runaway propagation modeling in modules...

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Qibo Li, Chunabo Yang, and Ahmad Pesaran National Renewable Energy Laboratory; Golden, CO Trung Nguyen, EIC Labs; Norwood, MA Venkatesan Manivannan, NAVAIR; Patuxent River, MD Thermal Runaway Propagation Modeling in Lithium Ion Modules with and without PCM

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Page 1: Runaway Propagation Modeling in Modules PCMcii-resource.com/cet/FBC-05-04/Presentations/BTS/Pesaran_Ahmad.pdf · PCM Time (Second) Liquid Volume Fraction of PCM Global Fraction Local

Qibo Li, Chunabo Yang, and Ahmad PesaranNational Renewable Energy Laboratory; Golden, COTrung Nguyen, EIC Labs; Norwood, MA Venkatesan Manivannan, NAVAIR; Patuxent River, MD

Thermal Runaway Propagation Modeling in Lithium Ion Modules with and without PCM

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Li‐Ion Battery Safety is a Concern for Many Applications

Thermal Runaway

If Heating Rate Exceeds Dissipation Rate

External Heating

Over-Charging

High Current Charging

Crush

Nail/rod penetration

External Abuse Conditions

External Short

Over-Discharging

Leak

Smoke

Gas Venting

Flammable electrolyte

Decompositions

Side Electrochemical Reactions

Electrode-ElectrolyteReactions

Lead to Exothermic Reactions

Foreign objects

Or Internal Events

Lithium Plating

Lithium Dendrite

Depends on:• Chemistry• Electrolyte• Additives• Separator• Cell design• Safety features• Environment• State of charge

Various Factors Could Lead to Thermal Runaway (TR) of a Cell

Rapid Disassembly

Flames

Thermal Runaway

Additional HeatAdditional Heat

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• Millions of lithium ion cells are produced everyday – production growing• Even with six sigma quality control, some cells may have inherent defects that

may lead to field failure later• During operation one or more cells may experience some kind of abuse• Can single cell thermal runway be avoided – safer chemistries & designs?• Single cell abuse has lead to thermal runaway and fire in modules with small

number of cells (Boeing 787 and laptops)• In modules/packs with significant large number of cells (vehicles and grid),

probability of cell TR increases • Cell‐to‐cell thermal runway in modules and packs leading to a larger safety

event is of much more concern (loss of assets& revenue; damage to brand) • Can diagnostics and monitoring systems warn about impending failures in a

module/pack for preventive or corrective actions?• Can cell‐to‐cell thermal runaway be avoided ‐ safer designs?

Module/Pack Thermal Runaway – a larger concern than cell TR

This presentation ‐Modeling

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Internal T

External T

(600°C)

0 40 (sec)

(30°C)

NREL Lithium Ion Battery Safety Portfolio ‐ 1NREL Lithium Ion Battery Safety Portfolio ‐ 1

• Computer Aided Engineering for Batteries (CAEBAT) (the first and second generation of these tools are now offered by ANSYS, CD-adapco, EC Power)

• Electrochemical-thermal (ETC) models (offered by NREL)

• Abuse reaction kinetics modeling (now offered by ANSYS)

• Overheating (thermo-chemical) simulations (offered by NREL)

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NREL Lithium Ion Battery Safety Portfolio ‐ 2NREL Lithium Ion Battery Safety Portfolio ‐ 2

• Mechanical-ETC models for crush simulation (will be offered in 2018 as a user-defined function in LS-Dyna)

• Internal short circuit modeling (offered by NREL)

• Nail penetration modeling (offered by NREL)

• Overcharge modeling and testing (offered by NREL)

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NREL Lithium Ion Battery Safety Portfolio ‐ 3NREL Lithium Ion Battery Safety Portfolio ‐ 3

• Accelerating rate calorimeter testing

• Fail safe design architecture for multi-cell strings (under development)

• Battery internal short circuit instigator device (offered by NREL)

• Cell-to-cell thermal propagation modeling (non-mechanical)

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Battery Module Modeled (4P8S)

• Module designed by ECI Labs per NAVAIR spec.

