scm thermal hardware specification -...

LISA Pathfinder

S2.ASU.RS.2060Issue 1

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S2.ASU.RS.2060 ISS01 SCM Thermal Hardware Spec.doc

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CONTENTS

1. INTRODUCTION AND SCOPE.....................................................................................................................5 1.1 Introduction.............................................................................................................................................5 1.2 Requirement Definition...........................................................................................................................5

2. APPLICABLE AND REFERENCE DOCUMENTS ........................................................................................7 2.1 Applicable Documents............................................................................................................................7 2.2 Standards ...............................................................................................................................................7 2.3 Abbreviations..........................................................................................................................................7

3. FUNCTIONAL REQUIREMENTS..................................................................................................................8 3.1 System Requirement..............................................................................................................................8

3.1.1 Satellite Design ............................................................................................................................8 3.1.2 Reference Frames........................................................................................................................9 3.1.3 Mission Phases ............................................................................................................................9 3.1.4 Thermal Hardware Configuration ...............................................................................................10 3.1.5 General Description....................................................................................................................10 3.1.6 Mass...........................................................................................................................................12

4. GENERAL DESIGN AND INTERFACE REQUIREMENTS ........................................................................13 4.1 General Requirements .........................................................................................................................13

4.1.1 Mass properties..........................................................................................................................13 4.2 MLI Design and Interface Requirements..............................................................................................13

4.2.1 Thermal Performance ................................................................................................................13 4.2.2 Thermo-optical Properties..........................................................................................................14 4.2.3 Temperature Range ...................................................................................................................15 4.2.4 Attachment Requirements..........................................................................................................16 4.2.5 Venting .......................................................................................................................................18 4.2.6 Bending ......................................................................................................................................18 4.2.7 Overlap.......................................................................................................................................18 4.2.8 Crack Stoppers...........................................................................................................................19 4.2.9 Accessibility/Maintainability........................................................................................................19

4.3 Heater Design and Interface Requirements.........................................................................................19 4.3.1 Heater Element ..........................................................................................................................19 4.3.2 Heater Insulation ........................................................................................................................20 4.3.3 Temperature Range ...................................................................................................................20 4.3.4 Leads..........................................................................................................................................20 4.3.5 Heater Backing...........................................................................................................................20 4.3.6 Heater Flexibility.........................................................................................................................21 4.3.7 Conditioning ...............................................................................................................................21 4.3.8 Radiation Resistance .................................................................................................................21

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4.4 Thermistor Design and Interface Requirements ..................................................................................21 4.4.1 Thermistor Type1: YSI-44907/-44908 (ANY).............................................................................22 4.4.2 Thermistor Type2: PT-1000 (ANP) ............................................................................................23

4.5 Thermocouple Design and Interface Requirements.............................................................................24 4.6 Interface Filler Design and Interface Requirements.............................................................................24 4.7 Thermal Washer Design and Interface Requirements.........................................................................24 4.8 Thermal Mathematical Model Requirements .......................................................................................24 4.9 Electrical Design and Interface Requirements .....................................................................................25

4.9.1 Magnetic Requirements .............................................................................................................25 4.9.2 EMC Requirements....................................................................................................................25

4.10 Integration...........................................................................................................................................26 4.11 Design Safety .....................................................................................................................................26 4.12 Spare Hardware .................................................................................................................................26 4.13 Transportation, Handling and Storage ...............................................................................................27

4.13.1 Storage.....................................................................................................................................27 4.13.2 Transport ..................................................................................................................................27

5. ENVIRONMENT DESIGN REQUIREMENTS .............................................................................................28 5.1 Atmospheric Conditions .......................................................................................................................28

5.1.1 Cleanliness.................................................................................................................................28 5.2 Thermal Environment ...........................................................................................................................28

5.2.1 In-orbit phase .............................................................................................................................28 5.3 Atomic Oxygen .....................................................................................................................................28

6. GDIR APPLICABILITY MATRIX..................................................................................................................30

TABLES Table 4.4-1: Option 1: Source Circuit Specification.........................................................................................22 Table 4.4-2: Option 1: Receiver Circuit Specification......................................................................................22 Table 4.4-3: Option 2: Source Circuit Specification........................................................................................23 Table 4.4-4: Option 2: Receiver Circuit Specification......................................................................................23 Table 5.2-1: Thermal Environment Parameters Table ....................................................................................28

FIGURES Figure 3.1-1: LISA Pathfinder Launch Composite.............................................................................................8 Figure 3.1-2: SCM Reference Frames ..............................................................................................................9

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1. INTRODUCTION AND SCOPE

1.1 Introduction

LISA Pathfinder is the second of the Small Missions for Advanced Research and Technology (SMART-2), an element of the European Space Agency's “Cosmic Vision” plan for scientific projects.

The purpose of the LISA Pathfinder mission is to flight test key technologies critical for the future space cornerstone mission LISA. Among these technologies, the demonstrations of the LISA Technology Package (LTP) and the µPropulsion Technologies have been identified as mandatory. Additionally the mission will enable the in-flight demonstration of the NASA provided DRS (Disturbance Reduction System).

The LISA Pathfinder spacecraft, to be launched in TBD, will demonstrate both electric and cold gas micro-thrusters during its 1 year mission.

This document defines the mission, performances, environment, interface and design requirements for the Science Spacecraft Structure subsystem for the LISA Pathfinder demonstration payload.

This document gathers together all the contractually relevant requirements and constraints for the LISA Pathfinder Science Spacecraft (SCM) Structure and its supporting elements. This issue of the specification includes:

• the performance as well as design and interface requirements of subject hardware;

Future issues of the specification will include references to

• the product assurance requirements;

• the testing and verification requirements.

1.2 Requirement Definition

Requirements within this document are shown in an italic font.

Information within this document is shown in normal font.

Each requirements is preceded by a summary line that contains the following fields, delimited by "/".

• <Doors Requirement Number> SCM-xyz. This is a unique number, assigned consecutively

• <Created From> Shows parent requirement

• <Test Method> T= Test, A = Analysis, I = Inspection, R = Review of Design

Requirement Text - If tables are considered as part of requirement they are referenced clearly in the text and inserted after and separated from the requirement table and are managed as free text attached to the identifier requirement.

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Upper Links - The trace to the upper level requirements shall be managed with the following format:

• AAA-NNNN where AAA is a label associated to the upper document and NNNN the requirement identifier of this upper level.

• Or CREATED key word if the requirement has no link with upper level

All document elements, which are not presented in the format explained above are not requirements and will not be verified or tracked.

