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Semiconductor Metrology Applications ContourGT-X Platform Capabilities and Automation for Semiconductor Applications

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Semiconductor Metrology ApplicationsContourGT-X Platform Capabilities and Automation for Semiconductor Applications

BRUKER CONFIDENTIAL

Outline

• Introduction

• Brief BNS – SOM General Overview

• Semiconductor Applications

• Automation Cassette/Wafer Loading

• Summary and Questions

BRUKER CONFIDENTIAL

Bruker Stylus and Optical MetrologySOM - World Leading Surface Metrology

• History of QA/QC solutions for industry Semiconductor

100+ Installed base multi-chip module inspection at board level

Data Storage 500+ Installed base disk drive slider metrology

Electronics and Industrial1000+ Installed base

Worldwide10,000+ Installed base

• Manufacturing Excellence Lean, six sigma-based process

100+ systems/quarter capacity

Rapid production ramp capability

1/30/2013 3

New Facility - Tucson, Arizona, USA Opened December 2011

BRUKER CONFIDENTIAL

3D Microscope Surface MetrologyGeneral Benefits of Core Technology

• Fast, accurate, GR&R capable metrology

• Non-contact, non-destructive

• 1000+ analysis parameters

• Stable and operator independent data

1/30/2013 4

BRUKER CONFIDENTIAL

Bruker Stylus and Optical MetrologyOur Products Broad Overview

1/30/2013 5

DektakXTContourGT-K

ContourGT-IM

ContourGT-XNPFLEX

NPFLEX-LA

SP9900+

ContourGT Auto-Ready

BRUKER CONFIDENTIAL

Bruker DektakXT Stylus ProfilersIndustrial Standard for Films and Steps

1/30/2013 6

• Dektak Reputation: Field proven performance, ease of use and reliability• Dektak Experience: 44+ year history in stylus profiler technology with over

10,000 installed systems world wide• Dektak Service & Support: Regional call centers world wide for prompt, local

support network

BRUKER CONFIDENTIAL

ContourGT-X Platform DetailStable, Accurate, Automation Ready

• Optical Metrology Module (OMM) with self-calibration on X8

• Programmable 8” or 12” Stage

• Automated Tip-Tilt in the head (+/- 6 degrees)

• Automated Z-Axis Focus

• Single Objective Adapter up to 5 -Position Automated Turret

• Dell Multi-Core PC Running Windows 7, 64 Bit Platform

• Vision64 Operation Software – advanced

• Single 23” Monitor with 1920x1080 resolution

• Operator Assist Sample Lamp

• Small Footprint Option with Automation Ready Package

• Integrated Isolation Table

1/30/2013 7

BRUKER CONFIDENTIAL

Focus

WLI measures the intensity at each pixel as the objective is moving vertically and analyzes the intensity while moving through focus to determine the height of the surface at each pixel

3D Optical MicroscopesWLI – Accurate, Fast, GR&R Ready!

BRUKER CONFIDENTIAL

Apply Benefits to Industry ProblemsSemiconductor Applications

• Broad range of applications including

Laser probe mark depth

Sensor dimensions and frequency performance (MEMS, DMEMS)

Cu wire bonding (bond force optimization, near line inspection)

Multichip Module HDI production inspection

Others (see next slides)

9

BRUKER CONFIDENTIAL

Range of Semiconductor Applications

January 30, 2013 Slide 10Bruker ConfidentialStylus and Optical Metrology Unit

BRUKER CONFIDENTIAL

Probe Mark SolutionAuto Detect Deepest Point

January 30, 2013 Slide 11

Auto filter removes higher level from the reference area

BRUKER CONFIDENTIAL

Probe Mark Solution Auto Detect Highest Peak

January 30, 2013 Slide 12

Auto filter removes lower level from the reference

BRUKER CONFIDENTIAL

Wafer Roughness 3D Areal Measurement – Large Area, FAST!

1/30/2013 13

Sa: 3.258 nm

BRUKER CONFIDENTIAL

Deposition, Etch, Probe MarksFast, accurate dimensions – non-contact!