• Geometry and fine mesh of battery module were created in ANSYS Workbench. Plastic enclosure applied at top and bottom of battery module

• Objective of this study is to understand the effectiveness of PCM on mitigation of cell‐cell thermal propagation after short circuit occurs in a cell

4P8S Battery Module

Chemistry LFP/Gr NMC/GrNumber of Cell 32 32

Structure 4 Parallel8 Series

4 Parallel8 Series

Volume (L) 2 2Weight (kg) 3.3 3.5Nominal Voltage (V) 13.2 14.8Capacity (Wh) 264 521

4P8S 3D Mesh4P8S 3D Geometry

PCM

Specifications of Battery Module

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Cell Specifications and Material Thermal Properties

Material Thermal Properties PCM Plastic

Density (kg/m3) 870 900Cp (J/kg‐K) 1877 (Solid) / 2399 (Liquid) 1800k (W/m‐K) (Radial, Tangential and Axial) 0.4 0.22

Phase Transition Temperature (°C) 72 – 73 N/AHeat of Fusion/Melting (J/g) 180 N/A

26650 Cylindrical CellCathode Active Material LFP NMC

Anode Active Material Graphite GraphiteWeight (g) 76 82Nominal Capacity (Ah) 2.5 4.4Nominal Voltage (V) 3.3 3.7Energy Density (Wh/kg) 108.1 198.5k (W/m‐K) (Radial, Tangential and Axial) 0.8, 27, 27 0.8, 27, 27

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3D Cell‐to‐Cell Thermal‐Propagation Simulation

Thermal only analysis; Simulation of electrical behaviors of 4P8S module is not included

Jr-24

One initial short-circuit at jelly roll of 24

Jr_13Jr_14

Jr_23Jr_24

• Assumptions• One cell in a 4P group develops a internal short circuit. • Cascading short is induced by localized internal temperature.

Separator shutdown occurs at 120°C. Separator breaks down at 160⁰C• Battery module is not under load, but the cells in one 4P group get

discharged • Heat released due to thermal runaway in estimated using NREL Abuse

reaction kinetics (ARK)• All TR heat goes into cells (no venting or outside combustions)

• Initial conditions• Short circuit occurs in Jr_24 with initial short resistance of 4 mΩ• All cells in battery module have a SOC of 100% and initial temperature

of 25⁰C• Natural convection cooling on all surfaces (Tamb=25⁰C; h=5 W/⁰C/m2)

Active Cells:Jr_13, Jr_14, Jr_23, Jr_24

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TR Heat Release for NMC Cells ‐ Abuse Reaction Kinetics Model

• Empirical reaction modelo Built from accelerating rate calorimetric test data

• Evaluates the rate of heat generated from exothermic decomposition reactions

Bottom‐up approach• Abuse reactions among cell components superimposed• Incorporates exothermic component reactions commonly

addressed; readily accommodates other abuse reactions

ARK Model EquationsS : volumetric reaction heat generated H : heat of reactiondα/dt : reaction rate k(T) : temperature‐dependent rate constant

Ea (J/mol) A (s-1) m n p

For NMC/Gr 2.80E5 5.14E25 0 0.0991 2.1145

For Estimating exothermic heat of NMC, there are four decomposition reactions, including SEI, NE, PE, and ELE. The heat is 257, 1714, 314, and 155 (J/g), respectively. The onset temperatures for SEI is 90⁰C‐120⁰C, PE is larger than 120⁰C, and ELE is greater than 200⁰C. Published data: Kim, G. , Pesaran, A. , and Spotnitz, R. , 2007, “ A Three‐Dimensional

Thermal Abuse Model for Lithium‐Ion Cells,” J. Power Sources, 170(2), pp. 476–489.

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TR Heat Release for LFP Cells ‐ Abuse Reaction Kinetics Model

Cell 26650 LFP 2.5 Ah

Onset Temperature 190⁰CExothermic Heat 220.73 J/g

Ea 9.18E4 J/mol

A 1.95E5 s-1

m, n, p 0, 1.25, 0

• Abuse reaction kinetics model was developed based on ARC test data to extract kinetics parameters of cell‐level abuse reactions occurring at elevated temperatures

• Literature review indicates onset temperatures of LFP cells varies from 90⁰C to 190⁰C. 190⁰C is defined as the onset temperature in this study because heat released below 190⁰C has low rates.

