sht a leading provider of graphene enhanced …
TRANSCRIPT
SHT – A LEADING
PROVIDER OF GRAPHENE
ENHANCED THERMAL
SOLUTIONS
M U R A L I M U R U G E S A N , S A L E S M A N A G E R
M U R A L I . M U R U G E S A N @ S H T - T E K . C O M
&T H I E N L A U B E C K , C E O
t h i e n . l a u b e c k @ s h t - t e k . c o m
2 0 2 1 - 1 0 - 0 8
Confidential 1
Architecture: The Matter At the
nanoscale
Thermal
conductionAligned graphene
enhances Z
direction thermal
conductivity
Functional
Coating
High phonon
mobility
Minimized contact
resistance
A special coating
increases elasticity of
the structure
Vertically aligned
structure enhances the
heat transfer
A better thermal
contact
with substrateFlexible structure
Flexible and flat
surfaces allow high
speed of phonon
transport
2
SHT has know-how in achieving extremely high thermal conductivity
in Z-direction using graphene enhanced thermal interface material
20 40 60 80 1000
500
1000
1500
GT (VG = 65%)
GT (VG = 75%)
GT (VG = 30%)
Ther
mal
conduct
ivit
y (
W/m
K)
Temperature (oC)
3
4
Commercial products of Graphene Enhanced Thermal
Interface Material from SHT GT series
PHYSICAL PROPERTIES
GT-25 GT-25S GT-70S GT-90S Units Test Method
Bulk Thermal
conductivity
12
350
25
350
70
350
90
400
W/(mK)
W/(mK)
ASTM
D5470
LFA447
Thermal
resistance
20-30 @100KPa
10-12 @400KPa
20
@100KPa
10
@400KPa
10@276KPa
6.5 (276
kPa,300μm)
Kmm2/W ASTM
Thickness 0.25-3.0 0.25-3.0 0.25-3.0 0.3-1.0 mm Micrometer
Density
(g/cm3) 0.6 0.6 0.5
0.5 g/cm3 -
Compressibility 20-30 30-40 >50
>50
%
Instron Tensile
Tester
Compressive
strength 800 750 200-500
650±100
(300μm)
KPa Instron Tensile
Tester
Recovery >60 >65 >70 >70 % ASTM
Tensile
strength 50 40 >30/40
>50 KPa Instron Tensile
Tester
Roughness
(μm) <5 <5 <5
<5 um Optical profiler
Specific heat
(J/g.K) 0.2-0.3 0.2-0.3 0.2-0.3
0.2-0.3 J/g.K Hotdisk
SHTs products are 10x better than the competing material from Japan (Carbon Fibre based thermal interface material) and 100x better than other existing thermal interface materials!
GT 25 series
Features:• Good flexibility• Compressible• Easy to useApplications:IGBT, GPU, CPU, LED, RF, Opto and power module cooling
5
Physical Properties GT-25 GT-25SCompetitor
TC-001Units
Thickness0.25-5(±
15%)
0.25-5(±
15%)0,15-2 mm
Roughness 5-15 5-15 - %
Filler Material GrapheneGraphen
eCarbon
fiber
Compressibility 20-30 30-40 -- %
Temperature Range -40 to 150 -40 to 150 - oC
Bulk Through-plane Thermal Conductivity
350-450 350-45040-90
W/mK
Thermal Resistance
60 (100 KPa)
25 (300 KPa)
10-12
(270-300 KPa)
-(276KPa-1MPa)
Kmm2
/W
6
Physical Properties Value Units Test Method
Thermal Conductivity
70
350
W/mK
W/mK
ASTM5470
LFA447
Thermal Resistance 10 (275KPa,300um) Kmm2/W ASTM5470
Thickness 0.25-1 mm -Density 0.5 g/cm3 -
Compressibility >50 % -
Compressive Strength 200-400 KPa At 50% compression
Recovery >70 % -
Tensile strength >30 (soft) and 50
(harder)KPa Tensile tester
Surface Roughness <5% μm Optical profiler Use temperature Range -40 to 200 oC -
