qualcomm wigig chipset for smartphones · ©2018 by system plus consulting | qualcomm wigig 60 ghz...
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©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 1
22 Boulevard Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Qualcomm WiGig Chipset for SmartphonesWorld’s First mmWave Chipset for handsetRF report by Stéphane ELISABETHJuly 2018 – version 1
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 2
Table of ContentsOverview / Introduction 4
o Executive Summaryo Reverse Costing Methodology
Company Profile 8o Qualcommo WiFi History, Evolution & Challengeso Qualcomm 60 GHz PortFolioo Toward 5G Implementationo TP-LINK Talon AD7200 Teardown
Market Analysis 23o WiGig First mmWave Certificated protocolo mmWave communication penetration rateo Doubled sided technologyo RF SiP packaging market revenue
Physical Analysis 28
o Synthesis of the Physical Analysis
o Module Package 31 Package Views: Dimensions, marking, Block Diagram
Physical Analysis of the Baseband Board 34
o Baseband Board 34 Board disassembly: Overview
o Baseband SiP 36 Package Views: Dimensions, marking
Package Opening: Top, Botttom, Bill of Materials
Package Cross-Section : PCB Substrate, Copper Pillars, Dies
Summary of Physical Data Summary of main Dies
o Baseband Processor & SiP active dies 52 Die View & Dimensions Delayering & main Blocs Die Process Die Cross-Section Die Process Characteristic
Physical Analysis of the Antenna Board 69
o Antenna Board 69 Board disassembly: Overview, Bill of materials
Board Overview : PCB Substrate, Antenna Patch
Board Cross-Section: PCB Substrate substrate, Patch antenna, Ground Plane
o Antenna SiP 81 Package Views: Dimensions, marking
Package Overview : Patch Antenna, Dipole Antenna
PCB Substrate deprocessing Package Opening: Botttom, Bill of Materials
Package Cross-SectionPCB Substrate, Copper Pillars, Ground Plane, Patch Antenna, Dipole Antenna
Summary of Physical Data Summary of main Dies
o RFIC 100 Die View & Dimensions Delayering & main Blocs Die Process: On Board Isolation, Transceiver
Die Cross-Section Die Process Characteristic
Physical Comparison 121 Baseband SiP Discrete packaging Solution FemtoCells vs. Handset: Chipset, From Factor, Cross-Section, Antennae
Manufacturing Process 127o Synthesis of the main partso Baseband Processor, RFIC Die Front-End Process & Fabrication Unito SiP Fabrication Unito SiP Packaging Process Flow
Cost Analysis 138o Synthesis of the cost analysiso Yields Explanation & Hypotheses 141
o Baseband Processor, RFIC 143 Die Front-End Cost Die Wafer Cost Die Cost
o Baseband & Antenna SiP Packaging 146
Reconstituted Panel Cost
Baseband & Antenna SiP Packaging Cost
Baseband & Antenna SiP Packaging Cost per steps
Baseband & Antenna SiP Component Cost
o Module 156 Wigig Chipset Smartphone Edition Module Assembly Cost
Estimated Selling Price 157
Company services 163
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 3
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Executive Summary
• This complete solution has been designed for smartphone application, especially for ASUS. The module, integrated in the ASUS ZenFone 4 Pro, comes with two systems linked by a coaxial connection. Both System in Package (SiP) use non-conventional double-sided molded packaging developed by Murata. One integrated on the main board and the other featuring innovative antennae integrated in an organic PCB. It integrates almost 20 antennae, a RFIC die, thermal management and isolation solution, all in a single package smaller than 40 mm².
• Developed by Wilocity, which has been a Qualcomm subsidiary since 2014, the RFIC features up to four transceivers controlling up to 32 antennas, both patch and dipole, for the beamforming at 60 GHz. Both SiPhas very thin confined PCB substrate and embedded Copper pillars realizing the signal distribution structure. This first integration of such mmWave device in a handset shows the full compatibility of this SiPtechnology that could give some answer for 5G implantation issues.
• This report includes a full investigation of the system, featuring a detailed study of the SiP and the antenna board including die analyses, processes and board cross-sections. It contains a complete cost analysis and a selling price estimation of the system. Finally, it features an exhaustive comparison with the Qualcomm’ QCA9500 dedicated to router or mobile computer.
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 4
Overview / Introduction
Company Profile & Supply Chain o Qualcommo WiFi technologyo Qualcomm PortFolioo 60GHz Network Applicationo Asus ZenFone 4 Pro
Teardown
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Asus ZenFone 4 Pro Teardown
Asus ZenFone 4 Pro Front & Rear Views©2018 by System Plus Consulting
Asus ZenFone 4 Pro Opening View©2018 by System Plus Consulting
For the ZenFone 4 pro, the main board takes 25 % of the space available on the frame.
