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Progress of Integration in MEMS and New Progress of Integration in MEMS and New Industry CreationIndustry Creation

Progress of Integration in MEMS and New Progress of Integration in MEMS and New Industry CreationIndustry Creation

Prof. Susumu Sugiyama

Scientific Expert, JSPS/JAICADirector, Research Institute for Nanomachine System Technology

Professor, Ritsumeikan Global Innovation Research Organization

Ritsumeikan University

Japanhttp://www.ritsumei.ac.jp/se/~sugiyama/index.html

18, September 2009

2 2

Ritsumeikan UniversityRitsumeikan UniversityFounded in 1869.• Spirit of the school: “Intellectual Freedom and Innovation”• Concept for education: “Peace and Democracy.”

Lake Biwa

Ritsumeikan Univ.Ritsumeikan Univ.Biwako-KusatsuBiwako-Kusatsu

Kyoto

Ritsumeikan Univ.Kinugasa

Shiga

Kinugasa Campus (Kyoto)Students : 15,300, Staff : 430• Faculties of Humanities and Social Science• College of Law• College of Social Sciences• College of International Relations• College of Policy Science• College of Letters

Biwako ･ Kusatsu Campus (Kusatsu City, Shiga Prefecture)Students : 17,000, Staff : 460• College of Economics• College of Business Administration• College of Science and Engineering• College of Information Science and Engineering• College of Life Sciences• College of Pharmaceutical Sciences

Japan

3 3

College of Science and EngineeringCollege of Science and Engineering

• Department of Mathematical Science

• Department of Physical Science

• Department of Electrical and Electronic Engineering

• Department of Photonics

• Department of VLSI System Design

• Department of Mechanical Engineering

• Department of Robotics

• Department of Micro System Technology

• Department of Civil Engineering

• Department of Environmental Systems Engineering

• Department of Architecture and Urban Design

Biwako ･ Kusatsu Campus (Kusatsu City, Shiga Prefecture)

4 4

Micro/Nano Fabrication

System 　Integration

Micro/Nano Materials

Evaluation

Design and Simulation

Research Institute for Nanomachine System Technology (RINST)

　　　　　 CAD 　　　　　　　　　　 Photolithography 　　　 Electron beam 　　　　 Micro process 　　　 Synchrotron radiation

Completion: 31st March 2002, Total Floor Space: 1350 m2 (Clean Room:325 m2)

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Nanomachine System Technology

Consortium(60 Companies)

Nanomachine System Technology

Consortium(60 Companies)

Research Institute for Nanomachine System

Technology(RINST)

Research Institute for Nanomachine System

Technology(RINST)

Industry, Government and Academia

Industry, Government and Academia

MEMS R & D and

Commercialization

MEMS R & D and

Commercialization

2121stst Century COE Program Century COE Program in the Ministry of Education, Culture, Sports, Science and Technology

2002 ~ 2006

Research Office

Research Office

MITSUBISHIHITACHI

PANASONICNEC

FUJITSUSUMITOMO E.

DENSOCANON

KONICA MINORUTARICHOEPSONOMRON

OLYMPUSBROTHER

SHIMADZU………

MITSUBISHIHITACHI

PANASONICNEC

FUJITSUSUMITOMO E.

DENSOCANON

KONICA MINORUTARICHOEPSONOMRON

OLYMPUSBROTHER

SHIMADZU………

6 6

OutIn

....

Concept of MEMSConcept of MEMS (Micro Electro Mechanical Systems)

ThermalElectricalMechanicalOpticalChemicalBiological....

ThermalElectricalMechanicalOpticalChemicalBiological....

Integrated devices.Inputs and outputs are not only electrical signal but also thermal, electrical, chemical, biological information, etc.Moving devices.Fundamental devices following ICs. ICs : rice, MEMS : beans.Expected to come into practical use for human society in the near future.

Processing ICsMemories

RF ICs

Sensors Actuators

Silicon chip

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Micro/Nano Technology Platform　 Lithography, Etching, Beam Process, Deposition, Epitaxial Growth

Molding, Inprinting, Measuring, Evaluation, etc

Micro/Nano Technology Platform　 Lithography, Etching, Beam Process, Deposition, Epitaxial Growth

Molding, Inprinting, Measuring, Evaluation, etc

MEMS/NEMSMEMS/NEMSMicro/Nano Micro/Nano

System Tech.System Tech.

Biology Biology EnvironmentEnvironment

Medical TreatmentMedical TreatmentWelfareWelfare

Communication Communication Information Tech.Information Tech.