In references to GDIR requirements the section number is provided for information only. If there is any conflict between the GDIR requirement number and the section number then the requirement number takes precedence.

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2. APPLICABLE AND REFERENCE DOCUMENTS

2.1 Applicable Documents

The Applicable Documents are listed below, and are referenced in the text with the acronym AD-x.

AD-1 General Design & Interface Requirements S2.ASU.RS.2031

AD-2 Product Assurance Requirements For Subcontractors S2.ASU.RS.1005

AD-3 Science Spacecraft Mechanical Interface Control Document S2.ASU.ICD.2002

AD-4 SCM Thermal Hardware Interface Definitions S2.ASU.ICD.2017

The issue valid at contract signature applies.

2.2 Standards

The Standards are listed below, and are referenced in the text with the acronym STD-x.

STD-3 Space Engineering - Mechanical ECSS-E-30 Parts 1A to 8A STD-14 Space Product Assurance - Materials Selection for Controlling Stress Corrosion Cracking ECSS-Q-70-36. STD-16 Space Engineering - Verification ECSS-E-10-02A STD-17 Space Engineering - Testing ECSS-E-10-03A STD-18 Metallic Materials & Elements For Aerospace Vehicle Structure MIL-HDBK-5H STD-19 Structural Materials Handbook PSS-03-203 Volumes 1 & 2 STD-20 Composite Materials Handbook MIL-HDBK-17 STD-21 Space Engineering - Fracture Control ECSS-E-30-01A

2.3 Abbreviations

Abbreviations and acronyms are contained in:-

Acronyms, Abbreviations & Terminology S2.ASU.LI.1006

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3. FUNCTIONAL REQUIREMENTS

3.1 System Requirement

The primary aim of the thermal design is to achieve completely passive control of the experiments for on-station operation, so that the balance between solar heat input, internal power dissipation, and that rejected via passive radiator panels will provide the correct operating temperatures for the equipment without the need for actively controlled heaters (during science operations) or heat pipes.

3.1.1 Satellite Design

At launch, LISA Pathfinder Launch Composite (LCM) consists of two elements, the Science Spacecraft (SCM) and the Propulsion Module (PRM), the configuration of which is shown illustratively in Figure 3.1-1.

Figure 3.1-1: LISA Pathfinder Launch Composite

The SCM is mounted on top of the PRM and secured by a low shock separation system, which allows the PRM to be detached once the operational orbit around the L1 Lagrange point has been reached.

At the core of the SCM Structure is a carbon fibre honeycomb Central Cylinder, inside which the sensor assemblies of the two experiments are mounted. The two experiments are the LISA Technology Package (LTP) and the Disturbance Reduction System (DRS). The LTP Core Assembly (LCA) is mounted in the upper part of the cylinder between two parallel Shear Walls each with an orthogonal Support Wall. The DRS consists of two colloidal thrusters on short external panels plus an electronics unit on a shear panel.

Radially surrounding the Central Cylinder are eight equipment bays separated by carbon fibre honeycomb Shear Walls, onto which are mounted all elements not requiring direct visibility of the external environment.

Each of the equipment bays are enclosed by a carbon fibre honeycomb External Wall, onto which are mounted any element requiring direct visibility of the external environment.

Finally further carbon fibre honeycomb panels form the Top Floor and the Lower Floor. The solar array is mounted to the top floor by 8 blade interfaces.

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3.1.2 Reference Frames

THS-48/CREATED/R

The SCM design shall adopt the axis system:

• reference frame is at the centre of the SCM / PRM separation plane

• The Z vector is oriented along the launch vehicle axis, away from the centre of the Earth (in the launch configuration).

• The X vector is aligned with the LTP LCA payload sensor coincides with the outward face normal to the surface carrying the solar array, and is parallel to the solar array axis.

• The Y vector completes the right handed reference frame.

The reference frame is shown in Figure 3.1-2.

Figure 3.1-2: SCM Reference Frames

3.1.3 Mission Phases

The LISA Pathfinder spacecraft has the following mission phases:

• Launch and Early Operations Phase (LEOP) & Transfer

• Commissioning Phase

• Demonstration Phase

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3.1.4 Thermal Hardware Configuration

The SCM thermal hardware configuration to be supplied contains all the thermal items to support the thermal sub-system's temperature control of the SCM.

THS-54/CREATED/R

The SCM Thermal Hardware configuration shall comply to the interfaces defined in AD-3 and AD-4.

THS-55/CREATED/R

The flight SCM Thermal Hardware shall comprise of the items listed in AD-4.

3.1.5 General Description

3.1.5.1 MLI Description

The thermal hardware for the LISA PathFinder SCM consists in MLI blankets, all necessary attachment and grounding devices

Different types of blanket will be used depending on the application. The different blankets are presented below.

• External spacecraft panel blankets

• External spacecraft unit specific blankets

• Internal blankets spacecraft internal units

THS-553/CREATED/T,A,R

The Thermal Hardware subcontractor shall be responsible for the MLI construction, including definition of materials and associated fixation hardware to the structure.


The Thermal Hardwaresubcontractor shall be responsible for the definition of attachment devices for grounding.


The Thermal Hardware subcontractor shall be responsible for the definition of adhesive tapes for overlap (if any).

THS-556/CREATED/I,R

The Thermal Hardware subcontractor shall be responsible for the manufacturing and delivering of the thermal blankets and thermal blankets templates in accordance with thermal interface control drawings, electronic 3D models provided by the Prime contractor, and defined access to the spacecraft where complex shapes are required to be tailored.

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THS-557/CREATED/R

The Thermal Hardware subcontractor shall also be required to provide support to installation of all MLI items as defined in statement of work.

3.1.5.2 Heater Description

THS-560/CREATED/A,R

The Thermal Hardware subcontractor shall be responsible for the flight and test heater procurement, including definition of materials and associated fixation hardware to the structure.

THS-575/CREATED/I,R

The Thermal Hardware subcontractor shall be responsible for the heater procurement and delivering of heaters in accordance with thermal interface definition (AD-4).

THS-582/CREATED/R

The Thermal Hardware subcontractor shall also be required to provide support to installation of all heater items as defined in statement of work.

3.1.5.3 Thermistor Description

THS-571/CREATED/A,R

The Thermal Hardware subcontractor shall be responsible for the flight thermistor procurement, including fixation hardware to the structure.

THS-576/CREATED/I,R

The Thermal Hardware subcontractor shall be responsible for the thermistor procurement and delivering of thermistors in accordance with thermal interface definition (AD-4).

