTEM FOR MEMS TUNABLE LASERS . . . . . .830X.M. Zhang, H. Cai, C. Lu, C.K. Chen, and A.Q. LiuNanyang Technological University, SINGAPORE

TPa42 PHOTONIC CRYSTAL ATTENUATOR WITH A FLEXIBLE WAVEGUIDE AND NANO-RODS . . . . . . . . . . . . . . . . . . . . . .834T. Takahata, K. Hoshino, K. Matsumoto, and I. ShimoyamaUniversity of Tokyo, JAPAN

TPa43 A SINGLE-LAYER MULTIPLE DEGREE-OF-FREEDOM PDMS-ON-SILICON DYNAMIC FOCUS MICRO-LENS . . . . . . .838Y.-C. Tung and K. KurabayashiUniversity of Michigan, USA

TPa44 NANOMETER-ORDER CONTROL OF MEMS RIBBONS FOR BLAZED GRATING LIGHT VALVES . . . . . . . . . . . . . . . . .842K. Saruta, H. Kasai, M. Nishida. M. Yamaguchi, Y. Ito, K. Yamashita, A. Taguchi, K. Oniki, and H. TamadaSony Corporation, JAPAN

TPb40 PNEUMATICALLY ACTUATED, MEMBRANE-BASED, MICRO-OPTICAL DEVICES . . . . . . . . . . . . . . . . . . . . . . . . . . . .846A. Werber and H. ZappeUniversity of Freiburg, GERMANY

TPb41 A TEMPERATURE-GRADIENT DRIVEN MICROMIRROR WITH LARGE ANGLES AND HIGH FREQUENCIES . . . . . . .850D. Elata and R. MahameedTechnion - Israel Institute of Technology, ISRAEL

TPb42 SUBWAVELENGTH METAL GRATING TUNABLE FILTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .854J. Provine1, J. Skinner1,2,3, and D.A. Horsley1,3

1University of California at Berkeley, USA, 2Sandia National Laboratories, USA, and3University of California at Davis, USA

WP39 MEMS TUNABLE OPTICAL FILTER USING AUTO-CLONED PHOTONIC CRYSTAL . . . . . . . . . . . . . . . . . . . . . . . . . . . .858S. Nagasawa, T. Onuki, Y. Ohtera, and H. KuwanoTohoku University, JAPAN

WP40 TWO-DIMENSIONAL MEMS SCANNER FOR DUAL-AXES CONFOCAL IN VIVO MICROSCOPY . . . . . . . . . . . . . . . . . .862H. Ra1, Y. Taguchi1, D. Lee1, W. Piyawattanametha1,2, and O. Solgaard1

1Stanford University, USA and 2National Electronics and Computer Technology Center, THAILAND

WIRELESS COMMUNICATION MICRO DEVICES AND SYSTEMS (NON-OPTICAL)

MP46 DISK-ARRAY DESIGN FOR SUPPRESSION OF UNWANTED MODES IN MICROMECHANICALCOMPOSITE-ARRAY FILTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .866S.-S. Li, Y.-W. Lin, Z. Ren, and C.T.-C. NguyenUniversity of Michigan, USA

MP47 A MONOLITHIC SURFACE MICROMACHINED HALF-COAXIAL TRANSMISSION LINE FILTER . . . . . . . . . . . . . . . . .870Y. Kim1,2, I. Llamas-Garro2, C.-W. Baek3, and Y.-K. Kim2

1Samsung Advanced Institute of Technology, KOREA, 2Seoul National University, KOREA, and 3Chung-Ang University, KOREA


MP48 A MILLIMETERWAVE MICROSTRIP ANTENNA WITHMICROMACHINED WAFER-LEVEL STACKING STRUCTURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .874Y. Yoshida, Y. Koga, A. Yamashita, K. Nishizawa, Y. Yokoyama, Y. Fujii, T. Hamaguchi,T. Nishino, M. Taguchi, and M. TakedaMitsubishi Electric Corporation, JAPAN

TPa45 LATERALLY ACTUATED, LOW VOLTAGE, 3-PORT RF MEMS SWITCH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .878R.W. Mosley1, E.M. Yeatman1,2, A.S. Holmes1,2, R.R.A. Syms1,2, A.P. Finlay1, and P. Boniface3

1Microsaic Systems, Ltd., UK, 2Imperial College London, UK, and 3EADS-Astrium Ltd., UK

TPa46 ULTRA-LOW VOLTAGE MEMS RESONATOR BASED ON RSG-MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .882N. Abelé1,2, K. Séguéni2, K. Boucart1, F. Casset2, B. Legrand3, L. Buchaillot3, P. Ancey2, and A.M. Ionescu1

1Ecole Polytechnique Fédérale de Lausanne, SWITZERLAND, 2ST Microelectronics, FRANCE, and 3IEMN, FRANCE

TPa47 ROTARY RF MEMS SWITCH BASED ON THE WOBBLE MOTOR PRINCIPLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .886S. Pranonsatit, G. Hong, A.S. Holmes, and S. LucyszynImperial College London, UK