Flammability V-0 UL94Specific Heat 0.2-0.3 J/g.K Hotdisk
Color Grey - -
Size Up to 5*5 cm2 -
Performance summary of Graphene Enhanced Thermal Interface Material SHT-GT 70S
8
8,5
9
9,5
10
10,5
300 258 194
Effective thermal resistance (Kmm2/W) vs thickness (um) at
400 KPa of SHT GT-70S
Confidential 7
Compressive Stress vs strain curve at
50% compression
0 200 400 600 800 1000 1200 1400 16000
5
10
15
20
25
30
35
40
Th
erm
al
res
ista
nc
e (
K m
m2/W
)
Thickness (um)
Thermal resistance VS Pressure (300µm) Thermal resistance VS thickness (at 40Psi))
10 20 30 40 50 60
8
10
12
14
16
18
Th
erm
al re
sis
tan
ce (
K m
m2/W
)
Pressure(psi)
Compressive Stress vs Strain Curve at 50% compression (300µm)
Tensile Strength
Performance summary of Graphene Enhanced Thermal Interface Material SHT-GT 70S
8
Physical Properties Value Units Test Method
Thickness 0.3 mm
Size Up to 5*5 cm2
Surface Roughness <5% μm WYKO NT1100
Optical profiler
Color Grey
Filler Material Graphene
Density 0.4 g/cm3
Compressibility 50 % ASTM5470
Recovery 70 % ASTM5470
Compressive Strength 690 KPa ASTM5470
Use temperature Range -40 to 200 oC
Bulk Through-plane
Thermal Conductivity
90
400
W/mK
W/mK
ASTM5470
LFA447
Effective Thermal Conductivity 45-50 (400 KPa) W/mK ASTM5470
Effective Thermal Resistance 6,5 (400 KPa) Kmm2/W ASTM5470
Bulk In-plane (parallel to alignment)
Thermal Conductivity
90
400
W/mK
W/mK
ASTM5470
LFA447
Specific Heat 0.2-0.3 J/g.K Hotdisk
Minimum in-plane tensile strength >50 KPa Tensile tester
Performance summary of Graphene Enhanced Thermal Interface Material SHT-GT 90S
Compressive Stress vs Strain Curve at 50% compression (300µm)
Tensile Strength
9
9,5
10
10,5
11
11,5
300 258 194 155
Thermal resistance (Kmm2/W) vs thickness (um) at 300 KPa of
SHT GT-25S
Performance summary of Graphene EnhancedThermal Interface Material SHT-GT 25S
0%
20%
40%
60%
80%
100%
16 45 87 98 178 429 865 1735260434794234
SHT GT-25S 300 um
Co
mp
ress
ion
Compression vs. Pressure
Pressure (KPa)
0 10 20 30 40 50 60
0
200
400
Co
mp
ressiv
e s
tre
ss (
KP
a)
Compressive strain (%)
280 micro GT25-S
320 micro GT25-S
350 micro GT25-S
1000 micro GT25-S
Compression strain curve of GT-25S at different thicknesses
Confidential 10
Thermal Performance of Graphene EnhancedThermal Interface Material SHT-GT 25S
Confidential 11
0 280 415
0
10
20
30
40
50
60
Com
pre
ssio
n r
atio
(%)
Pressure (KPa)
280 micro GT25-S
320 micro GT25-S
350 micro GT25-S
Compression degree vs applied perssure of
SHT GT-25S at different thicknesses
12
Thermal Performance of Graphene Enhanced Thermal Interface Material
SHT-GT 25S after humidity testing of 500 hours
13
0 1 2 3 4 5 6
0
20
40
60
80Te
nsile
stre
ss (K
Pa)
Displacement (mm)
Tensile Stress Performance of Graphene Enhanced Thermal
Interface Material SHT-GT 25S along the alignment direction
0%
20%
40%
60%
80%
100%
120%
140%
160%
180%
200%
16 43 82 172 437 879 1720 2608 3477 4230
Co
mp
ress
ion
Pressure (kPa)
GT25 200 GT25 400