SecuritySecuritySafetySafety

Bottom Up Tech.Nano Technology

Status of MEMS/NEMS TechnologyStatus of MEMS/NEMS Technology

0.1nm 1nm 10nm 100nm 1m 10m 100m 1mm

Top Down Tech.Micormachining

Micro-Nano 　 System Devices

Waveguide Grating

Photonic Crystal ModulatorProbe for Strage

Image Sensor

Trench etching stopper

Absorbing membrane

Etching holes for Si substrate

40 µm

Readout lineSi substrate

Support leg

Nano Pillar for DNA Analysis

Nano Carrier for DDS

Monitoring Device

RF-Integrated Device

Bio-polymer Chip

-TAS

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Medical TreatmentDiagnosis

Medical TreatmentDiagnosis

Robotics, FARobotics, FA

Chemical AnalysisChemical Analysis

Environment, Bio

Environment, Bio

AerospaceAerospace

Information TechnologyInformation Technology

Medical EngineeringSports

Medical EngineeringSports

ProductionDeliveryTransportFactoryAgriculture

ProductionDeliveryTransportFactoryAgriculture

Internet

MEMS/NEMS ApplicationsMEMS/NEMS Applications

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1987 2000

Passive Devices

R & D

Microsystems

Gas Chromatography (Stanford Univ., 1979)

Micro Pressure Sensor (Toyota R&D, 1986)

Active Devices

Electrostatic Micro Motor (MIT, 1989)

Micro Gear (AT&T Bell Lab., 1987)

Commercialization

21st Century

Development of MEMS/NEMSDevelopment of MEMS/NEMS

Sensor

s Actuator

s

Sensors+

Actuators+

Processor

Systematization Nano-technology

Integrated Pressure Sensor

(Toyota R&D, 1983)

Closed Loop Accelerometer

(Analog Devices)

Micro-NanoSystems

)

Digital Mirror DeviceDLP TM

(Texas Instruments)

)

10 10

MEMSMEMSMoving Devices with Integrated Circuits on a Chip Moving Devices with Integrated Circuits on a Chip

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MEMSMEMSMoving Devices with Integrated Circuits on a Chip Moving Devices with Integrated Circuits on a Chip

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Global MEMS/NEMS market prospect 2005-2010Global MEMS/NEMS market prospect 2005-2010(Silicon and Quart based devices)

(Source: Yole Dévelopement, 8/2006)(US$ 1M 1 億円 )

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2005 2010 2015

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4.85

1.17

2.40

1

2

3

4

5

6

7

■

6.14

MEMS Domestic Market (MMC Data)

Semiconductor Domestic Capacity (WST Data May 2008)

■ 　ＭＥＭＳ市場の伸びは、半導体市場（生産能力）の伸びを上回る。　　　（ＭＥＭＳが高機能・高集積・知能化部品として、半導体代替の傾向？）

0.44

■

●

●

●

5.535.75

5.40

5.73

■■

■■

0

（ 2.2%/Y ）

（ 21%/Y ）

兆円Ter

a Y

enMEMS market exceeds semiconductor market in growth(MEMS will be alternative of ICs as advanced intelligent parts)

MEMS Market and Semi. MarketMEMS Market and Semi. Market

Fiscal Yera

14 14

Successful Applications Using Successful Applications Using MEMS/NEMS TechnologyMEMS/NEMS Technology

Previous Previous

15 15

Success in Automobile - Sensors - Success in Automobile - Sensors -

              

 

Full-production began from the 1980s.Production of pressure sensors and accelerometers become more than 10 million/month in scale at present.

Accelerometer for Airbag

System

(Denso)３ × ３ mm2

Pressure Sensor for Electronic Fuel Injection Control System for Engine, Toyota CRDL

Gyro ScopeTire Pressure Sensor

Rotation Sensor Gas Sensor

etc.

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““DMD”DMD”

Projector System

Texas Instruments DLP (Digital Light Processing)

Success in IT - Digital Mirror Device -Success in IT - Digital Mirror Device -Full-production began from the latter half of the 1990s undergo developing for over 10 years.It is competing with LC projector in the digital projection market at present.

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R & D AppliedR & D AppliedMEMS/NEMS TechnologyMEMS/NEMS Technology

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Application into Robotics and AutomationApplication into Robotics and Automation

５m

m

Pressure sensor Tactile Sensor Force Sensor

Accelerometer

Gyroscope

X

Z

Y

RollYaw

Pitch

19 19

<111>

Si (110)

2.0

mm

750m

1.5mm

Head

Transmission Rod

Piezoresistor

Sensor Chip

Base Plate3.0

mm

Force

300 m

750 m

R1

R3

R4

R2 A'A X<111>

Y <211>

Si

Piezoresistors

Cross section of A-A'

2080 m

750 m

Si Piezoreesistive Pressure Sensor

Packaged sensor

20 20

6-DOF Micro Force-Moment Sensor6-DOF Micro Force-Moment Sensor

Silicone rubber

Mx

MyFz

Fx

Fy

Mz

Shear piezoresistor (30 x 30)

Normal piezoresistor (3 x 40)

Contact hole (2 x 2) Electrical wiring (width 4)

(Unit : m)

Fabricated by D-RIE on SOI sub.Diffused piezoresistors.Center of the beam = force-applying point.