Dual Rear Camera
Battery
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 5
Overview / Introduction
Company Profile & Supply Chain
Market Analysiso Communication protocolo mmWave penetration rateo Double sided technologyo RF SiP Market revenue
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
mmWave communication penetration rate
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 6
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Moduleo Baseband Board
Board Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies
o Antenna Board Board Board Cross-Section Antenna SiP Antenna SiP Cross-Section RFIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Summary of the Physical Analysis
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 7
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Moduleo Baseband Board
Board Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies
o Antenna Board Board Board Cross-Section Antenna SiP Antenna SiP Cross-Section RFIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Module View & Dimensions
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Moduleo Baseband Board
Board Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies
o Antenna Board Board Board Cross-Section Antenna SiP Antenna SiP Cross-Section RFIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Baseband Board – Board Overview
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 9
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Moduleo Baseband Board
Board Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies
o Antenna Board Board Board Cross-Section Antenna SiP Antenna SiP Cross-Section RFIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Baseband SiP – Package View & Dimensions
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 10
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Moduleo Baseband Board
Board Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies
o Antenna Board Board Board Cross-Section Antenna SiP Antenna SiP Cross-Section RFIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Baseband SiP – Bill of Material
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 11
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Moduleo Baseband Board
Board Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies
o Antenna Board Board Board Cross-Section Antenna SiP Antenna SiP Cross-Section RFIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Baseband SiP – Package Cross-Section
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 12
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Moduleo Baseband Board
Board Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies
o Antenna Board Board Board Cross-Section Antenna SiP Antenna SiP Cross-Section RFIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Baseband SiP – Baseband Processor Die Dimensions
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 13
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Moduleo Baseband Board
Board Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies
o Antenna Board Board Board Cross-Section Antenna SiP Antenna SiP Cross-Section RFIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Antenna Board – Board Overview
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 14
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Moduleo Baseband Board
Board Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies
o Antenna Board Board Board Cross-Section Antenna SiP Antenna SiP Cross-Section RFIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Antenna Board – Board Cross-Section
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 15
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Moduleo Baseband Board
Board Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies
o Antenna Board Board Board Cross-Section Antenna SiP Antenna SiP Cross-Section RFIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Antenna SiP – Package View & Dimensions
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 16
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Moduleo Baseband Board
Board Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies
o Antenna Board Board Board Cross-Section Antenna SiP Antenna SiP Cross-Section RFIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Antenna SiP – Package Cross-Section
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 17
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Moduleo Baseband Board
Board Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies
o Antenna Board Board Board Cross-Section Antenna SiP Antenna SiP Cross-Section RFIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Antenna SiP – RFIC – Die View & Dimensions
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 18
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Moduleo Baseband Board
Board Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies
o Antenna Board Board Board Cross-Section Antenna SiP Antenna SiP Cross-Section RFIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Antenna SiP – RFIC – Die Cross-Section – Decoupling Structure
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 19
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison o Discrete Packaging o FemtoCells vs. Handset
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Qualcomm WiGig Chipset – Femto Cells vs. Handset
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 20
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Synthesiso Front-End Process &
Fabrication Unito SiP Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Packaging Process Flow (1/2)
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 21
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yield Hypotheseso Baseband FE Cost &
Wafer/Die Costo BB SiP Packaging Costo BB SiP Component Costo RFIC FE Cost & Wafer/Die
Costo Antenna SiP Packaging
Costo Antenna SiP Component
Costo Module Cost
Selling Price Analysis
Feedbacks
About System Plus
Baseband SiP Packaging Cost
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 22
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yield Hypotheseso Baseband FE Cost &
Wafer/Die Costo BB SiP Packaging Costo BB SiP Component Costo RFIC FE Cost & Wafer/Die
Costo Antenna SiP Packaging
Costo Antenna SiP Component
Costo Module Cost
Selling Price Analysis
Feedbacks
About System Plus
Baseband SiP Component Cost
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 23
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yield Hypotheseso Baseband FE Cost &
Wafer/Die Costo BB SiP Packaging Costo BB SiP Component Costo RFIC FE Cost & Wafer/Die
Costo Antenna SiP Packaging
Costo Antenna SiP Component
Costo Module Cost
Selling Price Analysis
Feedbacks
About System Plus
RFIC Front-End Cost
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 24
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yield Hypotheseso Baseband FE Cost &
Wafer/Die Costo BB SiP Packaging Costo BB SiP Component Costo RFIC FE Cost & Wafer/Die
Costo Antenna SiP Packaging
Costo Antenna SiP Component
Costo Module Cost
Selling Price Analysis
Feedbacks
About System Plus
Module Cost
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 25
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysiso Definition of Priceso Manufacturer Financial o Manufacturer Price
Feedbacks
About System Plus
Estimated Manufacturer Price
©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 26
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Pluso Company serviceso Related reportso Contacto Legal
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
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©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 28
Overview / Introduction
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About System Pluso Company serviceso Related reportso Contacto Legal
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©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 29
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Pluso Company serviceso Related reportso Contacto Legal
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