Compression vs. Pressure
Compression Performance of Graphene Enhanced Thermal Interface
Material SHT-GT-25
commercial16 32 64 128 256 512 1024 2048
0
20
40
60
80
100
120
140
Th
erm
al R
esis
tance
(K
mm
2/W
)Pressure (KPa)
GT25-S
Hitachi
GT (Y) GT (X) Hitachi
0
200
400
Te
nsile
str
ess (
KP
a)
A
Mechanical and thermal properties comparison
between SHT- GT 25 and commercial product
GT (Y): Along the alignment direction
GT(X): Perpendicular to the alignment
commercial
Pad 0408 SR250
Pad 0408 SR250
Pad HF OLD
Pad HF OLD
Thermal Expansion of Graphene Enhanced Thermal Interface Material SHT-GT 25
17
SHT Technology – Outstanding performance compared to the
existing thermal interface materials of SHT GT-25
Performance after temperature cycling
18
Customer Thermal testing data based
on SHT GT-25
GT25
Commercial TIM from Japan
Use of SHT GT in cooling of devices in
mobile phone
19
20
Video on efficiency of graphene enhanced thermal interface
materials (SHT GT) for electronics and power module cooling
(5x5 cm2)
Outlook and Prototypes of SHT GT-series of products (Not volume production)
Product type Thermal PadReflowable
TIMCurable TIM
Insulated
TIMTemporary sticky TIM
Features Easy to useLow thermal
resistance
Strong
bonding
Electrical
insulation
Easy to use, sticky surface,
flexibility
Bonding
conditions
PressureLow pressure
(100-400KPa)
Low reflow
pressure
(100-400KPa,
optional)
No pressure
needed
No pressure
needed
No/low pressure needed
(0-100KPa)
Temperature Room temperature 180-220oC80-150oC
(0,5-1 hour)
90oC
(10 min)Room temperature
Product name GT-80 MGT-90 AGT-10 IGT-10SGT-10
No pressure 100 KPa
Compression ratio (%) 5-10 5-10 20-30 20-30 20-30 20-30
Bulk through-plane thermal
conductivity (W/mK)880-1000 880-1000 - - - -
Thermal resistance (Kmm2/W)50-80
(400KPa)
5-8
(2MPa)3-5 50-60 30-70 50-60 20-25
Density (g/cm3) 1.8-2 1.8-2 0.5-0.8 0.5-0.8 0.5-0.8 0.5-0.8
Specific heat (J/g.K) 0.6-0.7 0.6-0.7 0.2-0.3 0.2-0.3 0.2-0.3 0.2-0.3
Thickness (mm) (0.25-5 )±15% (0.25-5 )±15%(0.25-5
)±15%
0.25-5
)±15%(0.25-5 )±15% (0.25-5 )±15%
Roughness (%) <5-15 <5-15 <5-15 <5-15 <5-15 <5-15
A big step forward in the thermal
management design
Bulk Thermal conductivity 10-100 times
better than the current commercial products
• Longer lasting life• High elasticity • Compressibility
• Sustainability: Energy saving using efficient thermal management solutions
X 100
Effective Thermal conductivity 2-5 times
better than the current commercial productsX 5
Thermal Resistance 2-5 times lower than the
current commercial products
22
✓ We offer thermal based solutions based
on graphene enhanced thermal interface
materials.
✓ Up to 5 000 pieces/month ready to supply.
✓ Ramp up 100 000/150000 pieces/month by
2022/2023.
Summary
23
24
Thank you!
- We make it cool
Contact Info
SHT Smart High-Tech AB
Address: Kemivägen 6, Se-412 58 GBG, Sweden
Phone: +46 73 988 84 96
Email: [email protected], [email protected] or [email protected]
www.sht-tek.com