Application: Fingertip sensor Tactile sensor Sophisticated robot area

５m

m

6-DOF MFMS

Transmission pillar

Soft hemisphere cover

Overload protection

PCB

Connector

Flexible cable

21 21

1 mm

3mm x 3mm

0.5mm x 0.5mm

1

MNMX

X Y

Z

-2.405

-1.872-1.338

-.805278-.272118

.261042.794203

1.3271.861

2.394

JUL 31 200321:47:05

ELEMENT SOLUTION

STEP=1SUB =1TIME=1SX (NOAVG)RSYS=0DMX =.024174SMN =-2.405SMX =2.394

Sensing beamFrame

Seismic mass

Silicon

3-D Accelerometer3-D Accelerometer

22 22

Piezoelectric pump

nozzle orifice

Si sensing chip

Gas Rate GyroscopeGas Rate GyroscopeHot wire

Laminar Jet

R

inVoutV

R

L

1R

2R

Resolution=0.04(deg/sec)

Ne

Application to stability controller system of ship and automobile.

Si sensing chip

Pump

Nozzle orifice

Sensing chip

Aluminum Case

Hotwire detects the deflection of gas flow induced by Coriolis force.

(L x W x T) 400 x 4 x 2 m3

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在宅

病院

Blood Testing ChipHome

Hospital

Application into Medical DiagnosisApplication into Medical Diagnosis

For QOLFor QOLOn Site DiagnosisOn Site Diagnosis

Wireless

Internet

24 24

【 2m-depth Chip 】

Flow test sample ： Control blood LC-TROL16P NORMAL (made in U.S.)

0 1 2 3 4 5 6 7 8 9 10 11

0

1

2

3

4

5 P2 PHa2 PHb2

Num

ber

of

red c

ells

[106 /

l]

F lowing distance [mm]

Sensing area

Blood Plasma SeparationBlood Plasma Separation赤血球：

380-530 万個 /L

血漿

血小板：15-34 万個 /L

白血球：4000-9000 個 /

L

Structure of Plasma Separation Chip

Inlet

Gras Cover

Si-sub

Channel Filter

Capillary Force

BloodBlood Plasma

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Antenna

Display

Micro Switches

Variable Capacitors /Inductors

Variable Filters

Integrated Microphone

Application into ICTApplication into ICT

Advanced Advanced Smart Cellular PhoneSmart Cellular Phone

Accelerometer / Vibrating Sensor

Altimeter / Pressure Sensor

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Application into GarmentApplication into Garment

５m

m

Pressure Sensor /Tactile Sensor

AccelerometerEnergy Harness

Cu NiHeat dissipation film

Polyimide

Hot junction

Heat absorption filmCold junction

45°

Cu NiHeat dissipation film

Polyimide

Hot junction

Heat absorption filmCold junction

45°

Temp. Sensor

Thermopile Thermopile Power GeneratorPower Generator

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LogicCPU

Sensor

ActuatorPower

storage

RFCircuit(GHz)

A/D

MemoryID

I/O

S-chip

ID, Data

userS-chip

S-chip

LAN

ID recognition

Internet

Server

Server

user

S-chip

user

Ubiquitous sensor environment

SNA-MEMS (SNA-MEMS (SSmart mart NaNano-MEMS)no-MEMS)

SNA-MEMS Card

SNA-MEMS Cube

SNA-MEMS Chip

13.56MHz

2004

54x86mm2

2005

10x10mm2

2006 ～2.5x2.5mm2

0.5mm x 0.5mm

Si Nano wire piezoresistor

W=55nm

2.45GHz

Wireless!Batteryless!

Final Goal 0.5x0.5x0.5 mm2

28 28

SNA-MEMS Cube PackagingSNA-MEMS Cube Packaging

Cube21st Century COE Program 1 cm cubic

Control logic Sensor Amp.