THS-583/CREATED/R

The Thermal Hardware subcontractor shall also be required to provide support to installation of all thermistor items as defined in statement of work.

3.1.5.4 Thermocouple Description

THS-572/CREATED/A,R

The Thermal Hardware subcontractor shall be responsible for the test thermocouple procurement, including fixation hardware to the structure.

THS-577/CREATED/I,R

The Thermal Hardware subcontractor shall be responsible for the thermocouple procurement and delivering of thermocouples in accordance with thermal interface definition (AD-4).

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THS-584/CREATED/R

The Thermal Hardware subcontractor shall also be required to provide support to installation of all thermocouple items as defined in statement of work.

3.1.5.5 Interface Filler Description

THS-573/CREATED/A,R

The Thermal Hardware subcontractor shall be responsible for the high conductivity thermal interface filler procurement and manufacture.

THS-579/CREATED/I,R

The Thermal Hardware subcontractor shall be responsible for the interface filler procurement and delivering of interface filler in accordance with thermal interface definition (AD-4).

THS-585/CREATED/R

The Thermal Hardware subcontractor shall also be required to provide support to installation of all interface filler items as defined in statement of work.

3.1.5.6 Thermal Washer Description

THS-574/CREATED/A,R

The Thermal Hardware subcontractor shall be responsible for the low conductivity washer procurement and manufacture.

THS-580/CREATED/I,R

The Thermal Hardware subcontractor shall be responsible for the thermal washer procurement and delivering of thermal washer in accordance with thermal interface definition (AD-4).

THS-586/CREATED/R

The Thermal Hardware subcontractor shall also be required to provide support to installation of all thermal washer items as defined in statement of work.

3.1.6 Mass


The SCM thermal hardware mass shall be minimised, and less than 6 kg including margins.

This shall include the items listed in Table AD-4, and shall declare the mass for each item separately. The mass of leadwires to thermistors, heaters and thermocouples shall not be included in the total item mass.

Note : The mass margin philosophy to be applied is defined in AD-1.

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4. GENERAL DESIGN AND INTERFACE REQUIREMENTS

See also Section 6. for GDIR Applicability.

4.1 General Requirements

4.1.1 Mass properties

THS-167/CREATED/T,A

The MLI mass shall include all electrical grounding hardware, blanket attachment hardware and any extra coating applied on outer layer.

THS-170/CREATED/T

Each SCM thermal hardware item shall be weighed individually

4.2 MLI Design and Interface Requirements

The location of the SCM thermal hardware is presented in AD-4.

THS-154/CREATED/A,R

The supplier shall propose MLI integration methods. The final spacecraft MLI configuration shall be selected by the prime contractor.

THS-155/CREATED/A,R

The MLI configurations proposed by the supplier shall describe how the MLI is integrated onto all areas of the spacecraft.

THS-156/CREATED/A,R

The supplier proposal shall take into account the description of the numbers of different blankets and blanket construction types required.

THS-157/CREATED/A,R

The total number of individual blankets in configurations discussed by the supplier shall be such that they are of a minimum number. Final numbers of blankets shall be selected by the prime contractor.

THS-158/CREATED/A,R

The location of fixations shall be defined by the supplier with respect to the interface, environment and performance requirements in accordance with the prime contractor.

4.2.1 Thermal Performance

The thermal efficiency of MLI is defined as a radiative efficiency (Er) and a conductive efficiency (Ec). So MLI leaks are defined as follow:

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Q = Ec x S x ∆T + Er x σ x S x ∆T4

With ∆T = Te - Ti

(Te is temperature of external sheet of MLI, Ti is temperature of the underlying surface)

S is surface of MLI

σ = 5.67 x 10e-8 (constant of Stephan-Boltzmann)

∆T4 = Te4 - Ti4


The constitution of blanket shall lead for all types of MLI to the following minimum values of efficiency:

- Radiative efficiency: 0.014

- Conductive efficiency: 0.019

THS-227/CREATED/T

The supplier shall demonstrate the MLI efficiency by test. Analysis or similarity of MLI performance from previous experience may be acceptable but shall be justified. Applicability of similarity shall be approved by Astrium.


The blanket materials shall meet the performance requirements over the life of the spacecraft.

THS-229/CREATED/T,R

The SCM thermal hardware coatings shall be designed such that performance, as measured at ambient conditions on ground, are maintained in the space environment.

4.2.2 Thermo-optical Properties

The thermal design shall take into account the degradation of thermal properties of thermal hardware during the lifetime of the spacecraft.

Due to the short duration of the mission (17months), consideration for degradation due to exposure to radiation and UV flux is not required.

THS-217/CREATED/A

The supplier shall identify whether any selected materials will suffer significant degradation to the optical property due to exposure to the mission's short duration, high fluence exposure to atomic oxygen environment which would require different properties to be considered for the demonstration phase of the mission.

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THS-218/CREATED/R

When selecting external thermal finishes, the thermal design shall make sure that sufficient protection against atomic oxygen during the LEOP phase is taken into account.

THS-219/CREATED/A

The thermo-optical properties used for the MLI materials shall be:

• SCM External Surfaces: Emissivity >=0.7, Absorptivity <=0.5 (BOL) (Aluminised Kapton type)

• SCM Internal Surfaces: Emissivity <=0.05 (VDA Kapton type)

THS-221/CREATED/A,R

The supplier can propose different MLI materials in order to achieve the optimal thermal performance.

THS-222/CREATED/A,R

The supplier shall provide the exact designation of MLI materials and their properties (properties shall at least contain asborptance, emissivity and specularity at beginning and end of life)

THS-223/CREATED/A,R

Particular attention shall be paid to the selection of the materials and processes to avoid sensitivity of these coatings to water desorption in vacuum environment, especially for the multi layer coatings, if any.

4.2.3 Temperature Range


All SCM external blankets (panel and equipment specific) shall withstand without degradations of their thermal and mechanical properties (MLI efficiency, thermo-optical values...) the operating temperature range of -200ºC to +160ºC.


The SCM internal blankets shall withstand without degradations of their thermal and mechanical properties (MLI efficiency, thermo-optical values) the operating temperature range of -40ºC to +60ºC.

THS-213/CREATED/A,R

The SCM thermal hardware blankets shall be sized so that they will not be stressed (tensile or compression) by their fixation points, taken into account the thermal environment (including space conditioning)

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4.2.4 Attachment Requirements

THS-173/CREATED/A,R

The thermal blankets shall be attached to the spacecraft using any of the following three methods:

• stand-offs

• adhesive transfer tape

• adhesive Kapton tape

THS-589/CREATED/A,R

Due to the potential uncertainty in the MLI mass distribution with respect to the spacecraft payload, the attachment of the MLI using Velcro is not permitted.