1/30/2013 14

BRUKER CONFIDENTIAL

Lead Frame SurfacesRoughness and 3D Areal Parameters

BRUKER CONFIDENTIAL

Roughness and Sdr Uniformity:Lead vs. Die Area – Roughness alone not enough to tell the story

1/30/2013 16

Die B – Sdrdifferent even though Sa is the same

BRUKER CONFIDENTIAL

Die AttachHeight and Tilt Referenced to Lead Frame

1/30/2013 17

BRUKER CONFIDENTIAL

Laser Mark and Bump HeightsAuto detect troughs and peaks

1/30/2013 18

Software auto detects features

of interest –every time!

BRUKER CONFIDENTIAL

Vision64 Production Software ModuleOperator interface enables simplified use

1/30/2013 19

BRUKER CONFIDENTIAL

Cu Wire Bonding Near Line MonitorCavity Depth and Ball Height Metrology

BRUKER CONFIDENTIAL

Wire Bond Near Line Monitor3D Optical Microscope >5x Faster than industry standard methodology

40

10

15

0.25

0 10 20 30 40 50 60

SEM

Bruker OpticalProfiler

Sample Preparation (minutes) Measurement / Analysis (minutes)

BRUKER CONFIDENTIAL

Al Pad Metal SplashAuto Detection and Analysis

Splash Analysis

Area of interest is identified by software

Highest peak and volume of Splash

BRUKER CONFIDENTIAL

Al Pad Cavity DepthAuto Detection and Analysis

Max Depth Analysis

Max depth below pad surface

BRUKER CONFIDENTIAL

Bruker 3D Optical MicroscopesQuality Characteristics

1/30/2013 24

FAST ACCURATE REPEATABLE

BRUKER CONFIDENTIAL

Vision64 Stage AutomationFast and simple operator setup

• XY Scatter and XY Grid functionality

• Wafer overlays clarify die positions and setup

• Grids are numbered and sub-grid (measure) locations are easily marked

• Variety of traversal patterns offered to customize motion

1/30/2013 25

BRUKER CONFIDENTIAL

Programmable Staging Wafer Grid and Within-Die Variable Points

1/30/2013 26

BRUKER CONFIDENTIAL

Cassette Loading Wafer AutomationContourGT-X Automation Ready Solution

• TCP/IP interface

• Partner with CHAD Industries

• CHAD 200mm, 300mm systems provide front end interface

• SECS standard communication

• Bruker X8 data is transmitted to CHAD system

• Factory MES or SPC system seamlessly interacts with CHAD interface

1/30/2013 27

BRUKER CONFIDENTIAL

Bruker BNS – SOM BUWorldwide Presence - World Class Support

1/30/2013 28

Bruker Corporation

Headquarters

BNS Mfg.Santa

Barbara

BNS Mfg.

Tucson

BNSSingapore

BNSHsinchuBNS

Bangkok

BNSPenang

BNSShanghai

BNSBeijing

BNSPalaiseau

BNSCambridg

e

BNSKarlsruh

e

BNSMalvern

BNS Mfg.Campbell

BNSIndia BNS

Brasil

BRUKER CONFIDENTIAL

2012 2013-2014 2015

System

Functionality

• Broad applications in Semi packaging/MCM

• Partner for auto ready solution

• MEMS/sensor metrology Color camera/defect inspect

• ISO Class 6 compatibility

• ISO Class 2 solution• 450 mm auto loading• Integrated defect

inspection

Throughput• Baseline • 2x improvement via

hardware/computational• 5x over baseline

System S/W and Interface

• Vision64, 64 bit OS• TCP/IP control via

automation client or remote operation

• Streamlined software/GUIintegration

• Enhanced Vision64 functionality

• SECS/GEM with wafer handling

• Simplest, fastest Operator control

• SECS/GEM interfacing via full wafer handling or stand alone systems

Overview of Two Year RoadmapSemiconductor solutions

30.01.2013 29

BRUKER CONFIDENTIAL

SUMMARY

• Overview of product solutions

• Bruker serves a range of customers in the electronics and semiconductor spaces today

• ContourGT-X platform addresses with and without cassette loading several 3D metrology needs

• Automation solution is currently available and Bruker looks forward to serving your growing metrology needs

30

BRUKER CONFIDENTIAL

THANK YOU!!!QUESTIONS?

Bruker Nano Surfaces

[email protected]@bruker-nano.com

www.bruker.com

www.bruker.com

© Copyright Bruker Corporation. All rights reserved.