Andrey W. Golubkov, et al, Thermal Runaway Experiments on Consumer Li-Ion Batteries with Metal-oxide and Olivine-Type Cathodes, RSC Adv., 2014, 4,3633

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Simulation Matrix

Case No. Chemistry PCM Volume* PCM Melting Point Initial Short Location of Cell1 NMC 50 % 72 °C 4 mΩ Jr_24 (center)2 LFP 50 % 72 °C 4 mΩ Jr_243 NMC 100 % 72 °C 4 mΩ Jr_24

4 NMC 0 % 72 °C 4 mΩ Jr_245 NMC 50 % 120 °C 4 mΩ Jr_246 NMC 50 % 72 °C 2 mΩ Jr_247 NMC 50 % 72 °C 4 mΩ Jr_11 (corner)

Effect of Parameters on Thermal Propagation Case No.Chemistry 1 Vs. 2PCM Volume (0% Vs. 50% Vs. 100% ) 1 Vs. 3 Vs. 4Melting Point of PCM 1 Vs. 5Initial Short Resistance 1 Vs. 6Location of Shorted Cell 1 Vs. 7

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Case 1. Propagation of Thermal Runaway in Source Cell (Jr_24)

• Abuse heat can be found around the internal short circuit region in the beginning, then it propagates along azimuthal direction, abuse heat distributes along axial and radial direction in the end .

• At the 10 second, concentration of electrolyte is close to 0.3, which indicates thermal runaway has been done in source cell

Contours of Electrolyte Concentration for Abuse Heat

5 second

10 second

W/m3

Propagation of Thermal Runaway

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Case 1. Distribution of Temperature in Source Cell (Jr_24)

25

225

425

625

825

1025

1225

0 100 200 300 400 500 600

Temep

rature of Jr_24

(°C)

Time (Second)

Average Temperature

Maximum Temperature

25

225

425

625

825

1025

1225

0 5 10 15 20

Tempe

rature (°C)

Time (Second)

1 second 3 second

6 second 9 second• Internal short circuit in source cell produces a hot spot first, then the high

temperature distributes along radial, tangential, and axial directions, and heats the entire fault cell

• With the increasing of average temperature of cell, thermal runaway occurs and makes the maximum temperature of cell rise again

• After 10 second, the potential of fault cell is close to zero due to short circuit and thermal runaway; the temperature of fault cell starts to decrease and distributes the heat to surrounding area

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Case 1. Distribution of Temperature in Adjacent Cells

0

20

40

60

80

100

120

0 100 200 300 400 500 600

Maxim

um Tem

perature (°C)

Time (Second)

Adjacent Cell of Source Cell (Jr_24)

jr14

jr23

jr25

jr34

10 second

200 second

400 second

600 second

• Jr_14 and Jr_23 are in the same 4P group as source cell (Jr_24); therefore, the temperature are higher than that of Jr_25 and Jr_34

• Maximum temperature of Adjacent cells is less than 110°C, which indicates thermal runaway doesn’t propagates to adjacent cell

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Case 1. Distribution of Liquid PCM (NMC Module, 50% PCM)

050100150200250300350400

0 100 200 300 400 500 600

Tempe

rature of P

CM (°C)

Time (Second)

Temperature of PCM

Maximum Temperature

Average Temperature

0%

20%

40%

60%

80%

100%

0 100 200 300 400 500 600

Liqu

id Fraction o PC

M

Time (Second)

Liquid Volume Fraction of PCM

Global Fraction

Local Fraction

10 second

200 second

600 second

Total volume of local fraction

• Most of PCM, which surrounds the source cell (Jr_24), has been melted

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Case 1. Vs 2. Effects of Cell Chemistry at ISR of 4mΩ (NMC Vs. LFP)

051015202530354045

25

2025

4025

6025

8025

10025

0 5 10 15 20

Abuse Heat o

f LFP

(W)

Abuse Heat o

f NMC (W

)

Time (Second)

NMC LFP

0%

2%

4%

6%

8%

10%

2575

125175225275325375

0 100 200 300 400 500 600

Liqu

id Fraction

Maxim

um T of P

CM (°C)