The design requirements for each of the fixing methods are given below.

• Stand-offs

THS-176/CREATED/A,R

The maximum distance between two attachments shall be less than 300mm.

THS-177/CREATED/A,R

The number of fixation devices shall be minimized on purpose to reduce the heat links.

THS-178/CREATED/R

Attachments shall be indicated in the blanket manufacturing files.

THS-179/CREATED/A,R

Fixing points along the edge of a blanket shall be between 20mm and 100mm from the edge, and no more than 300mm apart.

THS-180/CREATED/A,R

Fixing points shall not be positioned closer than 20mm to any slit, cut-out, corner or grounding position.

THS-181/CREATED/R

Stand-offs shall be attached to CFRP structure using Araldite AV138M / HV998 (TBC).


The adhesive / material combinations shall withstand temperature ranges as given in Section 4.2.3

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THS-183/CREATED/A,R

Location of stand-offs shall be defined in accordance with the prime contractor. The subcontractor shall provide a CATIA compatible model of the stand-off positions for the prime contractor to confirm layout.

• Adhesive transfer tape

THS-193/CREATED/R

If adhesive transfer tape is used to attach blankets, the tape shall be 3M 966.

THS-194/CREATED/A,R

Adhesive transfer tape shall not be the sole means of securing a blanket.

THS-195/CREATED/A,R

Fixings made using adhesive transfer tape are not intended to be disassembled. If for any reason a blanket fixed by this method is removed, a new piece of transfer adhesive shall be applied to cover all traces of the old adhesive. The backing paper shall not be removed until just before the blanket is re-attached to the spacecraft.

THS-196/CREATED/A,R

25mm by 25mm patches of adhesive shall be used to secure areas of blankets to the spacecraft, arranged in a 200mm square grid.

THS-197/CREATED/A,R

Where this method is used to secure the edges of blankets, 25mm wide strips of adhesive shall be used. A gap of 25mm shall be left every 300mm to allow venting.

• Adhesive Kapton tape

THS-199/CREATED/A,R

Kapton tapes shall only be used at the edge of a blanket for blanket to blanket joints, or for sealing the edge of a blanket to the structure.

THS-200/CREATED/A,R

The tape chosen for each individual joint shall match the thermo-optical properties of the adjacent blankets.

THS-201/CREATED/A,R

The minimum tape width used shall be 25mm.

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4.2.5 Venting

THS-86/CREATED/A,R

The SCM thermal hardware shall ensure adequate venting of volumes enclosed by them to accommodate the rate of barometric pressure during launch, ascent and test.

THS-88/CREATED/I,R

The SCM thermal hardware shall avoid contamination (in particular on mirrors) by particles from inside blanket during venting.

THS-89/CREATED/A,R

Adjacent blanket layers shall be configured so that the perforations do not line up.

THS-90/CREATED/R

Justification of the size and pattern of the perforations of layers shall be provided.

THS-91/CREATED/R

The venting concept shall be included in the proposal.

4.2.6 Bending

THS-105/CREATED/A,R

Blankets which bend over edges have to be built in such a way that compression at the edges and resulting increased heat links shall be estimated and minimised.

4.2.7 Overlap

THS-93/CREATED/R

Internal and external blankets shall overlap adjacent blankets by at least 50mm.

THS-95/CREATED/R

The edges of MLI blankets shall be sealed

THS-96/CREATED/R

The outer layer of a blanket shall overlap the inner layer by at least 25mm where it is wrapped over at the edge of the blanket.

THS-97/CREATED/R

The overlapping concept shall be included in the proposal.

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THS-100/CREATED/R

The supplier shall propose methods of supporting the MLI at spacecraft corners in order to reduce localised blanket compression and thereby improve thermal performance.

4.2.8 Crack Stoppers

THS-103/CREATED/R

All slits and cut-outs on the blankets shall be protected against tearing by finishing with a hole of 3mm (+ 2mm tolerance) diameter.

4.2.9 Accessibility/Maintainability

THS-114/CREATED/R

The SCM thermal hardware blankets shall be removable. It shall be designed to facilitate the maintenance, mounting and dismounting operations, element inspections and replacement of failed elements by a good accessibility.

THS-115/CREATED/I,R

The SCM thermal hardware blankets shall be designed such that they may be easily removed from and replaced ten times on the spacecraft while maintaining reproducible mechanical and thermal characteristics (efficiency, thermo-optical properties...). Special care shall be taken if ITO coating is chosen for atomic oxygen protection.

4.3 Heater Design and Interface Requirements

The heater mats will be bonded to the local structure using an electrically conductive pressure-sensitive adhesive (PSA), in accordance with customer qualified process. Most heaters are single element, with redundancy provided by a second heater mat. In areas where space is at a premium dual element heater mats are used.

THS-727/CREATED/R

Heaters shall be of the etched-foil type, encapsulated in Kapton.

4.3.1 Heater Element


All heater elements shall not induce a magnetic field when operating. (non-induction type)

THS-597/CREATED/R

The heater circuitry layout shall provide maximum uniform packing density for uniform heat transfer over the heat sink surface area.

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THS-598/CREATED/R

Heater element width uniformity, and spacing between heater elements, shall not vary by more than +/-10% of their respective minimum characteristic dimension. Minimum spacing between strands shall be 0.05mm.

THS-603/CREATED/A,R

The power density across the surface of the heater shall be no greater than 0.8W/(square cm) when on an 80°C substrate.

The PSA qualified bonding process defines a maximum allowable power density of 0.8W/cm², and a substrate temperature up to 80°C. These two limits apply at the same time (i.e. heater operating at 0.8W/cm² on an 80°C substrate).

4.3.2 Heater Insulation

THS-594/CREATED/R

Heater insulation material shall be polyimide ("Kapton") film.

4.3.3 Temperature Range

THS-601/CREATED/T,R

Heaters shall withstand without degradations of their thermal and mechanical properties the operating temperature range of -65ºC to +150ºC

THS-602/CREATED/T,R

Heaters shall withstand without degradations of their thermal and mechanical properties the storage temperature range of -65ºC to +150ºC

4.3.4 Leads

THS-595/CREATED/R

Heaters shall be supplied with leadwires and insulation no less than 1 meter in length.

THS-604/CREATED/R

Leadwires shall be secured to the heater in such a way that lead pull stresses are not transmitted to the weld joint.

