select connect 3d-mid summit 09 22 10
DESCRIPTION
Learn about my latest business development technology, Laser Direct Structuring. This business is flying!TRANSCRIPT
Designing Your Next Generation ProductUsing 3D-Molded Interconnect Devices to Reduce
Complexity, Size, Weight and Costs
SelectConnect Technologieswww.selectconnecttech.com
Presented by Jim Liddle
LDS 3-D MID
Laser Direct Structured 3-D Molded Interconnect
3D-Interconnects by DS / LDS
Double-Shot Single-Shot LDS
LDS 3-D MID
LDS Summary
LDS Summary
LDS Summary
LDS Summary
LDS Summary
LDS Technical Summary
Laser Direct Structuring – LDS
LDS Technical Summary
LDS Technical Summary
LDS Pitch for High Yield
6 mil lines
8 mil spaces
(14 mil pitch)
Business Drivers for 3D-MID
Business Drivers for 3D-MID
LDS Grade Materials
Reflow temperatures
• Pb Free 245 -260° C
• Sn/Pb 225 -235° C
LDS Design Rules
LDS Design Rules
LDS Design Rules
LDS Design Rules
Optimum cycle times
LDS Design Rules
Metallization
Electroless Copper Nickel Immersion Gold [Electroless Gold]
Typical builds:
SelectConnect™ Metallization
Copper 100 – 200 micro-inches (2.5 – 5.0 µm)
Nickel 50 – 100 micro-inches (1.2 – 2.5 µm)
Gold Immersion, ~ 8 micro-inches (0.2 µm)
Key Markets / Applications
Medical Devices
OmniPod® Insulin Management System
OEM: Insulet
Molder: Phillips Plastics
Plater: Arlington Plating
Material: PC, PC/ABS (doped)
Process: DS (Double Shot)
Medical Devices
3-dimensional PCB for Hearing Aids
Stereo hearing aid component:
Source: Harting / Siemens
process steps
Material: Vectra E820i LDS
Integrated Antenna
Medical Devices
Switch Ring for Caries Diagnostic Laser Pen
Features:
Reduction of assembly time (6s vs. 20s)
Increase of assembly yield
Reduction of parts (3 vs. 8)
Reduction of cost (78%)
Source: KaVo Dental
Material: Vectra E840i LDS
Military / Defense
Security Housing
Manufacturer: BournsMaterial: Pocan DP 7102 (PBT)
Automotive
Source: Kromberg & Schubert GmbH & Co. KGBMW K46 Superbike
Automotive
SMD Process Steps:
Source: Kromberg & Schubert GmbH & Co. KG
3D Pick and Place Electrical Components
Automotive
HMI
Tracability:
Source: Kromberg & Schubert GmbH & Co. KG
Data Matrix Code
Automotive
Potential Automotive-Applications
Tracability:
Source: Kromberg & Schubert GmbH & Co. KG
Data Matrix Code
Seat Module
Sensors and Actuators
In-Door Electronics
Lightning
Switches
LDS 3-D MID
Automotive
Automotive Steering Wheel
TRW’s “Base-Line” MID after assembly:
Source: I&T 3D-Produktionsgesellschaft mbH
Automotive
Former device, 10mm Dia. Flip Chip ® MID, 5mm Dia.
Source: Robert Bosch GmbH
Redesign of Rotation Automotive Brake Sensor
Automotive
ASIC deposited onto MID with LPKF-LDS®
technologyConventional Solution
Sensor ASIC
MID using LPKF-LDS® technology
Source: Robert Bosch GmbH
Rotation Sensor for Automotive Brake System (ESP)
Flipped
Positioned
SignalGround
Support bumps
Automotive
Qualification:
Temperature Shock
-40°C…150°C
Realized by Flip Chip on LPKF-LDS® MID
Source: Robert Bosch GmbH
Rotation Sensor for Automotive Brake System (ESP)
Automotive
Qualification:
Warm-Humidity
85°C/85% rel.H
300 pcs. - no defects after 1000hSource: Robert Bosch GmbH
Rotation Sensor for Automotive Brake System (ESP)
Automotive
Former device10mm Dia.
Prototype Sensor Dia.: 5mm
Flip Chip on LDS 3D-MID
Source: Robert Bosch GmbH
Rotation Sensor for Automotive Brake System (ESP)
Source: ZMD AG
AMR Sensor (Automotive)
Material: Vectra E840i LDS
Automotive
Source: Harting
Sensors
Automotive
LED Turn Indicator Light
Source: Kromberg & Schubert GmbH & Co. KG
before
after
Source: Harting Mitronics AG
RFID
RFID-Transponder
LDS 3D-MID
Company Overview
SelectConnect Technologies
Division of Arlington Plating Company
Palatine, Illinois
Jim Liddle 847.359.1490
www.selectconnecttech.com