TPb43 EFFECT OF GAS AND PRESSURE ON THE LIFETIME OF CAPACITIVE RF MEMS SWITCHES . . . . . . . . . . . . . . . . . .890P. Czarnecki1,2, X. Rottenberg1,2, R. Puers2, and I. De Wolf11IMEC, BELGIUM and 2Katholieke Universiteit Leuven, BELGIUM

TPb44 CHANNEL-SELECT MICROMECHANICAL FILTERS USING HIGH-K DIELECTRICALLYTRANSDUCED MEMS RESONATORS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .894H. Chandrahalim, D. Weinstein, L.F. Cheow, and S.A. BhaveCornell University, USA

TPb45 MECHANICALLY TRI-STABLE IN-LINE SINGLE-POLE-DOUBLE-THROW ALL-METAL-SWITCH . . . . . . . . . . . . . . . . .898J. Oberhammer1, M. Tang2,3, A.Q. Liu2, and G. Stemme1

1Royal Institute of Technology, SWEDEN, 2Nanyang Technological University, SINGAPORE, and3Institute of Microelectronics, SINGAPORE

WP41 A COMPARISION BETWEEN TUNABLE FBARS WITH AN INTEGRATED AND WITH A DISCRETEVARIABLE MEMS CAPACITOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .902W. Pan1,2, P. Soussan1, B. Nauwelaers2, R.P. Mertens1,2, and H.A.C. Tilmans1

1IMEC, BELGIUM and 2Katholieke Universiteit Leuven, BELGIUM

WP42 MECHANICALLY COUPLED CONTOUR MODE PIEZOELECTRIC ALUMINUM NITRIDE MEMS FILTERS . . . . . . . . . .906P.J. Stephanou, G. Piazza, C.D. White, M.B.J. Wijesundara, and A.P. PisanoUniversity of California at Berkeley, USA

WP43 TEMPERATURE COMPENSATED IBAR REFERENCE OSCILLATORS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .910G.K. Ho, K. Sundaresan, S. Pourkamali, and F. AyaziGeorgia Institute of Technology, USA

NANOELECTRICOMECHANICAL DEVICES AND SYSTEMS

MP49 DENSITY CONTROL OF CARBON NANOTUBES USING ETHANOL VAPOR FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . .914Y. Takei, K. Hoshino, K. Matsumoto, and I. ShimoyamaUniversity of Tokyo, JAPAN

MP50 MICROASSEMBLED MEMS MINISEM WITH CARBON NANOTUBE EMITTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .918R. Saini1, Z. Jandric1, M. Nolan1, and S.A.M. Mentink2

1Zyvex Corporation, USA and 2Philips Research Labs, THE NETHERLANDS

TPa48 WAFER-LEVEL TRANSFER OF THERMO-PIEZOELECTRIC SI3N4 CANTILEVER ARRAY ON A CMOS CIRCUITFOR HIGH DENSITY PROBE-BASED DATA STORAGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .922Y.-S. Kim1, H.-J. Nam1, S.S. Jang1, C.S. Lee1, W.-H. Jin1, I.-J. Cho1, J.-U. Bu1, S.-I. Chang2, and E. Yoon2

1LG Electronics Institute of Technology, KOREA and 2University of Minnesota, USA

TPb46 E-BEAM PHOTORESIST AND CARBON NANOTUBES AS BIOMIMETIC DRY ADHESIVES . . . . . . . . . . . . . . . . . . . . . .926Y.-C. Tsai, W.-P. Shih, Y.-M. Wang, L.-S. Huang, and P.-J. ShihNational Taiwan University, TAIWAN

WP44 POST-PROCESSING TECHNIQUES FOR THE INTEGRATION OF SILICON NANOWIRES AND MEMS . . . . . . . . . . . . .930O. Englander, D. Christensen, J. Kim, and L. LinUniversity of California at Berkeley, USA


POWER MEMS AND ENERGY HARVESTING

MP51 A ONE-COMPARTMENT, DIRECT GLUCOSE FUEL CELLFOR POWERING LONG-TERM MEDICAL IMPLANTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .934F. von Stetten1, S. Kerzenmacher1, A. Lorenz1, V. Chokkalingham1, N. Miyakawa1, R. Zengerle1,2, and J. Ducrée2


MP52 A MICROFABRICATED DIRECT METHANOL FUEL CELLWITH AN INTEGRATED ELECTROOSMOTIC PUMP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .938C.R. Buie, Y. Banin, C. Tang, J.G. Santiago, F.B. Prinz, and B.L. PruittStanford University, USA

TPa49 DEVELOPMENT OF METHANOL STEAM REFORMING SYSTEM INTEGRATEDWITH CATALYTIC COMBUSTER USING CARBON NANOTUBES AS CATALYST SUPPORTS . . . . . . . . . . . . . . . . . . . . .942D.-E. Park1, T.-K. Kim1, S. Kwon1, and E. Yoon2