4.3.5 Heater Backing

THS-596/CREATED/R

Heaters shall have an aluminium foil backing 0.076mm thick. The bonding process of the backing to the heater shall be in agreement with the prime contractor.

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4.3.6 Heater Flexibility

THS-599/CREATED/T,R

Heaters shall have sufficient flexibility to conform to a surface with a minimum bend radius of 7.6mm at 25 degrees C. The lead termination area is excluded from this requirement.

4.3.7 Conditioning

THS-616/CREATED/A,R

The heater DC resistance shall be measured between the heater terminals. The measured resistance shall be within 3% of the resistance specified.

THS-613/CREATED/A,R

Heaters shall be conditioned by suspension in still air at 25 degreesC +/-5 degrees C by their terminal leads. The operating design voltage shall be applied continuously for >168 hours.

THS-615/CREATED/A,R

There shall be no mechanical damage including blistering, delamination or bubbles after conditioning. The change in DC resistance shall not exceed +/-1%.

4.3.8 Radiation Resistance

THS-600/CREATED/T,R

Each heater shall withstand a radiator dosage of 10E5 Rads in normal atmosphere without degradation of electrical characteristics or material properties, including adhesives.

4.4 Thermistor Design and Interface Requirements

These acquisitions are used for thermal control (control and monitoring) and also for unit monitoring.

There are two options:

• Type 1 (IF-Code "ANY"):

Thermistor type: YSI-44907/-44908 (10KOhm @25°C) or equalivant.

• Type 2 (IF-Code "ANP"):

Thermistor type: PT-1000 (1000 Ohm @ 0°C) or equalivant.

THS-625/CREATED/R

The thermistors shall be supplied with leadwires and insulation no less than 1 meter in length.

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4.4.1 Thermistor Type1: YSI-44907/-44908 (ANY)

THS-629/CREATED/T,R

Temperature Acquisition Type 1: YSI 44907/YSI-44908 (ANY) Interface.

The supplier shall supply where required thermistors compliant to the characteristics as defined in Interface Datasheet "ANY", Table 4.4-1 and compatible with the receiver circuit specification in Table 4.4-2.

INTERFACE DATA SHEET Page 1 / 2

IF Designation: Temperature Acquisition Type 1: YSI 44907/YSI-44908) IF-Code: ANY Req Driver Circuit Specification Ver. Iss.

-1 Circuit Type Thermistor YSI-44907/-44908 (10KOhm @ 25°C) -2 Transfer DC coupled -3 Operating temp. range - 55 to +70 deg C -4 Fault voltage tolerance -16.5V to +16.5V A -5 Fault voltage emission Not applicable

Table 4.4-1: Option 1: Source Circuit Specification INTERFACE DATA SHEET Page 2 / 2

IF Designation: Temperature Acquisition Type 1: YSI 44907/YSI-44908) IF-Code: ANY Req Receiver Circuit Specification Ver. Iss.

-6 Circuit Type Conditioning circuitry -7 Transfer DC coupled -8 Resolution at least 0.2 K / LSB -9 Measurement Range –50°C to +70°C (equivalent to 441.3 KOhm to 1990 Ohm) -10 Stability +/- 1 K (-50 to +70 deg C) -11 Measurement current ≤ 700 µA

-12 Measurement chain accuracy (uncalibrated channels)

better than +/-5 K between -50°C to -5°C better than +/-4 K between -5° to 70°

-13 Measurement chain accuracy (calibrated channels)

better than +/-3 K between -50°C to -5 °C better than +/-2 K between -5 ° to 70°

-14 Acquisition rate consecutive and different acquisitions every 128 µsec with full performance

-15 Receiver bandwidth 50Hz to 1500Hz @ 3dB -16 Fault voltage tolerance -14V to +14V A -17 Fault voltage emission -16 V to +16 V (through 1.5 KOhms) A Harness Specification -18 Wiring Type Twisted Shielded Pair (TSP) R -19 Shielding Shield at backshell on driver and receiver side R Notes:

Fault Voltages shall be verified by Worst Case Analysis.

Table 4.4-2: Option 1: Receiver Circuit Specification

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4.4.2 Thermistor Type2: PT-1000 (ANP)

THS-633/CREATED/T,R

Temperature Acquisition Type 2: PT-1000 (ANP) Interface.

The supplier shall supply where required thermistors compliant to the characteristics as defined in Interface Datasheet "ANY", Table 4.4-3 and compatible with the receiver circuit specification in Table 4.4-4.

INTERFACE DATA SHEET Page 1 / 2

IF Designation: Temperature Acquisition Type 2: PT-1000 IF-Code: ANP Req Driver Circuit Specification Ver. Iss.

-1 Circuit Type Thermistor PT1000 (1KOhm @ 0°C), two wire connection -2 Transfer DC coupled -3 Operating temp range -160°C to +150 deg C -4 Fault voltage tolerance -16.5V to +16.5V A -5 Fault voltage emission Not applicable A

Table 4.4-3: Option 2: Source Circuit Specification INTERFACE DATA SHEET Page 2 / 2

IF Designation: Temperature Acquisition Type 2: PT-1000 IF-Code: ANP Req Receiver Circuit Specification Ver. Iss.

-6 Circuit Type Conditioning circuitry -7 Transfer DC coupled -8 Measurement range -160°C to +140°C (equivalent to 344.6 Ohm to 1542.6 Ohm) -9 Resolution at least 0.2 K / LSB -10 Measurement chain accuracy better than +/-3 K -11 Measurement current ≤ 300 µA (permanent) -12 Acquisition rate consecutive and different acquisitions every 128 µsec with

full performance

-13 Receiver bandwidth: ≤ 350 Hz @ 3dB -14 Fault voltage tolerance: -14V to +14V A -15 Fault voltage emission: -16 V to +16 V (through 1.5 KOhms) A Harness Specification

-16 Wiring Type: Twisted Shielded Pair (TSP) R -17 Shielding: Shield at backshell on driver and receiver side R Notes:

Fault Voltages shall be verified by Worst Case Analysis.

Table 4.4-4: Option 2: Receiver Circuit Specification

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4.5 Thermocouple Design and Interface Requirements

THS-645/CREATED/R

Thermocouples shall be type T and shall be compatible with a measurement temperature range of -170°C to +200°C.

THS-725/CREATED/R

The thermocouples shall be supplied with leadwires and insulation/sheathing no less than 6 (TBC) meters in length.