Time (Second)

Temperature for LFP Temperature for NMCLiquid Fraction for LFP Liquid Fraction for NMC

0

20

40

60

80

100

120

25

225

425

625

825

1025

1225

0 100 200 300 400 500 600 Tempe

rature of A

djacen

t Cell (°C)

Tempe

rature of Sou

rce cell (°C)

Time (Second)Source Cell of LFP Source Cell of NMCAdjacent Cell of LFP Adjacent Cell of NMC

• Due to chemistry difference, maximum temperature of source cell and adjacent cell for LFP battery is much lower than that for NMC battery

• Abuse heat can be found in LFP in the beginning, but the magnitude of abuse heat is very small, and it decays within a short time

• LFP battery is safer than NMC battery in term of magnitude of abuse heat

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Effects of PCM Volume for NMC at ISR of 4mΩ (Cases 1, 3, 4)

25

125

225

325

425

525

625

0 100 200 300 400 500 600

Average Tempe

rature (°C)

Time (Second)

Average Temperature of Source Cell (Jr_24)

PCM=0%

PCM=50%

PCM=100%

0%

2%

4%

6%

8%

10%

0 100 200 300 400 500 600

Liqu

id Fraction of PCM

Time (Second)

Volume Fraction of Liquid PCM

PCM=0%

PCM=50%

PCM=100%

2535455565758595105115

0 100 200 300 400 500 600

Maxim

um Tem

perature (°C)

Time (Second)

Maximum Temperature of Adjacent Cell (Jr_14)

PCM=0%

PCM=50%

PCM=100%

• PCM starts to work after 10 second• PCM is 0% means the phase‐change material is

substituted by plastic• Average temperature of source cell and Adjacent

cell is decreasing with volume of PCM increasingo Abuse heat doesn’t propagates to adjacent cell in

plastic case too because of insulating effect of the surrounding the cell (0.22W/m °C)

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Effects of Melting Point of PCM (Cases 1 &5)

25

45

65

85

105

125

0 100 200 300 400 500 600

Average Tempe

rature (°C)

Time (Second)

Average Temperature of Adjacent Cell (Jr_14)

Melting Point is 120 °CMelting Point is 72 °C

25

225

425

625

825

1025

1225

0 100 200 300 400 500 600

Maxim

um Tem

perature (°C)

Time (Second)

Maximum Temperature of Source Cell (Jr_24)

Melting Point is 120 °CMelting Point is 72 °C

0%

2%

4%

6%

8%

10%

0 100 200 300 400 500 600

Fractio

n of PCM

Time (Second)

Volume Fraction of Liquid PCM

Melting Point is 120 °CMelting Point is 72 °C

• Average temperature of adjacent cell is lower when melting point of PCM is 72 °C

• Low melting point of PCM provides a better performance

• Maximum temperature of source cell is not affected by melting point

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Effects of Initial Short Resistance (2mΩ Vs. 4mΩ) (Cases 1 & 6)

25

2025

4025

6025

8025

10025

12025

0 5 10 15 20

Abuse Heat G

eneration (W

)

Time (Second)

Abuse Heat in Source Cell (Jr_24)

ISR=2mΩ

ISR=4mΩ

0%

2%

4%

6%

8%

10%

12%

0 100 200 300 400 500 600

Fractio

n of PCM

Time (Second)

Volume Fraction of Liquid PCM

ISR=2mΩ

ISR=4mΩ

0

20

40

60

80

100

120

25

525

1025

1525

2025

0 100 200 300 400 500 600

Adjacent Cell (°C)

Source Cell (°C)

Time (Second)

Maximum Temperature

Source Cell (ISR=2 mΩ) Source Cell (ISR=4 mΩ)

Adjacent Cell (ISR=2 mΩ) Adjacent Cell (ISR=4 mΩ)

• Abuse heat propagates faster when ISR is 2 mΩ

• Maximum temperature of adjacent cell for ISR of 2mΩ is greater than that for ISR of 4 mΩ , but adjacent cell is still safe (T < 120 °C)

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Effects of Location of Shorted Cell (Cases 1 & 7)

25

45

65

85

105

125

0 100 200 300 400 500 600

Average Tempe

rature (°C)

Time (Second)

Average Temperature of Adjacent Cell

Jr12 (Source Cell@Jr11)Jr21 (Source Cell@Jr11)Jr14 (Source Cell@Jr24)Jr23 (Source Cell@Jr24)

0%

2%

4%

6%

8%

10%

12%

0 100 200 300 400 500 600

Fractio

n of PCM

Time (Second)

Volume Fraction of Liquid PCM

Source Cell@Jr11

Source Cell@Jr24

600 second

Vs.