1KAIST, KOREA and 2University of Minnesota, USA

TPa50 FLEXIBLE THIN-FILM BiTe THERMOPILE FOR ROOM TEMPERATURE POWER GENERATION . . . . . . . . . . . . . . . . .946M. Shiozaki1, S, Sugiyama1, N. Watanabe2, H. Ueno2, and K. Itoigawa2

1Ritsumeikan University, JAPAN and 2TOKAI RIKA Co., Ltd., JAPAN

TPb47 THREE-DIMENSIONAL NICKEL-ZINC MICROBATTERIES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .950F. Chamran, H.-S. Min, B. Dunn, and C.-J. KimUniversity of California at Los Angeles, USA

WP45 ASSEMBLY AND HERMETIC ENCAPSULATION OF WAFER LEVEL SECONDARY BATTERIES . . . . . . . . . . . . . . . . . .954K. Marquardt1, R. Hahn2, T. Luger1, and H. Reichl1,2

1Technische Universität Berlin, GERMANY and 2Fraunhofer IZM, GERMANY

Hagia Sophia


Exhibit FLOORPLAN


BALLROOM A

ENTRANCEFROM STREET

REG

ISTR

ATIO

N D

ESK

ENTRANCEFROM HOTEL

ESC

ALA

TOR

S

COFFEE

1

23 26

24 27

25 28

29 32

30 33

31 34

18

14 15 16 17

2 3 4 5

6 7 8 9

10 11 12 13

40

41

42

48 47 4644 43

45

EXHIBITS

EXHIBITS

EXHIBITS

TABLES

CLOAKAREA

POSTER FLOORPLAN

WP3

TPb3

TPa3

MP3

MP4

TPb4

TPa4

WP4

TPa9

WP9

MP9

TPb9

MP1

0

TPb1

0

TPa1

0

WP1

0

TPa1

5

WP1

5

MP1

5

TPb1

5

MP1

6

TPb1

6

TPa1

6

WP1

6

TPa2

1

WP2

1

MP2

1

TPb2

1

MP2

2

TPb2

2

TPa2

2

WP2

2

TPa2

7

WP2

7

MP2

7

TPb2

7

MP2

8

TPb2

8

TPa2

8

WP2

8

TPa3

3

WP3

3

MP3

3

TPb3

3

MP3

4

TPb3

4

TPa3

4

WP3

4

WP2

TPb2

TPa2

MP2

MP5

TPb5

TPa5

WP5

TPa8

WP8

MP8

TPb8

MP1

1

TPb1

1

TPa1

1

WP1

1

TPa1

4

WP1

4

MP1

4

TPb1

4

MP1

7

TPb1

7

TPa1

7

WP1

7

TPa2

0

WP2

0

MP2

0

TPb2

0

MP2

3

TPb2

3

TPa2

3

WP2

3

TPa2

6

WP2

6

MP2

6

TPb2

6

MP2

9

TPb2

9

TPa2

9

WP2

9

TPa3

2

WP3

2

MP3

2

TPb3

2

MP3

5

TPb3

5

TPa3

5

WP3

5

WP1

TPb1

TPa1

MP1

MP6

TPb6

TPa6

WP6

TPa7

WP7

MP7

TPb7

MP1

2

TPb1

2

TPa1

2

WP1

2

TPa1

3

WP1

3

MP1

3

TPb1

3

MP1

8

TPb1

8

TPa1

8

WP1

8

TPa1

9

WP1

9

MP1

9

TPb1

9

MP2

4

TPb2

4

TPa2

4

WP2

4

TPa2

5

WP2

5

MP2

5

TPb2

5

MP3

0

TPb3

0

TPa3

0

WP3

0

TPa3

1

WP3

1

MP3

1

TPb3

1

MP3

6

TPb3

6

TPa3

6

WP3

6

TPa3

9

WP3

9

MP3

9

TPb3

9

MP4

0

TPb4

0

TPa4

0

WP4

0

TPa4

5

WP4

5

MP4

5

TPb4

5

MP4

6

TPb4

6

TPa4

6

MP4

7

TPa3

8

WP3

8

MP3

8

TPb3

8

MP4

1

TPb4

1

TPa4

1

WP4

1

TPa4

4

WP4

4

MP4

4

TPb4

4

TPb4

7

TPa4

7

MP4

8

TPa4

8

TPa3

7

WP3

7

MP3

7

TPb3

7

MP4

2

TPb4

2

TPa4

2

WP4

2

TPa4

3

WP4

3

MP4

3

TPb4

3

MP4

9

TPa4

9

MP5

0

TPa5

0

MP5

1

MP5

2

Monday (MP)Poster/Oral Session I

Tuesday A (TPa)Poster/Oral Session II

Tuesday B (TPb)Poster/Oral Session III

Wednesday (WP)Poster/Oral Session IV

Poster COLOR Legend

TO EXHIBITS


program at a glance - mems conferences · 2006-01-12 · 4 mems 2006final program socialevents...

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