4.6 Interface Filler Design and Interface Requirements

THS-647/CREATED/I,R

All thermally conducting interface filler shall be of non-curing gasket type rather than a grease or curing rubber/adhesive

THS-648/CREATED/I,R

The performance of the interface filler shall be that over a 20cm squared area the coupling through the filler shall be greater than 1000 W/m squared Kelvin.

THS-652/CREATED/I,R

The thermal performance shall be ensured when the interface filler is compressed between surfaces with a roughness no greater than 0.1mm under TBC of pressure. (i.e. surfaces with a variation of +/-0.05mm)

4.7 Thermal Washer Design and Interface Requirements

THS-650/CREATED/I,R

The thermally isolating washer material shall have a material conductivity of less than or equal to 0.5 W/K.m.

4.8 Thermal Mathematical Model Requirements

THS-236/CREATED/R

No thermal model of the thermal hardware shall be provided to the prime contractor. However, sufficient data shall be provided through MICD and TICD in order to establish the system level mathematical model. These data shall be as a minimum:

- IR emissivity and solar absorptivity of external foils (at beginning and end of life)

- Blanket surfaces

- Mass

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- Temperature limits

- Radiative and conductive efficiencies and their variation with the temperature range of work for MLIs.

- Thermal performance properties of materials (interface fillers, isolating washers)

- Electrical description of all heaters (heater mat resistances)

4.9 Electrical Design and Interface Requirements

4.9.1 Magnetic Requirements

THS-730/CREATED/R

The thermal hardware shall comply to the Magnetic Moment design requirements of [AD 1]. See details in GDIR Applicability Matrix Section 6. .

THS-731/CREATED/R

Tight control over DC and AC magnetic and electric fields at the experiments is essential for the successful achievement of the mission objectives. Critical frequencies span the range .01 milliHz to 10 kHz. Rigorous, documented application of good design practices shall be employed to minimize unit-generated fields at the experiments including careful frequency planning and design analysis to eradicate the generation of spurious frequencies in the bands of interest. Fields, field gradients and fluctuation of fields over time are all important parameters. It is important that frequencies not required for system level use are not allowed to radiate or conduct from the thermal hardware to avoid the risk of beat frequencies being generated with other signals.

For magnetic fields good design practices include employing minimum currents and loop areas in heater mats and in wiring, including the use of twisted pairs as appropriate. Strict avoidance of all magnetic materials is essential except where required for correct functioning of the unit. All potential applications of such materials shall be reported to prime before use.

For electric field reduction, close proximity of live and return wires and employment of good shielding practices at equipment level and in wiring shall all be employed.

THS-733/CREATED/T

Magnetic measurements shall be made in a appropriately compensated facility to ensure that effects due to the Earth's field are negated.

4.9.2 EMC Requirements

4.9.2.1 Bonding

THS-240/CREATED/R

The bond shall be resistant against corrosion.

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THS-241/CREATED/A,R

The concept of bonding shall be included in the proposal

4.9.2.2 Grounding and Isolation

4.9.2.2.1 Thermal parts

THS-251/CREATED/R

Metallic layers of the coatings, if any, shall be grounded.

THS-252/CREATED/A,R

The concept of grounding shall be included in the proposal

4.10 Integration

THS-254/CREATED/R

Appropriate procedures for all levels of integration shall be defined by the supplier. They shall include as the minimum:

- specifications for parts and materials

- integration instructions (preparation, support, equipment and tooling, parts and materials, method, cleaning...)

- inspection and / or test.

4.11 Design Safety

THS-82/CREATED/R

Personnel and equipment safety shall be a prime consideration in the design, manufacture, test, handling and transportation of all equipments.

4.12 Spare Hardware

THS-117/CREATED/R

With respect to MLI and interface filler, spare sets shall represent 50% of the quantity foreseen by the supplier. These spare sets shall be retained by the supplier and be available to the prime contractor until the launch of the spacecraft.

Heater, thermistor and thermocouple spares are defined in AD-4.

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4.13 Transportation, Handling and Storage

4.13.1 Storage

THS-120/CREATED/R

During manufacturing, the following procedure shall be used to store either fully or partially completed blankets within the confines of the blanket manufacturing area:

- Place each blanket, lying flat, into the storage area, and cover it with Mylar foil

- Up to 10 blankets may be stacked in this manner.

THS-121/CREATED/R

After manufacturing, the SCM thermal hardware blankets shall be stored using the following procedure:

- Wrap each blanket in clean, clear Mylar foil

- Seal up to 5 wrapped blankets in a polyethylene bag with a humidity indicator, and seal a label in a separate compartment

- Seal the first bag inside a second bag, with desiccant

- Pack the bag in a storage or transport container or sufficient strength and rigidity to prevent damage to the item under normal handling conditions.

4.13.2 Transport

THS-123/CREATED/R

SCM thermal hardware items shall be individually packed as described in Section 4.13.1 .

THS-128/CREATED/R

Where a purpose built container exists, the blankets shall be placed within it such that movement between blankets will be minimised.

4.13.3 Product Assurance

THS-752/CREATED/R

The thermal hardware shall be designed, manufactured and tested inaccordance with the PA requirements specified in AD-2.

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5. ENVIRONMENT DESIGN REQUIREMENTS

5.1 Atmospheric Conditions

5.1.1 Cleanliness

THS-261/CREATED/R

The SCM thermal hardware shall be designed, manufactures, assembled, delivered in respect with following cleanliness requirements defined in section 3.8 of AD-2.

5.2 Thermal Environment

5.2.1 In-orbit phase

Thermal environment in orbit: the range of environmental parameters for design are presented in the Table 5.2-1.

Table 5.2-1: Thermal Environment Parameters Table

5.3 Atomic Oxygen


The effect of atomic oxygen on MLI blankets shall be taken into account in performance requirement. The maximum total fluence over the LPF mission is 9E20 atoms/cm². This represents the worst case maximum as it is with respect to a surface pointing into the velocity direction of the orbit.


The supplier shall define methods to protect the SCM MLI blankets to levels of atomic oxygen that they are exposed to.

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The supplier shall consider the impact of the atomic oxygen protection on the thermo-optical properties. The final MLI coating shall be selected by the prime contractor.