600 second

Jr_11

Jr_21

Jr_12

• When shorted cell locates in the center of module, average temperature of adjacent cell is lower than the case which shorted cell locates at the corner of battery module

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• To validate the thermal propagation model with hardware testing, one or two cells need to be sent to thermal runaway?

• What are approaches in sending cells into thermal away?o Overheating of a cell with heaters (uniformly or localized)o Overcharging of a cello Nail/rod penetration into one cell (side or top)o Localizing heating of a cell with laser (SNL investigating)o Trigger a cell embedded into TR with NREL Battery Internal Short Circuit Instigator Device

• Overheating, overcharge, and nail/rod penetration may generate much more heat to the adjacent cells and will make them pre‐disposed to thermal runaway

• NREL ISC device trigger simulates a realistic short – but need access to cell/module

• Localized heating of a cell in a module with a laser may present an interesting opportunity

Validating Cell‐to‐Cell Thermal Propagation in Module

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NREL ISC Device for Instigating Internal Short Circuit in Li‐Ion Cells

Battery Separator

Positive current collector (Al)Cathode electrode

ISC deviceWax

Negative current collector (Cu)Anode electrode

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• To validate the thermal propagation model with hardware testing, one or two cells need to be sent to thermal runaway?

• What are approaches in sending cells into thermal away?o Overheating of a cell with heaters (uniformly or localized)o Overcharging of a cello Nail/rod penetration into one cell (side or top)o Localizing heating of a cell with laser (SNL investigating)o Trigger a cell embedded into TR with NREL Battery Internal Short Circuit Instigator Device

• Overheating, overcharge, and nail/rod penetration may generate much more heat to the adjacent cells and will make them pre‐disposed to thermal runaway

• NREL ISC device trigger simulates a realistic short – but need access to cell/module

• Localized heating of a cell in a module with a laser may present an interesting opportunity (no modification)

Validating Cell‐to‐Cell Thermal Propagation in Module

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• Sandia National Lab has shown that an appropriately sized laser can send a pouch cell to thermal runaway (Lamb, et. al. BSC, 1/12/2017)

• Robert Swaim of NTSB has proposed the following: o Drill a 1 mm hole through the module/pack casing o Minimize reflectivity of the visible cell by applying black paint or ink

o Cover hole with a laser‐transparent glass piece o Fire a laser with appropriate power at cell seen through the hole to send it to thermal runaway

o Initial proof of concept shown that a cell in a string of 18650 Li‐Ion cells expose to a laser beam through a cover hole can go into thermal runaway

NTSB’s Proposed Method to Induce Cell‐to‐Cell Propagation with Laser

Cells in battery case

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• NREL has a portfolio of tools to understand safety issues and how solutions might work• We modeled cell‐to cell‐thermal propagation in a 32‐cell module • Localize heating (similar to internal short circuit was simulated)• The model include chemical kinetics reactions happening in a cell depending on

chemistry • LFP and NMC chemistries were modeled (NMC resulted in higher temperatures)• Results show that phase change material could be effective in preventing propagation

when a cell abused• Corner cells if go into TR could results in higher temperature in adjacent cells than

middle cells• Need to evaluate thermal performance under normal operation• The model needs to be validated with hardware under abuse testing • Two single cell TR methods could be used for validation: NREL ISC Device or laser

ignition of a cell

Summary

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Acknowledgements

• U.S. Department of Energy ‐ Vehicle Technologies Office

• NAVAIR ‐ SBIR/STTR Program

• NREL Technical Team: Matt Keyser, Shriram Santhanagopalan, and Kandler Smith