Sensor Amp.Switch circuit

RF circuit Power circuit3-D A-sensor

T-sensor

Electrodes/Antenna

29 29

30 30Rotational comb actuatorsAnti-reverse Mechanism

Rotated Motor Combining Latch Mechanism with Rotated Motor Combining Latch Mechanism with Comb Drive Electrostatic ActuatorComb Drive Electrostatic Actuator

Outer ratchet ring

Gear

31 31

Straight module

T-Junction module

Turning module

Departure module

Directional-switching leverComb actu

ator

Si Micro Transportation SystemSi Micro Transportation SystemIn Biotechnology / Medical Science, very-small-quantity substances such as

bio-cells and molecular samples under the microscope inspection

32 32

Straight movement Turning movement

28.559.5

138.75

234.67

320392

738

0

100

200

300

400

500

600

700

800

900

1000

0 2 4 6 8 10 12 14 16 18 20

Frequency (Hz)V

elo

city

(u

m/s

)

Calculation

Measurement

T-Junction Module

- In order to guarantee the movement of microcar, x must be larger than pitch of ratchet tooth p = 10m. In other word, if L =150m, from (5): y 10.9m- When L =150m; V = 100(V) y = 24m From (5), we have: x = 19.5mFrom (6), velocity of microcar: v = 2.x.f = 39f (m/s)

Movement of Micro Container in MTSMovement of Micro Container in MTS

33 33

Packaged engine for operation ・ P= 0.45MPa・ Q= 105ml/s・ F= 2Hz

Micro Reciprocating EngineMicro Reciprocating Engine

Magnet (Nd-Fe-B)

Generator Core

Cylinder case (Si)

1 [mm]

10 [mm]

15 [mm]Piston (Si)

Exhaust vent

Pressure pump

Combustion chamber

Upper plate (glass)

Energy Harness

34 34

MEMS/NEMS Devices Production Utilized Bio-based Polymer MEMS/NEMS Devices Production Utilized Bio-based Polymer (Green (Green MEMS/NEMSMEMS/NEMS))

・ Adaptation to global issues such as progress of global warming and climate change・ Establishment of sustainable production system ・ Breakaway from extreme oil dependence of energy resources・ Recyclable resources, carbon-neutral production system

＜ Background of the Research ＞・ Reduction of nanotechnology research results to the society ・ Since MEMS production uses the same system as a semiconductor/IC, the cost is high （ down to 1/10 ）・ Bio-compatibility of a device, and disposable problem in medical use

Shift to the bio-base material originated plant from petrochemicals

Progress of micro/nano process technologyConformity to a limited production with a wide variety

Research for MEMS Devise Production Utilized Bio-based Polymer

＋

Comparison to Si of PMMA

Young's modulus 　 1/50Density 　 1/2

Thermal expansion coefficient 　X15

Insulating propertyTransparency

20µm

5µm

High aspect ratio (15 (2µm×30µm ) structures by Nano-imprinting

Utilizing material properties

Characteristic improvement technology of

materialStable

production

micro/nano process technology

Biomass grain

Starch

Glucose

Lactic acid

Poly-lactic acid

Lactic acidCO2 ・ H ２ O

Photosynthesis

Biodegradation

Hydrolysis

Enzyme decomposition

Lactic acidfermentation

Polymerization

Biology

Industry

Circulation cycle of poly-lactic acid (PLA)

Establishment of sustainable

production system

Application High Functional Micro Devices

Microsensors, Actuators, μ-TAS, DDS, Artificial OrgansIndustry

ICT, Automobile, Bio-medical, Precision Instruments

2008-12-02 　 R-GIRO S.Sugiyama

Development of fabrication technology

Nano-imprinting ＋ Assembly

Development of material generation technology

Composition of bio-base polymer

35 35

• The hot embossing molding machine for high precision MEMS was made.• The high precision hot embossing molding technology using Si mold was established. Mini

mum size: 2um, maximum aspect ratio: 15• A polymer MEMS fabrication process has been established.• The PMMA comb drive electrostatic micro-actuator was manufactured, and operation was de

monstrated.

10μm

(a) Fabrication of two-step Si mold

(b) Hot embossing of comb actuator

(c) Bonding by surface activation method

(d) Removing film ultra-precision machining

(e) Coating Au for electrode

Si PMMA AuSi PMMA Au

Movable part

Fixed part

200μm2 m

30 m

2 m

30 m

5μm

Polymer MEMS: Comb Drive Polymer MEMS: Comb Drive Electrostatic ActuatorElectrostatic Actuator

36 36

100V@5Hz

Mirror device

Incident laser beamReflected laser

Mirror Device Mirror Device Driving TestDriving Test

Device Under Test

Laser beam scanning by mirror device driving

37 37

100V@100Hz 100V@5Hz

Polymer MEMS is driven like Si device

Laser Beam Track Reflected by Mirror Device

Mirror Device Mirror Device Driving TestDriving Test

38 38

THANK YOU FOR KIND ATTENTION ! THANK YOU FOR KIND ATTENTION ! THANK YOU FOR KIND ATTENTION ! THANK YOU FOR KIND ATTENTION !

Prof. Susumu Sugiyama

Scientific Expert, JSPS/JAICADirector, Research Institute for Nanomachine System Technology

Professor, Ritsumeikan Global Innovation Research Organization

Ritsumeikan University

Japanhttp://www.ritsumei.ac.jp/se/~sugiyama/index.html

18, September 2009