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6. GDIR APPLICABILITY MATRIX

Req No. Reference Applicability Verif. Method

THS-653 GDI-31: The on-ground lifetime of flight hardware is defin …

Y R

THS-654 GDI-32: The Unit shall meet the requirements of this speci …

Y A,R

THS-655 GDI-33: The in-orbit lifetime of the satellite is defined …

Y R

THS-656 GDI-34: The unit shall be designed with positive margins o …

Y A,R

THS-657 GDI-35: Maintenance during storage shall be as limited as …

Y R

THS-658 GDI-37: The unit shall be designed and fabricated with com …

Y A

THS-659 GDI-38: General safety requirements for units are as follo …

Y A

THS-660 GDI-41: The unit shall be able to operate within a pressur …

Y A,R

THS-661 GDI-42: For all relevant thermal hardware, explicitly MLI, …

Y R

THS-662 GDI-43: Unless a cavity is hermetically sealed adequate me …

Y R

THS-663 GDI-46: All spacecraft units of the same part or �esign�io …

Y R

THS-664 GDI-50: For the particular case of connector �esign�ion�ion …

Y I

THS-665 GDI-52: The design of the unit, the position of the connec …

Y R

THS-666 GDI-53: The equipment shall be designed to require a minim …

Y R

THS-668 GDI-70: Unless justified and agreed beforehand, any therma …

Y I,R

THS-669 GDI-78: No lubricants shall be used without the prior writ …

Y R

THS-670 GDI-80: All fasteners used on the unit shall be locked by …

Y I,R

THS-671 GDI-82: All drawings, specifications and engineering data …

Y R

THS-672 GDI-83: Units shall be compatible with mechanical testing. …

Y R

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THS-673 GDI-84: Following testing the unit shall be inspected to c …

Y I

THS-674 GDI-91: The following failure modes, for units at all leve …

Y A

THS-675 GDI-92: The unit shall be designed to withstand the enviro …

Y A,R

THS-676 GDI-93: For sine and random vibrations, the mechanical siz …

Y A

THS-677 GDI-94: Wherever practical a fail safe design based on red …

Y A

THS-678 GDI-95: In cases where a failsafe design cannot be impleme …

Y A

THS-679 GDI-2045: All potential fracture critical items shall be sub …

Y A

THS-680 GDI-98: All mass estimations shall be accompanied by the d …

Y T

THS-681 GDI-100: The mass of an item must be measured with the foll …

Y T

THS-682 GDI-183: The mechanical and optical configuration and its i …

Y A

THS-683 GDI-184: Interfaces will be subjected to a formal �esign�ion …

Y T,I

THS-684 GDI-185: The issues of ICDs have to be released as defined …

Y A

THS-685 GDI-186: One of the attachment holes on a unit shall be spe …

Y R

THS-686 GDI-191: Interface Control Drawings shall be provided to th …

Y R

THS-687 GDI-269: All unit thermal interfaces shall be described wit …

Y R

THS-688 GDI-273: Units: All units used in thermal models (geometric …

Y A

THS-734 GDI-338: All units connected to the sunlight regulated bus …

Y T,A

THS-735 GDI-349: Units connected to LCL’s or FCL’s shall be designe …

Y A

THS-736 GDI-482: The signal shall be transmitted via twisted shield …

Y R

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THS-737 GDI-483: The temperature aquisition interface circuitry, as …

Y R

THS-689 GDI-593: Space exposed insulating material having a bulk re …

Y R

THS-690 GDI-595: MLI: MLI shall carry at least 1 conductive layer …

Y I

THS-691 GDI-596: MLI: The grounding points shall be in a minimum of …

Y I,R

THS-692 GDI-597: MLI: The resistance between each bonding point an …

Y T

THS-693 GDI-598: MLI: The resistance between each bonding point an …

Y T

THS-694 GDI-600: HEATERS & THERMISTORS: Heaters, thermistors and o …

Y T,R

THS-696 GDI-2144: Heater mats shall be designed to produce a minimum …

Y R

THS-738 GDI-1997: Each equipment shall be designed and fabricated to …

Y T,R

THS-697 GDI-771: The unit shall be designed to withstand a relative …

Y R

THS-698 GDI-773: The cleanliness design requirements on the unit H/ …

Y R

THS-699 GDI-775: The S/C units flight H/W shall be designed to with …

Y R

THS-700 GDI-780: Units mounted on the S/C shall be designed to with …

Y T

THS-701 GDI-782: Cleanliness requirements are as defined in the Sec …

Y T,R

THS-702 GDI-790: The equipment/assembly and associated transport co …

Y T,A

THS-703 GDI-793: During ground transportation the equipments shall …

Y T,A

THS-704 GDI-795: The design of transport containers shall be such t …

Y T,A

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THS-705 GDI-799: The quasi-static and low frequency flight limit ac …

Y T,A

THS-706 GDI-808: All units mounted on the SCM structure shall be de …

Y T,A

THS-707 GDI-812: Units mounted on the SCM structure shall be �esign …

Y T,A

THS-708 GDI-818: Units mounted on the SCM Structure shall be design …

Y A,R

THS-709 GDI-823: During orbit and attitude correction manoeuvres, u …

Y T,A,R

THS-739 GDI-2051: This requirement applies to external items only. P …

Y A,R

THS-740 GDI-2052: This requirement applies to external items only. M …

Y A,R

THS-741 GDI-847: The radiation environment for the mission is shown …

Y A,R

THS-742 GDI-1966: The radiation environment for the mission shall be …

Y A,R

THS-743 GDI-1969: The Subcontractor shall implement a Radiation Hard …

Y R

THS-744 GDI-1970: All parts shall be reviewed by the Subcontractor t …

Y R

THS-745 GDI-1971: The Subcontractor shall issue a Radiation Assessme …

Y R

THS-746 GDI-1975: The total dose to be taken into account is defined …

Y A,R

THS-747 GDI-1977: Parts are considered SEE immune when the LETth is …

Y R

THS-748 GDI-1978: The component shall be designed to tolerate GCR, p …

Y T,A,R

THS-749 GDI-1980: Devices with a LETth for SEL less than 60 MeV-cm2/ …

Y A,R

THS-710 GDI-954: The use of ferro-magnetics shall be avoided for pa …

Y I,R

THS-711 GDI-956: Steel or other magnetic materials shall be avoided …

Y I,R

THS-712 GDI-962: The unit shall not be susceptible when submitted t …

Y T

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THS-713 GDI-967: Qualification of the design shall be accomplished …

Y T,A

THS-714 GDI-969: Environmental acceptance testing shall be performe …

Y T,A,R

THS-715 GDI-973: Any test facility to be used within the instrument …

Y A,R

THS-716 GDI-975: The accuracy of instrument and test equipment used …

Y A,R

THS-717 GDI-977: The allowed test condition tolerances shall be app …

Y A,I,R

THS-718 GDI-981: Unless otherwise specified herein, all measurement …

Y A,I,R

THS-719 GDI-983: Test execution shall be started only if all starti …

Y A,I,R

THS-720 GDI-985: The test is successfully performed if all measurem …

Y T,A

THS-721 GDI-1185: A life test shall be required for all the assembli …

Y T,R

THS-722 GDI-1187: Space conditioning shall be performed whenever des …

Y T,R

THS-723 GDI-1188: The contractors shall propose the corresponding te …

Y R

THS-724 GDI-1189: For example, but without limitation to, materials …

Y T

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Requirement/Section Cross Reference

THS-48 ............ 3.1.2....................9 THS-54 ............ 3.1.4....................10 THS-55 ............ 3.1.4....................10 THS-58 ............ 3.1.6....................12 THS-82 ............ 4.11.....................26 THS-86 ............ 4.2.5....................18 THS-88 ............ 4.2.5....................18 THS-89 ............ 4.2.5....................18 THS-90 ............ 4.2.5....................18 THS-91 ............ 4.2.5....................18 THS-93 ............ 4.2.7....................18 THS-95 ............ 4.2.7....................18 THS-96 ............ 4.2.7....................18 THS-97 ............ 4.2.7....................18 THS-100 .......... 4.2.7....................18 THS-103 .......... 4.2.8....................19 THS-105 .......... 4.2.6....................18 THS-114 .......... 4.2.9....................19 THS-115 .......... 4.2.9....................19 THS-117 .......... 4.12.....................26 THS-120 .......... 4.13.1..................27 THS-121 .......... 4.13.1..................27 THS-123 .......... 4.13.2..................27 THS-128 .......... 4.13.2..................27 THS-154 .......... 4.2.......................13 THS-155 .......... 4.2.......................13 THS-156 .......... 4.2.......................13 THS-157 .......... 4.2.......................13 THS-158 .......... 4.2.......................13 THS-167 .......... 4.1.1....................13 THS-170 .......... 4.1.1....................13 THS-173 .......... 4.2.4....................16 THS-176 .......... 4.2.4....................16 THS-177 .......... 4.2.4....................16 THS-178 .......... 4.2.4....................16 THS-179 .......... 4.2.4....................16 THS-180 .......... 4.2.4....................16 THS-181 .......... 4.2.4....................16 THS-182 .......... 4.2.4....................16 THS-183 .......... 4.2.4....................16 THS-193 .......... 4.2.4....................16 THS-194 .......... 4.2.4....................16 THS-195 .......... 4.2.4....................16 THS-196 .......... 4.2.4....................16 THS-197 .......... 4.2.4....................16 THS-199 .......... 4.2.4....................16 THS-200 .......... 4.2.4....................16 THS-201 .......... 4.2.4....................16 THS-210 .......... 4.2.3....................15 THS-212 .......... 4.2.3....................15 THS-213 .......... 4.2.3....................15 THS-217 .......... 4.2.2....................14 THS-218 .......... 4.2.2....................14 THS-219 .......... 4.2.2....................14 THS-221 .......... 4.2.2....................14 THS-222 .......... 4.2.2....................14 THS-223 .......... 4.2.2....................14 THS-226 .......... 4.2.1....................13

THS-227.......... 4.2.1.................... 13 THS-228.......... 4.2.1.................... 13 THS-229.......... 4.2.1.................... 13 THS-236.......... 4.8....................... 24 THS-240.......... 4.9.2.1................. 25 THS-241.......... 4.9.2.1................. 25 THS-251.......... 4.9.2.2.1.............. 26 THS-252.......... 4.9.2.2.1.............. 26 THS-254.......... 4.10..................... 26 THS-261.......... 5.1.1.................... 28 THS-288.......... 4.3.1.................... 19 THS-293.......... 5.3....................... 28 THS-295.......... 5.3....................... 28 THS-296.......... 5.3....................... 28 THS-553.......... 3.1.5.1................. 10 THS-554.......... 3.1.5.1................. 10 THS-555.......... 3.1.5.1................. 10 THS-556.......... 3.1.5.1................. 10 THS-557.......... 3.1.5.1................. 10 THS-560.......... 3.1.5.2................. 11 THS-571.......... 3.1.5.3................. 11 THS-572.......... 3.1.5.4................. 11 THS-573.......... 3.1.5.5................. 12 THS-574.......... 3.1.5.6................. 12 THS-575.......... 3.1.5.2................. 11 THS-576.......... 3.1.5.3................. 11 THS-577.......... 3.1.5.4................. 11 THS-579.......... 3.1.5.5................. 12 THS-580.......... 3.1.5.6................. 12 THS-582.......... 3.1.5.2................. 11 THS-583.......... 3.1.5.3................. 11 THS-584.......... 3.1.5.4................. 11 THS-585.......... 3.1.5.5................. 12 THS-586.......... 3.1.5.6................. 12 THS-589.......... 4.2.4.................... 16 THS-594.......... 4.3.2.................... 20 THS-595.......... 4.3.4.................... 20 THS-596.......... 4.3.5.................... 20 THS-597.......... 4.3.1.................... 19 THS-598.......... 4.3.1.................... 19 THS-599.......... 4.3.6.................... 21 THS-600.......... 4.3.8.................... 21 THS-601.......... 4.3.3.................... 20 THS-602.......... 4.3.3.................... 20 THS-603.......... 4.3.1.................... 19 THS-604.......... 4.3.4.................... 20 THS-613.......... 4.3.7.................... 21 THS-615.......... 4.3.7.................... 21 THS-616.......... 4.3.7.................... 21 THS-625.......... 4.4....................... 21 THS-629.......... 4.4.1.................... 22 THS-633.......... 4.4.2.................... 23 THS-645.......... 4.5....................... 24 THS-647.......... 4.6....................... 24 THS-648.......... 4.6....................... 24 THS-650.......... 4.7....................... 24 THS-652.......... 4.6....................... 24 THS-725.......... 4.5....................... 24

THS-727 ..........4.3 .......................19 THS-730 ..........4.9.1 ....................25 THS-731 ..........4.9.1 ....................25 THS-733 ..........4.9.1 ....................25

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DOCUMENT CHANGE DETAILS

ISSUE CHANGE AUTHORITY CLASS RELEVANT INFORMATION/INSTRUCTIONS

1 - - Initial Issue

DISTRIBUTION LIST

INTERNAL

EXTERNAL

S. Barraclough ESA A.G, Jones N. Dunbar G. Adams J.McCALL M. Backler

Configuration Management